BAV756S_BAW56_SER - NXP Semiconductors - Farnell Element 14
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Farnell Element 14 :
See the trailer for the next exciting episode of The Ben Heck show. Check back on Friday to be among the first to see the exclusive full show on element…
Connect your Raspberry Pi to a breadboard, download some code and create a push-button audio play project.
Puce électronique / Microchip :
Sans fil - Wireless :
Texas instrument :
Ordinateurs :
Logiciels :
Tutoriels :
Autres documentations :
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1. Product profile
1.1 General description
High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD)
plastic packages.
1.2 Features and benefits
1.3 Applications
High-speed switching
General-purpose switching
1.4 Quick reference data
[1] When switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA.
BAV756S; BAW56 series
High-speed switching diodes
Rev. 6 — 18 March 2015 Product data sheet
Table 1. Product overview
Type number Package Package
configuration
Configuration
NXP JEITA JEDEC
BAV756S SOT363 SC-88 - very small quadruple common
anode/common cathode
BAW56 SOT23 - TO-236AB small dual common anode
BAW56M SOT883 SC-101 - leadless ultra
small
dual common anode
BAW56S SOT363 SC-88 - very small quadruple common
anode/common anode
BAW56T SOT416 SC-75 - ultra small dual common anode
BAW56W SOT323 SC-70 - very small dual common anode
High switching speed: trr 4 ns Low capacitance: Cd 2 pF
Low leakage current Reverse voltage: VR 90 V
Small SMD plastic packages AEC-Q101 qualified
Table 2. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
Per diode
IR reverse current VR = 80 V - - 0.5 A
VR reverse voltage - - 90 V
trr reverse recovery time [1] - - 4 ns
BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 18 March 2015 2 of 16
NXP Semiconductors BAV756S; BAW56 series
High-speed switching diodes
2. Pinning information
Table 3. Pinning
Pin Description Simplified outline Symbol
BAV756S
1 anode (diode 1)
2 cathode (diode 2)
3 common anode (diode 2 and
diode 3)
4 cathode (diode 3)
5 anode (diode 4)
6 common cathode (diode 1
and diode 4)
BAW56; BAW56T; BAW56W
1 cathode (diode 1)
2 cathode (diode 2)
3 common anode
BAW56M
1 cathode (diode 1)
2 cathode (diode 2)
3 common anode
BAW56S
1 cathode (diode 1)
2 cathode (diode 2)
3 common anode (diode 3 and
diode 4)
4 cathode (diode 3)
5 cathode (diode 4)
6 common anode (diode 1 and
diode 2)
1 3 2
56 4
006aab103
1 3
6
2
5 4
006aaa144
1 2
3
006aab099
1 2
3
3
1
2
Transparent
top view
006aab099
1 2
3
1 3 2
56 4
006aab102
1 3
6
2
5 4
BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 18 March 2015 3 of 16
NXP Semiconductors BAV756S; BAW56 series
High-speed switching diodes
3. Ordering information
4. Marking
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
Table 4. Ordering information
Type number Package
Name Description Version
BAV756S SC-88 plastic surface-mounted package; 6 leads SOT363
BAW56 - plastic surface-mounted package; 3 leads SOT23
BAW56M SC-101 leadless ultra small plastic package; 3 solder lands;
body 1.0 0.6 0.5 mm
SOT883
BAW56S SC-88 plastic surface-mounted package; 6 leads SOT363
BAW56T SC-75 plastic surface-mounted package; 3 leads SOT416
BAW56W SC-70 plastic surface-mounted package; 3 leads SOT323
Table 5. Marking codes
Type number Marking code[1]
BAV756S A7*
BAW56 A1*
BAW56M S5
BAW56S A1*
BAW56T A1
BAW56W A1*
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
VRRM repetitive peak reverse
voltage
- 90 V
VR reverse voltage - 90 V
IF forward current
BAV756S Ts = 60 C - 250 mA
BAW56 Tamb 25 C - 215 mA
BAW56M Tamb 25 C - 150 mA
BAW56S Ts = 60 C - 250 mA
BAW56T Ts = 90 C - 150 mA
BAW56W Tamb 25 C - 150 mA
BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 18 March 2015 4 of 16
NXP Semiconductors BAV756S; BAW56 series
High-speed switching diodes
[1] Tj = 25 C prior to surge.
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[3] Reflow soldering is the only recommended soldering method.
[4] Single diode loaded.
6. Thermal characteristics
IFRM repetitive peak forward
current
- 500 mA
IFSM non-repetitive peak forward
current
square wave [1]
tp = 1 s - 4 A
tp = 1 ms - 1 A
tp = 1 s - 0.5 A
Ptot total power dissipation [2]
BAV756S Ts = 60 C - 350 mW
BAW56 Tamb 25 C - 250 mW
BAW56M Tamb 25 C [3] - 250 mW
BAW56S Ts = 60 C - 350 mW
BAW56T Ts = 90 C [4] - 170 mW
BAW56W Tamb 25 C - 200 mW
Per device
IF forward current
BAV756S Ts = 60 C - 100 mA
BAW56 Tamb 25 C - 125 mA
BAW56M Tamb 25 C - 75 mA
BAW56S Ts = 60 C - 100 mA
BAW56T Ts = 90 C - 75 mA
BAW56W Tamb 25 C - 130 mA
Tj junction temperature - 150 C
Tamb ambient temperature 65 +150 C
Tstg storage temperature 65 +150 C
Table 6. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per diode
Rth(j-a) thermal resistance from
junction to ambient
in free air [1]
BAW56 - - 500 K/W
BAW56M [2] - - 500 K/W
BAW56W - - 625 K/W
BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 18 March 2015 5 of 16
NXP Semiconductors BAV756S; BAW56 series
High-speed switching diodes
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
7. Characteristics
[1] Pulse test: tp 300 s; 0.02.
[2] When switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA.
[3] When switched from IF = 10 mA; tr = 20 ns.
Rth(j-sp) thermal resistance from
junction to solder point
BAV756S - - 255 K/W
BAW56 - - 360 K/W
BAW56S - - 255 K/W
BAW56T - - 350 K/W
BAW56W - - 300 K/W
Table 7. Thermal characteristics …continued
Symbol Parameter Conditions Min Typ Max Unit
Table 8. Characteristics
Tamb = 25 C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per diode
VF forward voltage [1]
IF = 1 mA - - 715 mV
IF = 10 mA - - 855 mV
IF = 50 mA - - 1 V
IF = 150 mA - - 1.25 V
IR reverse current VR = 25 V - - 30 nA
VR = 80 V - - 0.5 A
VR = 25 V; Tj = 150 C - - 30 A
VR = 80 V; Tj = 150 C - - 150 A
Cd diode capacitance VR = 0 V; f = 1 MHz - - 2 pF
trr reverse recovery time [2] - - 4 ns
VFR forward recovery voltage [3] - - 1.75 V
BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 18 March 2015 6 of 16
NXP Semiconductors BAV756S; BAW56 series
High-speed switching diodes
(1) Tamb = 150 C
(2) Tamb = 85 C
(3) Tamb = 25 C
(4) Tamb = 40 C
Based on square wave currents.
Tj = 25 C; prior to surge
Fig 1. Forward current as a function of forward
voltage; typical values
Fig 2. Non-repetitive peak forward current as a
function of pulse duration; maximum values
(1) Tamb = 150 C
(2) Tamb = 85 C
(3) Tamb = 25 C
(4) Tamb = 40 C
f = 1 MHz; Tamb = 25 C
Fig 3. Reverse current as a function of reverse
voltage; typical values
Fig 4. Diode capacitance as a function of reverse
voltage; typical values
006aab109
VF (V)
0.2 1.4 0.6 1.0
1
10
102
103
IF
(mA)
10−1
(1) (2) (3) (4)
mbg704
10
1
102
IFSM
(A)
10−1
tp (μs)
1 104 103 10 102
006aab110
10−2
10−4
10−3
10
1
10−1
102
IR
(μA)
10−5
VR (V)
0 100 20 40 60 80
(1)
(2)
(3)
(4)
0 25
VR (V)
2.5
0
0.5
mbh191
1.0
1.5
2.0
5
Cd
(pF)
10 15 20
BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 18 March 2015 7 of 16
NXP Semiconductors BAV756S; BAW56 series
High-speed switching diodes
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
(1) IR = 1 mA
Input signal: reverse pulse rise time tr = 0.6 ns; reverse voltage pulse duration tp = 100 ns; duty cycle = 0.05
Oscilloscope: rise time tr = 0.35 ns
Fig 5. Reverse recovery time test circuit and waveforms
Input signal: forward pulse rise time tr = 20 ns; forward current pulse duration tp 100 ns; duty cycle 0.005
Fig 6. Forward recovery voltage test circuit and waveforms
trr
(1)
+ IF
t
output signal
tr tp
t
10 %
90 % VR
input signal
V = VR + IF × RS
RS = 50 Ω IF
D.U.T.
Ri
= 50 Ω
SAMPLING
OSCILLOSCOPE
mga881
tr
t
tp
10 %
90 %
I
input signal
RS = 50 Ω
I
Ri
= 50 Ω
OSCILLOSCOPE
1 kΩ 450 Ω
D.U.T.
mga882
VFR
t
output signal
V
BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 18 March 2015 8 of 16
NXP Semiconductors BAV756S; BAW56 series
High-speed switching diodes
9. Package outline
Fig 7. Package outline BAW56 (SOT23/TO-236AB) Fig 8. Package outline BAW56M (SOT883/SC-101)
Fig 9. Package outline BAV756S and
BAW56S (SOT363/SC-88)
Fig 10. Package outline BAW56T (SOT416/SC-75)
Fig 11. Package outline BAW56W (SOT323/SC-70)
Dimensions in mm 04-11-04
0.45
0.15
1.9
1.1
0.9
3.0
2.8
2.5
2.1
1.4
1.2
0.48
0.38
0.15
0.09
1 2
3
Dimensions in mm 03-04-03
0.62
0.55
0.55
0.47
0.50
0.46
0.65
0.20
0.12
3
2 1
0.30
0.22
0.30
0.22
1.02
0.95
0.35
0.25
0.10
0.3
0.2
pin 1
index
1.3
0.65
2.2
2.0
1.35
1.15
2.2
1.8
1.1
0.8
0.45
0.15
1 3 2
6 5 4
Dimensions in mm 14-10-03 Dimensions in mm 04-11-04
0.95
0.60
1.8
1.4
1.75
1.45
0.9
0.7
0.25
0.10
1
0.30
0.15
1 2
3 0.45
0.15
Dimensions in mm 04-11-04
0.45
0.15
1.1
0.8
2.2
1.8
2.2
2.0
1.35
1.15
1.3
0.4
0.3
0.25
0.10
1 2
3
BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 18 March 2015 9 of 16
NXP Semiconductors BAV756S; BAW56 series
High-speed switching diodes
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
[2] T1: normal taping
[3] T2: reverse taping
11. Soldering
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
3000 10000
BAV756S SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 -135
4 mm pitch, 8 mm tape and reel; T2 [3] -125 -165
BAW56 SOT23 4 mm pitch, 8 mm tape and reel -215 -235
BAW56M SOT883 2 mm pitch, 8 mm tape and reel - -315
BAW56S SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 -135
4 mm pitch, 8 mm tape and reel; T2 [3] -125 -165
BAW56T SOT416 4 mm pitch, 8 mm tape and reel -115 -135
BAW56W SOT323 4 mm pitch, 8 mm tape and reel -115 -135
Fig 12. Reflow soldering footprint BAW56 (SOT23/TO-236AB)
solder lands
solder resist
occupied area
solder paste
sot023_fr
0.5
(3×)
0.6
(3×)
0.6
(3×)
0.7
(3×)
3
1
3.3
2.9
1.7
1.9
2
Dimensions in mm
BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 18 March 2015 10 of 16
NXP Semiconductors BAV756S; BAW56 series
High-speed switching diodes
Fig 13. Wave soldering footprint BAW56 (SOT23/TO-236AB)
Reflow soldering is the only recommended soldering method.
Fig 14. Reflow soldering footprint BAW56M (SOT883/SC-101)
solder lands
solder resist
occupied area
preferred transport direction during soldering
sot023_fw
2.8
4.5
1.4
4.6
1.4
(2×)
1.2
(2×)
2.2
2.6
Dimensions in mm
solder lands
solder resist
occupied area
solder paste
sot883_fr
1.3
0.3
0.6 0.7
0.4
0.9
0.3
(2×)
0.4
(2×)
0.25
(2×)
0.7 R0.05 (12×)
Dimensions in mm
BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 18 March 2015 11 of 16
NXP Semiconductors BAV756S; BAW56 series
High-speed switching diodes
Fig 15. Reflow soldering footprint BAV756S and BAW56S (SOT363/SC-88)
Fig 16. Wave soldering footprint BAV756S and BAW56S (SOT363/SC-88)
solder lands
solder resist
occupied area
solder paste
sot363_fr
2.65
2.35 0.4 (2×)
0.6
(2×)
0.5
(4×)
0.5
(4×)
0.6
(4×)
0.6
(4×)
1.5
1.8
Dimensions in mm
sot363_fw
solder lands
solder resist
occupied area
preferred transport
direction during soldering
5.3
1.3 1.3
1.5
0.3
1.5
4.5
2.45
2.5
Dimensions in mm
BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 18 March 2015 12 of 16
NXP Semiconductors BAV756S; BAW56 series
High-speed switching diodes
Fig 17. Reflow soldering footprint BAW56T (SOT416/SC-75)
Fig 18. Reflow soldering footprint BAW56W (SOT323/SC-70)
Fig 19. Wave soldering footprint BAW56W (SOT323/SC-70)
solder resist occupied area
Dimensions in mm solder lands solder paste
msa438
2.0
0.6
(3x)
0.7
1.5
1
2
3
1.1
2.2
0.5
(3x)
0.85
0.6
1.9
msa429
0.852.35
0.55
(3×)
0.75 1.325
2.40
2.65
1.30
3
2
1
0.60
(3×)
0.50
(3×) 1.90
solder lands
solder resist
occupied area
solder paste
Dimensions in mm
msa419
4.00
4.60
2.103.65
1.15
2.70 3
2
1 0.90
(2×)
preferred transport direction during soldering
solder lands
solder resist
occupied area
Dimensions in mm
BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 18 March 2015 13 of 16
NXP Semiconductors BAV756S; BAW56 series
High-speed switching diodes
12. Revision history
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BAV756S_BAW56_SER
v.6
20150318 Product data sheet - BAV756S_BAW56_SER_
5
Modifications: • The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
BAV756S_BAW56_SER_5 20071126 Product data sheet - BAV756S_2
BAW56_4
BAW56S_2
BAW56T_2
BAW56W_4
BAV756S_2 19971021 Product specification - BAV756S_1
BAW56_4 20030325 Product specification - BAW56_3
BAW56S_2 19971021 Product specification - BAW56S_1
BAW56T_2 19971219 Product specification - -
BAW56W_4 19990511 Product specification - BAW56W_3
BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 18 March 2015 14 of 16
NXP Semiconductors BAV756S; BAW56 series
High-speed switching diodes
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 18 March 2015 15 of 16
NXP Semiconductors BAV756S; BAW56 series
High-speed switching diodes
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors BAV756S; BAW56 series
High-speed switching diodes
© NXP Semiconductors N.V. 2015. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 18 March 2015
Document identifier: BAV756S_BAW56_SER
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 3
4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 4
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 7
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 7
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
10 Packing information . . . . . . . . . . . . . . . . . . . . . 9
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
13.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
14 Contact information. . . . . . . . . . . . . . . . . . . . . 15
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
PWP RHB NT
1FEATURES APPLICATIONS
DESCRIPTION
Delay
x0
12−Bit Grayscale
PWM Control
DC Register
GS Register
DC EEPROM
Constant Current
Driver
LED Open Detection
Temperature
Error Flag
(TEF)
Max. OUTn
Current
Delay
x1
12−Bit Grayscale
PWM Control
DC Register
GS Register
DC EEPROM
Constant Current
Driver
LED Open Detection
Delay x15
6−Bit Dot
12−Bit Grayscale
PWM Control
DC Register
GS Register
DC EEPROM
Constant Current
Driver
LED Open Detection
OUT0
OUT1
OUT15
SOUT
SCLK SIN
IREF
XERR
XLAT
GSCLK
BLANK
DCPRG
DCPRG
DCPRG
VPRG
VPRG
VPRG
VCC GND
VPRG
Input
Shift
Register
Input
Shift
Register
VPRG 0 11
12 23
180 191
90 95
6 11
5
VPRG
0
0
95
96
191
LED Open
Detection
(LOD)
5
90 95
6 11
DCPRG
0
192
96
1 0
1 0 0
1
1 0
GS Counter CNT
CNT
CNT
CNT
96
96
Status
Information:
LOD,
TED,
DC DATA
192
0
191
1
0
0
1
VREF =1.24 V
Correction
6−Bit Dot
Correction
6−Bit Dot
Correction
1 0
Blank
TLC5940
SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007 www.ti.com
16 CHANNEL LED DRIVER WITH DOT CORRECTION AND GRAYSCALE PWM CONTROL
2• 16 Channels • Monocolor, Multicolor, Full-Color LED Displays
• 12 bit (4096 Steps) Grayscale PWM Control • LED Signboards
• Dot Correction • Display Backlighting
• General, High-Current LED Drive
– 6 bit (64 Steps)
– Storable in Integrated EEPROM
• Drive Capability (Constant-Current Sink)
The TLC5940 is a 16-channel, constant-current sink
– 0 mA to 60 mA (VCC < 3.6 V)
LED driver. Each channel has an individually
– 0 mA to 120 mA (VCC > 3.6 V) adjustable 4096-step grayscale PWM brightness
• LED Power Supply Voltage up control and a 64-step, constant-current sink (dot
to 17 V
correction). The dot correction adjusts the brightness
• VCC = 3 V to 5.5 V
variations between LED channels and other LED
• Serial Data Interface drivers. The dot correction data is stored in an
• Controlled In-Rush Current integrated EEPROM. Both grayscale control and dot
correction are accessible via a serial interface. A
• 30MHz Data Transfer Rate
single external resistor sets the maximum current
• CMOS Level I/O value of all 16 channels.
• Error Information
The TLC5940 features two error information circuits.
– LOD: LED Open Detection The LED open detection (LOD) indicates a broken or
– TEF: Thermal Error Flag disconnected LED at an output terminal. The thermal
error flag (TEF) indicates an overtemperature
condition.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2004–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
www.ti.com
ABSOLUTE MAXIMUM RATINGS.
TLC5940
SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
TA PACKAGE(1)
PART NUMBER
28-pin HTSSOP PowerPAD™ TLC5940PWP
–40°C to 85°C 32-pin 5mm x 5mm QFN TLC5940RHB
28-pin PDIP TLC5940NT
(1) For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI website at www.ti.com.
over operating free-air temperature range (unless otherwise noted)
(1)
UNIT
VI Input voltage range(2)
VCC –0.3V to 6V
IO Output current (dc) 130mA
VI Input voltage range V(BLANK), V(DCPRG), V(SCLK), V(XLAT), V(SIN), V(GSCLK), V(IREF) –0.3V to VCC +0.3V
V(SOUT), V(XERR) –0.3V to VCC +0.3V
VO Output voltage range
V(OUT0) to V(OUT15) –0.3V to 18V
EEPROM program range V(VPRG) –0.3V to 24V
EEPROM write cycles 50
HBM (JEDEC JESD22-A114, Human Body Model) 2kV
ESD rating
CBM (JEDEC JESD22-C101, Charged Device Model) 500V
Tstg Storage temperature range –55°C to 150°C
TA Operating ambient temperature range –40°C to 85°C
HTSSOP (PWP)
(4)
31.58°C/W
Package thermal impedance(3)
QFN (RHB) 35.9°C/W
PDIP (NP) 48°C/W
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
(4) With PowerPAD soldered on PCB with 2 oz. (56,7 grams) trace of copper. See SLMA002 for further information.
2 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Link(s): TLC5940
www.ti.com
RECOMMENDED OPERATING CONDITIONS
DISSIPATION RATINGS
TLC5940
SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007
MIN NOM MAX UNIT
DC CHARACTERISTICS
VCC Supply Voltage 3 5.5 V
VO Voltage applied to output (OUT0–OUT15) 17 V
VIH High-level input voltage 0.8 VCC VCC V
VIL Low-level input voltage GND 0.2 VCC V
IOH High-level output current VCC = 5V at SOUT –1 mA
IOL Low-level output current VCC = 5V at SOUT, XERR 1 mA
OUT0 to OUT15, VCC < 3.6V 60 mA
IOLC Constant output current
OUT0 to OUT15, VCC > 3.6V 120 mA
V(VPRG) EEPROM program voltage 20 22 23 V
TA Operating free-air temperature range -40 85 °C
AC CHARACTERISTICS
VCC = 3 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)
f
(SCLK) Data shift clock frequency SCLK 30 MHz
f
(GSCLK) Grayscale clock frequency GSCLK 30 MHz
twh0/twl0 SCLK pulse duration SCLK = H/L (see Figure 11) 16 ns
twh1/twl1 GSCLK pulse duration GSCLK = H/L (see Figure 11) 16 ns
twh2 XLAT pulse duration XLAT = H (see Figure 11) 20 ns
twh3 BLANK pulse duration BLANK = H (see Figure 11) 20 ns
t
su0 SIN to SCLK ↑
(1)
(see Figure 11) 5 ns
t
su1 SCLK ↓ to XLAT ↑ (see Figure 11) 10 ns
t
su2 VPRG ↑ ↓ to SCLK ↑ (see Figure 11) 10 ns
t
su3 Setup time VPRG ↑ ↓XLAT ↑ (see Figure 11) 10 ns
t
su4 BLANK ↓ to GSCLK ↑ (see Figure 11) 10 ns
t
su5 XLAT ↑ to GSCLK ↑ (see Figure 11) 30 ns
t
su6 VPRG ↑ to DCPRG ↑ (see Figure 16) 1 ms
th0 SCLK ↑ to SIN (see Figure 11) 3 ns
th1 XLAT ↓ to SCLK ↑ (see Figure 11) 10 ns
th2 SCLK ↑ to VPRG ↑ ↓ (see Figure 11) 10 ns
Hold Time
th3 XLAT ↓ to VPRG ↑ ↓ (see Figure 11) 10 ns
th4 GSCLK ↑ to BLANK ↑ (see Figure 11) 10 ns
th5 DCPRG ↓ to VPRG ↓ (see Figure 11) 1 ms
tprog Programming time for EEPROM (see Figure 16) 20 ms
(1) ↑ and ↓ indicates a rising edge, and a falling edge respectively.
POWER RATING DERATING FACTOR POWER RATING POWER RATING
PACKAGE
TA < 25°C ABOVE TA = 25°C TA = 70°C TA = 85°C
28-pin HTSSOP with
3958mW 31.67mW/C 2533mW 2058mW
PowerPAD™(1)
soldered
28-pin HTSSOP with PowerPAD™ 2026mW 16.21mW/°C 1296mW 1053mW
unsoldered
32-pin QFN(1)
3482mW 27.86mW/°C 2228mW 1811mW
28-pin PDIP 2456mW 19.65mW/°C 1572mW 1277mW
(1) The PowerPAD is soldered to the PCB with a 2 oz. (56,7 grams) copper trace. See SLMA002 for further information.
Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 3
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ELECTRICAL CHARACTERISTICS
TLC5940
SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007
VCC = 3 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH High-level output voltage IOH = -1mA, SOUT VCC –0.5 V
VOL Low-level output voltage IOL = 1mA, SOUT 0.5 V
VI = VCC or GND; BLANK, DCPRG, GSCLK, SCLK, SIN,
–1 1
XLAT
µA
I VI = GND; VPRG –1 1
I Input current
VI = VCC; VPRG 50
VI = 22V; VPRG; DCPRG = VCC 4 10 mA
No data transfer, all output OFF,
0.9 6
VO = 1V, R(IREF) = 10kΩ
No data transfer, all output OFF,
5.2 12
VO = 1V, R(IREF) = 1.3kΩ
ICC Supply current mA
Data transfer 30MHz, all output ON,
16 25
VO = 1V, R(IREF) = 1.3kΩ
Data transfer 30MHz, all output ON,
30 60
VO = 1V, R(IREF) = 640Ω
Constant sink current (see
IO(LC) All output ON, VO = 1V, R(IREF) = 640Ω 54 61 69 mA
Figure 2)
All output OFF, VO = 15V, R(IREF) = 640Ω,
I
lkg Leakage output current 0.1 µA
OUT0 to OUT15
All output ON, VO = 1V, R(IREF) = 640Ω,
1 ±4
OUT0 to OUT15, –20°C to 85°C
All output ON, VO = 1V, R(IREF) = 640Ω,
1 8
OUT0 to OUT15(1)
Constant sink current error
ΔIO(LC0) %
(see Figure 2) All output ON, VO = 1V, R(IREF) = 320Ω,
1 6
OUT0 to OUT15, –20°C to 85°C
All output ON, VO = 1V, R(IREF) = 320Ω,
±1 ±8
VCC = 4.5V to 5.5V, OUT0 to OUT15(1)
Constant sink current error Device to device, Averaged current from OUT0 to –2
ΔIO(LC1) 4 %
(see Figure 2) OUT15, R(IREF) = 1920Ω (20mA)
(2)
+0.4
Constant sink current error Device to device, Averaged current from OUT0 to –2.7
ΔIO(LC2) ±4 %
(see Figure 2) OUT15, R(IREF) = 480Ω (80mA)
(2)
+2
All output ON, VO = 1V, R(IREF) = 640Ω
1 ±4 %/V
OUT0 to OUT15, VCC = 3V to 5.5V(3)
ΔIO(LC3) Line regulation (see Figure 2)
All output ON, VO = 1V, R(IREF) = 320Ω ,
±1 ±6 %/V
OUT0 to OUT15, VCC = 3V to 5.5V(3)
All output ON, VO = 1V to 3V, R(IREF) = 640Ω,
±2 ±6 %/V
OUT0 to OUT15(4)
ΔIO(LC4) Load regulation (see Figure 2)
All output ON, VO = 1V to 3V, R(IREF) = 320Ω,
2 8 %/V
OUT0 to OUT15(4)
T(TEF) Thermal error flag threshold Junction temperature(5)
150 170 C
V(LED) LED open detection threshold 0.3 0.4 V
Reference voltage
V(IREF) R(IREF) = 640Ω 1.20 1.24 1.28 V
output
(1) The deviation of each output from the average of OUT0-15 constant current. It is calculated by Equation 1 in Table 1.
(2) The deviation of average of OUT1-15 constant current from the ideal constant-current value. It is calculated by Equation 2 in Table 1.
The ideal current is calculated by Equation 3 in Table 1.
(3) The line regulation is calculated by Equation 4 in Table 1.
(4) The load regulation is calculated by Equation 5 in Table 1.
(5) Not tested. Specified by design
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100
I
I I
(%)
OUTavg _ 0 15
OUTn OUTavg _ 0 15
´
-
D =
-
-
(1)
100
I
I I
(%)
OUT(IDEAL)
OUTavg OUT(IDEAL)
´
-
D =
(2)
÷
÷
ø
ö
ç
ç
è
æ
= ´
IREF
OUT(IDEAL)
R
.1 24V
I 31 5.
(3)
5.2
100
I( at V 0.3 V)
I( at V 5.5 V) I( at V 0.3 V)
(% / V)
OUTn CC
OUTn CC OUTn CC ´
=
= - =
D =
(4)
0.2
100
I( at V 0.1 V)
I( at V 0.3 V) I( at V 0.1 V)
(%/ V)
OUTn OUTn
OUTn OUTn OUTn OUTn ´
=
= - =
D =
(5)
SWITCHING CHARACTERISTICS
TLC5940
SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007
Table 1. Test Parameter Equations
VCC = 3V to 5.5V, TA = -40°C to 85°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
t
r0 SOUT 16
Rise time ns
t
r1 OUTn, VCC = 5V, TA = 60°C, DCn = 3Fh 10 30
t
f0 SOUT 16
Fall time ns
t
f1 OUTn, VCC = 5V, TA = 60°C, DCn = 3Fh 10 30
tpd0 SCLK to SOUT (see Figure 11) 30 ns
tpd1 BLANK to OUT0 60 ns
tpd2 OUTn to XERR (see Figure 11 ) 1000 ns
Propagation delay time
tpd3 GSCLK to OUT0 (see Figure 11 ) 60 ns
tpd4 XLAT to IOUT (dot correction) (see Figure 11 ) 60 ns
tpd5 DCPRG to OUT0 (see Figure 11) 30 ns
td Output delay time OUTn to OUT(n+1) (see Figure 11 ) 20 30 ns
ton-err Output on-time error touton– Tgsclk (see Figure 11), GSn = 01h, GSCLK = 11 MHz 10 –50 –90 ns
Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 5
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DEVICE INFORMATION
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
GND
BLANK
XLAT
SCLK
SIN
VPRG
OUT0
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
VCC
IREF
DCPRG
GSCLK
SOUT
XERR
OUT15
OUT14
OUT13
OUT12
OUT11
OUT10
OUT9
OUT8
PWP PACKAGE
(TOP VIEW)
Thermal
PAD
THERMAL
PAD
GSCLK 24
SOUT 23
XERR 22
OUT15 21
OUT14 20
OUT13 19
OUT12 18
OUT11 17
16 OUT10
15 OUT9
14 OUT8
13 NC
12 NC
11 OUT7
10 OUT6
9 OUT5
OUT4 8
OUT3 7
OUT2 6
OUT1 5
OUT0 4
VPRG 3
SIN 2
SCLK 1
DCPRG 25
IREF 26
VCC 27
NC 28
NC 29
GND 30
BLANK 31
XLAT 32
RHB PACKAGE
(TOP VIEW)
NC − No internal connection
1
2
3
4
5
6
7
8
9
10
11
12
13
14
18
17
16
15
22
21
20
19
26
25
24
23
28
27
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
OUT8
OUT9
OUT10
OUT11
OUT12
OUT13
OUT14
GND
VCC
IREF
DCPRG
GSCLK
SOUT
XERR
OUT15
SCLK
XLAT
BLANK
OUT0
VPRG
SIN
NT PACKAGE
(TOP VIEW)
TLC5940
SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007
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TLC5940
SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007
TERMINAL FUNCTION
TERMINAL
NO. I/O DESCRIPTION
NAME
DIP PWP RHB
Blank all outputs. When BLANK = H, all OUTn outputs are forced OFF. GS counter is also
BLANK 23 2 31 I
reset. When BLANK = L, OUTn are controlled by grayscale PWM control.
Switch DC data input. When DCPRG = L, DC is connected to EEPROM. When DCPRG = H,
DCPRG 19 26 25 I DC is connected to the DC register.
DCPRG also controls EEPROM writing, when VPRG = V(PRG). EEPROM data = 3Fh (default)
GND 22 1 30 G Ground
GSCLK 18 25 24 I Reference clock for grayscale PWM control
IREF 20 27 26 I Reference current terminal
12, 13,
NC – – No connection
28, 29
OUT0 28 7 4 O Constant current output
OUT1 1 8 5 O Constant current output
OUT2 2 9 6 O Constant current output
OUT3 3 10 7 O Constant current output
OUT4 4 11 8 O Constant current output
OUT5 5 12 9 O Constant current output
OUT6 6 13 10 O Constant current output
OUT7 7 14 11 O Constant current output
OUT8 8 15 14 O Constant current output
OUT9 9 16 15 O Constant current output
OUT10 10 17 16 O Constant current output
OUT11 11 18 17 O Constant current output
OUT12 12 19 18 O Constant current output
OUT13 13 20 19 O Constant current output
OUT14 14 21 20 O Constant current output
OUT15 15 22 21 O Constant current output
SCLK 25 4 1 I Serial data shift clock
SIN 26 5 2 I Serial data input
SOUT 17 24 23 O Serial data output
VCC 21 28 27 I Power supply voltage
Multifunction input pin. When VPRG = GND, the device is in GS mode. When VPRG = VCC, the
VPRG 27 6 3 I device is in DC mode. When VPRG = V(VPRG), DC register data can programmed into DC
EEPROM with DCPRG=HIGH. EEPROM data = 3Fh (default)
XERR 16 23 22 O Error output. XERR is an open-drain terminal. XERR goes L when LOD or TEF is detected.
Level triggered latch signal. When XLAT = high, the TLC5940 writes data from the input shift
XLAT 24 3 32 I register to either GS register (VPRG = low) or DC register (VPRG = high). When XLAT = low,
the data in GS or DC register is held constant.
Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 7
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PARAMETER MEASUREMENT INFORMATION
PIN EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS
VCC
INPUT
GND
400 W
INPUT EQUIVALENT CIRCUIT
(BLANK, XLAT, SCLK, SIN, GSCLK, DCPRG)
23 W
23
SOUT
GND
OUTPUT EQUIVALENT CIRCUIT (SOUT)
_
+
Amp
400 W
100 W
VCC
INPUT
GND
INPUT EQUIVALENT CIRCUIT (IREF)
XERR
GND
OUTPUT EQUIVALENT CIRCUIT (XERR)
23 W
INPUT
INPUT
GND
GND
INPUT EQUIVALENT CIRCUIT (VCC)
INPUT EQUIVALENT CIRCUIT (VPRG)
OUT
GND
OUTPUT EQUIVALENT CIRCUIT (OUT)
VCC
W
V(IREF)
TLC5940
SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007
Resistor values are equivalent resistances, and they are not tested.
Figure 1. Input and Output Equivalent Circuits
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SOUT
OUTn
t , t , t r0 f0 pd0 t , t , t , t , t , t , t , t r1 f1 pd1 pd2 pd3 pd4 pd5 d
VO = 4V
Testpoint
C = 15pF L
Testpoint
R = 51 L W
C = 15pF L
V = 1V O
OUTn
V = 1V to 3V O
OUTn
IREF
R (IREG) 470kΩ
Testpoint
V(IREF)
VCC
XERR
tpd3
I , I , I , I , I O(LC) O(LC0) O(LC1) O(LC2) O(LC3) D D D D DIO(LC4)
= 640W
TLC5940
SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 2. Parameter Measurement Circuits
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TYPICAL CHARACTERISTICS
100
1 k
10 k
IO
− Output Current − mA
0 20 60 100
Reference Resistor, R - (IREF) W
40 80 120
7.68 kΩ
1.92 kΩ
0.96 kΩ
0.64 kΩ
0.38 kΩ
0.32 kΩ
0.48 kΩ
0
1 k
3 k
4 k
2 k
TA
− Free-Air Temperature − C
o
-20 0 20 100
Power Dissipation Rate - mW
-40 40 60 80
TLC5940PWP
PowerPAD Soldered
TLC5940PWP
PowerPAD Unsoldered
TLC5940RHB
TLC5940NT
0
20
40
60
80
100
120
140
0 0.5 1 1.5 2 2.5 3
V - Output Voltage - V O
I - Output Current - mA O
T = 25 C,
V = 5 V
A
CC
° I = 120 mA O
I = 100 mA O
I = 80 mA O
I = 60 mA O
I = 40 mA O
I = 20 mA O
I = 5 mA O
55
56
57
58
59
60
61
62
63
64
65
0 0.5 1 1.5 2 2.5 3
V - Output Voltage - V O
I - Output Current - mA
O
I = 60 mA,
V = 5 V
O
CC T = 85 C A
°
T = -40 C A
°
T = 25 C A
°
TLC5940
SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007
REFERENCE RESISTOR POWER DISSIPATION RATE
vs vs
OUTPUT CURRENT FREE-AIR TEMPERATURE
Figure 3. Figure 4.
OUTPUT CURRENT OUTPUT CURRENT
vs vs
OUTPUT VOLTAGE OUTPUT VOLTAGE
Figure 5. Figure 6.
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-8
-6
-4
-2
0
2
4
6
8
0 20 40 60 80
I - Output Current - mA O
Δ I - Constant Output Current - % OLC
T = 25 C,
V = 5 V
A
CC
°
-8
-6
-4
-2
0
2
4
6
8
-40 -20 0 20 40 60 80 100
T - Ambient Temperature - C A
°
Δ I - Constant Output Current - % OLC
V = 3.3 V CC
V = 5 V CC
I = 60 mA O
0
20
40
60
80
100
120
140
0 10 20 30 40 50 60 70
Dot Correction Data - dec
I - Output Current - mA O
I = 5 mA O
I = 60 mA O
I = 80 mA O
I = 120 mA O
I = 30 mA O
T = 25 C,
V = 5 V
A
CC
°
0
10
20
30
40
50
60
70
0 10 20 30 40 50 60 70
Dot Correction Data - dec
I - Output Current - mA O
T = -40 C A
°
T = 25 C A
°
T = 85 C A
°
I = 60 mA,
V = 5 V
O
CC
TLC5940
SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007
TYPICAL CHARACTERISTICS (continued)
CONSTANT OUTPUT CURRENT, ΔIOLC CONSTANT OUTPUT CURRENT, ΔIOLC
vs vs
AMBIENT TEMPERATURE OUTPUT CURRENT
Figure 7. Figure 8.
OUTPUT CURRENT OUTPUT CURRENT
vs vs
DOT CORRECTION LINEARITY (ABS VALUE) DOT CORRECTION LINEARITY (ABS VALUE)
Figure 9. Figure 10.
Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 11
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PRINCIPLES OF OPERATION
SERIAL INTERFACE
VPRG
XLAT
SIN
SCLK
SOUT
BLANK
GSCLK
OUT0
(current)
OUT1
(current)
OUT15
(current)
XERR
1 96
DC
MSB
DC
LSB
DC
MSB
1 192 193 1 192 193 1
1 4096
t
t su4 h4
twh3
1
GS1
MSB
GS1
LSB
GS1
MSB
GS2
MSB
GS2
LSB
GS2
MSB
SID2
MSB
SID2
MSB-1
SID1
MSB
SID1
MSB-1
SID1
LSB
GS3
MSB
- - -
twh2
t
su2 t
su1 twh0
twl0
t
su0 th0
tpd0
tpd1
t + t pd1 d
t + 15 x t pd1 d
tpd3
td
15 x td
tpd2
t + t pd3 d
tpd3 tpd4
twl1
twh1
DC Data Input Mode GS Data Input Mode
1st GS Data Input Cycle 2nd GS Data Input Cycle
1st GS Data Output Cycle 2nd GS Data Output Cycle
t
su3 th3
th2 th1
t
su5
Tgsclk
touton
SIN(a) SIN SOUT SOUT(b)
TLC5940 (a)
GSCLK,
BLANK,
SIN SOUT
TLC5940 (b)
SCLK, XLAT,
VPRG
DCPRG,
TLC5940
SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007
The TLC5940 has a flexible serial interface, which can be connected to microcontrollers or digital signal
processors in various ways. Only 3 pins are needed to input data into the device. The rising edge of SCLK signal
shifts the data from the SIN pin to the internal register. After all data is clocked in, a high-level pulse of XLAT
signal latches the serial data to the internal registers. The internal registers are level-triggered latches of XLAT
signal. All data are clocked in with the MSB first. The length of serial data is 96 bit or 192 bit, depending on the
programming mode. Grayscale data and dot correction data can be entered during a grayscale cycle. Although
new grayscale data can be clocked in during a grayscale cycle, the XLAT signal should only latch the grayscale
data at the end of the grayscale cycle. Latching in new grayscale data immediately overwrites the existing
grayscale data. Figure 11 shows the timing chart. More than two TLC5940s can be connected in series by
connecting an SOUT pin from one device to the SIN pin of the next device. An example of cascading two
TLC5940s is shown in Figure 12 and the timing chart is shown in Figure 13. The SOUT pin can also be
connected to the controller to receive status information from TLC5940 as shown in Figure 22.
Figure 11. Serial Data Input Timing Chart
Figure 12. Cascading Two TLC5940 Devices
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VPRG
XLAT
SIN(a)
SCLK
SOUT(b)
BLANK
GSCLK
OUT0
(current)
OUT1
(current)
OUT15
(current)
XERR
1
192X2
DCb
MSB
DCa
LSB
DCb
MSB
1 384 385 1 384 385 1
1 4096 1
GSb1
MSB
GSa1
LSB
GSb1
MSB
GSb2
MSB
GSa2
LSB
GSb2
MSB
SIDb2
MSB
SIDb2
MSB-1
SIDb1
MSB
SIDb1
MSB-1
SIDa1
LSB
GSb3
MSB
- - -
192
96X2
ERROR INFORMATION OUTPUT
TEF: THERMAL ERROR FLAG
TLC5940
SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007
Figure 13. Timing Chart for Two Cascaded TLC5940 Devices
The open-drain output XERR is used to report both of the TLC5940 error flags, TEF and LOD. During normal
operating conditions, the internal transistor connected to the XERR pin is turned off. The voltage on XERR is
pulled up to VCC through an external pullup resistor. If TEF or LOD is detected, the internal transistor is turned
on, and XERR is pulled to GND. Since XERR is an open-drain output, multiple ICs can be OR'ed together and
pulled up to VCC with a single pullup resistor. This reduces the number of signals needed to report a system error
(see Figure 22).
To differentiate LOD and TEF signal from XERR pin, LOD can be masked out with BLANK = HIGH.
Table 2. XERR Truth Table
ERROR CONDITION ERROR INFORMATION SIGNALS
TEMPERATURE OUTn VOLTAGE TEF LOD BLANK XERR
TJ < T(TEF) Don't Care L X H
H
TJ > T(TEF) Don't Care H X L
OUTn > V(LED) L L H
TJ < T(TEF)
OUTn < V(LED) L H L
L
OUTn > V(LED) H L L
TJ > T(TEF)
OUTn < V(LED) H H L
The TLC5940 provides a temperature error flag (TEF) circuit to indicate an overtemperature condition of the IC. If
the junction temperature exceeds the threshold temperature (160C typical), TEF becomes H and XERR pin goes
to low level. When the junction temperature becomes lower than the threshold temperature, TEF becomes L and
XERR pin becomes high impedance. TEF status can also be read out from the TLC5940 status register.
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LOD: LED OPEN DETECTION
DELAY BETWEEN OUTPUTS
OUTPUT ENABLE
SETTING MAXIMUM CHANNEL CURRENT
Imax
V
(IREF)
R(IREF)
31.5
(6)
TLC5940
SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007
The TLC5940 has an LED-open detector that detects broken or disconnected LEDs. The LED open detector
pulls the XERR pin to GND when an open LED is detected. XERR and the corresponding error bit in the Status
Information Data is only active under the following open-LED conditions.
1. OUTn is on and the time tpd2 (1 µs typical) has passed.
2. The voltage of OUTn is < 0.3V (typical)
The LOD status of each output can be also read out from the SOUT pin. See STATUS INFORMATION OUTPUT
section for details. The LOD error bits are latched into the Status Information Data when XLAT returns to a low
after a high. Therefore, the XLAT pin must be pulsed high then low while XERR is active in order to latch the
LOD error into the Status Information Data for subsequent reading via the serial shift register.
The TLC5940 has graduated delay circuits between outputs. These circuits can be found in the constant current
driver block of the device (see the functional block diagram). The fixed-delay time is 20ns (typical), OUT0 has no
delay, OUT1 has 20ns delay, and OUT2 has 40ns delay, etc. The maximum delay is 300ns from OUT0 to
OUT15. The delay works during switch on and switch off of each output channel. These delays prevent large
inrush currents which reduces the bypass capacitors when the outputs turn on.
All OUTn channels of the TLC5940 can be switched off with one signal. When BLANK is set high, all OUTn
channels are disabled, regardless of logic operations of the device. The grayscale counter is also reset. When
BLANK is set low, all OUTn channels work under normal conditions. If BLANK goes low and then back high
again in less than 300ns, all outputs programmed to turn on still turn on for either the programmed number of
grayscale clocks, or the length of time that the BLANK signal was low, which ever is lower. For example, if all
outputs are programmed to turn on for 1ms, but the BLANK signal is only low for 200ns, all outputs still turn on
for 200ns, even though some outputs are turning on after the BLANK signal has already gone high.
Table 3. BLANK Signal Truth Table
BLANK OUT0 - OUT15
LOW Normal condition
HIGH Disabled
The maximum output current per channel is programmed by a single resistor, R(IREF), which is placed between
IREF pin and GND pin. The voltage on IREF is set by an internal band gap V(IREF) with a typical value of
1.24V. The maximum channel current is equivalent to the current flowing through R(IREF) multiplied by a factor of
31.5. The maximum output current per channel can be calculated by Equation 6:
where:
V(IREF) = 1.24 V
R(IREF) = User-selected external resistor.
Imax must be set between 5 mA and 120 mA. The output current may be unstable if Imax is set lower than 5 mA.
Output currents lower than 5 mA can be achieved by setting Imax to 5 mA or higher and then using dot
correction.
Figure 3 shows the maximum output current IO versus R(IREF). R(IREF)
is the value of the resistor between IREF
terminal to GND, and IO is the constant output current of OUT0 to OUT15. A variable power supply may be
connected to the IREF pin through a resistor to change the maximum output current per channel. The maximum
output current per channel is 31.5 times the current flowing out of the IREF pin.
14 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Link(s): TLC5940
www.ti.com
POWER DISSIPATION CALCULATION
P = V x I + D CC CC V x I OUT MAX x
DCn
63
x dPWM x N ( ) ( )
(7)
OPERATING MODES
SETTING DOT CORRECTION
IOUTn Imax DCn
63
(8)
TLC5940
SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007
The device power dissipation must be below the power dissipation rating of the device package to ensure correct
operation. Equation 7 calculates the power dissipation of device:
where:
VCC: device supply voltage
ICC: device supply current
VOUT: TLC5940 OUTn voltage when driving LED current
IMAX: LED current adjusted by R(IREF) Resistor
DCn: maximum dot correction value for OUTn
N: number of OUTn driving LED at the same time
dPWM: duty cycle defined by BLANK pin or GS PWM value
The TLC5940 has operating modes depending on the signals DCPRG and VPRG. Table 4 shows the available
operating modes. The TPS5940 GS operating mode (see Figure 11) and shift register values are not defined
after power up. One solution to solve this is to set dot correction data after TLS5940 power-up and switch back
to GS PWM mode. The other solution is to overflow the input shift register with 193 bits of dummy data and latch
it while TLS540 is in GS PWM mode. The values in the input shift register, DC register and GS register are
unknown just after power on. The DC and GS register values should be properly stored through the serial
interface before starting the operation.
Table 4. TLC5940 Operating Modes Truth Table
SIGNAL
INPUT SHIFT REGISTER MODE DC VALUE
DCPRG VPRG
L EEPROM
GND 192 bit Grayscale PWM Mode
H DC Register
L EEPROM
VCC 96 bit Dot Correction Data Input Mode
H DC Register
L EEPROM
H V(VPRG) X EEPROM Programming Mode Write dc register value to EEPROM. (Default
data: 3Fh)
The TLC5940 has the capability to fine adjust the output current of each channel OUT0 to OUT15 independently.
This is also called dot correction. This feature is used to adjust the brightness deviations of LEDs connected to
the output channels OUT0 to OUT15. Each of the 16 channels can be programmed with a 6-bit word. The
channel output can be adjusted in 64 steps from 0% to 100% of the maximum output current Imax. Dot correction
for all channels must be entered at the same time. Equation 8 determines the output current for each output n:
where:
Imax = the maximum programmable output current for each output.
DCn = the programmed dot correction value for output n (DCn = 0 to 63).
n = 0 to 15
Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Link(s): TLC5940
www.ti.com
DC 0.0
0
DC 1.0
6
DC 15.0
90
DC 15.5
95
DC 0.5
5
DC 14.5
89
MSB LSB
DC OUT15 DC OUT14 − DC OUT2 DC OUT0
tsu1
DC n
MSB
DC n
MSB−1
DC n
MSB−2
DC n
LSB+1
DC n
LSB
DC n
MSB
DC n+1
MSB
DC n+1
MSB−1
DC n
MSB−1
DC n
MSB−2
DC n−1
LSB
DC n−1
LSB+1
DC n−1
MSB
DC n−1
MSB−1
DC n−1
MSB−2
SCLK 1 2 3 95 96 1 2
SOUT
SIN
VPRG
XLAT
DC Mode Data
Input Cycle n DC Mode Data
Input Cycle n+1 VCC
twh0
twl0
DC n−1
LSB
twh2
th1
TLC5940
SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007
Figure 14 shows the dot correction data packet format which consists of 6 bits x 16 channel, total 96 bits. The
format is Big-Endian format. This means that the MSB is transmitted first, followed by the MSB-1, etc. The DC
15.5 in Figure 14 stands for the 5th most significant bit for output 15.
Figure 14. Dot Correction Data Packet Format
When VPRG is set to VCC, the TLC5940 enters the dot correction data input mode. The length of input shift
register becomes 96 bits. After all serial data are shifted in, the TLC5940 writes the data in the input shift register
to DC register when XLAT is high, and holds the data in the DC register when XLAT is low. The DC register is a
level triggered latch of XLAT signal. Since XLAT is a level-triggered signal, SCLK and SIN must not be changed
while XLAT is high. After XLAT goes low, data in the DC register is latched and does not change. BLANK signal
does not need to be high to latch in new data. XLAT has setup time (tsu1) and hold time (th1) to SCLK as shown
in Figure 15.
Figure 15. Dot Correction Data Input Timing Chart
The TLC5940 also has an EEPROM to store dot correction data. To store data from the dot correction register to
EEPROM, DCPRG is set to high after applying VPRG to the VPRG pin. Figure 16 shows the EEPROM
programming timings. The EEPROM has a default value of all 1s.
16 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Link(s): TLC5940
www.ti.com
VPRG
DCPRG
XLAT
SIN
SCLK
SOUT
1 96
DC
MSB
-
DC
MSB
DC
LSB
VCC
V(PRG)
t
su6 tprog th5
DCPRG
OUT0
(Current)
tpd5 tpd5
OUT15
(Current)
SETTING GRAYSCALE
Brightness in % GSn
4095 100
(9)
GS 0.0
0
GS 1.0
12
GS 15.0
180
GS 15.11
191
GS 0.11
11
GS 14.11
179
MSB LSB
GS OUT15 GS OUT14 − GS OUT2 GS OUT0
TLC5940
SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007
Figure 16. EEPROM Programming Timing Chart
Figure 17. DCPRG and OUTn Timing Diagram
The TLC5940 can adjust the brightness of each channel OUTn using a PWM control scheme. The use of 12 bits
per channel results in 4096 different brightness steps, respective 0% to 100% brightness. Equation 9 determines
the brightness level for each output n:
where:
GSn = the programmed grayscale value for output n (GSn = 0 to 4095)
n = 0 to 15
Grayscale data for all OUTn
Figure 18 shows the grayscale data packet format which consists of 12 bits x 16 channels, totaling 192 bits. The
format is Big-Endian format. This means that the MSB is transmitted first, followed by the MSB-1, etc.
Figure 18. Grayscale Data Packet Format
When VPRG is set to GND, the TLC5940 enters the grayscale data input mode. The device switches the input
shift register to 192-bit width. After all data is clocked in, a rising edge of the XLAT signal latches the data into
Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Link(s): TLC5940
www.ti.com
STATUS INFORMATION OUTPUT
LOD 15 X DC 15.5 DC 0.0 X X
0
23
LOD Data DC Values Reserved
MSB LSB
24 119 120
TEF
LOD 0 TEF
16
X
15 191
TLC5940
SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007
the grayscale register (see Figure 11). New grayscale data immediately becomes valid at the rising edge of the
XLAT signal; therefore, new grayscale data should be latched at the end of a grayscale cycle when BLANK is
high.The first GS data input cycle after dot correction requires an additional SCLK pulse after the XLAT signal to
complete the grayscale update cycle. All GS data in the input shift register is replaced with status information
data (SID) after updated the grayscale register.
The TLC5940 does have a status information register, which can be accessed in grayscale mode (VPRG=GND).
After the XLAT signal latches the data into the GS register the input shift register data will be replaced with status
information data (SID) of the device (see Figure 18). LOD, TEF, and dot correction EEPROM data
(DCPRG=LOW) or dot correction register data (DCPRG=HIGH) can be read out at SOUT pin. The status
information data packet is 192 bits wide. Bits 0-15 contain the LOD status of each channel. Bit 16 contains the
TEF status. If DCPRG is low, bits 24-119 contain the data of the dot-correction EEPROM. If DCPRG is high, bits
24-119 contain the data of the dot-correction register.The remaining bits are reserved. The complete status
information data packet is shown in Figure 19.
SOUT outputs the MSB of the SID at the same time the SID are stored in the SID register, as shown Figure 20.
The next SCLK pulse, which will be the clock for receiving the SMB of the next grayscale data, transmits MSB-1
of SID. If output voltage is < 0.3 V (typical) when the output sink current turns on, LOD status flage becomes
active. The LOD status flag is an internal signal that pulls XERR pin down to low when the LOD status flag
becomes active. The delay time, tpd2 (1 µs maximum), is from the time of turning on the output sink current to
the time LOD status flage becomes valid. The timing for each channel's LOD status to become valid is shifted by
the 30-ns (maximum) channel-to-channel turn-on time. After the first GSCLK goes high, OUT0 LOD status is
valid; tpd3 + tpd2 = 60 ns + 1 µs. OUT1 LOD status is valid; tpd3 + td + tpd2 = 60 ns + 30 ns + 1 µs = 1.09 µs.
OUT2 LOD status is valid; tpd3 + 2*td + tpd2 = 1.12 µs, and so on. It takes 1.51 µs maximum (tpd3 + 15*td +
tpd2) from the first GSCLK rising edge until all LOD become valid; tsuLOD must be > 1.51 µs (see Figure 20) to
ensure that all LOD data are valid.
Figure 19. Status Information Data Packet Format
18 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Link(s): TLC5940
www.ti.com
VPRG
XLAT
SIN
SCLK
SOUT
BLANK
GSCLK
OUT0
(current)
OUT1
(current)
OUT15
(current)
XERR
1 192 193 1 192
1 4096
GS1
MSB
GS1
LSB
GS1
MSB
GS2
MSB
GS2
LSB
GS2
MSB
SID1
MSB
SID1
MSB-1
SID1
LSB
- -
t + 15 x t + t pd3 d pd2
tpd3
td
15 x td
tpd2
GS Data Input Mode
1st GS Data Input Cycle 2nd GS Data Input Cycle
(1st GS Data Output Cycle)
t
suLOD
> tpd4 + 15 x td + tpd3
GRAYSCALE PWM OPERATION
TLC5940
SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007
Figure 20. Readout Status Information Data (SID) Timing Chart
The grayscale PWM cycle starts with the falling edge of BLANK. The first GSCLK pulse after BLANK goes low
increases the grayscale counter by one and switches on all OUTn with grayscale value not zero. Each following
rising edge of GSCLK increases the grayscale counter by one. The TLC5940 compares the grayscale value of
each output OUTn with the grayscale counter value. All OUTn with grayscale values equal to the counter values
are switched off. A BLANK=H signal after 4096 GSCLK pulses resets the grayscale counter to zero and
completes the grayscale PWM cycle (see Figure 21). When the counter reaches a count of FFFh, the counter
stops counting and all outputs turn off. Pulling BLANK high before the counter reaches FFFh immediately resets
the counter to zero.
Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Link(s): TLC5940
www.ti.com
GSCLK
BLANK
GS PWM
Cycle n
1 2 3 1
GS PWM
Cycle n+1
OUT0
OUT1
OUT15
XERR
n x t d
tpd1
tpd1 + td
tpd1 + 15 x td
tpd2
tpd3
twh1
twl1
twl1
tpd3
4096
th4 twh3
tpd3+ n x td
tsu4
(Current)
(Current)
(Current)
SERIAL DATA TRANSFER RATE
f
(GSCLK) 4096 f
(update)
f
(SCLK) 193 f
(update) n
(10)
TLC5940
SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007
Figure 21. Grayscale PWM Cycle Timing Chart
Figure 22 shows a cascading connection of n TLC5940 devices connected to a controller, building a basic
module of an LED display system. The maximum number of cascading TLC5940 devices depends on the
application system and is in the range of 40 devices. Equation 10 calculates the minimum frequency needed:
where:
f
(GSCLK): minimum frequency needed for GSCLK
f
(SCLK): minimum frequency needed for SCLK and SIN
f
(update): update rate of whole cascading system
n: number cascaded of TLC5940 device
20 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Link(s): TLC5940
www.ti.com
APPLICATION EXAMPLE
TLC5940
SIN SOUT
OUT0 OUT15
SCLK
GSCLK
XLAT
VPRG
BLANK
IREF
XERR
DCPRG
TLC5940
SIN SOUT
OUT0 OUT15
SCLK
GSCLK
XLAT
VPRG
BLANK
IREF
XERR
DCPRG
IC 0 IC n
7
SIN
SCLK
GSCLK
XLAT
BLANK
XERR
DCPRG Controller
SOUT
VPRG_D
VPRG_OE
W_EEPROM
100 k
50 k
50 k
50 k
50 k
50 k
50 k
VPRG
100 nF
VCC V(LED) V(LED) V(LED) V(LED)
100 nF
V(22V) V(22V)
VCC VCC
TLC5940
SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007
Figure 22. Cascading Devices
Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 21
Product Folder Link(s): TLC5940
PACKAGE OPTION ADDENDUM
www.ti.com 27-Jul-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TLC5940NT ACTIVE PDIP NT 28 13 Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type -40 to 85 TLC5940NT
TLC5940NTG4 ACTIVE PDIP NT 28 13 Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type -40 to 85 TLC5940NT
TLC5940PWP ACTIVE HTSSOP PWP 28 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TLC5940
TLC5940PWPG4 ACTIVE HTSSOP PWP 28 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TLC5940
TLC5940PWPR ACTIVE HTSSOP PWP 28 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TLC5940
TLC5940PWPRG4 ACTIVE HTSSOP PWP 28 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TLC5940
TLC5940RHBR ACTIVE VQFN RHB 32 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TLC
5940
TLC5940RHBRG4 ACTIVE VQFN RHB 32 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TLC
5940
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
PACKAGE OPTION ADDENDUM
www.ti.com 27-Jul-2013
Addendum-Page 2
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TLC5940 :
•
Enhanced Product: TLC5940-EP
NOTE: Qualified Version Definitions:
•
Enhanced Product - Supports Defense, Aerospace and Medical Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
TLC5940RHBR VQFN RHB 32 3000 330.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 27-Jul-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLC5940RHBR VQFN RHB 32 3000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 27-Jul-2013
Pack Materials-Page 2
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LC Filter
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4.5 V-26 V
PSU
Tuner AM/FM
CD/ MP3
Aux in
Left
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Audio Processor
And control
TPA3116D2
AM/FM Avoidance
Control
FAULTZ
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MUTE
Capable of synchronizing to other devices Sync
GAIN control and Master /Slave setting GAIN/SLV
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TPA3116D2, TPA3118D2, TPA3130D2
SLOS708D –APRIL 2012–REVISED JANUARY 2015
TPA3116D2 15-W, 30-W, 50-W Filter-Free Class-D Stereo Amplifier Family With AM
Avoidance
1 Features 3 Description
The TPA31xxD2 series are stereo efficient, digital
1• Supports Multiple Output Configurations
amplifier power stage for driving speakers up to 100
– 2 × 50 W Into a 4-Ω BTL Load at 21 V W / 2 Ω in mono. The high efficiency of the
(TPA3116D2) TPA3130D2 allows it to do 2 × 15 W without external
– 2 × 30 W Into a 8-Ω BTL Load at 24 V heat sink on a single layer PCB. The TPA3118D2 can
(TPA3118D2) even run 2 × 30 W / 8 Ω without heat sink on a dual
layer PCB. If even higher power is needed the
– 2 × 15 W Into a 8-Ω BTL Load at 15 V
TPA3116D2 does 2 × 50 W / 4 Ω with a small heat- (TPA3130D2) sink attached to its top side PowerPAD. All three
• Wide Voltage Range: 4.5 V to 26 V devices share the same footprint enabling a single
• Efficient Class-D Operation PCB to be used across different power levels.
– >90% Power Efficiency Combined With Low The TPA31xxD2 advanced oscillator/PLL circuit
Idle Loss Greatly Reduces Heat Sink Size employs a multiple switching frequency option to
– Advanced Modulation Schemes avoid AM interferences; this is achieved together with
an option of either master or slave option, making it
• Multiple Switching Frequencies possible to synchronize multiple devices.
– AM Avoidance
The TPA31xxD2 devices are fully protected against
– Master and Slave Synchronization faults with short-circuit protection and thermal
– Up to 1.2-MHz Switching Frequency protection as well as overvoltage, undervoltage, and
• Feedback Power-Stage Architecture With High DC protection. Faults are reported back to the
PSRR Reduces PSU Requirements processor to prevent devices from being damaged
during overload conditions.
• Programmable Power Limit
• Differential and Single-Ended Inputs Device Information(1)
• Stereo and Mono Mode With Single-Filter Mono PART NUMBER PACKAGE BODY SIZE (NOM)
Configuration DAD (32) TPA3116D2 11.00 mm × 6.20 mm DAP (32) • Single Power Supply Reduces Component Count
TPA3118D2 • Integrated Self-Protection Circuits Including DAP (32) 11.00 mm × 6.20 mm TPA3130D2
Overvoltage, Undervoltage, Overtemperature, DC-
(1) For all available packages, see the orderable addendum at Detect, and Short Circuit With Error Reporting the end of the datasheet.
• Thermally Enhanced Packages
– DAD Simplified Application Circuit (32-Pin HTSSOP Pad Up)
– DAP (32-Pin HTSSOP Pad Down)
• –40°C to 85°C Ambient Temperature Range
2 Applications
• Mini-Micro Component, Speaker Bar, Docks
• After-Market Automotive
• CRT TV
• Consumer Audio Applications
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPA3116D2, TPA3118D2, TPA3130D2
SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com
Table of Contents
1 Features.................................................................. 1 7.3 Feature Description................................................. 13
2 Applications ........................................................... 1 7.4 Device Functional Modes........................................ 24
3 Description ............................................................. 1 8 Applications and Implementation ...................... 25
8.1 Application Information............................................ 25 4 Revision History..................................................... 2
8.2 Typical Application .................................................. 25 5 Pin Configuration and Functions......................... 3
9 Power Supply Recommendations...................... 28 6 Specifications......................................................... 5
10 Layout................................................................... 28 6.1 Absolute Maximum Ratings ...................................... 5
10.1 Layout Guidelines ................................................. 28 6.2 ESD Ratings ............................................................ 5
10.2 Layout Example .................................................... 29 6.3 Recommended Operating Conditions....................... 5
10.3 Heat Sink Used on the EVM ................................. 31 6.4 Thermal Information.................................................. 6
6.5 DC Electrical Characteristics .................................... 6 11 Device and Documentation Support ................. 32
6.6 AC Electrical Characteristics..................................... 6 11.1 Related Links ........................................................ 32
6.7 Typical Characteristics .............................................. 8 11.2 Trademarks ........................................................... 32
11.3 Electrostatic Discharge Caution............................ 32 7 Detailed Description ............................................ 13
11.4 Glossary ................................................................ 32 7.1 Overview ................................................................. 13
7.2 Functional Block Diagram ....................................... 13 12 Mechanical, Packaging, and Orderable
Information ........................................................... 32
4 Revision History
Changes from Revision C (April 2012) to Revision D Page
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Changes from Revision B (May 2012) to Revision C Page
• Changed Notes 2 and 3 of the Thermal Information Table.................................................................................................... 6
• Changed the Gain (BTL) Test Condition values for R1 and R2............................................................................................. 6
• Changed the Gain (SLV) Test Condition values for R1 and R2............................................................................................. 6
• Changed the SYSTEM BLOCK DIAGRAM .......................................................................................................................... 13
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32
31
30
29
19
13
14
15
16 17
18
20
1
2
3
4
5
6
7
8
9
10
11
12 21
22
23
24
28
27
26
25
FAULTZ
SDZ
SYNC
AM0
AM1
MUTE
LINN
LINP
PLIMIT
RINN
GVDD
RINP
AVCC
OUTPR
PVCC
BSPL
GND
OUTPL
PVCC
OUTNL
BSNL
PVCC
OUTNR
BSNR
MODSEL
BSPR
GND
GND
PVCC
GND
GAIN/SLV
AM2
Thermal
PAD
32
31
30
29
19
13
14
15
16 17
18
20
1
2
3
4
5
6
7
8
9
10
11
12 21
22
23
24
28
27
26
25
FAULTZ
SDZ
SYNC
AM0
AM1
MUTE
LINN
LINP
PLIMIT
RINN
GVDD
RINP
AVCC
OUTPR
PVCC
BSPL
GND
OUTPL
PVCC
OUTNL
BSNL
PVCC
OUTNR
BSNR
MODSEL
BSPR
GND
GND
PVCC
GND
GAIN/SLV
AM2
Thermal
PAD
TPA3116D2, TPA3118D2, TPA3130D2
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5 Pin Configuration and Functions
DAD Package
32-Pin HTSSOP With PowerPAD Up
TPA3116D2 Only, Top View
DAP Package
32-Pin HTSSOP With PowerPAD Down
Top View
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Pin Functions
PIN
TYPE(1) DESCRIPTION
NO. NAME
1 MODSEL I Mode selection logic input (LOW = BD mode, HIGH = 1 SPW mode). TTL logic levels with compliance to
AVCC.
2 SDZ I Shutdown logic input for audio amp (LOW = outputs Hi-Z, HIGH = outputs enabled). TTL logic levels with
compliance to AVCC.
3 FAULTZ DO General fault reporting including Over-temp, DC Detect. Open drain.
FAULTZ = High, normal operation
FAULTZ = Low, fault condition
4 RINP I Positive audio input for right channel. Biased at 3 V.
5 RINN I Negative audio input for right channel. Biased at 3 V.
6 PLIMIT I Power limit level adjust. Connect a resistor divider from GVDD to GND to set power limit. Connect directly
to GVDD for no power limit.
7 GVDD PO Internally generated gate voltage supply. Not to be used as a supply or connected to any component other
than a 1 µF X7R ceramic decoupling capacitor and the PLIMIT and GAIN/SLV resistor dividers.
8 GAIN/SLV I Selects Gain and selects between Master and Slave mode depending on pin voltage divider.
9 GND G Ground
10 LINP I Positive audio input for left channel. Biased at 3 V. Connect to GND for PBTL mode.
11 LINN I Negative audio input for left channel. Biased at 3 V. Connect to GND for PBTL mode.
12 MUTE I Mute signal for fast disable/enable of outputs (HIGH = outputs Hi-Z, LOW = outputs enabled). TTL logic
levels with compliance to AVCC.
13 AM2 I AM Avoidance Frequency Selection
14 AM1 I AM Avoidance Frequency Selection
15 AM0 I AM Avoidance Frequency Selection
16 SYNC DIO Clock input/output for synchronizing multiple class-D devices. Direction determined by GAIN/SLV terminal.
17 AVCC P Analog Supply
18 PVCC P Power supply
19 PVCC P Power supply
20 BSNL BST Boot strap for negative left channel output, connect to 220 nF X5R, or better ceramic cap to OUTPL
21 OUTNL PO Negative left channel output
22 GND G Ground
23 OUTPL PO Positive left channel output
24 BSPL BST Boot strap for positive left channel output, connect to 220 nF X5R, or better ceramic cap to OUTNL
25 GND G Ground
26 BSNR BST Boot strap for negative right channel output, connect to 220 nF X5R, or better ceramic cap to OUTNR
27 OUTNR PO Negative right channel output
28 GND G Ground
29 OUTPR PO Positive right channel output
30 BSPR BST Boot strap for positive right channel output, connect to 220 nF X5R or better ceramic cap to OUTPR
31 PVCC P Power supply
32 PVCC P Power supply
33 PowerPAD G Connect to GND for best system performance. If not connected to GND, leave floating.
(1) TYPE: DO = Digital Output, I = Analog Input, G = General Ground, PO = Power Output, BST = Boot Strap.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage, VCC PVCC, AVCC –0.3 30 V
INPL, INNL, INPR, INNR –0.3 6.3 V
Input voltage, VI PLIMIT, GAIN / SLV, SYNC –0.3 GVDD+0.3 V
AM0, AM1, AM2, MUTE, SDZ, MODSEL –0.3 PVCC+0.3 V
Slew rate, maximum(2) AM0, AM1, AM2, MUTE, SDZ, MODSEL 10 V/ms
Operating free-air temperature, TA –40 85 °C
Operating junction temperature , TJ –40 150 °C
Storage temperature, Tstg –40 125 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) 100 kΩ series resistor is needed if maximum slew rate is exceeded.
6.2 ESD Ratings
VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000
V(ESD) Electrostatic discharge Charged-device model (CDM), per JEDEC specification JESD22- ±500 V
C101(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. .
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Supply voltage PVCC, AVCC 4.5 26 V
High-level input VIH AM0, AM1, AM2, MUTE, SDZ, SYNC, MODSEL 2 V
voltage
Low-level input VIL AM0, AM1, AM2, MUTE, SDZ, SYNC, MODSEL 0.8 V
voltage
Low-level output VOL FAULTZ, RPULL-UP = 100 kΩ, PVCC = 26 V 0.8 V
voltage
High-level input IIH AM0, AM1, AM2, MUTE, SDZ, MODSEL (VI = 2 V, VCC = 18 V) 50 µA
current
TPA3116D2, TPA3118D2 3.2 4
RL(BTL) Output filter: L = 10 µH, C = 680 nF
Minimum load TPA3130D2 5.6 8
Ω
Impedance TPA3116D2, TPA3118D2 1.6
RL(PBTL) Output filter: L = 10 µH, C = 1 µF
TPA3130D2 3.2 4
Output-filter Lo Minimum output filter inductance under short-circuit condition 1 µH
Inductance
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6.4 Thermal Information
TPA3130D2 TPA3118D2 TPA3116D2
THERMAL METRIC(1) DAP(2) DAP(3) DAD(4) UNIT
32 PINS 32 PINS 32 PINS
RθJA Junction-to-ambient thermal resistance 36 22 14
ψJT Junction-to-top characterization parameter 0.4 0.3 1.2 °C/W
ψJB Junction-to-board characterization parameter 5.9 4.7 5.7
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) For the PCB layout please see the TPA3130D2EVM user guide.
(3) For the PCB layout please see the TPA3118D2EVM user guide.
(4) The heat sink drawing used for the thermal model data are shown in the application section, size: 14mm wide, 50mm long, 25mm high.
6.5 DC Electrical Characteristics
TA = 25°C, AVCC = PVCC = 12 V to 24 V, RL = 4 Ω (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Class-D output offset voltage (measured | VOS | VI = 0 V, Gain = 36 dB 1.5 15 mV differentially)
SDZ = 2 V, No load or filter, PVCC = 12 V 20 35
ICC Quiescent supply current mA
SDZ = 2 V, No load or filter, PVCC = 24 V 32 50
Quiescent supply current in shutdown SDZ = 0.8 V, No load or filter, PVCC = 12 V <50
ICC(SD) µA mode SDZ = 0.8 V, No load or filter, PVCC = 24 V 50 400
Drain-source on-state resistance,
rDS(on) PVCC = 21 V, Iout = 500 mA, TJ = 25°C 120 mΩ measured pin to pin
R1 = 5.6 kΩ, R2 = Open 19 20 21
dB
R1 = 20 kΩ, R2 = 100 kΩ 25 26 27
G Gain (BTL)
R1 = 39 kΩ, R2 = 100 kΩ 31 32 33
dB
R1 = 47 kΩ, R2 = 75 kΩ 35 36 37
R1 = 51 kΩ, R2 = 51 kΩ 19 20 21
dB
R1 = 75 kΩ, R2 = 47 kΩ 25 26 27
G Gain (SLV)
R1 = 100 kΩ, R2 = 39 kΩ 31 32 33
dB
R1 = 100 kΩ, R2 = 16 kΩ 35 36 37
ton Turn-on time SDZ = 2 V 10 ms
tOFF Turn-off time SDZ = 0.8 V 2 µs
GVDD Gate drive supply IGVDD < 200 µA 6.4 6.9 7.4 V
Output voltage maximum under PLIMIT VO V(PLIMIT) = 2 V; VI = 1 Vrms 6.75 7.90 8.75 V
control
6.6 AC Electrical Characteristics
TA = 25°C, AVCC = PVCC = 12 V to 24 V, RL = 4 Ω (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
200 mVPP ripple at 1 kHz, Gain = 20 dB, Inputs AC- KSVR Power supply ripple rejection –70 dB coupled to GND
THD+N = 10%, f = 1 kHz, PVCC = 14.4 V 25
PO Continuous output power W
THD+N = 10%, f = 1 kHz, PVCC = 21 V 50
THD+N Total harmonic distortion + noise VCC = 21 V, f = 1 kHz, PO = 25 W (half-power) 0.1%
65 µV
Vn Output integrated noise 20 Hz to 22 kHz, A-weighted filter, Gain = 20 dB
–80 dBV
Crosstalk VO = 1 Vrms, Gain = 20 dB, f = 1 kHz –100 dB
Maximum output at THD+N < 1%, f = 1 kHz, Gain = 20 dB, SNR Signal-to-noise ratio 102 dB A-weighted
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AC Electrical Characteristics (continued)
TA = 25°C, AVCC = PVCC = 12 V to 24 V, RL = 4 Ω (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
AM2=0, AM1=0, AM0=0 376 400 424
AM2=0, AM1=0, AM0=1 470 500 530
AM2=0, AM1=1, AM0=0 564 600 636
AM2=0, AM1=1, AM0=1 940 1000 1060
fOSC Oscillator frequency kHz
AM2=1, AM1=0, AM0=0 1128 1200 1278
AM2=1, AM1=0, AM0=1
AM2=1, AM1=1, AM0=0 Reserved
AM2=1, AM1=1, AM0=1
Thermal trip point 150+ °C
Thermal hysteresis 15 °C
TPA3130D2 4.5
Over current trip point A
TPA3118D2, TPA3116D2 7.5
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0.001
0.01
0.1
1
10
20 100 1k 10k 20k
Frequency (Hz)
THD+N (%)
PO = 1W
PO = 5W
PO = 10W
Gain = 26dB
PVCC = 24V
TA = 25°C
RL = 8Ω
G006
0.001
0.01
0.1
1
10
0.01 0.1 1 10
Output Power (W)
THD+N (%)
f = 20Hz
f = 1kHz
f = 6kHz
Gain = 26dB
PVCC = 6V
TA = 25°C
RL = 4Ω
G008
0.001
0.01
0.1
1
10
20 100 1k 10k 20k
Frequency (Hz)
THD+N (%)
PO = 1W
PO = 5W
PO = 10W
Gain = 26dB
PVCC = 24V
TA = 25°C
RL = 4Ω
G004
0.001
0.01
0.1
1
10
20 100 1k 10k 20k
Frequency (Hz)
THD+N (%)
PO = 1W
PO = 2.5W
PO = 5W
Gain = 26dB
PVCC = 12V
TA = 25°C
RL = 8Ω
G005
0.001
0.01
0.1
1
10
20 100 1k 10k 20k
Frequency (Hz)
THD+N (%)
PO = 0.5W
PO = 1W
PO = 2.5W
Gain = 26dB
PVCC = 6V
TA = 25°C
RL = 4Ω
G002
0.001
0.01
0.1
1
10
20 100 1k 10k 20k
Frequency (Hz)
THD+N (%)
PO = 1W
PO = 2.5W
PO = 5W
Gain = 26dB
PVCC = 12V
TA = 25°C
RL = 4Ω
G003
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6.7 Typical Characteristics
fs = 400 kHz, BD Mode (unless otherwise noted)
Figure 1. Total Harmonic Distortion + Noise (BTL) vs Figure 2. Total Harmonic Distortion + Noise (BTL) vs
Frequency Frequency
Figure 3. Total Harmonic Distortion + Noise (BTL) vs Figure 4. Total Harmonic Distortion + Noise (BTL) vs
Frequency Frequency
Figure 5. Total Harmonic Distortion + Noise (BTL) vs Figure 6. Total Harmonic Distortion + Noise (BTL) vs Output
Frequency Power
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0
10
20
30
40
50
0 1 2 3 4
PLIMIT Voltage (V)
Output Power (W)
Gain = 26dB
TA = 25°C
PVCC = 24V
RL = 4Ω
G013
20 100 1k 10k 100k
−50
−40
−30
−20
−10
0
10
20
30
−500
−400
−300
−200
−100
0
100
200
300
Frequency (Hz)
Gain (dB)
Phase (°)
Gain
Phase
Gain = 26dB
PVCC = 12V
TA = 25°C
RL = 4Ω
G014
0.001
0.01
0.1
1
10
0.01 0.1 1 10 50
Output Power (W)
THD+N (%)
f = 20Hz
f = 1kHz
f = 6kHz
Gain = 26dB
PVCC = 12V
TA = 25°C
RL = 8Ω
G011
0.001
0.01
0.1
1
10
0.01 0.1 1 10 50
Output Power (W)
THD+N (%)
f = 20Hz
f = 1kHz
f = 6kHz
Gain = 26dB
PVCC = 24V
TA = 25°C
RL = 8Ω
G012
0.001
0.01
0.1
1
10
0.01 0.1 1 10 40
Output Power (W)
THD+N (%)
f = 20Hz
f = 1kHz
f = 6kHz
Gain = 26dB
PVCC = 12V
TA = 25°C
RL = 4Ω
G009
0.001
0.01
0.1
1
10
0.01 0.1 1 10 100
Output Power (W)
THD+N (%)
f = 20Hz
f = 1kHz
f = 6kHz
Gain = 26dB
PVCC = 24V
TA = 25°C
RL = 4Ω
G010
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Typical Characteristics (continued)
fs = 400 kHz, BD Mode (unless otherwise noted)
Figure 7. Total Harmonic Distortion + Noise (BTL) vs Output Figure 8. Total Harmonic Distortion + Noise (BTL) vs Output
Power Power
Figure 9. Total Harmonic Distortion + Noise (BTL) vs Output Figure 10. Total Harmonic Distortion + Noise (BTL) vs
Power Output Power
Figure 11. Output Power (BTL) vs Plimit Voltage Figure 12. Gain/Phase (BTL) vs Frequency
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−140
−130
−120
−110
−100
−90
−80
−70
−60
−50
−40
−30
−20
−10
0
20 100 1k 10k 20k
Frequency (Hz)
Crosstalk (dB)
Right to Left
Left to Right
Gain = 26dB
PVCC = 24V
TA = 25°C
RL = 8Ω
G021
−140
−130
−120
−110
−100
−90
−80
−70
−60
−50
−40
−30
−20
−10
0
20 100 1k 10k 20k
Frequency (Hz)
Crosstalk (dB)
Right to Left
Left to Right
Gain = 26dB
PVCC = 12V
TA = 25°C
RL = 4Ω
G022
0
10
20
30
40
50
60
70
80
90
100
0 5 10 15 20 25 30 35 40 45 50
Output Power (W)
Power Efficiency (%)
PVCC = 6V
PVCC =12V
PVCC = 24V
Gain = 26dB
TA = 25°C
RL = 8Ω
G017
0
10
20
30
40
50
60
70
80
90
100
0 5 10 15 20 25 30 35 40 45 50
Output Power (W)
Power Efficiency (%)
PVCC = 6V
PVCC = 12V
PVCC = 24V
Gain = 26dB
TA = 25°C
RL = 4Ω
G018
0
5
10
15
20
25
30
35
40
45
50
4 6 8 10 12 14 16 18 20 22 24 26
Supply Voltage (V)
Maximum Output Power (W)
THD+N = 1%
THD+N = 10%
Gain = 26dB
TA = 25°C
RL = 8Ω
G015
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
4 6 8 10 12 14 16 18 20 22 24 26
Supply Voltage (V)
Maximum Output Power (W)
THD+N = 1%
THD+N = 10%
Gain = 26dB
TA = 25°C
RL = 4Ω
G016
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Typical Characteristics (continued)
fs = 400 kHz, BD Mode (unless otherwise noted)
Figure 13. Maximum Output Power (BTL) vs Supply Voltage Figure 14. Maximum Output Power (BTL) vs Supply Voltage
Figure 15. Power Efficiency (BTL) vs Output Power Figure 16. Power Efficiency (BTL) vs Output Power
Figure 17. Crosstalk vs Frequency Figure 18. Crosstalk vs Frequency
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0
10
20
30
40
50
60
70
80
90
100
0 10 20 30 40 50 60 70 80 90 100
Output Power (W)
Power Efficiency (%)
PVCC = 6V
PVCC = 12V
PVCC =24V
Gain = 26dB
TA = 25°C
RL = 2Ω
G028
−100
−90
−80
−70
−60
−50
−40
−30
−20
−10
0
20 100 1k 10k 20k
Frequency (Hz)
kSVR (dB)
Gain = 26dB
PVCC = 12VDC + 200mVP-P
TA = 25°C
RL = 2Ω
G030
0.001
0.01
0.1
1
10
0.01 0.1 1 10 40
Output Power (W)
THD+N (%)
f = 20Hz
f = 1kHz
f = 6kHz
Gain = 26dB
PVCC = 12V
TA = 25°C
RL = 2Ω
G025
0
20
40
60
80
100
120
140
160
180
4 6 8 10 12 14 16 18 20 22 24 26
Supply Voltage (V)
Maximum Output Power (W)
THD+N = 1%
THD+N = 10%
Gain = 26dB
TA = 25°C
RL = 2Ω
G027
−100
−90
−80
−70
−60
−50
−40
−30
−20
−10
0
20 100 1k 10k 20k
Frequency (Hz)
kSVR (dB)
Left Channel
Right Channel
Gain = 26dB
PVCC = 12VDC + 200mVP-P
TA = 25°C
RL = 8Ω
G023
0.001
0.01
0.1
1
10
20 100 1k 10k 20k
Frequency (Hz)
THD+N (%)
PO = 1W
PO = 5W
PO = 10W
Gain = 26dB
PVCC = 12V
TA = 25°C
RL = 2Ω
G024
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Typical Characteristics (continued)
fs = 400 kHz, BD Mode (unless otherwise noted)
Figure 19. Supply Ripple Rejection Ratio (BTL) vs Figure 20. Total Harmonic Distortion + Noise (PBTL) vs
Frequency Frequency
Figure 21. Total Harmonic Distortion + Noise (PBTL) vs Figure 22. Maximum Output Power (PBTL) vs Supply
Output Power Voltage
Figure 23. Power Efficiency (PBTL) vs Output Power Figure 24. Supply Ripple Rejection Ratio (PBTL) vs
Frequency
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0.001
0.01
0.1
1
10
0.01 0.1 1 10 100 200
Output Power (W)
THD+N (%)
f = 20Hz
f = 1kHz
f = 6kHz
Gain = 26dB
PVCC = 24V
TA = 25°C
RL = 3Ω
G032
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
4 6 8 10 12 14 16 18 20 22 24 26
Supply Voltage (V)
Maximum Output Power (W)
THD+N = 1%
THD+N = 10%
Gain = 26dB
TA = 25°C
RL = 3Ω
G034
TPA3116D2, TPA3118D2, TPA3130D2
SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com
Typical Characteristics (continued)
fs = 400 kHz, BD Mode (unless otherwise noted)
Figure 25. Total Harmonic Distortion + Noise (PBTL) vs Figure 26. Maximum Output Power (PBTL) vs Supply
Output Power Voltage
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Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2
+
–
+
–
+ –
+
+
SDZ
MUTE
TTL
Buffer
Gain
Control
GAIN
OUTPR_FB
RINP
RINN
Gain
Control
OUTPNR_FB
FAULTZ
SYNC
GAIN/SLV
AM<2:0>
PLIMIT
AVCC
GVDD
LDO
Regulator
LINP
LINN
GND
Input
Sense PBTL
Select
OUTPL_FB
Gain
Control
OUTNL_FB
AVDD
GVDD
PLIMIT
Reference
Ramp
Generator
Biases and
References
Startup Protection
Logic
SC Detect
DC Detect
Thermal
Detect
UVLO/OVLO
PVCC
GVDD PVCC
Gate
Drive
OUTNL_
FB
PVCC GVDD
PVCC
Gate
Drive
PWM
Logic
Modulation and
PBTL Select OUTPL_FB
GND
OUTPL
BSPL
GND
OUTNL
BSNL
GND
BSNR
OUTPR
GND
OUTNR
OUTNR_
FB
BSPR
OUTPR_FB
PVCC GVDD
PVCC
Gate
Drive
PVCC GVDD
PVCC
Gate
Drive
PWM
Logic
Modulation and
PBTL Select
PLIMIT
PLIMIT
+
–
+
–
+
–
+
–
+
–
+
–
– –
Thermal
Pad
+
–
PVCC PVCC
TPA3116D2, TPA3118D2, TPA3130D2
www.ti.com SLOS708D –APRIL 2012–REVISED JANUARY 2015
7 Detailed Description
7.1 Overview
The TPA31xxD2 device is a highly efficient Class D audio amplifier with integrated 120m Ohms MOSFET that
allows output currents up to 7.5 A. The high efficiency allows the amplifier to provide an excellent audio
performance without the need for a bulky heat sink.
The device can be configured for either master or slave operation by using the SYNC pin. This helps to prevent
audible beats noise.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Gain Setting and Master and Slave
The gain of the TPA31xxD2 family is set by the voltage divider connected to the GAIN/SLV control pin. Master or
Slave mode is also controlled by the same pin. An internal ADC is used to detect the 8 input states. The first four
stages sets the GAIN in Master mode in gains of 20, 26, 32, 36 dB respectively, while the next four stages sets
the GAIN in Slave mode in gains of 20, 26, 32, 36 dB respectively. The gain setting is latched during power-up
and cannot be changed while device is powered. Table 1 lists the recommended resistor values and the state
and gain:
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i i
1
f
2 Z C p
ƒ =
5
6
7
8
9
10
INNR
PLIMIT
GVDD
GAIN/SLV
GND
2 1
C5 1 Fµ 2 1
2 1
R1 51 k
R2 51 k
TPA3116D2, TPA3118D2, TPA3130D2
SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com
Table 1. Gain and Master/Slave
MASTER / SLAVE GAIN R1 (to GND)(1) R2 (to GVDD)(1) INPUT IMPEDANCE MODE
Master 20 dB 5.6 kΩ OPEN 60 kΩ
Master 26 dB 20 kΩ 100 kΩ 30 kΩ
Master 32 dB 39 kΩ 100 kΩ 15 kΩ
Master 36 dB 47 kΩ 75 kΩ 9 kΩ
Slave 20 dB 51 kΩ 51 kΩ 60 kΩ
Slave 26 dB 75 kΩ 47 kΩ 30 kΩ
Slave 32 dB 100 kΩ 39 kΩ 15 kΩ
Slave 36 dB 100 kΩ 16 kΩ 9 kΩ
(1) Resistor tolerance should be 5% or better.
Figure 27. Gain, Master/Slave
In Master mode, SYNC terminal is an output, in Slave mode, SYNC terminal is an input for a clock input. TTL
logic levels with compliance to GVDD.
7.3.2 Input Impedance
The TPA31xxD2 family input stage is a fully differential input stage and the input impedance changes with the
gain setting from 9 kΩ at 36 dB gain to 60 kΩ at 20 dB gain. Table 1 lists the values from min to max gain. The
tolerance of the input resistor value is ±20% so the minimum value will be higher than 7.2 kΩ. The inputs need to
be AC-coupled to minimize the output dc-offset and ensure correct ramping of the output voltages during powerON
and power-OFF. The input ac-coupling capacitor together with the input impedance forms a high-pass filter
with the following cut-off frequency:
(1)
If a flat bass response is required down to 20 Hz the recommended cut-off frequency is a tenth of that, 2 Hz.
Table 2 lists the recommended ac-couplings capacitors for each gain step. If a -3 dB is accepted at 20 Hz 10
times lower capacitors can used – for example, a 1 µF can be used.
Table 2. Recommended Input AC-Coupling Capacitors
GAIN INPUT IMPEDANCE INPUT CAPACITANCE HIGH-PASS FILTER
20 dB 60 kΩ 1.5 µF 1.8 Hz
26 dB 30 kΩ 3.3 µF 1.6 Hz
32 dB 15 kΩ 5.6 µF 2.3 Hz
36 dB 9 kΩ 10 µF 1.8 Hz
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Input
Signal
Ci
IN Zi
Zf
TPA3116D2, TPA3118D2, TPA3130D2
www.ti.com SLOS708D –APRIL 2012–REVISED JANUARY 2015
Figure 28. Input Impedance
The input capacitors used should be a type with low leakage, like quality electrolytic, tantalum or ceramic. If a
polarized type is used the positive connection should face the input pins which are biased to 3 Vdc.
7.3.3 Startup and Shutdown Operation
The TPA31xxD2 family employs a shutdown mode of operation designed to reduce supply current (Icc) to the
absolute minimum level during periods of nonuse for power conservation. The SDZ input terminal should be held
high (see specification table for trip point) during normal operation when the amplifier is in use. Pulling SDZ low
will put the outputs to mute and the amplifier to enter a low-current state. It is not recommended to leave SDZ
unconnected, because amplifier operation would be unpredictable.
For the best power-off pop performance, place the amplifier in the shutdown mode prior to removing the power
supply. The gain setting is selected at the end of the start-up cycle. At the end of the start-up cycle, the gain is
selected and cannot be changed until the next power-up.
7.3.4 PLIMIT Operation
The TPA31xxD2 family has a built-in voltage limiter that can be used to limit the output voltage level below the
supply rail, the amplifier simply operates as if it was powered by a lower supply voltage, and thereby limits the
output power. Add a resistor divider from GVDD to ground to set the voltage at the PLIMIT pin. An external
reference may also be used if tighter tolerance is required. Add a 1 µF capacitor from pin PLIMIT to ground to
ensure stability. It is recommended to connect PLIMIT to GVDD when using 1SPW-modulation mode.
Figure 29. Power Limit Example
The PLIMIT circuit sets a limit on the output peak-to-peak voltage. The limiting is done by limiting the duty cycle
to a fixed maximum value. This limit can be thought of as a "virtual" voltage rail which is lower than the supply
connected to PVCC. This "virtual" rail is approximately 4 times the voltage at the PLIMIT pin. This output voltage
can be used to calculate the maximum output power for a given maximum input voltage and speaker impedance.
Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2
2
L
P
L S
OUT
L
R
V
R + 2 R
P = for unclipped power
2 R
æ ö æ ö ç ÷ ç ÷´
´ è ø è ø
´
TPA3116D2, TPA3118D2, TPA3130D2
SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com
where
• POUT (10%THD) = 1.25 × POUT (unclipped)
• RL
is the load resistance.
• RS is the total series resistance including RDS(on), and output filter resistance.
• VP is the peak amplitude
• VP = 4 × PLIMIT voltage if PLIMIT < 4 × VP (2)
Table 3. Power Limit Example
PVCC (V) PLIMIT VOLTAGE (V)(1) R to GND R to GVDD OUTPUT VOLTAGE (Vrms)
24 V GVDD Short Open 17.9
24 V 3.3 45 kΩ 51 kΩ 12.67
24 V 2.25 24 kΩ 51 kΩ 9
12 V GVDD Short Open 10.33
12 V 2.25 24 kΩ 51 kΩ 9
12 V 1.5 18 kΩ 68 kΩ 6.3
(1) PLIMIT measurements taken with EVM gain set to 26dB and input voltage set to 1Vrms.
7.3.5 GVDD Supply
The GVDD Supply is used to power the gates of the output full bridge transistors. It can also be used to supply
the PLIMIT and GAIN/SLV voltage dividers. Decouple GVDD with a X5R ceramic 1 µF capacitor to GND. The
GVDD supply is not intended to be used for external supply. It is recommended to limit the current consumption
by using resistor voltage dividers for GAIN/SLV and PLIMIT of 100 kΩ or more.
7.3.6 BSPx AND BSNx Capacitors
The full H-bridge output stages use only NMOS transistors. Therefore, they require bootstrap capacitors for the
high side of each output to turn on correctly. A 220 nF ceramic capacitor of quality X5R or better, rated for at
least 16 V, must be connected from each output to its corresponding bootstrap input. (See the application circuit
diagram in Figure 37.) The bootstrap capacitors connected between the BSxx pins and corresponding output
function as a floating power supply for the high-side N-channel power MOSFET gate drive circuitry. During each
high-side switching cycle, the bootstrap capacitors hold the gate-to-source voltage high enough to keep the highside
MOSFETs turned on.
7.3.7 Differential Inputs
The differential input stage of the amplifier cancels any noise that appears on both input lines of the channel. To
use the TPA31xxD2 family with a differential source, connect the positive lead of the audio source to the RINP or
LINP input and the negative lead from the audio source to the RINN or LINN input. To use the TPA31xxD2 family
with a single-ended source, ac ground the negative input through a capacitor equal in value to the input capacitor
on positive and apply the audio source to either input. In a single-ended input application, the unused input
should be ac grounded at the audio source instead of at the device input for best noise performance. For good
transient performance, the impedance seen at each of the two differential inputs should be the same.
The impedance seen at the inputs should be limited to an RC time constant of 1 ms or less if possible. This is to
allow the input dc blocking capacitors to become completely charged during the 10 ms power-up time. If the input
capacitors are not allowed to completely charge, there will be some additional sensitivity to component matching
which can result in pop if the input components are not well matched.
7.3.8 Device Protection System
The TPA31xxD2 family contains a complete set of protection circuits carefully designed to make system design
efficient as well as to protect the device against any kind of permanent failures due to short circuits, overload,
over temperature, and under-voltage. The FAULTZ pin will signal if an error is detected according to Table 4:
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Table 4. Fault Reporting
TRIGGERING CONDITION LATCHED/SELF- FAULT FAULTZ ACTION (typical value) CLEARING
Over Current Output short or short to PVCC or GND Low Output high impedance Latched
Over Temperature Tj > 150°C Low Output high impedance Latched
Too High DC Offset DC output voltage Low Output high impedance Latched
Under Voltage on PVCC < 4.5V – Output high impedance Self-clearing PVCC
Over Voltage on PVCC > 27V – Output high impedance Self-clearing PVCC
7.3.9 DC Detect Protection
The TPA31xxD2 family has circuitry which will protect the speakers from DC current which might occur due to
defective capacitors on the input or shorts on the printed circuit board at the inputs. A DC detect fault will be
reported on the FAULT pin as a low state. The DC Detect fault will also cause the amplifier to shutdown by
changing the state of the outputs to Hi-Z.
If automatic recovery from the short circuit protection latch is desired, connect the FAULTZ pin directly to the
SDZ pin. This allows the FAULTZ pin function to automatically drive the SDZ pin low which clears the DC Detect
protection latch.
A DC Detect Fault is issued when the output differential duty-cycle of either channel exceeds 60% for more than
420 msec at the same polarity. Table x below shows some examples of the typical DC Detect Protection
threshold for several values of the supply voltage. This feature protects the speaker from large DC currents or
AC currents less than 2Hz. To avoid nuisance faults due to the DC detect circuit, hold the SD pin low at powerup
until the signals at the inputs are stable. Also, take care to match the impedance seen at the positive and
negative inputs to avoid nuisance DC detect faults.
Table 5 lists the minimum output offset voltages required to trigger the DC detect. The outputs must remain at or
above the voltage listed in the table for more than 420 ms to trigger the DC detect.
Table 5. DC Detect Threshold
PVCC (V) VOS - OUTPUT OFFSET VOLTAGE (V)
4.5 0.96
6 1.3
12 2.6
18 3.9
7.3.10 Short-Circuit Protection and Automatic Recovery Feature
The TPA31xxD2 family has protection from over current conditions caused by a short circuit on the output stage.
The short circuit protection fault is reported on the FAULTZ pin as a low state. The amplifier outputs are switched
to a high impedance state when the short circuit protection latch is engaged. The latch can be cleared by cycling
the SDZ pin through the low state.
If automatic recovery from the short circuit protection latch is desired, connect the FAULTZ pin directly to the
SDZ pin. This allows the FAULTZ pin function to automatically drive the SDZ pin low which clears the shortcircuit
protection latch.
In systems where a possibility of a permanent short from the output to PVDD or to a high voltage battery like a
car battery can occur, pull the MUTE pin low with the FAULTZ signal with a inverting transistor to ensure a highZ
restart, like shown in the figure below:
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> 1.4sec
mP TPA3116D2
SDZ
MUTE
FAULTZ
SDZ
MUTE
FAULTZ
TPA3116D2, TPA3118D2, TPA3130D2
SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com
Figure 30. MUTE Driven by Inverted FAULTZ Figure 31. Timing Requirement for SDZ
7.3.11 Thermal Protection
Thermal protection on the TPA31xxD2 family prevents damage to the device when the internal die temperature
exceeds 150°C. There is a ±15°C tolerance on this trip point from device to device. Once the die temperature
exceeds the thermal trip point, the device enters into the shutdown state and the outputs are disabled. This is a
latched fault.
Thermal protection faults are reported on the FAULTZ terminal as a low state.
If automatic recovery from the thermal protection latch is desired, connect the FAULTZ pin directly to the SDZ
pin. This allows the FAULTZ pin function to automatically drive the SDZ pin low which clears the thermal
protection latch.
7.3.12 Device Modulation Scheme
The TPA31xxD2 family has the option of running in either BD modulation or 1SPW modulation; this is set by the
MODSEL pin.
7.3.12.1 MODSEL = GND: BD-Modulation
This is a modulation scheme that allows operation without the classic LC reconstruction filter when the amp is
driving an inductive load with short speaker wires. Each output is switching from 0 volts to the supply voltage.
The OUTPx and OUTNx are in phase with each other with no input so that there is little or no current in the
speaker. The duty cycle of OUTPx is greater than 50% and OUTNx is less than 50% for positive output voltages.
The duty cycle of OUTPx is less than 50% and OUTNx is greater than 50% for negative output voltages. The
voltage across the load sits at 0V throughout most of the switching period, reducing the switching current, which
reduces any I
2R losses in the load.
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OUTP
OUTN
OUTP-OUTN
Speaker
Current
OUTP
OUTN
OUTP-OUTN
Speaker
Current
OUTP
OUTN
OUTP-OUTN
Speaker
Current
0V
0V
PVCC
No Output
Positive Output
Negative Output
0A
0A
0V
-PVCC
TPA3116D2, TPA3118D2, TPA3130D2
www.ti.com SLOS708D –APRIL 2012–REVISED JANUARY 2015
Figure 32. BD Mode Modulation
7.3.12.2 MODSEL = HIGH: 1SPW-modulation
The 1SPW mode alters the normal modulation scheme in order to achieve higher efficiency with a slight penalty
in THD degradation and more attention required in the output filter selection. In 1SPW mode the outputs operate
at ~15% modulation during idle conditions. When an audio signal is applied one output will decrease and one will
increase. The decreasing output signal will quickly rail to GND at which point all the audio modulation takes place
through the rising output. The result is that only one output is switching during a majority of the audio cycle.
Efficiency is improved in this mode due to the reduction of switching losses. The THD penalty in 1SPW mode is
minimized by the high performance feedback loop. The resulting audio signal at each half output has a
discontinuity each time the output rails to GND. This can cause ringing in the audio reconstruction filter unless
care is taken in the selection of the filter components and type of filter used.
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OUTP
OUTN
OUTP-OUTN
Speaker
Current
OUTP
OUTN
OUTP-OUTN
Speaker
Current
OUTP
OUTN
OUTP-OUTN
Speaker
Current
0 V
0 V
PVCC
No Output
Positive Output
Negative Output
0A
0 A
0 V
-PVCC
TPA3116D2, TPA3118D2, TPA3130D2
SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com
Figure 33. 1SPW Mode Modulation
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7.3.13 Efficiency: LC Filter Required with the Traditional Class-D Modulation Scheme
The main reason that the traditional class-D amplifier-based on AD modulation needs an output filter is that the
switching waveform results in maximum current flow. This causes more loss in the load, which causes lower
efficiency. The ripple current is large for the traditional modulation scheme, because the ripple current is
proportional to voltage multiplied by the time at that voltage. The differential voltage swing is 2 × VCC, and the
time at each voltage is half the period for the traditional modulation scheme. An ideal LC filter is needed to store
the ripple current from each half cycle for the next half cycle, while any resistance causes power dissipation. The
speaker is both resistive and reactive, whereas an LC filter is almost purely reactive.
The TPA3116D2 modulation scheme has little loss in the load without a filter because the pulses are short and
the change in voltage is VCC instead of 2 × VCC. As the output power increases, the pulses widen, making the
ripple current larger. Ripple current could be filtered with an LC filter for increased efficiency, but for most
applications the filter is not needed.
An LC filter with a cutoff frequency less than the class-D switching frequency allows the switching current to flow
through the filter instead of the load. The filter has less resistance but higher impedance at the switching
frequency than the speaker, which results in less power dissipation, therefore increasing efficiency.
7.3.14 Ferrite Bead Filter Considerations
Using the Advanced Emissions Suppression Technology in the TPA3116D2 amplifier it is possible to design a
high efficiency class-D audio amplifier while minimizing interference to surrounding circuits. It is also possible to
accomplish this with only a low-cost ferrite bead filter. In this case it is necessary to carefully select the ferrite
bead used in the filter. One important aspect of the ferrite bead selection is the type of material used in the ferrite
bead. Not all ferrite material is alike, so it is important to select a material that is effective in the 10 to 100 MHz
range which is key to the operation of the class-D amplifier. Many of the specifications regulating consumer
electronics have emissions limits as low as 30 MHz. It is important to use the ferrite bead filter to block radiation
in the 30 MHz and above range from appearing on the speaker wires and the power supply lines which are good
antennas for these signals. The impedance of the ferrite bead can be used along with a small capacitor with a
value in the range of 1000 pF to reduce the frequency spectrum of the signal to an acceptable level. For best
performance, the resonant frequency of the ferrite bead/ capacitor filter should be less than 10 MHz.
Also, it is important that the ferrite bead is large enough to maintain its impedance at the peak currents expected
for the amplifier. Some ferrite bead manufacturers specify the bead impedance at a variety of current levels. In
this case it is possible to make sure the ferrite bead maintains an adequate amount of impedance at the peak
current the amplifier will see. If these specifications are not available, it is also possible to estimate the bead
current handling capability by measuring the resonant frequency of the filter output at low power and at maximum
power. A change of resonant frequency of less than fifty percent under this condition is desirable. Examples of
ferrite beads which have been tested and work well with the TPA3130D2 can be seen in the TPA3130D2EVM
user guide SLOU341.
A high quality ceramic capacitor is also needed for the ferrite bead filter. A low ESR capacitor with good
temperature and voltage characteristics will work best.
Additional EMC improvements may be obtained by adding snubber networks from each of the class-D outputs to
ground. Suggested values for a simple RC series snubber network would be 18 Ω in series with a 330 pF
capacitor although design of the snubber network is specific to every application and must be designed taking
into account the parasitic reactance of the printed circuit board as well as the audio amp. Take care to evaluate
the stress on the component in the snubber network especially if the amp is running at high PVCC. Also, make
sure the layout of the snubber network is tight and returns directly to the GND pins on the IC.
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Figure 34. TPA311xD2 Radiated Emissions
7.3.15 When to Use an Output Filter for EMI Suppression
The TPA3116D2 has been tested with a simple ferrite bead filter for a variety of applications including long
speaker wires up to 125 cm and high power. The TPA3116D2 EVM passes FCC class-B specifications under
these conditions using twisted speaker wires. The size and type of ferrite bead can be selected to meet
application requirements. Also, the filter capacitor can be increased if necessary with some impact on efficiency.
There may be a few circuit instances where it is necessary to add a complete LC reconstruction filter. These
circumstances might occur if there are nearby circuits which are sensitive to noise. In these cases a classic
second order Butterworth filter similar to those shown in the figures below can be used.
Some systems have little power supply decoupling from the AC line but are also subject to line conducted
interference (LCI) regulations. These include systems powered by "wall warts" and "power bricks." In these
cases, LC reconstruction filters can be the lowest cost means to pass LCI tests. Common mode chokes using
low frequency ferrite material can also be effective at preventing line conducted interference.
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OUTP
OUTN
10 µH
L1
10 µH
L2
C2
C3
0.68 µF
0.68 µF
OUTP
OUTN
Ferrite
Chip Bead
1 nF
1 nF
Ferrite
Chip Bead
4 - 8 W W
4 - 8 W W
TPA3116D2, TPA3118D2, TPA3130D2
www.ti.com SLOS708D –APRIL 2012–REVISED JANUARY 2015
Figure 35. TPA31xxD2 Output Filters
7.3.16 AM Avoidance EMI Reduction
To reduce interference in the AM radio band, the TPA3116D2 has the ability to change the switching frequency
via AM<2:0> pins. The recommended frequencies are listed in Table 6. The fundamental frequency and its
second harmonic straddle the AM radio band listed. This eliminates the tones that can be present due to the
switching frequency being demodulated by the AM radio.
Table 6. AM Frequencies
US EUROPEAN
SWITCHING FREQUENCY (kHz) AM2 AM1 AM0
AM FREQUENCY (kHz) AM FREQUENCY (kHz)
522-540
540-917 540-914 500 0 0 1
0 1 0
917-1125 914-1122 600 (or 400)
0 0 0
1125-1375 1122-1373 500 0 0 1
0 1 0
1375-1547 1373-1548 600 (or 400)
0 0 0
0 1 0
1547-1700 1548-1701 600 (or 500)
0 0 1
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TPA3116D2 4.5 V–26 V
PSU
LC Filter
OUTPR
OUTNR
OUTPL
OUTNL
Right
Left PBTL
Detect
TPA3116D2, TPA3118D2, TPA3130D2
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7.4 Device Functional Modes
7.4.1 Mono Mode (PBTL)
The TPA31xxD2 family can be connected in MONO mode enabling up to 100W output power. This is done by:
• Connect INPL and INNL directly to Ground (without capacitors) this sets the device in Mono mode during
power up.
• Connect OUTPR and OUTNR together for the positive speaker terminal and OUTNL and OUTPL together for
the negative pin.
• Analog input signal is applied to INPR and INNR.
Figure 36. Mono Mode
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8 Applications and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
This section describes a 2.1 Master and Slave application. The Master is configured as stereo outputs and the
Slave is configured as mono PBTL output.
8.2 Typical Application
A 2.1 solution, U1 TPA3116D2 in Master mode 400 kHz, BTL, gain if 20 dB, power limit not implemented. U2 in
Slave, PBTL mode gain of 20dB. Inputs are connected for differential inputs.
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Power Pad
U1
TPA3116D2
MODSEL
1
SDZ
2
FAULTZ
3
INPR
4
INNR
5
PLIMIT
6
GVDD
7
GAIN/SLV
8
GND
9
INPL
10
INNL
11
MUTE
12
AM2
13
AM1
14
AM0
15
SYNC
16
PVCC
32
PVCC
31
BSPR
30
OUTPR
29
GND
28
OUTNR
27
BSNR
26
GND
25
BSPL
24
OUTPL
23
GND
22
OUTNL
21
BSNL
20
PVCC
19
PVCC
18
AVCC
17
PVCC DECOUPLING
C17 220nF
1 2
PVCC DECOUPLING GND
C16 220nF
1 2
C13 1uF
2 1
C58 100nF
1 2
C29
680nF
2 1
L7 10uH
1 2
R10 3.3R
1 2
L8 10uH
1 2
C28
680nF
2 1
L9
10uH
1 2
C57
10nF
2 1
R12
20k
1 2
L10 10uH
1 2
C38
10nF
2 1
R14 100k
1 2
C25
220uF
1 2
C26
680nF
2 1
R18
3.3R
1 2
C40
10nF
2 1
R17
3.3R
1 2
GND
C41
1nF
2 1
C32
1nF
2 1
C11 1uF
2 1
C22
220uF
1 2
GND
C21
100nF
2 1
C20
1nF
2 1
C31
1nF
2 1
R15
3.3R
1 2
C33
1nF
2 1
R16
3.3R
1 2
GND
C19 220nF
1 2
C30
1nF
2 1
C27
680nF
2 1
C34
10nF
2 1
C37
10nF
2 1
IN_P_LEFT
IN_N_RIGHT
IN_N_LEFT
IN_P_RIGHT
GND
PVCC
GND GND
GND
GND
GND
GND GND
GND
OUT_ N_LEFT OUT_P_LEFT
-
+ OUT_N_RIGHT OUT_P_RIGHT
+
PVCC -
C14 1uF
2 1
R11
100k
1 2
MUTE_LR
OUTPUT LC FILTER
R13
100k
1 2
C15
1uF
2 1
EMI C-RC SNUBBER
C24
100nF
2 1
GND
PVCC
C18 220nF
1 2
GND
/SD_LR
PVCC
C23
1nF
2 1
GND
C12 1uF
2 1
R73
10k
1 2
C42 220nF
1 2
L15 10uH
1 2
L16 10uH
1 2
R21
75k
1 2
R22
100k
1 2
C50
220uF
1 2
C51
1uF
2 1
GND
C35 1uF
2 1
GND
C47
220uF
1 2
C46
100nF
2 1
C45
1nF
2 1
C54
1nF
2 1
R23
3.3R
1 2
GND
R24
3.3R
1 2
C44 220nF
1 2
C53
1nF
2 1
C52
1uF
2 1
C55
10nF
2 1
C56
10nF
2 1
IN_P_SUB
IN_N_SUB
GND
SYNC
GND
GND
GND
-
+ OUT_P_SUB OUT_N_SUB
PVCC
MUTE_SUB
R20
47k
1 2
OUTPUT LC FILTER
R19
100k
1 2
C39
1uF
2 1
C49
100nF
2 1
EMI C-RC SNUBBER
PVCC
C43 220nF
1 2
PVCC
/SD_SUB
C48
1nF
2 1
GND
C36 1uF
2 1
GND
Power Pad
U2
TPA3116D2
MODSEL
1
SDZ
2
FAULTZ
3
INPR
4
INNR
5
PLIMIT
6
GVDD
7
GAIN/SLV
8
GND
9
INPL
10
INNL
11
MUTE
12
AM2
13
AM1
14
AM0
15
SYNC
16
PVCC
32
PVCC
31
BSPR
30
OUTPR
29
GND
28
OUTNR
27
BSNR
26
GND
25
BSPL
24
OUTPL
23
GND
22
OUTNL
21
BSNL
20
PVCC
19
PVCC
18
AVCC
17
PVCC DECOUPLING
C43 220nF
1 2
PVCC DECOUPLING GND
4R
4R
2R
TPA3116D2, TPA3118D2, TPA3130D2
SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com
Typical Application (continued)
Figure 37. Schematic
8.2.1 Design Requriements
DESIGN PARAMETERS EXAMPLE VALUE
Input voltage range PVCC 4.5 V to 26 V
PWM output frequencies 400 kHz, 500 kHz, 600 kHz, 1 MHz or 1.2 MHz
Maximum output power 50 W
26 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated
Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2
TPA3116D2, TPA3118D2, TPA3130D2
www.ti.com SLOS708D –APRIL 2012–REVISED JANUARY 2015
8.2.2 Detailed Design Procedure
The TPA31xxD2 family is a very flexible and easy to use Class D amplifier; therefore the design process is
straightforward. Before beginning the design, gather the following information regarding the audio system.
• PVCC rail planned for the design
• Speaker or load impedance
• Maximum output power requirement
• Desired PWM frequency
8.2.2.1 Select the PWM Frequency
Set the PWM frequency by using AM0, AM1 and AM2 pins.
8.2.2.2 Select the Amplifier Gain and Master/Slave Mode
In order to select the amplifier gain setting, the designer must determine the maximum power target and the
speaker impedance. Once these parameters have been determined, calculate the required output voltage swing
which delivers the maximum output power.
Choose the lowest analog gain setting that corresponds to produce an output voltage swing greater than the
required output swing for maximum power. The analog gain and master/slave mode can be set by selecting the
voltage divider resistors (R1 and R2) on the Gain/SLV pin.
8.2.2.3 Select Input Capacitance
Select the bulk capacitors at the PVCC inputs for proper voltage margin and adequate capacitance to support the
power requirements. In practice, with a well-designed power supply, two 100-μF, 50-V capacitors should be
sufficient. One capacitor should be placed near the PVCC inputs at each side of the device. PVCC capacitors
should be a low ESR type because they are being used in a high-speed switching application.
8.2.2.4 Select Decoupling Capacitors
Good quality decoupling capacitors need to be added at each of the PVCC inputs to provide good reliability,
good audio performance, and to meet regulatory requirements. X5R or better ratings should be used in this
application. Consider temperature, ripple current, and voltage overshoots when selecting decoupling capacitors.
Also, these decoupling capacitors should be located near the PVCC and GND connections to the device in order
to minimize series inductances.
8.2.2.5 Select Bootstrap Capacitors
Each of the outputs require bootstrap capacitors to provide gate drive for the high-side output FETs. For this
design, use 0.22-μF, 25-V capacitors of X5R quality or better.
Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 27
Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2
0.001
0.01
0.1
1
10
0.01 0.1 1 10 40
Output Power (W)
THD+N (%)
f = 20Hz
f = 1kHz
f = 6kHz
Gain = 26dB
PVCC = 12V
TA = 25°C
RL = 4Ω
G009
0.001
0.01
0.1
1
10
0.01 0.1 1 10 100
Output Power (W)
THD+N (%)
f = 20Hz
f = 1kHz
f = 6kHz
Gain = 26dB
PVCC = 24V
TA = 25°C
RL = 4Ω
G010
TPA3116D2, TPA3118D2, TPA3130D2
SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com
8.2.3 Application Curves
Figure 38. Total Harmonic Distortion + Noise (BTL) vs Figure 39. Total Harmonic Distortion + Noise (BTL) vs
Output Power Output Power
9 Power Supply Recommendations
The power supply requirements for the TPA3116D2 consist of one higher-voltage supply to power the output
stage of the speaker amplifier. Several on-chip regulators are included on the TPA3116D2 to generate the
voltages necessary for the internal circuitry of the audio path. It is important to note that the voltage regulators
which have been integrated are sized only to provide the current necessary to power the internal circuitry. The
external pins are provided only as a connection point for off-chip bypass capacitors to filter the supply.
Connecting external circuitry to these regulator outputs may result in reduced performance and damage to the
device. The high voltage supply, between 4.5 V and 26 V, supplies the analog circuitry (AVCC) and the power
stage (PVCC). The AVCC supply feeds internal LDO including GVDD. This LDO output are connected to
external pins for filtering purposes, but should not be connected to external circuits. GVDD LDO output have
been sized to provide current necessary for internal functions but not for external loading.
10 Layout
10.1 Layout Guidelines
The TPA3116D2 can be used with a small, inexpensive ferrite bead output filter for most applications. However,
since the class-D switching edges are fast, it is necessary to take care when planning the layout of the printed
circuit board. The following suggestions will help to meet EMC requirements.
• Decoupling capacitors — The high-frequency decoupling capacitors should be placed as close to the PVCC
and AVCC terminals as possible. Large (100 μF or greater) bulk power supply decoupling capacitors should
be placed near the TPA3116D2 on the PVCC supplies. Local, high-frequency bypass capacitors should be
placed as close to the PVCC pins as possible. These caps can be connected to the IC GND pad directly for
an excellent ground connection. Consider adding a small, good quality low ESR ceramic capacitor between
220 pF and 1 nF and a larger mid-frequency cap of value between 100 nF and 1 µF also of good quality to
the PVCC connections at each end of the chip.
• Keep the current loop from each of the outputs through the ferrite bead and the small filter cap and back to
GND as small and tight as possible. The size of this current loop determines its effectiveness as an antenna.
• Grounding — The PVCC decoupling capacitors should connect to GND. All ground should be connected at
the IC GND, which should be used as a central ground connection or star ground for the TPA3116D2.
• Output filter — The ferrite EMI filter (see Figure 35) should be placed as close to the output terminals as
possible for the best EMI performance. The LC filter should be placed close to the outputs. The capacitors
used in both the ferrite and LC filters should be grounded.
28 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated
Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2
TPA3116D2, TPA3118D2, TPA3130D2
www.ti.com SLOS708D –APRIL 2012–REVISED JANUARY 2015
Layout Guidelines (continued)
For an example layout, see the TPA3116D2 Evaluation Module (TPA3116D2EVM) User Guide (SLOU336). Both
the EVM user manual and the thermal pad application reports, SLMA002 and SLMA004, are available on the TI
Web site at http://www.ti.com.
10.2 Layout Example
Figure 40. Layout Example Top
Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 29
Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2
TPA3116D2, TPA3118D2, TPA3130D2
SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com
Layout Example (continued)
Figure 41. Layout Example Bottom
30 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated
Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2
MACHINE THESE
3 EDGES AFTER
0.00 ANODIZATION
–0.60
+.000
–.024
SINK HEIGHT
25.00
.984
1.00
[.118]
3.00
[.118]
0
[.000]
10.00
[.394]
19.50
[.768]
30.50
[1.201]
40.00
[1.575]
50.00±0.38
[1.969±.015]
SINK LENGTH
3.00
[.118]
6.35
[.250]
13.90±0.38
[.547±.015]
BASE WIDTH
6.95
[.274]
5.00
[.197]
40.00
[1.575] 2X 4-40 6.5 x
TPA3116D2, TPA3118D2, TPA3130D2
www.ti.com SLOS708D –APRIL 2012–REVISED JANUARY 2015
10.3 Heat Sink Used on the EVM
The heat sink (part number ATS-TI 10 OP-521-C1-R1) used on the EVM is an 14x25x50 mm extruded aluminum
heat sink with three fins (see drawing below). For additional information on the heat sink, go to www.qats.com.
Figure 42. EVM Heatsink
This size heat sink has shown to be sufficient for continuous output power. The crest factor of music and having
airflow will lower the requirement for the heat sink size and smaller types can be used.
Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 31
Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2
TPA3116D2, TPA3118D2, TPA3130D2
SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com
11 Device and Documentation Support
11.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 7. Related Links
TECHNICAL TOOLS & SUPPORT &
PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY
TPA3116D2 Click here Click here Click here Click here Click here
TPA3118D2 Click here Click here Click here Click here Click here
TPA3130D2 Click here Click here Click here Click here Click here
11.2 Trademarks
All trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
32 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated
Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2014
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TPA3116D2DAD ACTIVE HTSSOP DAD 32 46 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR -40 to 85 TPA
3116
D2
TPA3116D2DADR ACTIVE HTSSOP DAD 32 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR -40 to 85 TPA
3116
D2
TPA3118D2DAP ACTIVE HTSSOP DAP 32 46 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR -40 to 85 TPA3118
TPA3118D2DAPR ACTIVE HTSSOP DAP 32 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR -40 to 85 TPA3118
TPA3130D2DAP ACTIVE HTSSOP DAP 32 46 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR -40 to 85 TPA3130
TPA3130D2DAPR ACTIVE HTSSOP DAP 32 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR -40 to 85 TPA3130
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2014
Addendum-Page 2
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
TPA3116D2DADR HTSSOP DAD 32 2000 330.0 24.4 8.6 11.5 1.6 12.0 24.0 Q1
TPA3118D2DAPR HTSSOP DAP 32 2000 330.0 24.4 8.6 11.5 1.6 12.0 24.0 Q1
TPA3130D2DAPR HTSSOP DAP 32 2000 330.0 24.4 8.6 11.5 1.6 12.0 24.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 25-Sep-2014
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPA3116D2DADR HTSSOP DAD 32 2000 367.0 367.0 45.0
TPA3118D2DAPR HTSSOP DAP 32 2000 367.0 367.0 45.0
TPA3130D2DAPR HTSSOP DAP 32 2000 367.0 367.0 45.0
PACKAGE MATERIALS INFORMATION
www.ti.com 25-Sep-2014
Pack Materials-Page 2
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15-V Digital or ±7.5-V Peak-to-Peak
Switching
125-Ω Typical On-State Resistance for 15-V
Operation
Switch On-State Resistance Matched to
Within 5 Ω Over 15-V Signal-Input Range
On-State Resistance Flat Over Full
Peak-to-Peak Signal Range
High On/Off Output-Voltage Ratio: 80 dB
Typical at fis = 10 kHz, RL = 1 kΩ
High Degree of Linearity: <0.5% Distortion
Typical at fis = 1 kHz, Vis = 5 V p-p,
VDD − VSS ≥ 10 V, RL = 10 kΩ
Extremely Low Off-State Switch Leakage,
Resulting in Very Low Offset Current and
High Effective Off-State Resistance: 10 pA
Typical at VDD − VSS = 10 V, TA = 25°C
Extremely High Control Input Impedance
(Control Circuit Isolated From Signal
Circuit): 1012 Ω Typical
Low Crosstalk Between Switches: −50 dB
Typical at fis = 8 MHz, RL = 1 kΩ
Matched Control-Input to Signal-Output
Capacitance: Reduces Output Signal
Transients
Frequency Response, Switch On = 40 MHz
Typical
100% Tested for Quiescent Current at 20 V
5-V, 10-V, and 15-V Parametric Ratings
Meets All Requirements of JEDEC Tentative
Standard No. 13-B, Standard Specifications
for Description of “B” Series CMOS
Devices
Applications:
− Analog Signal Switching/Multiplexing:
Signal Gating, Modulator, Squelch
Control, Demodulator, Chopper,
Commutating Switch
− Digital Signal Switching/Multiplexing
− Transmission-Gate Logic Implementation
− Analog-to-Digital and Digital-to-Analog
Conversion
− Digital Control of Frequency, Impedance,
Phase, and Analog-Signal Gain
description/ordering information
The CD4066B is a quad bilateral switch intended for the transmission or multiplexing of analog or digital signals.
It is pin-for-pin compatible with the CD4016B, but exhibits a much lower on-state resistance. In addition, the
on-state resistance is relatively constant over the full signal-input range.
The CD4066B consists of four bilateral switches, each with independent controls. Both the p and the n devices
in a given switch are biased on or off simultaneously by the control signal. As shown in Figure 1, the well of the
n-channel device on each switch is tied to either the input (when the switch is on) or to VSS (when the switch
is off). This configuration eliminates the variation of the switch-transistor threshold voltage with input signal and,
thus, keeps the on-state resistance low over the full operating-signal range.
The advantages over single-channel switches include peak input-signal voltage swings equal to the full supply
voltage and more constant on-state impedance over the input-signal range. However, for sample-and-hold
applications, the CD4016B is recommended.
!" #!$% & "' Copyright 2003, Texas Instruments Incorporated &! #" #" (" " ") !"
& & * +' &! # " , &" " " %+ %!&" " , %% # " " '
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
2
3
4
5
6
7
14
13
12
11
10
9
8
SIG A IN/OUT
SIG A OUT/IN
SIG B OUT/IN
SIG B IN/OUT
CONTROL B
CONTROL C
VSS
VDD
CONTROL A
CONTROL D
SIG D IN/OUT
SIG D OUT/IN
SIG C OUT/IN
SIG C IN/OUT
E, F, M, NS, OR PW PACKAGE
(TOP VIEW)
SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003
2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
description/ordering information (continued)
ORDERING INFORMATION
TA PACKAGE† ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
CDIP − F Tube of 25 CD4066BF3A CD4066BF3A
PDIP − E Tube of 25 CD4066BE CD4066BE
Tube of 50 CD4066BM
−55°C to 125°C SOIC − M Reel of 2500 CD4066BM96 CD4066BM
−55°C to 125°C SOIC − M
Reel of 250 CD4066BMT
CD4066BM
SOP − NS Reel of 2000 CD4066BNSR CD4066B
TSSOP − PW
Tube of 90 CD4066BPW
CM066B
Reel of 2000 CD4066BPWR
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
† All control inputs are protected by the CMOS protection network.
NOTES: A. All p substrates are connected to VDD.
B. Normal operation control-line biasing: switch on (logic 1), VC = VDD; switch off (logic 0), VC = VSS
C. Signal-level range: VSS ≤ Vis ≤ VDD
Control
VC†
VDD
VSS
VSS
n
n
p
Out
Vos
Control
Switch
In
92CS-29113
p n
Vis
Figure 1. Schematic Diagram of One-of-Four Identical Switches and Associated Control Circuitry
SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
DC supply-voltage range, VDD (voltages referenced to VSS terminal) −0.5 V to 20 V . . . . . . . . . . . . . . . . . . . .
Input voltage range, Vis (all inputs) −0.5 V to V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DD + 0.5 V
DC input current, IIN (any one input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±10 mA
Package thermal impedance, θJA (see Note 1): E package 80 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . °C/W
M package 86 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . °C/W
NS package 76 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . °C/W
PW package 113 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . °C/W
Lead temperature (during soldering):
At distance 1/16 ± 1/32 inch (1,59 ± 0,79 mm) from case for 10 s max 265 . . . . . . . . . . . . . . . . . . . . . . . °C
Storage temperature range, Tstg −65 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . °C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
MIN MAX UNIT
VDD Supply voltage 3 18 V
TA Operating free-air temperature −55 125 °C
SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003
4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics
LIMITS AT INDICATED TEMPERATURES
PARAMETER TEST CONDITIONS VIN VDD −55°C −40°C 85°C 125°C
PARAMETER TEST CONDITIONS 25°C UNIT VIN
(V)
VDD
(V) −55°C −40°C 85°C 125°C TYP MAX
UNIT
0, 5 5 0.25 0.25 7.5 7.5 0.01 0.25
IDD
Quiescent device 0, 10 10 0.5 0.5 15 15 0.01 0.5
IDD A Quiescent device
current 0, 15 15 1 1 30 30 0.01 1 µA current
0, 20 20 5 5 150 150 0.02 5
Signal Inputs (Vis) and Outputs (Vos)
VC = VDD,
RL = 10 kΩ returned
5 800 850 1200 1300 470 1050
ron On-state resistance
(max)
RL = 10 kΩ returned
to ,
VDD VSS
2 on 10 310 330 500 550 180 400 Ω (max) to ,
Vis = VSS to VDD
2
15 200 210 300 320 125 240
On-state resistance 5 15
∆ron
On-state resistance
difference between
any two switches
RL = 10 kΩ, VC = VDD ∆ron difference between 10 10 Ω
any two switches
RL = 10 kΩ, VC = VDD
15 5
Ω
THD Total harmonic
distortion
VC = VDD = 5 V, VSS = −5 V,
Vis(p-p) = 5 V (sine wave centered on 0 V),
RL = 10 kΩ, fis = 1-kHz sine wave
0.4 %
−3-dB cutoff
frequency
(switch on)
VC = VDD = 5 V, VSS = −5 V, Vis(p-p) = 5 V
(sine wave centered on 0 V), RL = 1 kΩ 40 MHz
−50-dB feedthrough
frequency (switch off)
VC = VSS = −5 V, Vis(p-p) = 5 V
(sine wave centered on 0 V), RL = 1 kΩ 1 MHz
Iis
Input/output leakage
current (switch off)
(max)
VC = 0 V, Vis = 18 V, Vos = 0 V;
and
VC = 0 V, Vis = 0 V, Vos = 18 V
18 ±0.1 ±0.1 ±1 ±1 ±10−5 ±0.1 µA
−50-dB crosstalk
frequency
VC(A) = VDD = 5 V,
VC(B) = VSS = −5 V,
Vis(A) = 5 Vp-p, 50-Ω source,
RL = 1 kΩ
8 MHz
Propagation delay
RL = 200 kΩ, VC = VDD,
VSS = GND, CL = 50 pF,
5 20 40
tpd
Propagation delay
(signal input to
signal output)
VSS = GND, CL = 50 pF,
Vis = 10 V
(square wave centered on 5 V),
pd (signal input to 10 10 20 ns
signal output)
is
(square wave centered on 5 V),
tr, tf = 20 ns 15 7 15
Cis Input capacitance VDD = 5 V, VC = VSS = −5 V 8 pF
Cos Output capacitance VDD = 5 V, VC = VSS = −5 V 8 pF
Cios Feedthrough VDD = 5 V, VC = VSS = −5 V 0.5 pF
SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5
electrical characteristics (continued)
LIMITS AT INDICATED TEMPERATURES
CHARACTERISTIC TEST CONDITIONS VDD −55°C −40°C 85°C 125°C
CHARACTERISTIC TEST CONDITIONS 25°C UNIT VDD
(V) −55°C −40°C 85°C 125°C TYP MAX
UNIT
Control (VC)
Control input, |Iis| < 10 µA, 5 1 1 1 1 1
VILC
Control input,
low voltage (max)
|Iis| < 10 µA,
Vis = VSS, VOS = VDD, and
V = V , V = V
VILC 10 2 2 2 2 2 V low voltage (max) Vis = VSS, VOS = VDD, and
Vis = VDD, VOS = VSS 15 2 2 2 2 2
V
Control input,
5 3.5 (MIN)
VIHC high voltage VIHC See Figure 6 10 7 (MIN) V high voltage See Figure 6
15 11 (MIN)
V
IIN Input current (max) Vis ≤ VDD, VDD − VSS = 18 V,
VCC ≤ VDD − VSS
18 ±0.1 ±0.1 ±1 ±1 ±10−5 ±0.1 µA
Crosstalk (control input
to signal output)
VC = 10 V (square wave),
tr, tf = 20 ns, RL = 10 kΩ 10 50 mV
Turn-on and turn-off VIN = VDD, tr, tf = 20 ns,
5 35 70
Turn-on and turn-off
propagation delay
VIN = VDD, tr, tf = 20 ns,
CL = 50 pF, RL = 1 kΩ 10 20 40 ns propagation delay CL = 50 pF, RL = 1 kΩ
15 15 30
ns
Vis = VDD, VSS = GND,
RL = 1 kΩ to GND, CL = 50 pF,
5 6
Maximum control input
repetition rate
RL = 1 kΩ to GND, CL = 50 pF,
VC = 10 V (square wave
centered on 5 V), tr, tf = 20 ns,
10 9 MHz repetition rate C
centered on 5 V), tr, tf = 20 ns,
Vos = 1/2 Vos at 1 kHz 15 9.5
CI Input capacitance 5 7.5 pF
switching characteristics
VDD
SWITCH INPUT SWITCH
VDD OUTPUT, Vos
(V) Vis
(V)
Iis (mA)
OUTPUT, Vos (V) (V) Vis
(V) −55°C −40°C 25°C 85°C 125°C MIN MAX
5 0 0.64 0.61 0.51 0.42 0.36 0.4
5 5 −0.64 −0.61 −0.51 −0.42 −0.36 4.6
10 0 1.6 1.5 1.3 1.1 0.9 0.5
10 10 −1.6 −1.5 −1.3 −1.1 −0.9 9.5
15 0 4.2 4 3.4 2.8 2.4 1.5
15 15 −4.2 −4 −3.4 −2.8 −2.4 13.5
SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003
6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Vis − Input Signal Voltage − V
600
500
400
300
200
100
0
−4 −3 −2 −1 0 1 2 3 4
TYPICAL ON-STATE RESISTANCE
vs
INPUT SIGNAL VOLTAGE (ALL TYPES)
92CS-27326RI
Figure 2
TA = 125°C
+25°C
−55°C
Supply Voltage (VDD − VSS) = 5 V
− Channel On-State Resistance − on
Ω r
Figure 3
TYPICAL ON-STATE RESISTANCE
vs
INPUT SIGNAL VOLTAGE (ALL TYPES)
300
250
200
150
100
50
0
−10 −7.5 −5 −2.5 0 2.5 5 7.5 10
Supply Voltage (VDD − VSS) = 10 V
TA = 125°C
Vis − Input Signal Voltage − V
+25°C
−55°C
92CS-27327RI
− Channel On-State Resistance − on
Ω r
Vis − Input Signal Voltage − V
TYPICAL ON-STATE RESISTANCE
vs
INPUT SIGNAL VOLTAGE (ALL TYPES)
Figure 4
300
250
200
150
100
50
0
−10 −7.5 −5 −2.5 0 2.5 5 7.5 10
Supply Voltage (VDD − VSS) = 15 V
TA = 125°C
+25°C
−55°C
92CS-27329RI
− Channel On-State Resistance − on
Ω r
Vis − Input Signal Voltage − V
Figure 5
TYPICAL ON-STATE RESISTANCE
vs
INPUT SIGNAL VOLTAGE (ALL TYPES)
600
500
400
300
200
100
0
−10 −7.5 −5 −2.5 0 2.5 5 7.5 10
Supply Voltage (VDD − VSS) = 5 V
TA = 125°C
10 V
−15 V
92CS-27330RI
− Channel On-State Resistance − on
Ω r
SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7
TYPICAL CHARACTERISTICS
CD4066B
1 of 4 Switches
Iis Vis Vos
92CS-30966
|Vis − Vos|
|Iis| ron =
Figure 6. Determination of ron as a Test Condition for Control-Input High-Voltage (VIHC) Specification
X-Y
Plotter
1-kΩ
Range
TG
On
Keithley
160 Digital
Multimeter
H. P.
Moseley
7030A
X
VSS
VDD
10 kΩ
92CS-22716
Y
Figure 7. Channel On-State Resistance Measurement Circuit
Figure 8
TYPICAL ON CHARACTERISTICS
FOR 1 OF 4 CHANNELS
3
2
1
0
−1
−2
−3
−3 −2 −1 0 1 2 3 4
VI − Input Voltage − V
92CS-30919
Output Voltage − V V −
VC = VDD VDD
Vis
Vos
RL
VSS
All unused terminals are
connected to VSS
CD4066B
1 of 4
Switches
O
Figure 9
10 102 103 10
101
102
103
104
f − Switching Frequency − kHz
POWER DISSIPATION PER PACKAGE
vs
SWITCHING FREQUENCY
TA = 25°C
Power Dissipation Per Package − W
D µ
6
4
2
6
4
2
6
4
2
6
4
2
2 46 2 46
92C-30920
5 V
10 V
VSS
VDD
5
6
13
12
7
CD4066B
P −
14
Supply Voltage
(VDD) = 15 V
SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003
8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
V VDD = 5 V C = −5 V
VSS = −5 V
Cios
Cis Cos
CD4066B
1 of 4
Switches
Measured on Boonton capacitance bridge, model 75a (1 MHz);
test-fixture capacitance nulled out.
92CS-30921
Figure 10. Typical On Characteristics
for One of Four Channels
VDD VC = VSS
Vos
VSS
CD4066B
1 of 4
Switches
Vis = VDD
I
92CS-30922
Figure 11. Off-Switch Input or Output Leakage
All unused terminals are connected to VSS.
VDD VC = VDD
Vos
VSS
CD4066B
1 of 4
Switches
Vis
Figure 12. Propagation Delay Time Signal Input
(Vis) to Signal Output (Vos)
92CS-30923
200 kΩ
50 pF
VDD
tr = tf = 20 ns
All unused terminals are connected to VSS.
VC VDD
Vos
VSS
CD4066B
1 of 4
Switches
Vis
Figure 13. Crosstalk-Control Input
to Signal Output
+10 V
tr = tf = 20 ns
92CS-30924
1 kΩ 10 kΩ
All unused terminals are connected to VSS.
SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9
TYPICAL CHARACTERISTICS
VDD
VC = VDD
Vos
VSS
CD4066B
1 of 4
Switches
VDD
92CS-30925
1 kΩ
50 pF
VDD
NOTES: A. All unused terminals are connected to VSS.
B. Delay is measured at Vos level of +10% from ground (turn-on) or on-state output level (turn-off).
tr = tf = 20 ns
Figure 14. Propagation Delay, tPLH, tPHL Control-Signal Output
VDD = 10 V
VC
VSS
CD4066B
1 of 4
Switches
Vis = 10 V
92CS-30925
50 pF 1 kΩ
tr = tf = 20 ns
VC
Vos
90%
10%
All unused terminals are connected to VSS.
VOS VOS at 1 kHz
2
VOS VOS at 1 kHz
2
Repetition
Rate
50%
tr tf
10 V
0 V
Figure 15. Maximum Allowable Control-Input Repetition Rate
SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003
10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Inputs
VSS
Measure inputs sequentially to both VDD and VSS. Connect all unused inputs to either VDD or VSS. Measure control inputs only.
I
VSS
VDD
92CS-27555
Figure 16. Input Leakage-Current Test Circuit
VDD
Channel 1
Channel 2
Channel 3
Channel 4
Channel 1
Channel 2
Channel 3
Channel 4
1/4 CD4066B CD4066B
CD4066B
CD4018B CD4018B
1/4 CD4066B
CD4001B
LPF
LPF
LPF
LPF
1
10 2 3 7 9 12
5 4
14
15 13
1 2
3
5
2
4
1
2
5
6
8
9
12
13
3
4
10
1
8
4
11
11
12
6 5 13
9
10
2
3
10 2 3 7 9 12
14
15
1
5 4
7
9
6
10
13 12 9 8 6 5 2 1
11 10 4 3
12 6 5 11
11 12
5
4 3 8
11
4
1
2
3
9
10
PE J1 J2 J3 J4 J5
Q1 Q2
1/3 CD4049B
CD4001B
Signal
Inputs
Clock
Reset
Package Count
2 - CD4001B
1 - CD4049B
3 - CD4066B
2 - CD4018B
1/3 CD4049B
1/6 CD4049B 10 k
Signal
Outputs
PE J1 J2 J3 J4 J5
Q1 Q2
External
Reset
Clock
Chan 1 Chan 2 Chan 3 Chan 4
VDD
30% (VDD − VSS)
Clock Maximum
Allowable
Signal Level VSS
92CM-30928
Ω
10 kΩ
10 kΩ
10 kΩ
10 kΩ
Figure 17. Four-Channel PAM Multiplex System Diagram
SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11
TYPICAL CHARACTERISTICS
SWA
SWB
SWC
SWD
92CS-30927
Analog Inputs (±5 V)
VDD = 5 V
VDD = 5 V
5 V
−5 V
5 V CD4066B
Analog Outputs (±5 V)
VSS = −5 V
CD4054B
VSS = 0 V
VEE = −5 V
IN
0
Digital
Control
Inputs
0
Figure 18. Bidirectional Signal Transmission Via Digital Control Logic
SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003
12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
In applications that employ separate power sources to drive VDD and the signal inputs, the VDD current capability
should exceed VDD/RL (RL = effective external load of the four CD4066B bilateral switches). This provision avoids
any permanent current flow or clamp action on the VDD supply when power is applied or removed from the CD4066B.
In certain applications, the external load-resistor current can include both VDD and signal-line components. To avoid
drawing VDD current when switch current flows into terminals 1, 4, 8, or 11, the voltage drop across the bidirectional
switch must not exceed 0.8 V (calculated from ron values shown).
No VDD current will flow through RL if the switch current flows into terminals 2, 3, 9, or 10.
PACKAGE OPTION ADDENDUM
www.ti.com 29-Mar-2015
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
CD4066BE ACTIVE PDIP N 14 25 Pb-Free
(RoHS)
CU NIPDAU | CU SN N / A for Pkg Type -55 to 125 CD4066BE
CD4066BEE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -55 to 125 CD4066BE
CD4066BF ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 CD4066BF
CD4066BF3A ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 CD4066BF3A
CD4066BF3AS2283 OBSOLETE CDIP J 14 TBD Call TI Call TI
CD4066BF3AS2534 OBSOLETE CDIP J 14 TBD Call TI Call TI
CD4066BM ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4066BM
CD4066BM96 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN Level-1-260C-UNLIM -55 to 125 CD4066BM
CD4066BM96E4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4066BM
CD4066BM96G4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4066BM
CD4066BME4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4066BM
CD4066BMG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4066BM
CD4066BMT ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4066BM
CD4066BNSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4066B
CD4066BPW ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM066B
CD4066BPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM066B
CD4066BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN Level-1-260C-UNLIM -55 to 125 CM066B
CD4066BPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM066B
PACKAGE OPTION ADDENDUM
www.ti.com 29-Mar-2015
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
JM38510/05852BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
05852BCA
M38510/05852BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
05852BCA
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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PACKAGE OPTION ADDENDUM
www.ti.com 29-Mar-2015
Addendum-Page 3
OTHER QUALIFIED VERSIONS OF CD4066B, CD4066B-MIL :
•
Catalog: CD4066B
•
Automotive: CD4066B-Q1, CD4066B-Q1
•
Military: CD4066B-MIL
NOTE: Qualified Version Definitions:
•
Catalog - TI's standard catalog product
•
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
CD4066BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4066BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4066BM96 SOIC D 14 2500 330.0 16.8 6.5 9.5 2.3 8.0 16.0 Q1
CD4066BM96G4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4066BM96G4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4066BMT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4066BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4066BPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 7-Apr-2014
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4066BM96 SOIC D 14 2500 333.2 345.9 28.6
CD4066BM96 SOIC D 14 2500 367.0 367.0 38.0
CD4066BM96 SOIC D 14 2500 364.0 364.0 27.0
CD4066BM96G4 SOIC D 14 2500 367.0 367.0 38.0
CD4066BM96G4 SOIC D 14 2500 333.2 345.9 28.6
CD4066BMT SOIC D 14 250 367.0 367.0 38.0
CD4066BNSR SO NS 14 2000 367.0 367.0 38.0
CD4066BPWR TSSOP PW 14 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 7-Apr-2014
Pack Materials-Page 2
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Copyright © 2015, Texas Instruments Incorporated
TAS5707, TAS5707A
www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009
20-W STEREO DIGITAL AUDIO POWER AMPLIFIER WITH EQ AND DRC
Check for Samples: TAS5707 TAS5707A
1FEATURES
23• Audio Input/Output Night-Mode Listening
– 20-W Into an 8-Ω Load From an 18-V Supply – Autobank Switching: Preload Coefficients
– Wide PVDD Range, From 8 V to 26 V for Different Sample Rates. No Need to
Write New Coefficients to the Part When
– Efficient Class-D Operation Eliminates Sample Rate Changes. Need for Heatsinks
– Autodetect: Automatically Detects
– Requires Only 3.3 V and PVDD Sample-Rate Changes. No Need for
– One Serial Audio Input (Two Audio External Microprocessor Intervention Channels)
– Supports 8-kHz to 48-kHz Sample Rate APPLICATIONS
(LJ/RJ/I2S) • Television
• Audio/PWM Processing • iPod™ Dock
– Independent Channel Volume Controls With • Sound Bar
24 dB to Mute
– Soft Mute (50% Duty Cycle) DESCRIPTION
– Programmable Dynamic Range Control The TAS5707 is a 20-W, efficient, digital-audio power
– 14 Programmable Biquads for Speaker EQ amplifier for driving stereo bridge-tied speakers. One
and Other Audio Processing Features serial data input allows processing of up to two
discrete audio channels and seamless integration to
– Programmable Coefficients for DRC Filters most digital audio processors and MPEG decoders.
– DC Blocking Filters The device accepts a wide range of input data and
• General Features data rates. A fully programmable data path routes
these channels to the internal speaker drivers.
– Serial Control Interface Operational Without
MCLK The TAS5707 is a slave-only device receiving all
clocks from external sources. The TAS5707 operates – Factory-Trimmed Internal Oscillator for
with a PWM carrier between a 384-kHz switching rate Automatic Rate Detection and 352-KHz switching rate, depending on the input
– Surface Mount, 48-PIN, 7-mm × 7-mm sample rate. Oversampling combined with a
HTQFP Package fourth-order noise shaper provides a flat noise floor
– Thermal and Short-Circuit Protection and excellent dynamic range from 20 Hz to 20 kHz..
• Benefits The TAS5707A is identical in function to the HTQFP
packaged TAS5707, but has a unique I
2
– EQ: Speaker Equalization Improves Audio C device
Performance address. The address of the TAS5707 is 0x36. The
address of the TAS5707A is 0x3A.
– DRC: Dynamic Range Compression. Can
Be Used As Power Limiter. Enables
Speaker Protection, Easy Listening,
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2iPod is a trademark of Apple Inc.
3All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2008–2009, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SDIN
LRCLK
SCLK
MCLK
RESET
PDN
SDA
PLL_FLTM
PLL_FLTP
AVDD/DVDD PVDD
OUT_A
OUT_C
OUT_B
OUT_D
BST_A
BST_C
BST_B
BST_D
3.3 V 8 V–26 V
SCL
Digital
Audio
Source
I C
Control
2
Control
Inputs
LC
LC
Left
Right
B0264-11
Loop
Filter(1)
TAS5707, TAS5707A
SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
SIMPLIFIED APPLICATION DIAGRAM
(1)See user's guide for loop-filter details.
2 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TAS5707 TAS5707A
SDIN
MCLK
SCLK
LRCLK
Serial
Audio
Port
7 BQ L
R
V
O
L
U
M
E
DRC
Protection
Logic
Click and Pop
Control
7 BQ
SDA
SCL
4
Order
th
Noise
Shaper
and
PWM
S
R
C
mDAP
Sample Rate
Autodetect
and PLL
Serial
Control
Microcontroller
Based
System
Control
Terminal Control
OUT_A
OUT_B
2 HB ´
FET Out
OUT_C
OUT_D
2 HB ´
FET Out
B0262-02
TAS5707, TAS5707A
www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009
FUNCTIONAL VIEW
Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TAS5707 TAS5707A
Temp.
Sense
VALID
FAULT
AGND
OC_ADJ
Power
On
Reset
Undervoltage
Protection
GND
PWM_D
OUT_D
PGND_CD
PVDD_D
BST_D
Gate
Drive
PWM
Rcv
Overcurrent
Protection
4
Protection
and
I/O Logic
PWM_C
OUT_C
PGND_CD
PVDD_C
BST_C
Timing Gate
Drive Ctrl PWM
Rcv
GVDD_CD
PWM_B
OUT_B
PGND_AB
PVDD_B
BST_B
Timing Gate
Drive Ctrl PWM
Rcv
PWM_A
OUT_A
PGND_AB
PVDD_A
BST_A
Timing Gate
Drive Ctrl PWM
Rcv
GVDD_AB
Ctrl
Pulldown Resistor
Pulldown Resistor
Pulldown Resistor
Pulldown Resistor
4
GVDD_CD
Regulator
GVDD_AB
Regulator
Timing
I
sense
B0034-05
PWM Controller
FAULT
TAS5707, TAS5707A
SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com
Figure 1. Power Stage Functional Block Diagram
4 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TAS5707 TAS5707A
Vol1
R
L
7 BQ EQ ´
´
ealpha
ealpha
´
´
7 BQ EQ
Input Muxing
Vol2
B0341-01
1
Energy
MAXMUX
Attack
Decay DRC1
DRC
ON/OFF
50[D7]
30–36
29–2F
3A
3A
3B–3C
46[D0]
To PWM
Hex numbers refer to I2C subaddresses
[Di] = bit "i" of subaddress
SSTIMER
OC_ADJ
PLL_FLTP
VR_ANA
NC
AVSS
PLL_FLTM
BST_A
GVDD_OUT
PVDD_A
OUT_A
RESET
PVDD_A
STEST
PDN
VR_DIG
OSC_RES
DVSSO
DVDD
FAULT
MCLK
SCLK
SDIN
LRCLK
AVDD
SDA
SCL
DVSS
GND
VREG
PVDD_B
BST_B
PVDD_C
OUT_C
PVDD_D
BST_D
PGND_AB
OUT_B
PGND_CD
OUT_D
AGND
PGND_AB
PVDD_B
PGND_CD
PVDD_D
BST_C
PVDD_C
GVDD_OUT
P0075-01
PHP Package
(Top View)
TAS5707
1
2
3
4
5
6
7
8
9
10
11
12
13 14 15 16 17 18 19 20 21 22 23 24
25
26
27
28
29
30
31
32
48 47 46 45 44 43 42 41 40 39 38 37
36
35
34
33
TAS5707, TAS5707A
www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009
DAP Process Structure
48-TERMINAL, HTQFP PACKAGE (TOP VIEW)
Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): TAS5707 TAS5707A
TAS5707, TAS5707A
SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com
PIN FUNCTIONS
PIN TYPE 5-V TERMINATION
(1) DESCRIPTION TOLERANT (2) NAME NO.
AGND 30 P Analog ground for power stage
AVDD 13 P 3.3-V analog power supply
AVSS 9 P Analog 3.3-V supply ground
BST_A 4 P High-side bootstrap supply for half-bridge A
BST_B 43 P High-side bootstrap supply for half-bridge B
BST_C 42 P High-side bootstrap supply for half-bridge C
BST_D 33 P High-side bootstrap supply for half-bridge D
DVDD 27 P 3.3-V digital power supply
DVSSO 17 P Oscillator ground
DVSS 28 P Digital ground
FAULT 14 DO Backend error indicator. Asserted LOW for over temperature, over
current, over voltage, and under voltage error conditions. De-asserted
upon recovery from error condition.
GND 29 P Analog ground for power stage
GVDD_OUT 5, 32 P Gate drive internal regulator output
LRCLK 20 DI 5-V Pulldown Input serial audio data left/right clock (sample rate clock)
MCLK 15 DI 5-V Pulldown Master clock input
NC 8 – No connection
OC_ADJ 7 AO Analog overcurrent programming. Requires resistor to ground.
OSC_RES 16 AO Oscillator trim resistor. Connect an 18.2-kΩ 1% resistor to DVSSO.
OUT_A 1 O Output, half-bridge A
OUT_B 46 O Output, half-bridge B
OUT_C 39 O Output, half-bridge C
OUT_D 36 O Output, half-bridge D
PDN 19 DI 5-V Pullup Power down, active-low. PDN prepares the device for loss of power
supplies by shutting down the noise shaper and initiating PWM stop
sequence.
PGND_AB 47, 48 P Power ground for half-bridges A and B
PGND_CD 37, 38 P Power ground for half-bridges C and D
PLL_FLTM 10 AO PLL negative loop filter terminal
PLL_FLTP 11 AO PLL positive loop filter terminal
PVDD_A 2, 3 P Power supply input for half-bridge output A
PVDD_B 44, 45 P Power supply input for half-bridge output B
PVDD_C 40, 41 P Power supply input for half-bridge output C
PVDD_D 34, 35 P Power supply input for half-bridge output D
RESET 25 DI 5-V Pullup Reset, active-low. A system reset is generated by applying a logic low
to this pin. RESET is an asynchronous control signal that restores the
DAP to its default conditions, and places the PWM in the hard mute
state (tristated).
SCL 24 DI 5-V I
2C serial control clock input
SCLK 21 DI 5-V Pulldown Serial audio data clock (shift clock). SCLK is the serial audio port input
data bit clock.
SDA 23 DIO 5-V I
2C serial control data interface input/output
SDIN 22 DI 5-V Pulldown Serial audio data input. SDIN supports three discrete (stereo) data
formats.
(1) TYPE: A = analog; D = 3.3-V digital; P = power/ground/decoupling; I = input; O = output
(2) All pullups are weak pullups and all pulldowns are weak pulldowns. The pullups and pulldowns are included to assure proper input logic
levels if the pins are left unconnected (pullups → logic 1 input; pulldowns → logic 0 input).
6 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TAS5707 TAS5707A
TAS5707, TAS5707A
www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009
PIN FUNCTIONS (continued)
PIN TYPE 5-V TERMINATION
(1) DESCRIPTION TOLERANT (2) NAME NO.
SSTIMER 6 AI Controls ramp time of OUT_X to minimize pop. Leave this pin floating
for BD mode. Requires capacitor of 2.2 nF to GND in AD mode. The
capacitor determines the ramp time.
STEST 26 DI Factory test pin. Connect directly to DVSS.
VR_ANA 12 P Internally regulated 1.8-V analog supply voltage. This pin must not be
used to power external devices.
VR_DIG 18 P Internally regulated 1.8-V digital supply voltage. This pin must not be
used to power external devices.
VREG 31 P Digital regulator output. Not to be used for powering external circuitry.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
VALUE UNIT
DVDD, AVDD –0.3 to 3.6 V
Supply voltage
PVDD_X –0.3 to 30 V
OC_ADJ –0.3 to 4.2 V
3.3-V digital input –0.5 to DVDD + 0.5 V
Input voltage
5-V tolerant(2) digital input (except MCLK) –0.5 to DVDD + 2.5(3) V
5-V tolerant MCLK input –0.5 to AVDD + 2.5(3) V
OUT_x to PGND_X 32(4) V
BST_x to PGND_X 43(4) V
Input clamp current, IIK ±20 mA
Output clamp current, IOK ±20 mA
Operating free-air temperature 0 to 85 °C
Operating junction temperature range 0 to 150 °C
Storage temperature range, Tstg –40 to 125 °C
(1) Stresses beyond those listed under absolute ratings may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under recommended operation conditions are
not implied. Exposure to absolute-maximum conditions for extended periods may affect device reliability.
(2) 5-V tolerant inputs are PDN, RESET, SCLK, LRCLK, MCLK, SDIN, SDA, and SCL.
(3) Maximum pin voltage should not exceed 6.0Vele
(4) DC voltage + peak ac waveform measured at the pin should be below the allowed limit for all conditions.
DISSIPATION RATINGS(1)
DERATING FACTOR TA ≤ 25°C TA = 45°C TA = 70°C
PACKAGE ABOVE TA = 25°C POWER RATING POWER RATING POWER RATING
7-mm × 7-mm HTQFP 40 mW/°C 5 W 4.2 W 3.2 W
(1) This data was taken using 1 oz trace and copper pad that is soldered directly to a JEDEC standard high-k PCB. The thermal pad must
be soldered to a thermal land on the printed-circuit board. See TI Technical Briefs SLMA002 for more information about using the
HTQFP thermal pad
RECOMMENDED OPERATING CONDITIONS
MIN NOM MAX UNIT
Digital/analog supply voltage DVDD, AVDD 3 3.3 3.6 V
Half-bridge supply voltage PVDD_X 8 26 V
VIH High-level input voltage 5-V tolerant 2 V
VIL Low-level input voltage 5-V tolerant 0.8 V
TA Operating ambient temperature range 0 85 °C
Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): TAS5707 TAS5707A
TAS5707, TAS5707A
SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com
RECOMMENDED OPERATING CONDITIONS (continued)
MIN NOM MAX UNIT
TJ
(1) Operating junction temperature range 0 125 °C
RL (BTL) Load impedance Output filter: L = 15 μH, C = 680 nF. 6 8 Ω
Minimum output inductance under 10 LO (BTL) Output-filter inductance μH
short-circuit condition
(1) Continuous operation above the recommended junction temperature may result in reduced reliability and/or lifetime of the device.
PWM OPERATION AT RECOMMENDED OPERATING CONDITIONS
PARAMETER TEST CONDITIONS VALUE UNIT
11.025/22.05/44.1-kHz data rate ±2% 352.8 kHz
Output sample rate
48/24/12/8/16/32-kHz data rate ±2% 384
8 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TAS5707 TAS5707A
TAS5707, TAS5707A
www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009
PLL INPUT PARAMETERS AND EXTERNAL FILTER COMPONENTS
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
fMCLKI MCLK Frequency 2.8224 24.576 MHz
MCLK duty cycle 40% 50% 60%
tr /
Rise/fall time for MCLK 5 ns tf(MCLK)
LRCLK allowable drift before LRCLK reset 4 MCLKs
External PLL filter capacitor C1 SMD 0603 Y5V 47 nF
External PLL filter capacitor C2 SMD 0603 Y5V 4.7 nF
External PLL filter resistor R SMD 0603, metal film 470 Ω
ELECTRICAL CHARACTERISTICS
DC Characteristics
TA = 25°, PVCC_X = 18V, DVDD = AVDD = 3.3V, RL= 8Ω, BTL AD Mode, FS = 48KHz (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH High-level output voltage FAULTZ and SDA IOH = –4 mA 2.4 V
DVDD = AVDD = 3 V
VOL Low-level output voltage FAULTZ and SDA IOL = 4 mA 0.5 V
DVDD = AVDD = 3 V
VI < VIL ; DVDD = AVDD 75 IIL Low-level input current μA
= 3.6V
VI > VIH ; DVDD = 75 IIH High-level input current μA
AVDD = 3.6V
Normal Mode 48 83
3.3 V supply voltage (DVDD, IDD 3.3 V supply current Reset (RESET = low, 24 32 mA AVDD)
PDN = high)
Normal Mode 30 55
IPVDD Half-bridge supply current No load (PVDD_X) Reset (RESET = low, 5 13 mA
PDN = high)
Drain-to-source resistance, LS TJ = 25°C, includes metallization resistance 180
rDS(on)
(1) Drain-to-source resistance, mΩ
TJ = 25°C, includes metallization resistance 180 HS
I/O Protection
Vuvp Undervoltage protection limit PVDD falling 7.2 V
Vuvp,hyst Undervoltage protection limit PVDD rising 7.6 V
OTE(2) Overtemperature error 150 °C
Extra temperature drop OTEHYST
(2) 30 °C
required to recover from error
OTW Overtemperature warning 125 °C
Temperature drop required to OTWHYST 25 °C
recover from warning
OLPC Overload protection counter fPWM = 384 kHz 0.63 ms
IOC Overcurrent limit protection Resistor—programmable, max. current, ROCP = 22 kΩ 4.5 A
IOCT Overcurrent response time 150 ns
OC programming resistor Resistor tolerance = 5% for typical value; the minimum ROCP 20 22 kΩ
range resistance should not be less than 20 kΩ.
Internal pulldown resistor at Connected when drivers are tristated to provide bootstrap RPD 3 kΩ the output of each half-bridge capacitor charge.
(1) This does not include bond-wire or pin resistance.
(2) Specified by design
Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): TAS5707 TAS5707A
TAS5707, TAS5707A
SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com
AC Characteristics (BTL)
PVDD_X = 18 V, BTL AD mode, FS = 48 KHz, RL = 8 Ω, ROCP = 22 KΩ, CBST = 33 nF, audio frequency = 1 kHz, AES17 filter,
fPWM = 384 kHz, TA = 25°C (unless otherwise noted). All performance is in accordance with recommended operating
conditions, unless otherwise specified.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
PVDD = 18 V,10% THD, 1-kHz input signal 20.6
PVDD = 18 V, 7% THD, 1-kHz input signal 19.5
PVDD = 12 V, 10% THD, 1-kHz input 9.4
P signal O Power output per channel W
PVDD = 12 V, 7% THD, 1-kHz input signal 8.9
PVDD = 8 V, 10% THD, 1-kHz input signal 4.1
PVDD = 8 V, 7% THD, 1-kHz input signal 3.8
PVDD= 18 V; PO = 1 W 0.06%
THD+N Total harmonic distortion + noise PVDD= 12 V; PO = 1 W 0.13%
PVDD= 8 V; PO = 1 W 0.2%
Vn Output integrated noise (rms) A-weighted 56 μV
PO = 0.25 W, f = 1kHz (BD Mode) –82 dB
Crosstalk
PO = 0.25 W, f = 1kHz (AD Mode) -69 dB
A-weighted, f = 1 kHz, maximum power at SNR Signal-to-noise ratio (1) 106 dB THD < 1%
(1) SNR is calculated relative to 0-dBFS input level.
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th1
t
su1
t
(edge)
t
su2
th2
SCLK
(Input)
LRCLK
(Input)
SDIN
T0026-04
t
r
t
f
TAS5707, TAS5707A
www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009
SERIAL AUDIO PORTS SLAVE MODE
over recommended operating conditions (unless otherwise noted)
TEST PARAMETER MIN TYP MAX UNIT CONDITIONS
fSCLKIN Frequency, SCLK 32 × fS, 48 × fS, 64 × fS CL = 30 pF 1.024 12.288 MHz
tsu1 Setup time, LRCLK to SCLK rising edge 10 ns
th1 Hold time, LRCLK from SCLK rising edge 10 ns
tsu2 Setup time, SDIN to SCLK rising edge 10 ns
th2 Hold time, SDIN from SCLK rising edge 10 ns
LRCLK frequency 8 48 48 kHz
SCLK duty cycle 40% 50% 60%
LRCLK duty cycle 40% 50% 60%
SCLK SCLK rising edges between LRCLK rising edges 32 64 edges
t(edge) SCLK LRCLK clock edge with respect to the falling edge of SCLK –1/4 1/4 period
tr / ns Rise/fall time for SCLK/LRCLK 8
tf(SCLK/LRCLK)
Figure 2. Slave Mode Serial Data Interface Timing
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SCL
SDA
tw(H) tw(L) t
r
t
f
t
su1 th1
T0027-01
SCL
SDA
th2 t
(buf)
t
su2 t
su3
Start
Condition
Stop
Condition
T0028-01
TAS5707, TAS5707A
SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com
I
2C SERIAL CONTROL PORT OPERATION
Timing characteristics for I
2C Interface signals over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN MAX UNIT
fSCL Frequency, SCL No wait states 400 kHz
tw(H) Pulse duration, SCL high 0.6 μs
tw(L) Pulse duration, SCL low 1.3 μs
tr Rise time, SCL and SDA 300 ns
tf Fall time, SCL and SDA 300 ns
tsu1 Setup time, SDA to SCL 100 ns
th1 Hold time, SCL to SDA 0 ns
t(buf) Bus free time between stop and start condition 1.3 μs
tsu2 Setup time, SCL to start condition 0.6 μs
th2 Hold time, start condition to SCL 0.6 μs
tsu3 Setup time, SCL to stop condition 0.6 μs
CL Load capacitance for each bus line 400 pF
Figure 3. SCL and SDA Timing
Figure 4. Start and Stop Conditions Timing
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tw(RESET)
RESET
td(I2C_ready)
System Initialization.
Enable via I C. 2
T0421-01
I C Active 2
I C Active 2
f − Frequency − Hz
20
PVDD = 18 V
RL = 8 Ω
100 1k 10k
THD+N − Total Harmonic Distortion + Noise − %
20k
G001
P = 1 W
P = 5 W
0.001
0.01
10
0.1
1
f − Frequency − Hz
20
PVDD = 12 V
RL = 8 Ω
100 1k 10k
THD+N − Total Harmonic Distortion + Noise − %
20k
G002
P = 2.5 W
0.001
0.01
10
0.1
1
P = 0.5 W
TAS5707, TAS5707A
www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009
RESET TIMING (RESET)
Control signal parameters over recommended operating conditions (unless otherwise noted). Please refer to Recommended
Use Model section on usage of all terminals.
PARAMETER MIN TYP MAX UNIT
tw(RESET) Pulse duration, RESET active 100 us
td(I2C_ready) Time to enable I
2C 13.5 ms
NOTE: On power up, it is recommended that the TAS5707 RESET be held LOW for at least 100 μs after DVDD has reached
3.0 V
NOTE: If the RESET is asserted LOW while PDN is LOW, then the RESET must continue to be held LOW for at least 100 μs
after PDN is deasserted (HIGH).
Figure 5. Reset Timing
TYPICAL CHARACTERISTICS, BTL CONFIGURATION
TOTAL HARMONIC DISTORTION + NOISE TOTAL HARMONIC DISTORTION + NOISE
vs vs
FREQUENCY FREQUENCY
Figure 6. Figure 7.
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Product Folder Link(s): TAS5707 TAS5707A
f − Frequency − Hz
20
PVDD = 8 V
RL = 8 Ω
100 1k 10k
THD+N − Total Harmonic Distortion + Noise − %
20k
G003
P = 0.5 W P = 1 W
0.001
0.01
10
0.1
1 P = 2.5 W
PO − Output Power − W
0.01
PVDD = 18 V
RL = 8 Ω
0.1 1 10
THD+N − Total Harmonic Distortion + Noise − %
0.001
0.01
10
40
0.1
G004
1
f = 20 Hz
f = 1 kHz
f = 10 kHz
PO − Output Power − W
0.01
PVDD = 12 V
RL = 8 Ω
0.1 1 10
THD+N − Total Harmonic Distortion + Noise − %
0.001
0.01
10
40
0.1
G005
1
f = 20 Hz
f = 1 kHz
f = 10 kHz
PO − Output Power − W
0.01
PVDD = 8 V
RL = 8 Ω
0.1 1 10
THD+N − Total Harmonic Distortion + Noise − %
0.001
0.01
10
40
0.1
G006
1
f = 20 Hz
f = 1 kHz
f = 10 kHz
TAS5707, TAS5707A
SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com
TYPICAL CHARACTERISTICS, BTL CONFIGURATION (continued)
TOTAL HARMONIC DISTORTION + NOISE TOTAL HARMONIC DISTORTION + NOISE
vs vs
FREQUENCY OUTPUT POWER
Figure 8. Figure 9.
TOTAL HARMONIC DISTORTION + NOISE TOTAL HARMONIC DISTORTION + NOISE
vs vs
OUTPUT POWER OUTPUT POWER
Figure 10. Figure 11.
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PVDD − Supply Voltage − V
2
4
6
8
10
12
14
16
18
20
8 9 10 11 12 13 14 15 16 17 18
PO − Output Power − W
G010
RL = 8 Ω
THD+N = 1%
THD+N = 10%
PO − Output Power (Per Channel) − W
0
10
20
30
40
50
60
70
80
90
100
0 4 8 12 16 20 24 28 32 36 40
Efficiency − %
G012
PVDD = 12 V
PVDD = 18 V
RL = 8 Ω
PVDD = 8 V
−100
−90
−80
−70
−60
−50
−40
−30
−20
−10
0
f − Frequency − Hz
Crosstalk − dB
G013
20 100 1k 10k 20k
Left to Right
Right to Left
PO = 0.25 W
PVDD = 18 V
RL = 8 Ω
−100
−90
−80
−70
−60
−50
−40
−30
−20
−10
0
f − Frequency − Hz
Crosstalk − dB
G014
20 100 1k 10k 20k
Left to Right
Right to Left
PO = 0.25 W
PVDD = 12 V
RL = 8 Ω
TAS5707, TAS5707A
www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009
TYPICAL CHARACTERISTICS, BTL CONFIGURATION (continued)
OUTPUT POWER EFFICIENCY
vs vs
SUPPLY VOLTAGE OUTPUT POWER
Figure 12. Figure 13.
CROSSTALK CROSSTALK
vs vs
FREQUENCY FREQUENCY
Figure 14. Figure 15.
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−100
−90
−80
−70
−60
−50
−40
−30
−20
−10
0
f − Frequency − Hz
Crosstalk − dB
G015
20 100 1k 10k 20k
Left to Right
Right to Left
PO = 0.25 W
PVDD = 8 V
RL = 8 Ω
TAS5707, TAS5707A
SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com
TYPICAL CHARACTERISTICS, BTL CONFIGURATION (continued)
CROSSTALK
vs
FREQUENCY
Figure 16.
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www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009
DETAILED DESCRIPTION
POWER SUPPLY
To facilitate system design, the TAS5707 needs only a 3.3-V supply in addition to the (typical) 18-V power-stage
supply. An internal voltage regulator provides suitable voltage levels for the gate drive circuitry. Additionally, all
circuitry requiring a floating voltage supply, e.g., the high-side gate drive, is accommodated by built-in bootstrap
circuitry requiring only a few external capacitors.
In order to provide good electrical and acoustical characteristics, the PWM signal path for the output stage is
designed as identical, independent half-bridges. For this reason, each half-bridge has separate bootstrap pins
(BST_X), and power-stage supply pins (PVDD_X). The gate drive voltages (GVDD_AB and GVDD_CD) are
derived from the PVDD voltage. Special attention should be paid to placing all decoupling capacitors as close to
their associated pins as possible. In general, inductance between the power-supply pins and decoupling
capacitors must be avoided.
For a properly functioning bootstrap circuit, a small ceramic capacitor must be connected from each bootstrap pin
(BST_X) to the power-stage output pin (OUT_X). When the power-stage output is low, the bootstrap capacitor is
charged through an internal diode connected between the gate-drive regulator output pin (GVDD_X) and the
bootstrap pin. When the power-stage output is high, the bootstrap capacitor potential is shifted above the output
potential and thus provides a suitable voltage supply for the high-side gate driver. In an application with PWM
switching frequencies in the range from 352 kHz to 384 kHz, it is recommended to use 33-nF ceramic capacitors,
size 0603 or 0805, for the bootstrap supply. These 33-nF capacitors ensure sufficient energy storage, even
during minimal PWM duty cycles, to keep the high-side power stage FET (LDMOS) fully turned on during the
remaining part of the PWM cycle.
Special attention should be paid to the power-stage power supply; this includes component selection, PCB
placement, and routing. As indicated, each half-bridge has independent power-stage supply pins (PVDD_X). For
optimal electrical performance, EMI compliance, and system reliability, it is important that each PVDD_X pin is
decoupled with a 100-nF ceramic capacitor placed as close as possible to each supply pin.
The TAS5707 is fully protected against erroneous power-stage turnon due to parasitic gate charging.
ERROR REPORTING
Any fault resulting in device shutdown is signaled by the FAULT pin going low (see Table 1). A sticky version of
this pin is available on D1 of register 0X02.
Table 1. FAULT Output States
FAULT DESCRIPTION
0 Overcurrent (OC) or undervoltage (UVP) error or overtemperature error (OTE) or over
voltage ERROR
1 No faults (normal operation)
DEVICE PROTECTION SYSTEM
Overcurrent (OC) Protection With Current Limiting
The device has independent, fast-reacting current detectors on all high-side and low-side power-stage FETs. The
detector outputs are closely monitored by two protection systems. The first protection system controls the power
stage in order to prevent the output current further increasing, i.e., it performs a cycle-by-cycle current-limiting
function, rather than prematurely shutting down during combinations of high-level music transients and extreme
speaker load impedance drops. If the high-current condition situation persists, i.e., the power stage is being
overloaded, a second protection system triggers a latching shutdown, resulting in the power stage being set in
the high-impedance (Hi-Z) state. The device returns to normal operation once the fault condition (i.e., a short
circuit on the output) is removed. Current limiting and overcurrent protection are not independent for half-bridges.
That is, if the bridge-tied load between half-bridges A and B causes an overcurrent fault, half-bridges A, B, C,
and D are shut down.
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TAS5707, TAS5707A
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Overtemperature Protection
The TAS5707 has a two-level temperature-protection system that asserts an active-high warning signal (OTW)
when the device junction temperature exceeds 125°C (nominal) and, if the device junction temperature exceeds
150°C (nominal), the device is put into thermal shutdown, resulting in all half-bridge outputs being set in the
high-impedance (Hi-Z) state and FAULT being asserted low. The TAS5707 recovers from shutdown
automatically once the temperature drops approximately 30°C. The overtemperature warning (OTW) is disabled
once the temperature drops approximately 25°C.
Undervoltage Protection (UVP) and Power-On
Reset (POR)
The UVP and POR circuits of the TAS5707 fully protect the device in any power-up/down and brownout situation.
While powering up, the POR circuit resets the overload circuit (OLP) and ensures that all circuits are fully
operational when the PVDD and AVDD supply voltages reach 7.6 V and 2.7 V, respectively. Although PVDD and
AVDD are independently monitored, a supply voltage drop below the UVP threshold on AVDD or either PVDD
pin results in all half-bridge outputs immediately being set in the high-impedance (Hi-Z) state and FAULT being
asserted low.
SSTIMER FUNCTIONALITY
The SSTIMER pin uses a capacitor connected between this pin and ground to control the output duty cycle when
exiting all-channel shutdown. The capacitor on the SSTIMER pin is slowly charged through an internal current
source, and the charge time determines the rate at which the output transitions from a near zero duty cycle to the
desired duty cycle. This allows for a smooth transition that minimizes audible pops and clicks. When the part is
shutdown the drivers are tristated and transition slowly down through a 3K resistor, similarly minimizing pops and
clicks. The shutdown transition time is independent of SSTIMER pin capacitance. Larger capacitors will increase
the start-up time, while capacitors smaller than 2.2 nF will decrease the start-up time. The SSTIMER pin should
be left floating for BD modulation.
CLOCK, AUTO DETECTION, AND PLL
The TAS5707 is a slave device. It accepts MCLK, SCLK, and LRCLK. The digital audio processor (DAP)
supports all the sample rates and MCLK rates that are defined in the clock control register .
The TAS5707 checks to verify that SCLK is a specific value of 32 fS, 48 fS, or 64 fS. The DAP only supports a 1 ×
fS LRCLK. The timing relationship of these clocks to SDIN is shown in subsequent sections. The clock section
uses MCLK or the internal oscillator clock (when MCLK is unstable, out of range, or absent) to produce the
internal clock (DCLK) running at 512 time the PWM switching frequency.
The DAP can autodetect and set the internal clock control logic to the appropriate settings for all supported clock
rates as defined in the clock control register.
TAS5707 has robust clock error handling that uses the bulit-in trimmed oscillator clock to quickly detect
changes/errors. Once the system detects a clock change/error, it will mute the audio (through a single step mute)
and then force PLL to limp using the internal oscillator as a reference clock. Once the clocks are stable, the
system will auto detect the new rate and revert to normal operation. During this process, the default volume will
be restored in a single step (also called hard unmute). The ramp process can be programmed to ramp back
slowly (also called soft unmute) as defined in volume register (0X0E).
SERIAL DATA INTERFACE
Serial data is input on SDIN. The PWM outputs are derived from SDIN. The TAS5707 DAP accepts serial data in
16-, 20-, or 24-bit left-justified, right-justified, and I
2S serial data formats.
PWM Section
The TAS5707 DAP device uses noise-shaping and sophisticated non-linear correction algorithms to achieve high
power efficiency and high-performance digital audio reproduction. The DAP uses a fourth-order noise shaper to
increase dynamic range and SNR in the audio band. The PWM section accepts 24-bit PCM data from the DAP
and outputs two BTL PWM audio output channels.
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23 22
SCLK
32 Clks
LRCLK (Note Reversed Phase) Left Channel
24-Bit Mode
1
19 18
20-Bit Mode
16-Bit Mode
15 14
MSB LSB
32 Clks
Right Channel
2-Channel I S (Philips Format) Stereo Input 2
T0034-01
9 8 5 4
1 0
0
5 4
1 0
23 22 1
19 18
15 14
MSB LSB
9 8 5 4
1 0
0
5 4
1 0
SCLK
TAS5707, TAS5707A
www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009
The PWM section has individual channel dc blocking filters that can be enabled and disabled. The filter cutoff
frequency is less than 1 Hz. Individual channel de-emphasis filters for 44.1- and 48-kHz are included and can be
enabled and disabled.
Finally, the PWM section has an adjustable maximum modulation limit of 93.8% to 99.2%.
For detailed description of using audio processing features like DRC and EQ, please refer to User's Guide and
TAS570X GDE software development tool documentation. Also refer to GDE software development tool for
device data path.
I
2C COMPATIBLE SERIAL CONTROL INTERFACE
The TAS5707 DAP has an I
2C serial control slave interface to receive commands from a system controller. The
serial control interface supports both normal-speed (100-kHz) and high-speed (400-kHz) operations without wait
states. As an added feature, this interface operates even if MCLK is absent.
The serial control interface supports both single-byte and multi-byte read and write operations for status registers
and the general control registers associated with the PWM.
SERIAL INTERFACE CONTROL AND TIMING
I
2S Timing
I
2S timing uses LRCLK to define when the data being transmitted is for the left channel and when it is for the
right channel. LRCLK is low for the left channel and high for the right channel. A bit clock running at 32, 48, or
64 × fS is used to clock in the data. There is a delay of one bit clock from the time the LRCLK signal changes
state to the first bit of data on the data lines. The data is written MSB first and is valid on the rising edge of bit
clock. The DAP masks unused trailing data bit positions.
NOTE: All data presented in 2s-complement form with MSB first.
Figure 17. I
2S 64-fS Format
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23 22
SCLK
24 Clks
LRCLK Left Channel
24-Bit Mode
1
19 18
20-Bit Mode
16-Bit Mode
15 14
MSB LSB
24 Clks
Right Channel
2-Channel I S (Philips Format) Stereo Input/Output (24-Bit Transfer Word Size) 2
T0092-01
17 16 9 8 5 4 3 2
1 0
0
13 12 5 4
9 8 1 0
23 22
SCLK
1
19 18
15 14
MSB LSB
17 16 9 8 5 4 3 2
13 12 5 4 1 0
9 8 1 0
SCLK
16 Clks
LRCLK Left Channel
16-Bit Mode
15 14 1 15 14 1
MSB LSB
16 Clks
Right Channel
2-Channel I S (Philips Format) Stereo Input 2
T0266-01
13 12 11 10 9 8 5 4 3 2 0 13 12 11 10 9 8 5 4 3 2
SCLK
MSB LSB
TAS5707, TAS5707A
SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com
NOTE: All data presented in 2s-complement form with MSB first.
Figure 18. I
2S 48-fS Format
NOTE: All data presented in 2s-complement form with MSB first.
Figure 19. I
2S 32-fS Format
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23 22
SCLK
32 Clks
LRCLK
Left Channel
24-Bit Mode
1
19 18
20-Bit Mode
16-Bit Mode
15 14
MSB LSB
32 Clks
Right Channel
2-Channel Left-Justified Stereo Input
T0034-02
9 8 5 4
5 4 1
1
0
0
0
23 22 1
19 18
15 14
MSB LSB
9 8 5 4
5 4 1
1
0
0
0
SCLK
TAS5707, TAS5707A
www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009
Left-Justified
Left-justified (LJ) timing uses LRCLK to define when the data being transmitted is for the left channel and when it
is for the right channel. LRCLK is high for the left channel and low for the right channel. A bit clock running at 32,
48, or 64 × fS is used to clock in the data. The first bit of data appears on the data lines at the same time LRCLK
toggles. The data is written MSB first and is valid on the rising edge of the bit clock. The DAP masks unused
trailing data bit positions.
NOTE: All data presented in 2s-complement form with MSB first.
Figure 20. Left-Justified 64-fS Format
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23 22
SCLK
24 Clks
LRCLK
Left Channel
24-Bit Mode
1
19 18
20-Bit Mode
16-Bit Mode
15 14
MSB LSB
24 Clks
Right Channel
2-Channel Left-Justified Stereo Input (24-Bit Transfer Word Size)
T0092-02
17 16 9 8 5 4
13 12 5 4 1
9 8 1
0
0
0
21
17
13
23 22
SCLK
1
19 18
15 14
MSB LSB
17 16 9 8 5 4
13 12 5 4 1
9 8 1
0
0
0
21
17
13
SCLK
16 Clks
LRCLK
Left Channel
16-Bit Mode
15 14 1 15 14 1
MSB LSB
16 Clks
Right Channel
2-Channel Left-Justified Stereo Input
T0266-02
13 12 11 10 9 8 5 4 3 2 0 13 12 11 10 9 8 5 4 3 2 0
SCLK
MSB LSB
TAS5707, TAS5707A
SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com
NOTE: All data presented in 2s-complement form with MSB first.
Figure 21. Left-Justified 48-fS Format
NOTE: All data presented in 2s-complement form with MSB first.
Figure 22. Left-Justified 32-fS Format
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23 22
SCLK
32 Clks
LRCLK
Left Channel
24-Bit Mode
1
20-Bit Mode
16-Bit Mode
15 14
MSB LSB
SCLK
32 Clks
Right Channel
2-Channel Right-Justified (Sony Format) Stereo Input
T0034-03
19 18
19 18 1
1
0
0
0
15 14
15 14 23 22 1
15 14
MSB LSB
19 18
19 18 1
1
0
0
0
15 14
15 14
TAS5707, TAS5707A
www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009
Right-Justified
Right-justified (RJ) timing uses LRCLK to define when the data being transmitted is for the left channel and when
it is for the right channel. LRCLK is high for the left channel and low for the right channel. A bit clock running at
32, 48, or 64 × fS is used to clock in the data. The first bit of data appears on the data 8 bit-clock periods (for
24-bit data) after LRCLK toggles. In RJ mode the LSB of data is always clocked by the last bit clock before
LRCLK transitions. The data is written MSB first and is valid on the rising edge of bit clock. The DAP masks
unused leading data bit positions.
Figure 23. Right Justified 64-fS Format
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23 22
SCLK
24 Clks
LRCLK
Left Channel
24-Bit Mode
1
20-Bit Mode
16-Bit Mode
15 14
MSB LSB
SCLK
24 Clks
Right Channel
MSB
2-Channel Right-Justified Stereo Input (24-Bit Transfer Word Size)
T0092-03
19 18 5
19 18 5 1
5 1
0
0
0
2
2
2
6
6
6
15 14
15 14 23 22 1
15 14
19 18 5
19 18 5 1
5 1
0
0
0
2
2
2
6
6
6
15 14
15 14
LSB
TAS5707, TAS5707A
SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com
Figure 24. Right Justified 48-fS Format
Figure 25. Right Justified 32-fS Format
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7-Bit Slave Address R/
W
A 8-Bit Register Address (N) 8-Bit Register Data For
Address (N)
Start Stop
SDA
SCL
7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
A
8-Bit Register Data For
Address (N) A A
T0035-01
TAS5707, TAS5707A
www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009
I
2C SERIAL CONTROL INTERFACE
The TAS5707 DAP has a bidirectional I
2C interface that compatible with the I
2C (Inter IC) bus protocol and
supports both 100-kHz and 400-kHz data transfer rates for single and multiple byte write and read operations.
This is a slave only device that does not support a multimaster bus environment or wait state insertion. The
control interface is used to program the registers of the device and to read device status.
The DAP supports the standard-mode I
2C bus operation (100 kHz maximum) and the fast I
2C bus operation
(400 kHz maximum). The DAP performs all I
2C operations without I
2C wait cycles.
General I
2C Operation
The I
2C bus employs two signals; SDA (data) and SCL (clock), to communicate between integrated circuits in a
system. Data is transferred on the bus serially one bit at a time. The address and data can be transferred in byte
(8-bit) format, with the most significant bit (MSB) transferred first. In addition, each byte transferred on the bus is
acknowledged by the receiving device with an acknowledge bit. Each transfer operation begins with the master
device driving a start condition on the bus and ends with the master device driving a stop condition on the bus.
The bus uses transitions on the data pin (SDA) while the clock is high to indicate a start and stop conditions. A
high-to-low transition on SDA indicates a start and a low-to-high transition indicates a stop. Normal data bit
transitions must occur within the low time of the clock period. These conditions are shown in Figure 26. The
master generates the 7-bit slave address and the read/write (R/W) bit to open communication with another
device and then waits for an acknowledge condition. The TAS5707 holds SDA low during the acknowledge clock
period to indicate an acknowledgment. When this occurs, the master transmits the next byte of the sequence.
Each device is addressed by a unique 7-bit slave address plus R/W bit (1 byte). All compatible devices share the
same signals via a bidirectional bus using a wired-AND connection. An external pullup resistor must be used for
the SDA and SCL signals to set the high level for the bus.
Figure 26. Typical I
2C Sequence
There is no limit on the number of bytes that can be transmitted between start and stop conditions. When the last
word transfers, the master generates a stop condition to release the bus. A generic data transfer sequence is
shown in Figure 26.
The 7-bit address for TAS5707 is 0011 011 (0x36). The 7-bit address for the TAS5707A is 0011 101 (0x3A).
The TAS5707 address can be changed from 0x36 to 0x38 by writing 0x38 to device slave address register 0xF9.
The TAS5707A address can be changed from 0x3A to 0x3C by writing 0x3C to device slave address register
0xF9.
Single- and Multiple-Byte Transfers
The serial control interface supports both single-byte and multiple-byte read/write operations for subaddresses
0x00 to 0x1F. However, for the subaddresses 0x20 to 0xFF, the serial control interface supports only
multiple-byte read/write operations (in multiples of 4 bytes).
During multiple-byte read operations, the DAP responds with data, a byte at a time, starting at the subaddress
assigned, as long as the master device continues to respond with acknowledges. If a particular subaddress does
not contain 32 bits, the unused bits are read as logic 0.
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A6 A5 A4 A3 A2 A1 A0 R/W ACK A7 A6 A5 A4 A3 A2 A1 A0 ACK D7 D6 D5 D4 D3 D2 D1 D0 ACK
Start
Condition
Stop
Condition
Acknowledge Acknowledge Acknowledge
I C Device Address and 2
Read/Write Bit
Subaddress Data Byte
T0036-01
D7 D0 ACK
Stop
Condition
Acknowledge
I C Device Address and 2
Read/Write Bit
Subaddress Last Data Byte
A6 A5 A1 A0 R/W ACK A7 A5 A1 A0 ACK D7 ACK
Start
Condition Acknowledge Acknowledge Acknowledge
First Data Byte
A6 A4 A3
Other Data Bytes
ACK
Acknowledge
D0 D7 D0
T0036-02
TAS5707, TAS5707A
SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com
During multiple-byte write operations, the DAP compares the number of bytes transmitted to the number of bytes
that are required for each specific subaddress. For example, if a write command is received for a biquad
subaddress, the DAP expects to receive five 32-bit words. If fewer than five 32-bit data words have been
received when a stop command (or another start command) is received, the data received is discarded.
Supplying a subaddress for each subaddress transaction is referred to as random I
2C addressing. The TAS5707
also supports sequential I
2C addressing. For write transactions, if a subaddress is issued followed by data for
that subaddress and the 15 subaddresses that follow, a sequential I
2C write transaction has taken place, and the
data for all 16 subaddresses is successfully received by the TAS5707. For I
2C sequential write transactions, the
subaddress then serves as the start address, and the amount of data subsequently transmitted, before a stop or
start is transmitted, determines how many subaddresses are written. As was true for random addressing,
sequential addressing requires that a complete set of data be transmitted. If only a partial set of data is written to
the last subaddress, the data for the last subaddress is discarded. However, all other data written is accepted;
only the incomplete data is discarded.
Single-Byte Write
As shown in Figure 27, a single-byte data write transfer begins with the master device transmitting a start
condition followed by the I
2C device address and the read/write bit. The read/write bit determines the direction of
the data transfer. For a write data transfer, the read/write bit will be a 0. After receiving the correct I
2C device
address and the read/write bit, the DAP responds with an acknowledge bit. Next, the master transmits the
address byte or bytes corresponding to the TAS5707 internal memory address being accessed. After receiving
the address byte, the TAS5707 again responds with an acknowledge bit. Next, the master device transmits the
data byte to be written to the memory address being accessed. After receiving the data byte, the TAS5707 again
responds with an acknowledge bit. Finally, the master device transmits a stop condition to complete the
single-byte data write transfer.
Figure 27. Single-Byte Write Transfer
Multiple-Byte Write
A multiple-byte data write transfer is identical to a single-byte data write transfer except that multiple data bytes
are transmitted by the master device to the DAP as shown in Figure 28. After receiving each data byte, the
TAS5707 responds with an acknowledge bit.
Figure 28. Multiple-Byte Write Transfer
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A6 A5 A0 R/W ACK A7 A6 A5 A4 A0 ACK A6 A5 A0 ACK
Start
Condition
Stop
Condition
Acknowledge Acknowledge Acknowledge
I C Device Address and 2
Read/Write Bit
Subaddress Data Byte
D7 D6 D1 D0 ACK
I C Device Address and
Read/Write Bit
2
Not
Acknowledge
A1 A1 R/W
Repeat Start
Condition
T0036-03
A6 A0 ACK
Acknowledge
I C Device Address and
Read/Write Bit
2
A6 A0 R/W ACK A0 ACK R/W D7 D0 ACK
Start
Condition
Stop
Condition
Acknowledge Acknowledge Acknowledge
Last Data Byte
ACK
First Data Byte
Repeat Start
Condition
Not
Acknowledge
I C Device Address and
Read/Write Bit
2
Subaddress Other Data Bytes
A7 A6 A5 D7 D0 ACK
Acknowledge
D7 D0
T0036-04
TAS5707, TAS5707A
www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009
Single-Byte Read
As shown in Figure 29, a single-byte data read transfer begins with the master device transmitting a start
condition followed by the I
2C device address and the read/write bit. For the data read transfer, both a write
followed by a read are actually done. Initially, a write is done to transfer the address byte or bytes of the internal
memory address to be read. As a result, the read/write bit becomes a 0. After receiving the TAS5707 address
and the read/write bit, TAS5707 responds with an acknowledge bit. In addition, after sending the internal memory
address byte or bytes, the master device transmits another start condition followed by the TAS5707 address and
the read/write bit again. This time the read/write bit becomes a 1, indicating a read transfer. After receiving the
address and the read/write bit, the TAS5707 again responds with an acknowledge bit. Next, the TAS5707
transmits the data byte from the memory address being read. After receiving the data byte, the master device
transmits a not acknowledge followed by a stop condition to complete the single byte data read transfer.
Figure 29. Single-Byte Read Transfer
Multiple-Byte Read
A multiple-byte data read transfer is identical to a single-byte data read transfer except that multiple data bytes
are transmitted by the TAS5707 to the master device as shown in Figure 30. Except for the last data byte, the
master device responds with an acknowledge bit after receiving each data byte.
Figure 30. Multiple Byte Read Transfer
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Output Level (dB)
Input Level (dB)
T
O
K
M0091-02
1:1 Transfer Function
Implemented Transfer Function S
Z
–1
Alpha Filter Structure
w
a
B0265-01
Energy
Filter
a w, T, K, O a w a
, a d d / , a w
DRC 0x3A 0x40, 0x41, 0x42 0x3B / 0x3C
Compression
Control
Attack
and
Decay
Filters
Audio Input DRC Coefficient
NOTE:
w a = 1 –
TAS5707, TAS5707A
SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com
Dynamic Range Control (DRC)
The DRC scheme has a single threshold, offset, and slope (all programmable). There is one ganged DRC for the
left/right channels.
The DRC input/output diagram is shown in Figure 31.
Professional-quality dynamic range compression automatically adjusts volume to flatten volume level.
• One DRC for left/right
• The DRC has adjustable threshold, offset, and compression levels
• Programmable energy, attack, and decay time constants
• Transparent compression: compressors can attack fast enough to avoid apparent clipping before engaging,
and decay times can be set slow enough to avoid pumping.
Figure 31. Dynamic Range Control
Figure 32. DRC Structure
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2 Bit –23
S_xx.xxxx_xxxx_xxxx_xxxx_xxxx_xxx
2 Bit –5
2 Bit –1
2 Bit 0
Sign Bit
2 Bit 1
M0125-01
TAS5707, TAS5707A
www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009
BANK SWITCHING
The TAS5707 uses an approach called bank switching together with automatic sample-rate detection. All
processing features that must be changed for different sample rates are stored internally in three banks. The
user can program which sample rates map to each bank. By default, bank 1 is used in 32kHz mode, bank 2 is
used in 44.1/48 kHz mode, and bank 3 is used for all other rates. Combined with the clock-rate autodetection
feature, bank switching allows the TAS5707 to detect automatically a change in the input sample rate and switch
to the appropriate bank without any MCU intervention.
An external controller configures bankable locations (0x29-0x36 and 0x3A-0x3C) for all three banks during the
initialization sequence.
If auto bank switching is enabled (register 0x50, bits 2:0) , then the TAS5707 automatically swaps the coefficients
for subsequent sample rate changes, avoiding the need for any external controller intervention for a sample rate
change.
By default, bits 2:0 have the value 000; indicating that bank switching is disabled. In that state, updates to
bankable locations take immediate effect. A write to register 0x50 with bits 2:0 being 001, 010, or 011 brings the
system into the coefficient-bank-update state update bank1, update bank2, or update bank3, respectively. Any
subsequent write to bankable locations updates the coefficient banks stored outside the DAP. After updating all
the three banks, the system controller should issue a write to register 0x50 with bits 2:0 being 100; this changes
the system state to automatic bank switching mode. In automatic bank switching mode, the TAS5707
automatically swaps banks based on the sample rate.
Command sequences for updating DAP coefficients can be summarized as follows:
1. Bank switching disabled (default): DAP coefficient writes take immediate effect and are not
influenced by subsequent sample rate changes.
OR
Bank switching enabled:
(a) Update bank-1 mode: Write "001" to bits 2:0 of reg 0x50. Load the 32 kHz coefficients.
(b) Update bank-2 mode: Write "010" to bits 2:0 of reg 0x50. Load the 48 kHz coefficients.
(c) Update bank-3 mode: Write "011" to bits 2:0 of reg 0x50. Load the other coefficients.
(d) Enable automatic bank switching by writing "100" to bits 2:0 of reg 0x50.
26-Bit 3.23 Number Format
All mixer gain coefficients are 26-bit coefficients using a 3.23 number format. Numbers formatted as 3.23
numbers means that there are 3 bits to the left of the decimal point and 23 bits to the right of the decimal point.
This is shown in Figure 33 .
Figure 33. 3.23 Format
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(1 or 0) 2 + ´
1
(1 or 0) 2 + (1 or 0) 2 + ....... (1 or 0) 2 + ....... (1 or 0) 2 ´ ´ ´ ´
0 –1 –4 –23
2 Bit 1
2 Bit 0
2 Bit –1 2 Bit –4 2 Bit –23
M0126-01
u
Coefficient
Digit 8
u u u u u S x
Coefficient
Digit 7
x. x x x
Coefficient
Digit 6
x x x x
Coefficient
Digit 5
x x x x
Coefficient
Digit 4
x x x x
Coefficient
Digit 3
x x x x
Coefficient
Digit 2
x x x x
Coefficient
Digit 1
Fraction
Digit 5
Fraction
Digit 4
Fraction
Digit 3
Fraction
Digit 2
Fraction
Integer Digit 1
Digit 1
Sign
Bit
Fraction
Digit 6
u = unused or don’t care bits
Digit = hexadecimal digit
M0127-01
0
TAS5707, TAS5707A
SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com
The decimal value of a 3.23 format number can be found by following the weighting shown in Figure 33. If the
most significant bit is logic 0, the number is a positive number, and the weighting shown yields the correct
number. If the most significant bit is a logic 1, then the number is a negative number. In this case every bit must
be inverted, a 1 added to the result, and then the weighting shown in Figure 34 applied to obtain the magnitude
of the negative number.
Figure 34. Conversion Weighting Factors—3.23 Format to Floating Point
Gain coefficients, entered via the I
2C bus, must be entered as 32-bit binary numbers. The format of the 32-bit
number (4-byte or 8-digit hexadecimal number) is shown in Figure 35
Figure 35. Alignment of 3.23 Coefficient in 32-Bit I
2C Word
Table 2. Sample Calculation for 3.23 Format
db Linear Decimal Hex (3.23 Format)
0 1 8388608 00800000
5 1.7782794 14917288 00E39EA8
–5 0.5623413 4717260 0047FACC
X L = 10(X/20) D = 8388608 × L H = dec2hex (D, 8)
Table 3. Sample Calculation for 9.17 Format
db Linear Decimal Hex (9.17 Format)
0 1 131072 20000
5 1.77 231997 38A3D
–5 0.56 73400 11EB8
X L = 10(X/20) D = 131072 × L H = dec2hex (D, 8)
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Initialization
50 ms
50 ms
2 sm
2 sm
2 sm
2 sm
AVDD/DVDD
PDN
PVDD
RESET
T0419-01
3 V 3 V
0 ns
0 ns
0 ns
10 sm
100 sμ
13.5 ms
100 sm
6 V 6 V
8 V 8 V
2I S
MCLK
LRCLK
SCLK
SDIN
2I C SCL SDA Trim Volume and Mute Commands
Clock Changes/Errors OK Stable and Valid Clocks Stable and Valid Clocks
Exit
SD
Enter
SD
DAP
Config
Other
Config
1 ms + 1.3 tstart(2)
1 ms + 1.3 tstart(2)
tPLL(1)
tPLL(1)
1 ms + 1.3 tstop(2)
0 ns
Normal Operation Shutdown Powerdown
(1) t has to be greater than 240 ms + 1.3 t .
This constraint only applies to the first trim command following AVDD/DVDD power-up.
It does not apply to trim commands following subsequent resets.
(2) t /t = PWM start/stop time as defined in register 0X1A
PLL start
start stop
TAS5707, TAS5707A
www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009
Recommended Use Model
Figure 36. Recommended Command Sequence
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2 sm
2 sm
2 sm
AVDD/DVDD
PDN
PVDD
RESET
T0420-01
3 V
8 V
6 V
I S2
I C2
2 ms
0 ns
0 ns
0 ns
0 ns
TAS5707, TAS5707A
SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com
Figure 37. Power Loss Sequence
Recommended Command Sequences
The DAP has two groups of commands. One set is for configuration and is intended for use only during
initialization. The other set has built-in click and pop protection and may be used during normal operation while
audio is streaming. The following supported command sequences illustrate how to initialize, operate, and
shutdown the device.
Initialization Sequence
Use the following sequence to power-up and initialize the device:
1. Hold all digital inputs low and ramp up AVDD/DVDD to at least 3V.
2. Initialize digital inputs and PVDD supply as follows:
• Drive RESETZ=0, PDNZ=1, and other digital inputs to their desired state while ensuring that
all are never more than 2.5V above AVDD/DVDD. Provide stable and valid I2S clocks
(MCLK, LRCLK, and SCLK). Wait at least 100us, drive RESETZ=1, and wait at least another
13.5ms.
• Ramp up PVDD to at least 8V while ensuring that it remains below 6V for at least 100us after
AVDD/DVDD reaches 3V. Then wait at least another 10us.
3. Trim oscillator (write 0x00 to register 0x1B) and wait at least 50ms.
4. Configure the DAP via I
2C (see Users's Guide for typical values):
Biquads (0x29-36)
DRC parameters (0x3A-3C, 0x40-42, and 0x46)
Bank select (0x50)
5. Configure remaining registers
6. Exit shutdown (sequence defined below).
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Normal Operation
The following are the only events supported during normal operation:
(a) Writes to master/channel volume registers
(b) Writes to soft mute register
(c) Enter and exit shutdown (sequence defined below)
(d) Clock errors and rate changes
Note: Events (c) and (d) are not supported for 240ms+1.3*Tstart after trim following AVDD/DVDD powerup
ramp (where Tstart is specified by register 0x1A).
Shutdown Sequence
Enter:
1. Ensure I2S clocks have been stable and valid for at least 50ms.
2. Write 0x40 to register 0x05.
3. Wait at least 1ms+1.3*Tstop (where Tstop is specified by register 0x1A).
4. Once in shutdown, stable clocks are not required while device remains idle.
5. If desired, reconfigure by ensuring that clocks have been stable and valid for at least 50ms before
returning to step 4 of initialization sequence.
Exit:
1. Ensure I2S clocks have been stable and valid for at least 50ms.
2. Write 0x00 to register 0x05 (exit shutdown command may not be serviced for as much as 240ms
after trim following AVDD/DVDD powerup ramp).
3. Wait at least 1ms+1.3*Tstart (where Tstart is specified by register 0x1A).
4. Proceed with normal operation.
Powerdown Sequence
Use the following sequence to powerdown the device and its supplies:
1. If time permits, enter shutdown (sequence defined above); else, in case of sudden power loss,
assert PDNZ=0 and wait at least 2ms.
2. Assert RESETZ=0.
3. Drive digital inputs low and ramp down PVDD supply as follows:
• Drive all digital inputs low after RESETZ has been low for at least 2us.
• Ramp down PVDD while ensuring that it remains above 8V until RESETZ has been low for at
least 2us.
4. Ramp down AVDD/DVDD while ensuring that it remains above 3V until PVDD is below 6V and
that it is never more than 2.5V below the digital inputs.
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Table 4. Serial Control Interface Register Summary
NO. OF INITIALIZATION SUBADDRESS REGISTER NAME CONTENTS BYTES VALUE
A u indicates unused bits.
0x00 Clock control register 1 Description shown in subsequent section 0x6C
0x01 Device ID register 1 Description shown in subsequent section 0x70
0x02 Error status register 1 Description shown in subsequent section 0x00
0x03 System control register 1 1 Description shown in subsequent section 0xA0
0x04 Serial data interface 1 Description shown in subsequent section 0x05
register
0x05 System control register 2 1 Description shown in subsequent section 0x40
0x06 Soft mute register 1 Description shown in subsequent section 0x00
0x07 Master volume 1 Description shown in subsequent section 0xFF (mute)
0x08 Channel 1 vol 1 Description shown in subsequent section 0x30 (0 dB)
0x09 Channel 2 vol 1 Description shown in subsequent section 0x30 (0 dB)
0x0A Fine master volume 1 Description shown in subsequent section 0x00 (0 dB)
0x0B–0X0D 1 Reserved(1)
0x0E Volume configuration 1 Description shown in subsequent section 0x91
register
0x0F 1 Reserved(1)
0x10 Modulation limit register 1 Description shown in subsequent section 0x02
0x11 IC delay channel 1 1 Description shown in subsequent section 0xAC
0x12 IC delay channel 2 1 Description shown in subsequent section 0x54
0x13 IC delay channel 3 1 Description shown in subsequent section 0xAC
0x14 IC delay channel 4 1 Description shown in subsequent section 0x54
0x15–0x19 1 Reserved(1)
0x1A Start/stop period register 1 Description shown in subsequent section 0x0F
0x1B Oscillator trim register 1 Description shown in subsequent section 0x82
0x1C BKND_ERR register 1 Description shown in subsequent section 0x02
0x1D–0x1F 1 Reserved(1)
0x20 Input MUX register 4 Description shown in subsequent section 0x0001 7772
0x21-0X24 4 Reserved(1)
0x25 PWM MUX register 4 Description shown in subsequent section 0x0102 1345
0x26–0x28 4 Reserved(1)
0x29 ch1_bq[0] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x2A ch1_bq[1] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x2B ch1_bq[2] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
(1) Reserved registers should not be accessed.
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Table 4. Serial Control Interface Register Summary (continued)
NO. OF INITIALIZATION SUBADDRESS REGISTER NAME CONTENTS BYTES VALUE
0x2C ch1_bq[3] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x2D ch1_bq[4] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x2E ch1_bq[5] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x2F ch1_bq[6] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x30 ch2_bq[0] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x31 ch2_bq[1] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x32 ch2_bq[2] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x33 ch2_bq[3] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x34 ch2_bq[4] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
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Table 4. Serial Control Interface Register Summary (continued)
NO. OF INITIALIZATION SUBADDRESS REGISTER NAME CONTENTS BYTES VALUE
0x35 ch2_bq[5] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x36 ch2_bq[6] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x37–0x39 Reserved(2)
DRC ae(3) u[31:26], ae[25:0] 0x0080 0000
0x3A 8
DRC (1 – ae) u[31:26], (1 – ae)[25:0] 0x0000 0000
DRC aa u[31:26], aa[25:0] 0x0080 0000
0x3B 8
DRC (1 – aa) u[31:26], (1 – aa)[25:0] 0x0000 0000
DRC ad u[31:26], ad[25:0] 0x0080 0000
0x3C 8
DRC (1 – ad) u[31:26], (1 – ad)[25:0] 0x0000 0000
0x3D–0x3F Reserved(2)
0x40 DRC-T 4 T[31:0] (9.23 format) 0xFDA2 1490
0x41 DRC-K 4 u[31:26], K[25:0] 0x0384 2109
0x42 DRC-O 4 u[31:26], O[25:0] 0x0008 4210
0x43–0x45 Reserved(2)
0x46 DRC control 4 Description shown in subsequent section 0x0000 0000
0x47–0x4F Reserved(2)
0x50 Bank switch control 4 Description shown in subsequent section 0x0F70 8000
0x51–0xC9 Reserved(2)
0xCA 8 Reserved(2)
0xCB–0xF8 Reserved(2)
Update device address 4 New Dev Id[7:1], ZERO[0] (New Dev Id = 0x38), 0x00000036 0xF9 register (7:1) defines the new device address
0xFA-0xFF Reserved(2)
(2) Reserved registers should not be accessed.
(3) "ae" stands for µ of energy filter, "aa" stands for µ of attack filter and "ad" stands for µ of decay filter and 1- µ = ω.
All DAP coefficients are 3.23 format unless specified otherwise.
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CLOCK CONTROL REGISTER (0x00)
The clocks and data rates are automatically determined by the TAS5707. The clock control register contains the
auto-detected clock status. Bits D7–D5 reflect the sample rate. Bits D4–D2 reflect the MCLK frequency. The
device accepts a 64-fS or 32-fS SCLK rate for all MCLK rates, but accepts a 48-fS SCLK rate for MCLK rates of
192 fS and 384 fS only.
Table 5. Clock Control Register (0x00)
D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
0 0 0 – – – – – fS = 32-kHz sample rate
0 0 1 – – – – – Reserved(1)
0 1 0 – – – – – Reserved(1)
0 1 1 – – – – – fS = 44.1/48-kHz sample rate (2)
1 0 0 – – – – – fs = 16-kHz sample rate
1 0 1 – – – – – fs = 22.05/24 -kHz sample rate
1 1 0 – – – – – fs = 8-kHz sample rate
1 1 1 – – – – – fs = 11.025/12 -kHz sample rate
– – – 0 0 0 – – MCLK frequency = 64 × fS
(3)
– – – 0 0 1 – – MCLK frequency = 128 × fS
(3)
– – – 0 1 0 – – MCLK frequency = 192 × fS
(4)
– – – 0 1 1 – – MCLK frequency = 256 × fS
(2) (5)
– – – 1 0 0 – – MCLK frequency = 384 × fS
– – – 1 0 1 – – MCLK frequency = 512 × fS
– – – 1 1 0 – – Reserved(1)
– – – 1 1 1 – – Reserved(1)
– – – – – – 0 – Reserved(1)
– – – – – – – 0 Reserved(1)
(1) Reserved registers should not be accessed.
(2) Default values are in bold.
(3) Only available for 44.1 kHz and 48 kHz rates.
(4) Rate only available for 32/44.1/48 KHz sample rates
(5) Not available at 8 kHz
DEVICE ID REGISTER (0x01)
The device ID register contains the ID code for the firmware revision.
Table 6. General Status Register (0x01)
D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
X – – – – – – – Reserved
– 1 1 1 0 0 0 0 Identification code
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ERROR STATUS REGISTER (0x02)
The error bits are sticky and are not cleared by the hardware. This means that the software must clear the
register (write zeroes) and then read them to determine if they are persistent errors.
Error Definitions:
• MCLK Error : MCLK frequency is changing. The number of MCLKs per LRCLK is changing.
• SCLK Error: The number of SCLKs per LRCLK is changing.
• LRCLK Error: LRCLK frequency is changing.
• Frame Slip: LRCLK phase is drifting with respect to internal frame sync.
Table 7. Error Status Register (0x02)
D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
1 - – – – – – – MCLK error
– 1 – – – – – – PLL autolock error
– – 1 – – – – – SCLK error
– – – 1 – – – – LRCLK error
– – – – 1 – – – Frame slip
– – – – – – 1 – Overcurrent, overtemperature, overvoltage or undervoltage error
– – – – – – – 1 Overtemperature warning (sets around 125°)
0 0 0 0 0 0 0 0 No errors (1)
(1) Default values are in bold.
SYSTEM CONTROL REGISTER 1 (0x03)
The system control register 1 has several functions:
Bit D7: If 0, the dc-blocking filter for each channel is disabled.
If 1, the dc-blocking filter (–3 dB cutoff <1 Hz) for each channel is enabled (default).
Bit D5: If 0, use soft unmute on recovery from clock error. This is a slow recovery. Unmute takes same
time as volume ramp defined in reg 0X0E.
If 1, use hard unmute on recovery from clock error (default). This is a fast recovery, a single step
volume ramp
Bits D1–D0: Select de-emphasis
Table 8. System Control Register 1 (0x03)
D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
0 – – – – – – – PWM high-pass (dc blocking) disabled
1 – – – – – – – PWM high-pass (dc blocking) enabled (1)
– 0 – – – – – – Reserved (1)
– – 0 – – – – – Soft unmute on recovery from clock error
– – 1 – – – – – Hard unmute on recovery from clock error (1)
– – – 0 – – – – Reserved (1)
– – – – 0 – – – Reserved (1)
– – – – – 0 – – Reserved(1)
– – – – – – 0 0 No de-emphasis (1)
– – – – – – 0 1 De-emphasis for fS = 32 kHz
– – – – – – 1 0 Reserved
– – – – – – 1 1 De-emphasis for fS = 48 kHz
(1) Default values are in bold.
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SERIAL DATA INTERFACE REGISTER (0x04)
As shown in Table 9, the TAS5707 supports 9 serial data modes. The default is 24-bit, I
2S mode,
Table 9. Serial Data Interface Control Register (0x04) Format
RECEIVE SERIAL DATA WORD D7–D4 D3 D2 D1 D0 INTERFACE FORMAT LENGTH
Right-justified 16 0000 0 0 0 0
Right-justified 20 0000 0 0 0 1
Right-justified 24 0000 0 0 1 0
I
2S 16 000 0 0 1 1
I
2S 20 0000 0 1 0 0
I
2S
(1) 24 0000 0 1 0 1
Left-justified 16 0000 0 1 1 0
Left-justified 20 0000 0 1 1 1
Left-justified 24 0000 1 0 0 0
Reserved 0000 1 0 0 1
Reserved 0000 1 0 1 0
Reserved 0000 1 0 1 1
Reserved 0000 1 1 0 0
Reserved 0000 1 1 0 1
Reserved 0000 1 1 1 0
Reserved 0000 1 1 1 1
(1) Default values are in bold.
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SYSTEM CONTROL REGISTER 2 (0x05)
When bit D6 is set low, the system exits all channel shutdown and starts playing audio; otherwise, the outputs
are shut down(hard mute).
Table 10. System Control Register 2 (0x05)
D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
0 – – – – – – – Reserved (1)
– 1 – – – – – – Enter all channel shut down (hard mute).(1)
– 0 – – – – – – Exit all-channel shutdown (normal operation)
– – 0 0 0 0 0 0 Reserved (1)
(1) Default values are in bold.
SOFT MUTE REGISTER (0x06)
Writing a 1 to any of the following bits sets the output of the respective channel to 50% duty cycle (soft mute).
Table 11. Soft Mute Register (0x06)
D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
– – – – – – – 1 Soft mute channel 1
– – – – – – – 0 Soft unmute channel 1
– – – – – – 1 – Soft mute channel 2
– – – – – – 0 – Soft unmute channel 2
0 0 0 0 0 0 – – Reserved
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VOLUME REGISTERS (0x07, 0x08, 0x09)
Step size is 0.5 dB.
Master volume – 0x07 (default is mute)
Channel-1 volume – 0x08 (default is 0 dB)
Channel-2 volume – 0x09 (default is 0 dB)
Table 12. Volume Registers (0x07, 0x08, 0x09)
D D D D D D D D
FUNCTION 7 6 5 4 3 2 1 0
0 0 0 0 0 0 0 0 24 dB
0 0 1 1 0 0 0 0 0 dB (default for individual channel volume) (1)
1 1 0 0 1 1 0 1 –78.5 dB
1 1 0 0 1 1 1 0 –79.0 dB
1 1 0 0 1 1 1 1 Values between 0xCF and 0xFE are Reserved
1 1 1 1 1 1 1 1 MUTE (default for master volume)
(1) Default values are in bold.
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MASTER FINE VOLUME REGISTER (0x0A)
This register can be used to provide precision tuning of master volume.
Table 13. Master Fine Volume Register (0x0A)
D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
– – – – – – 0 0 0 dB (1)
– – – – – – 0 1 0.125 dB
– – – – – – 1 0 0.25 dB
– – – – – – 1 1 0.375 dB
1 – – – – – – – Write enable bit
0 – – – – – – – Ignore Write to register 0X0A
(1) Default values are in bold.
VOLUME CONFIGURATION REGISTER (0x0E)
Bits Volume slew rate (Used to control volume change and MUTE ramp rates). These bits control the
D2–D0: number of steps in a volume ramp.Volume steps occur at a rate that depends on the sample rate of
the I2S data as follows
Sample Rate (KHz) Approximate Ramp Rate
8/16/32 125 us/step
11.025/22.05/44.1 90.7 us/step
12/24/48 83.3 us/step
Table 14. Volume Control Register (0x0E)
D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
1 0 0 1 0 – – – Reserved (1)
– – – – – 0 0 0 Volume slew 512 steps (43 ms volume ramp time at 48kHz)
– – – – – 0 0 1 Volume slew 1024 steps (85 ms volume ramp time at 48kHz) (1)
– – – – – 0 1 0 Volume slew 2048 steps (171 ms volume ramp time at 48kHz)
– – – – – 0 1 1 Volume slew 256 steps (21ms volume ramp time at 48kHz)
– – – – – 1 X X Reserved
(1) Default values are in bold.
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MODULATION LIMIT REGISTER (0x10)
The modulation limit is the maximum duty cycle of the PWM output waveform.
Table 15. Modulation Limit Register (0x10)
D7 D6 D5 D4 D3 D2 D1 D0 MODULATION LIMIT
– – – – – 0 0 0 99.2%
– – – – – 0 0 1 98.4%
– – – – – 0 1 0 97.7%
– – – – – 0 1 1 96.9%
– – – – – 1 0 0 96.1%
– – – – – 1 0 1 95.3%
– – – – – 1 1 0 94.5%
– – – – – 1 1 1 93.8%
0 0 0 0 0 – – – RESERVED
INTERCHANNEL DELAY REGISTERS (0x11, 0x12, 0x13, and 0x14)
Internal PWM channels 1, 2, 1, and 2 are mapped into registers 0x11, 0x12, 0x13, and 0x14.
Table 16. Channel Interchannel Delay Register Format
BITS DEFINITION D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
0 0 0 0 0 0 – – Minimum absolute delay, 0 DCLK cycles
0 1 1 1 1 1 – – Maximum positive delay, 31 × 4 DCLK cycles
1 0 0 0 0 0 – – Maximum negative delay, –32 × 4 DCLK cycles
0 0 RESERVED
SUBADDRESS D7 D6 D5 D4 D3 D2 D1 D0 Delay = (value) × 4 DCLKs
0x11 1 0 1 0 1 1 – – Default value for channel 1
(1)
0x12 0 1 0 1 0 1 – – Default value for channel 2
(1)
0x13 1 0 1 0 1 1 – – Default value for channel 1
(1)
0x14 0 1 0 1 0 1 – – Default value for channel 2
(1)
(1) Default values are in bold.
ICD settings have high impact on audio performance (e.g., dynamic range, THD, crosstalk etc.) Therefore,
appropriate ICD settings must be used. By default, the device has ICD settings for AD mode. If used in BD
mode, then update these registers before coming out of all-channel shutdown.
REGISTER AD MODE BD MODE
0x11 0xAC 0xB8
0x12 0x54 0x60
0x13 0xAC 0xA0
0x14 0x54 0x48
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START/STOP PERIOD REGISTER (0x1A)
This register is used to control the soft-start and soft-stop period following an enter/exit all channel shut down
command or change in the PDN state. This helps reduce pops and clicks at start-up and shutdown.The times are
only approximate and vary depending on device activity level and I2S clock stability.
Table 17. Start/Stop Period Register (0x1A)
D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
0 0 0 – – – – – Reserved
– – – 0 0 – – – No 50% duty cycle start/stop period
– – – 0 1 0 0 0 16.5-ms 50% duty cycle start/stop period
– – – 0 1 0 0 1 23.9-ms 50% duty cycle start/stop period
– – – 0 1 0 1 0 31.4-ms 50% duty cycle start/stop period
– – – 0 1 0 1 1 40.4-ms 50% duty cycle start/stop period
– – – 0 1 1 0 0 53.9-ms 50% duty cycle start/stop period
– – – 0 1 1 0 1 70.3-ms 50% duty cycle start/stop period
– – – 0 1 1 1 0 94.2-ms 50% duty cycle start/stop period
– – – 0 1 1 1 1 125.7-ms 50% duty cycle start/stop period(1)
– – – 1 0 0 0 0 164.6-ms 50% duty cycle start/stop period
– – – 1 0 0 0 1 239.4-ms 50% duty cycle start/stop period
– – – 1 0 0 1 0 314.2-ms 50% duty cycle start/stop period
– – – 1 0 0 1 1 403.9-ms 50% duty cycle start/stop period
– – – 1 0 1 0 0 538.6-ms 50% duty cycle start/stop period
– – – 1 0 1 0 1 703.1-ms 50% duty cycle start/stop period
– – – 1 0 1 1 0 942.5-ms 50% duty cycle start/stop period
– – – 1 0 1 1 1 1256.6-ms 50% duty cycle start/stop period
– – – 1 1 0 0 0 1728.1-ms 50% duty cycle start/stop period
– – – 1 1 0 0 1 2513.6-ms 50% duty cycle start/stop period
– – – 1 1 0 1 0 3299.1-ms 50% duty cycle start/stop period
– – – 1 1 0 1 1 4241.7-ms 50% duty cycle start/stop period
– – – 1 1 1 0 0 5655.6-ms 50% duty cycle start/stop period
– – – 1 1 1 0 1 7383.7-ms 50% duty cycle start/stop period
– – – 1 1 1 1 0 9897.3-ms 50% duty cycle start/stop period
– – – 1 1 1 1 1 13,196.4-ms 50% duty cycle start/stop period
(1) Default values are in bold.
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OSCILLATOR TRIM REGISTER (0x1B)
The TAS5707 PWM processor contains an internal oscillator to support autodetect of I2S clock rates. This
reduces system cost because an external reference is not required. Currently, TI recommends a reference
resistor value of 18.2 kΩ (1%). This should be connected between OSC_RES and DVSSO.
Writing 0X00 to reg 0X1B enables the trim that was programmed at the factory.
Note that trim must always be run following reset of the device.
Table 18. Oscillator Trim Register (0x1B)
D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
1 – – – – – – – Reserved (1)
– 0 – – – – – – Oscillator trim not done (read-only) (1)
– 1 – – – – – – Oscillator trim done (read only)
– – 0 0 0 0 – – Reserved (1)
– – – – – – 0 – Select factory trim (Write a 0 to select factory trim; default is 1.)
– – – – – – 1 – Factory trim disabled (1)
– – – – – – – 0 Reserved (1)
(1) Default values are in bold.
BKND_ERR REGISTER (0x1C)
When a back-end error signal is received from the internal power stage, the power stage is reset stopping all
PWM activity. Subsequently, the modulator waits approximately for the time listed in Table 19 before attempting
to re-start the power stage.
Table 19. BKND_ERR Register (0x1C)(1)
D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
0 0 0 0 0 0 0 X Reserved
– – – – 0 0 1 0 Set back-end reset period to 299 ms (2)
– – – – 0 0 1 1 Set back-end reset period to 449 ms
– – – – 0 1 0 0 Set back-end reset period to 598 ms
– – – – 0 1 0 1 Set back-end reset period to 748 ms
– – – – 0 1 1 0 Set back-end reset period to 898 ms
– – – – 0 1 1 1 Set back-end reset period to 1047 ms
– – – – 1 0 0 0 Set back-end reset period to 1197 ms
– – – – 1 0 0 1 Set back-end reset period to 1346 ms
– – – – 1 0 1 X Set back-end reset period to 1496 ms
– – – – 1 1 X X Set back-end reset period to 1496 ms
(1) This register can be written only with a "non-Reserved" value. Also this register can be written once after the reset.
(2) Default values are in bold.
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INPUT MULTIPLEXER REGISTER (0x20)
This register controls the modulation scheme (AD or BD mode) as well as the routing of I2S audio to the internal
channels.
Table 20. Input Multiplexer Register (0x20)
D31 D30 D29 D28 D27 D26 D25 D24 FUNCTION
0 0 0 0 0 0 0 0 Reserved (1)
D23 D22 D21 D20 D19 D18 D17 D16 FUNCTION
0 – – – – – – – Channel-1 AD mode
1 – – – – – – – Channel-1 BD mode
– 0 0 0 – – – – SDIN-L to channel 1
(1)
– 0 0 1 – – – – SDIN-R to channel 1
– 0 1 0 – – – – Reserved
– 0 1 1 – – – – Reserved
– 1 0 0 – – – – Reserved
– 1 0 1 – – – – Reserved
– 1 1 0 – – – – Ground (0) to channel 1
– 1 1 1 – – – – Reserved
– – – – 0 – – – Channel 2 AD mode
– – – – 1 – – – Channel 2 BD mode
– – – – – 0 0 0 SDIN-L to channel 2
– – – – – 0 0 1 SDIN-R to channel 2
(1)
– – – – – 0 1 0 Reserved
– – – – – 0 1 1 Reserved
– – – – – 1 0 0 Reserved
– – – – – 1 0 1 Reserved
– – – – – 1 1 0 Ground (0) to channel 2
– – – – – 1 1 1 Reserved
D15 D14 D13 D12 D11 D10 D9 D8 FUNCTION
0 1 1 1 0 1 1 1 Reserved (1)
D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
0 1 1 1 0 0 1 0 Reserved (1)
(1) Default values are in bold.
PWM OUTPUT MUX REGISTER (0x25)
This DAP output mux selects which internal PWM channel is output to the external pins. Any channel can be
output to any external output pin.
Bits D21–D20: Selects which PWM channel is output to OUT_A
Bits D17–D16: Selects which PWM channel is output to OUT_B
Bits D13–D12: Selects which PWM channel is output to OUT_C
Bits D09–D08: Selects which PWM channel is output to OUT_D
Note that channels are enclosed so that channel 1 = 0x00, channel 2 = 0x01, channet 1 = 0x02, and channel 2 =
0x03.
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Table 21. PWM Output Mux Register (0x25)
D31 D30 D29 D28 D27 D26 D25 D24 FUNCTION
0 0 0 0 0 0 0 1 Reserved(1)
D23 D22 D21 D20 D19 D18 D17 D16 FUNCTION
0 0 – – – – – – Reserved(1)
– – 0 0 – – – – Multiplex channel 1 to OUT_A (1)
– – 0 1 – – – – Multiplex channel 2 to OUT_A
– – 1 0 – – – – Multiplex channel 1 to OUT_A
– – 1 1 – – – – Multiplex channel 2 to OUT_A
– – – – 0 0 – – Reserved (1)
– – – – – – 0 0 Multiplex channel 1 to OUT_B
– – – – – – 0 1 Multiplex channel 2 to OUT_B
– – – – – – 1 0 Multiplex channel 1 to OUT_B (1)
– – – – – – 1 1 Multiplex channel 2 to OUT_B
D15 D14 D13 D12 D11 D10 D9 D8 FUNCTION
0 0 – – – – – – Reserved (1)
– – 0 0 – – – – Multiplex channel 1 to OUT_C
– – 0 1 – – – – Multiplex channel 2 to OUT_C(1)
– – 1 0 – – – – Multiplex channel 1 to OUT_C
– – 1 1 – – – – Multiplex channel 2 to OUT_C
– – – – 0 0 – – Reserved (1)
– – – – – – 0 0 Multiplex channel 1 to OUT_D
– – – – – – 0 1 Multiplex channel 2 to OUT_D
– – – – – – 1 0 Multiplex channel 1 to OUT_D
– – – – – – 1 1 Multiplex channel 2 to OUT_D (1)
D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
0 1 0 0 0 1 0 1 RESERVED
(1) Default values are in bold.
DRC CONTROL (0x46)
Each DRC can be enabled independently using the DRC control register. The DRCs are disabled by default.
Table 22. DRC Control Register (0x46)
D31 D30 D29 D28 D27 D26 D25 D24 FUNCTION
0 0 0 0 0 0 0 0 Reserved (1)
D23 D22 D21 D20 D19 D18 D17 D16 FUNCTION
0 0 0 0 0 0 0 0 Reserved (1)
D15 D14 D13 D12 D11 D10 D9 D8 FUNCTION
0 0 0 0 0 0 0 0 Reserved (1)
D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
– – – – – – – 0 DRC turned OFF (1)
– – – – – – – 1 DRC turned ON
0 0 0 0 0 0 0 – Reserved (1)
(1) Default values are in bold.
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BANK SWITCH AND EQ CONTROL (0x50)
Table 23. Bank Switching Command
D31 D30 D29 D28 D27 D26 D25 D24 FUNCTION
0 – – – – – – – 32 kHz, does not use bank 3
(1)
1 – – – – – – – 32 kHz, uses bank 3
– 0 – – – – – – Reserved(1)
– – 0 – – – – – Reserved(1)
– – – 0 – – – – 44.1/48 kHz, does not use bank 3
(1)
– – – 1 – – – – 44.1/48 kHz, uses bank 3
– – – – 0 – – – 16 kHz, does not use bank 3
– – – – 1 – – – 16 kHz, uses bank 3
(1)
– – – – – 0 – – 22.025/24 kHz, does not use bank 3
– – – – – 1 – – 22.025/24 kHz, uses bank 3
(1)
– – – – – – 0 – 8 kHz, does not use bank 3
– – – – – – 1 – 8 kHz, uses bank 3
(1)
– – – – – – – 0 11.025 kHz/12, does not use bank 3
– – – – – – – 1 11.025/12 kHz, uses bank 3
(1)
D23 D22 D21 D20 D19 D18 D17 D16 FUNCTION
0 – – – – – – – 32 kHz, does not use bank 2
(1)
1 – – – – – – – 32 kHz, uses bank 2
– 1 – – – – – – Reserved (1)
– – 1 – – – – – Reserved (1)
– – – 0 – – – – 44.1/48 kHz, does not use bank 2
– – – 1 – – – – 44.1/48 kHz, uses bank 2
(1)
– – – – 0 – – – 16 kHz, does not use bank 2
(1)
– – – – 1 – – – 16 kHz, uses bank 2
– – – – – 0 – – 22.025/24 kHz, does not use bank 2
(1)
– – – – – 1 – – 22.025/24 kHz, uses bank 2
– – – – – – 0 – 8 kHz, does not use bank 2
(1)
– – – – – – 1 – 8 kHz, uses bank 2
– – – – – – – 0 11.025/12 kHz, does not use bank 2
(1)
– – – – – – – 1 11.025/12 kHz, uses bank 2
D15 D14 D13 D12 D11 D10 D9 D8 FUNCTION
0 – – – – – – – 32 kHz, does not use bank 1
1 – – – – – – – 32 kHz, uses bank 1
(1)
– 0 – – – – – – Reserved(1)
– – 0 – – – – – Reserved(1)
– – – 0 – – – – 44.1/48 kHz, does not use bank 1
(1)
– – – 1 – – – – 44.1/48 kHz, uses bank 1
– – – – 0 – – – 16 kHz, does not use bank 1
(1)
– – – – 1 – – – 16 kHz, uses bank 1
– – – – – 0 – – 22.025/24 kHz, does not use bank 1
(1)
– – – – – 1 – – 22.025/24 kHz, uses bank 1
– – – – – – 0 – 8 kHz, does not use bank 1
(1)
– – – – – – 1 – 8 kHz, uses bank 1
– – – – – – – 0 11.025/12 kHz, does not use bank 1
(1)
– – – – – – – 1 11.025/12 kHz, uses bank 1
(1) Default values are in bold.
48 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TAS5707 TAS5707A
TAS5707, TAS5707A
www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009
Table 23. Bank Switching Command (continued)
D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
0 EQ ON
1 – – – – – – – EQ OFF (bypass BQ 0-6 of channels 1 and 2)
– 0 – – – – – – Reserved (2)
– – 0 – – – – – Ignore bank-mapping in bits D31–D8.Use default mapping. (2)
1 Use bank-mapping in bits D31–D8.
– – – 0 – – – – L and R can be written independently. (2)
L and R are ganged for EQ biquads; a write to Left channel BQ is
– – – 1 – – – –
also written to Right channel BQ. (0X29-2F is ganged to 0X30-0X36).
– – – – 0 – – – Reserved (2)
– – – – – 0 0 0 No bank switching. All updates to DAP (2)
– – – – – 0 0 1 Configure bank 1 (32 kHz by default)
– – – – – 0 1 0 Configure bank 2 (44.1/48 kHz by default)
– – – – – 0 1 1 Configure bank 3 (other sample rates by default)
– – – – – 1 0 0 Automatic bank selection
– – – – – 1 0 1 Reserved
– – – – – 1 1 X Reserved
(2) Default values are in bold.
Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 49
Product Folder Link(s): TAS5707 TAS5707A
TAS5707, TAS5707A
SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com
Changes from Revision A (November 2008) to Revision B Page
• Added TAS5707A device to data sheet ................................................................................................................................ 1
• Changed PVDD maximum voltage to 26 V in Features ....................................................................................................... 1
• Added Applications section ................................................................................................................................................... 1
• Inserted paragraph on TAS5707A into Description section .................................................................................................. 1
• Changed PVDD maximum voltage to 26 V in simplified application diagram ...................................................................... 2
• Changed PVDD maximum voltage to 26 V in recommended operating conditions ............................................................. 7
• Added AVDD to output voltage test conditions ..................................................................................................................... 9
• Added rows to Electrical Characteristics fro OTW and OTW ............................................................................................... 9
• Changed OLPC typical value to 0.63 ms. ............................................................................................................................. 9
• Replaced text of Overtemperature Protection section ........................................................................................................ 18
• Added address information for the TAS5707A ................................................................................................................... 25
• Revised Sample Calculation for 3.23 Format table ............................................................................................................ 30
• Added 0xCA row to Register Summary table ..................................................................................................................... 36
• Revised 0xF9 row of Register Summary table ................................................................................................................... 36
• Corrected temperature from 145°C to 125°C ..................................................................................................................... 38
• Changed de-emphasis settings in register 0x03 table ........................................................................................................ 38
• Added text to Modulationi Limit Register section ................................................................................................................ 43
• Added text to the DRC Control section ............................................................................................................................... 47
50 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TAS5707 TAS5707A
PACKAGE OPTION ADDENDUM
www.ti.com 9-Sep-2014
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TAS5707APHP ACTIVE HTQFP PHP 48 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR 0 to 85 TAS5707A
TAS5707APHPR ACTIVE HTQFP PHP 48 1000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR 0 to 85 TAS5707A
TAS5707PHP ACTIVE HTQFP PHP 48 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR 0 to 85 TAS5707
TAS5707PHPR ACTIVE HTQFP PHP 48 1000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR 0 to 85 TAS5707
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
PACKAGE OPTION ADDENDUM
www.ti.com 9-Sep-2014
Addendum-Page 2
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
TAS5707APHPR HTQFP PHP 48 1000 330.0 16.4 9.6 9.6 1.5 12.0 16.0 Q2
TAS5707APHPR HTQFP PHP 48 1000 330.0 16.4 9.6 9.6 1.5 12.0 16.0 Q2
TAS5707PHPR HTQFP PHP 48 1000 330.0 16.4 9.6 9.6 1.5 12.0 16.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 4-Jun-2014
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TAS5707APHPR HTQFP PHP 48 1000 367.0 367.0 38.0
TAS5707APHPR HTQFP PHP 48 1000 336.6 336.6 31.8
TAS5707PHPR HTQFP PHP 48 1000 336.6 336.6 31.8
PACKAGE MATERIALS INFORMATION
www.ti.com 4-Jun-2014
Pack Materials-Page 2
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Copyright © 2014, Texas Instruments Incorporated
tm
March 2009
FDS6679AZ P-Channel PowerTrench
® MOSFET
©2009 Fairchild Semiconductor Corporation
FDS6679AZ Rev. B2
1 www.fairchildsemi.com
FDS6679AZ
P-Channel PowerTrench® MOSFET
-30V, -13A, 9mΩ
General Description
This P-Channel MOSFET is producted using Fairchild
Semiconductor’s advanced PowerTrench process that has
been especially tailored to minimize the on-state
resistance.
This device is well suited for Power Management and load
switching applications common in Notebook Computers
and Portable Battery Packs.
Features
Max rDS(on) = 9.3mΩ at VGS = -10V, ID = -13A
Max rDS(on) = 14.8mΩ at VGS = -4.5V, ID = -11A
Extended VGS range (-25V) for battery applications
HBM ESD protection level of 6kV typical (note 3)
High performance trench technology for extremely low
rDS(on)
High power and current handing capability
RoHS Compliant
S
D
S S SO-8
D
D
D
G
1
7
5
2
8
4
6 3
MOSFET Maximum Ratings TA = 25°C unless otherwise noted
Thermal Characteristics
Package Marking and Ordering Information
Symbol Parameter Ratings Units
VDS Drain to Source Voltage -30 V
VGS Gate to Source Voltage ±25 V
ID
Drain Current -Continuous (Note 1a) -13 A
-Pulsed -65
PD
Power Dissipation for Single Operation (Note 1a) 2.5
(Note 1b) 1.2 W
(Note 1c) 1.0
TJ, TSTG Operating and Storage Temperature -55 to +150 °C
RθJA Thermal Resistance , Junction to Ambient (Note 1a) 50 °C/W
RθJC Thermal Resistance , Junction to Case (Note 1) 25 °C/W
Device Marking Device Reel Size Tape Width Quantity
FDS6679AZ FDS6679AZ 13’’ 12mm 2500 units
FDS6679AZ P-Channel PowerTrench® MOSFET
©2009 Fairchild Semiconductor Corporation
2 www.fairchildsemi.com
FDS6679AZ Rev. B2
Electrical Characteristics
T
J = 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics BVDSS Drain to Source Breakdown Voltage
I
D = -250
µA, VGS = 0V -30
V
∆
BVDSS
∆
T
J
Breakdown Voltage Temperature
Coefficient
I
D = -250
µA, referenced to
25
°
C -20 mV/°C
IDSS Zero Gate Voltage Drain Current
VDS = -24V, VGS=0V -1
µ
A
IGSS Gate to Source Leakage Current
VGS = ±25V, VDS=0V ±10
µ
A
On Characteristics VGS(th) Gate to Source Threshold Voltage
VGS = VDS, I
D = -250
µ
A -1 -1.9 -3
V
∆
VGS(th)
∆
T
J
Gate to Source Threshold Voltage
Temperature Coefficient
I
D = -250
µA, referenced to
25°C 6.5 mV/°C
rDS(on) Drain to Source On Resistance
VGS = -10V, I
D = -13A 7.7 9.3
m
Ω
VGS = -4.5V, I
D = -11A 11.8 14.8
VGS = -10V, I
D = -13A,
T
J = 125
°
C 10.7 13.4
gFS Forward Transconductance
VDS = -5V, I
D = -13A 55
S
(Note 2)
Dynamic Characteristics Ciss Input Capacitance
VDS = -15V, VGS = 0V,
f = 1MHz
2890 3845 pF
Coss Output Capacitance 500 665 pF Crss Reverse Transfer Capacitance 495 745 pF
Switching Characteristics (Note 2) td(on) Turn-On Delay Time
VDD = -15V, I
D = -1A
VGS = -10V, RGS = 6
Ω
13 24 ns
t
r Rise Time 15 27 ns
td(off) Turn-Off Delay Time 210 336 ns tf Fall Time 92 148 ns Qg Total Gate Charge VDS = -15V, VGS = -10V, ID = -13A 68 96 nC Qg Total Gate Charge VDS = -15V, VGS = -5V, ID = -13A
38 54 nC
Qgs Gate to Source Gate Charge 10 nC Qgd Gate to Drain Charge 17 nC
Drain-Source Diode Characteristic VSD Source to Drain Diode Forward Voltage
VGS = 0V, I
S = -2.1A -0.7 -1.2
V
trr Reverse Recovery Time
I
F = -13A, di/dt = 100A/
µ
s 40 ns
Qrr Reverse Recovery Charge
I
F = -13A, di/dt = 100A/
µ
s -31 nC
Notes:
1:
R
θJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the
drain pins. R
θJC is guaranteed by design while
R
θCA is determined by the user’s board design.
Scale 1 : 1 on letter size paper
2: Pulse Test:Pulse Width <300
µs, Duty Cycle <2.0%
3: The diode connected between the gate and source serves only as protection against ESD. No gate overvoltage rating is implied.
a) 50
°C/W when
mounted on a 1 in
2
pad of 2 oz copper
b)105
°C/W when
mounted on a .04 in
2
pad of 2 oz copper
minimun pad
c) 125
°C/W when
mounted on a
FDS6679AZ P-Channel PowerTrench® MOSFET
©2009 Fairchild Semiconductor Corporation
3 www.fairchildsemi.com
FDS6679AZ Rev. B2
Typical Characteristics
T
J = 25°C unless otherwise noted
Figure 1. On Region Characteristics
01234
0
10
20
30
40
50
60
70
PULSE DURATION = 80
µ
s
DUTY CYCLE = 0.5%MAX
VGS = -5V
VGS = -4V
VGS = -3V
VGS = -3.5V
VGS = -4.5V
VGS = -10V
-ID, DRAIN CURRENT (A)
-VDS, DRAIN TO SOURCE VOLTAGE (V)
Figure 2. Normalized
0 10 20 30 40 50 60 70
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
PULSE DURATION = 80
µ
s
DUTY CYCLE = 0.5%MAX
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
-I
D, DRAIN CURRENT(A) VGS = -10V VGS = -5V VGS = -4.5V VGS = -4V
VGS = -3.5V
On-Resistance vs Drain
Current and Gate Voltage
Figure 3.
-80 -40 0 40 80 120 160
0.6
0.8
1.0
1.2
1.4
1.6
I
D = -13A VGS = -10V
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
T
J, JUNCTION TEMPERATURE
(
o
C
)
Normalized On Resistance vs Junction
Temperature
Figure 4.
3.0 4.5 6.0 7.5 9.0 0
10
20
30
PULSE DURATION = 80
µ
s
DUTY CYCLE = 0.5%MAX TJ = 150oC TJ = 25oC
ID = -13A
rDS(on), DRAIN TO SOURCE
ON-RESISTANCE (mΩ)
-VGS, GATE TO SOURCE VOLTAGE (V)
10
On-Resistance vs Gate to Source
Voltage
Figure 5. Transfer Characteristics
2.0 2.5 3.0 3.5 4.0 4.5 0
10
20
30
40
50
60
70
PULSE DURATION = 80
µ
s
DUTY CYCLE = 0.5%MAX
T
J = -55
o
C
T
J = 25
o
C
TJ = 150
o
C
-ID, DRAIN CURRENT (A)
-VGS, GATE TO SOURCE VOLTAGE (V)
Figure 6.
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
1E-3
0.01
0.11
10
100
T
J = -55
o
C
T
J = 25
o
C
TJ = 150
o
C
VGS = 0V
-IS, REVERSE DRAIN CURRENT (A)
-VSD, BODY DIODE FORWARD VOLTAGE (V)
Source to Drain Diode Forward
Voltage vs Source Current
FDS6679AZ P-Channel PowerTrench® MOSFET
©2009 Fairchild Semiconductor Corporation
4 www.fairchildsemi.com
FDS6679AZ Rev. B2
Figure 7.
0 15 30 45 60 75
02468
10
VDD = -20V
VDD = -10V
-VGS, GATE TO SOURCE VOLTAGE(V)
Q
g, GATE CHARGE(nC) VDD = -15V
Gate Charge Characteristics Figure 8.
0.1 1 10
100
1000
10000
f = 1MHz VGS = 0V
CAPACITANCE (pF)
-VDS, DRAIN TO SOURCE VOLTAGE (V) Crss Coss Ciss
30
Capacitance vs Drain to Source Voltage
Figure 9. I
g vs VGS
0 5 10 15 20 25 30 35
1E-4
1E-3
0.01
0.11
10
100
1000
TJ = 150
o
CT
J = 25
o
C
-Ig(uA)
-VGS(V)
Figure 10.
10-2 10-1 10
0 10
1 10
2
1
10
TJ = 25
o
C
TJ = 125
o
C
-IAS, AVALANCHE CURRENT(A)
20
t
AV, TIME IN AVALANCHE(ms)
Unclamped Inductive Switching
Capability
Figure 11.
25 50 75 100 125 150 02468
10
12
14
16
VGS = -10V
VGS = -4.5V
-ID, DRAIN CURRENT (A)
TA, AMBIENT TEMPERATURE
(
o
C
)
Maximum Continuous Drain Current vs
Ambient Temperature
Figure 12. Forward Bias Safe Operating Area
0.01 0.1 1 10 100
0.01
0.11
10
100
100 us
1 s
10 s
DC
100 ms
10 ms
1 ms
ID, DRAIN CURRENT (A)
VDS, DRAIN to SOURCE VOLTAGE (V)
THIS AREA IS
LIMITED BY rDS(on)
SINGLE PULSE TJ = MAX RATED RθJA = 125 o
C/W
TA = 25
o
C
200
Typical Characteristics
T
J = 25°C unless otherwise noted
FDS6679AZ P-Channel PowerTrench® MOSFET
©2009 Fairchild Semiconductor Corporation
5 www.fairchildsemi.com
FDS6679AZ Rev. B2
Figure 13.
10-4 10-3 10-2 10-1 1 10 10
2 10
3
0.51
10
10
2
10
3
10
4
SINGLE PULSE RθJA = 125 o
C/W
TA = 25
o
C
VGS = -10 V
P(PK), PEAK TRANSIENT POWER (W)
t, PULSE WIDTH (sec)
Single Pulse Maximum Power Dissipation
Figure 14.
10-4 10-3 10-2 10-1 1 10 10
2 10
3 10-4
10-3
10-2
10-11
SINGLE PULSE RθJA = 125 o
C/W
DUTY CYCLE-DESCENDING ORDER
NORMALIZED THERMAL
IMPEDANCE, ZθJA
t, RECTANGULAR PULSE DURATION (sec)
D = 0.5
0.2
0.1
0.05
0.02
0.01
2
PDM
t
1
t
2
NOTES:
DUTY FACTOR: D = t
1/t
2
PEAK T
J = PDM x Z
θJA x R
θJA + TA
Junction-to-Ambient Transient Thermal Response Curve
Typical Characteristics
T
J = 25°C unless otherwise noted
6 www.fairchildsemi.com
FDS6679AZ P-Channel PowerTrench
® MOSFET
©2009 Fairchild Semiconductor Corporation
FDS6679AZ Rev. B2
Rev. I39
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY
PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY
THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Build it Now™
CorePLUS™
CorePOWER™
CROSSVOLT™
CTL™
Current Transfer Logic™
EcoSPARK®
EfficentMax™
EZSWITCH™ *
™
Fairchild®
Fairchild Semiconductor®
FACT Quiet Series™
FACT®
FAST®
FastvCore™
FlashWriter® *
FPS™
F-PFS™
FRFET®
Global Power ResourceSM
Green FPS™
Green FPS™ e-Series™
GTO™
IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
MicroPak™
MillerDrive™
MotionMax™
Motion-SPM™
OPTOLOGIC®
OPTOPLANAR®
®
PDP SPM™
Power-SPM™
PowerTrench®
PowerXS™
Programmable Active Droop™
QFET®
QS™
Quiet Series™
RapidConfigure™
™
Saving our world, 1mW /W /kW at a time™
SmartMax™
SMART START™
SPM®
STEALTH™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SupreMOS™
SyncFET™
®
The Power Franchise®
TinyBoost™
TinyBuck™
TinyLogic®
TINYOPTO™
TinyPower™
TinyPWM™
TinyWire™
TriFault Detect™
TRUECURRENT™*
µSerDes™
UHC®
Ultra FRFET™
UniFET™
VCX™
VisualMax™
XS™
tm
®
tm
tm
Datasheet Identification Product Status Definition
Advance Information Formative / In Design Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Preliminary First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
No Identification Needed Full Production Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete Not In Production Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website,
www.Fairchildsemi.com, under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their
parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed
application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the
proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild
Distributors who are listed by country on our web page cited above. Products customers buy either from fairchild directly or from Authorized Fairchild
Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of
up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and
warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is
committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
－ FC32 －
Plastic Film Capacitors
Metallized Polyester Film Capacitor
Type:ECQE(F)
Non-inductive construction using metallized Polyester
film with flame retardant epoxy resin coating
■Features
•Self-healing property
•Excellent electrical characteristics
•Flame retardant epoxy resin coating
•RoHS directive compliant
■Recommended Applications
•General purpose usage
❈Please contact us when applications are CD , ignitor etc.
■Explanation of Part Numbers
1 2 3 4 5 6 7 8 9 10 11 12
E C Q E
Product code Dielectric &
construction
Rated volt. Capacitance
F
Cap. Tol. Suffix Suffix
1
2
4
6
100 VDC
250 VDC
400 VDC
630 VDC
10
12
1A
2A
1000 VDC
1250 VDC
125 VAC
250 VAC
J
K
±5 %
±10 %
E C Q E
Product code Dielectric &
construction
Rated volt. Capacitance
R F
Suffix Cap. Tol. Suffix
■Specifications
●Explanation of Part Number for Odd Size Taping
Category temp. range
(Including temperature-rise on unit surface)
Rated voltage
Capacitance range
Capacitance tolerance
Dissipation factor (tan )
Withstand voltage
Insulation resistance (IR)
100 VDC, 250 VDC,400 VDC, 630 VDC, 1000 VDC, 1250 VDC,
125 VAC, 250 VAC
–40 ˚C to +105 ˚C
–40 ˚C to +105 ˚C
100 VDC, 250 VDC, 400 VDC, 630 VDC, 1000 VDC, 1250 VDC,
(Derating of rated voltage by 1.25 %/˚C at more than 85 ˚C)
125 VAC, 250 VAC
0.0010 µF to 10 µF (E12)
±5 %(J), ±10 %(K)
tan <=1.0 % (20 ˚C, 1 kHz)
•Rated volt. 100 V to 630 VDC
Between terminals : Rated volt.(VDC)✕150 % 60 s
•Rated volt. 1000 VDC, 1250 VDC
Between terminals : Rated volt. (VDC)✕175 % 2 s to 5 s or 1000 VAC 60 s
Between terminals to enclosure : 1500 VAC 60 s
•Rated volt. 125 VAC, 250 VAC
Between terminals : Rated volt.(VAC)✕230 % 60 s
Between terminals to enclosure : 1500 VAC 60 s
100 V to 630 VDC: C <= 0.33 µF : IR>=9000 MΩ (20 ˚C, 100 VDC, 60 s)
C > 0.33 µF : IR>=3000 MΩ . µF
1000 VDC, 1250 VDC: IR>=10000 MΩ (20 ˚C, 100 VDC, 60 s)
IR>=2000 MΩ (20 ˚C, 500 VDC, 60 s)
125 VAC, 250 VAC: C <= 0.47 µF : IR>=2000 MΩ (20 ˚C, 500 VDC, 60 s)
C > 0.47 µF : IR>=3000 MΩ . µF (20 ˚C, 100 VDC, 60 s)
❈ In case of applying voltage in alternating current (50 Hz or 60 Hz sine wave) to a capacitor with DC rated voltage, please
refer to the page of “Permissible voltage (R.M.S) in alternating current corresponding to DC rated voltage”.
❈ Voltage to be applied to ECQE1A (F) & ECQE2A (F) is only sine wave (50 Hz or 60 Hz).
Suffix
Blank
B
Z
3
6
Lead Form
Straight
Crimped lead
Cut lead
Crimped taping (Ammo)
Crimped taping (Ammo)
p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 32
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
－ FC33 －
Plastic Film Capacitors
■Dimensions in mm (not to scale)
Cut lead
■Packaging Specifications for Bulk Package
Packing quantity:100 pcs./bag
■Taping Specifications for Automatic Insertion
●Taping style
❈Refer to the page of taping specifications.
100 VDC
250 VDC
400 VDC
630 VDC
1000 VDC
1250 VDC
125 VAC
250 VAC
ECQE (F)
AD AS AB BCD E
0.56 to 0.68 ○ Ammo ( ) F3
0.82 to 1.0 ○ Ammo ( ) F3
1.2 to 3.3 ○ Ammo ( ) F3
1.2 to 3.3 ○ Ammo R( ) F
0.010 to 0.27 ○ Ammo ( ) F3
0.33 ○ Ammo ( ) F3
0.39 to 1.5 ○ Ammo ( ) F3
0.010 to 0.33 ○ Ammo R( ) F
0.39 to 1.5 ○ Ammo R( ) F
0.010 to 0.10 ○ Ammo ( ) F3
0.12 to 0.47 ○ Ammo ( ) F3
0.010 to 0.10 ○ Ammo R( ) F
0.12 to 0.47 ○ Ammo R( ) F
0.0010 to 0.033 ○ Ammo ( ) F3
0.039 to 0.047 ○ Ammo ( ) F3
0.056 to 0.22 ○ Ammo ( ) F3
0.0010 to 0.047 ○ Ammo R( ) F
0.056 to 0.22 ○ Ammo R( ) F
0.010 to 0.10 ○ Ammo R( ) F
0.0010 to 0.022 ○ Ammo R( ) F
0.010 to 0.068 ○ Ammo ( ) F6
0.010 to 0.068 ○ Ammo R( ) F
0.010 to 0.033 ○ Ammo ( ) F6
0.010 to 0.047 ○ Ammo R( ) F
0.056 to 0.22 ○ Ammo R( ) F
●Packaging Specifications
Cap. range
(µF)
Taping style Type Rated volt. Packing suffix Style
AD
AB
B
C
D
E
Lead Spacing
5.0 mm
5.0 mm
5.0 mm
5.0 mm
7.5 mm
7.5 mm
❈See the column
“Rating, Dimensions
& Quantity Box” for
packing quantity.
●Lead Spacing
Metallized Film
p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 33
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
－ FC34 －
Plastic Film Capacitors
■Rating, Dimensions & Quantity/Ammo Box
●Rated voltage : 250 VDC, Capacitance tolerance : ±5 %(J), ±10 %(K)
Style D: 0.010 µF to 0.33 µF
Style B: 0.39 µF to 10.0 µF Suffix for lead crimped or taped type
Cap. tol. code
▲ ▲
Suffix for lead crimped or taped type
Cap. tol. code
▲ ▲
■Rating, Dimensions & Quantity/Ammo Box
●Rated voltage : 100 VDC, Capacitance tolerance : ± 5 %(J), ±10 %(K)
0.56 12.0 5.5 10.9 15.9 10.0 10.0 1.0 0.60
0.68 12.0 6.0 11.9 16.9 10.0 10.0 1.0 0.60
0.82 12.0 6.0 13.5 18.5 10.0 10.0 1.0 0.60
1.0 12.0 6.7 14.0 19.0 10.0 10.0 1.0 0.60
1.2 18.5 5.5 12.8 17.8 15.0 10.0 1.0 0.60
1.5 18.5 6.0 13.4 18.4 15.0 10.0 1.0 0.80
1.8 18.5 6.5 14.4 19.4 15.0 10.0 1.0 0.80
2.2 18.5 7.0 15.0 20.0 15.0 10.0 1.0 0.80
2.7 18.5 8.0 15.8 20.8 15.0 10.0 1.0 0.80
3.3 18.5 8.5 16.5 21.5 15.0 10.0 1.0 0.80
3.9 26.0 7.0 16.4 21.4 22.5 15.0 1.0 0.80
4.7 26.0 7.5 17.0 22.0 22.5 15.0 1.0 0.80
5.6 26.0 8.3 17.5 22.5 22.5 15.0 1.0 0.80
6.8 26.0 9.0 18.5 23.5 22.5 15.0 1.0 0.80
8.2 26.0 10.0 20.0 25.0 22.5 15.0 1.5 0.80
10.0 26.0 11.5 21.0 26.0 22.5 15.0 1.5 0.80
Part No. Cap.
(µF)
Min. order Q'ty
Taping
500 －
－ －
－
Dimensions (mm)
L max. T max. Standard
5 mm Odd size
5 mm Odd size
7.5 mm
ø d
ECQE1564□F( )
ECQE1684□F( )
ECQE1824□F( )
ECQE1105□F( )
ECQE1125□F( )
ECQE1155□F( )
ECQE1185□F( )
ECQE1225□F( )
ECQE1275□F( )
ECQE1335□F( )
ECQE1395□F( )
ECQE1475□F( )
ECQE1565□F( )
ECQE1685□F( )
ECQE1825□F( )
ECQE1106□F( )
500
1,000
400 400
500
600
－
H max.
Straight Crimped lead Straight
F
Crimped lead
S
Straight
G max.
Bulk
500
style D: 0.056 µF to 1.0 µF
style B: 1.2 µF to 10.0 µF
Part No. Cap.
(µF)
Dimensions (mm)
L max. T max. ø d
ECQE2103□F( ) 0.010 10.3 4.3 7.4 12.4 7.5 7.5 1.0 0.60
ECQE2123□F( ) 0.012 10.3 4.4 7.5 12.5 7.5 7.5 1.0 0.60
ECQE2153□F( ) 0.015 10.3 4.4 7.5 12.5 7.5 7.5 1.0 0.60
ECQE2183□F( ) 0.018 10.3 4.4 7.5 12.5 7.5 7.5 1.0 0.60
ECQE2223□F( ) 0.022 10.3 4.4 7.5 12.5 7.5 7.5 1.0 0.60
ECQE2273□F( ) 0.027 10.3 4.4 7.5 12.5 7.5 7.5 1.0 0.60
ECQE2333□F( ) 0.033 10.3 4.5 7.5 12.5 7.5 7.5 1.0 0.60
ECQE2393□F( ) 0.039 10.3 4.5 7.5 12.5 7.5 7.5 1.0 0.60
ECQE2473□F( ) 0.047 10.3 4.5 7.5 12.5 7.5 7.5 1.0 0.60
ECQE2563□F( ) 0.056 10.3 4.8 7.9 12.9 7.5 7.5 1.0 0.60
ECQE2683□F( ) 0.068 10.3 4.5 7.5 12.5 7.5 7.5 1.0 0.60
ECQE2823□F( ) 0.082 10.3 4.9 8.0 13.0 7.5 7.5 1.0 0.60
ECQE2104□F( ) 0.10 10.3 5.8 8.4 13.4 7.5 7.5 1.0 0.60
ECQE2124□F( ) 0.12 10.3 6.0 9.0 14.0 7.5 7.5 1.0 0.60
ECQE2154□F( ) 0.15 10.3 6.0 10.8 15.8 7.5 7.5 1.0 0.60
ECQE2184□F( ) 0.18 12.0 5.0 10.3 15.3 10.0 10.0 1.0 0.60
ECQE2224□F( ) 0.22 12.0 5.5 10.5 15.5 10.0 10.0 1.0 0.60
ECQE2274□F( ) 0.27 12.0 6.0 11.5 16.5 10.0 10.0 1.0 0.60
ECQE2334□F( ) 0.33 12.0 6.5 12.0 17.0 10.0 10.0 1.0 0.60
ECQE2394□F( ) 0.39 18.5 4.9 12.0 17.0 15.0 10.0 1.0 0.60
ECQE2474□F( ) 0.47 18.5 5.3 12.5 17.5 15.0 10.0 1.0 0.60
ECQE2564□F( ) 0.56 18.5 5.5 13.0 18.0 15.0 10.0 1.0 0.60
ECQE2684□F( ) 0.68 18.5 6.0 13.5 18.5 15.0 10.0 1.0 0.80
ECQE2824□F( ) 0.82 18.5 6.5 14.5 19.5 15.0 10.0 1.0 0.80
ECQE2105□F( ) 1.0 18.5 7.4 15.0 20.0 15.0 10.0 1.0 0.80
ECQE2125□F( ) 1.2 18.5 8.0 15.9 20.9 15.0 10.0 1.0 0.80
ECQE2155□F( ) 1.5 18.5 9.0 16.8 21.8 15.0 10.0 1.0 0.80
ECQE2185□F( ) 1.8 26.0 7.5 15.5 20.5 22.5 15.0 1.0 0.80
ECQE2225□F( ) 2.2 26.0 8.5 16.3 21.3 22.5 15.0 1.0 0.80
ECQE2275□F( ) 2.7 26.0 9.4 17.0 22.0 22.5 15.0 1.0 0.80
ECQE2335□F( ) 3.3 26.0 10.3 18.0 23.0 22.5 15.0 1.5 0.80
ECQE2395□F( ) 3.9 26.0 11.0 20.5 25.5 22.5 15.0 1.5 0.80
ECQE2475□F( ) 4.7 26.0 12.0 21.5 26.5 22.5 15.0 1.5 0.80
ECQE2565□F( ) 5.6 31.0 11.8 21.0 26.0 27.5 22.5 1.5 0.80
ECQE2685□F( ) 6.8 31.0 13.0 22.4 27.4 27.5 22.5 1.5 0.80
ECQE2825□F( ) 8.2 31.0 14.3 23.5 28.5 27.5 22.5 1.5 0.80
ECQE2106□F( )10.0 31.0 15.9 25.8 30.8 27.5 22.5 1.5 0.80
1000
－
－ 1000
500
500
1000
400
500
400
300
－ －
H max.
Straight Crimped lead Straight
F
Crimped lead
S
Straight
G max.
500
Min. order Q'ty
Taping Standard
5 mm Odd size
5 mm Odd size
7.5 mm
Bulk
p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 34
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
－ FC35 －
Plastic Film Capacitors
■Rating, Dimensions & Quantity/Ammo Box
●Rated voltage : 400 VDC, Capacitance tolerance : ±5 %(J), ±10 %(K)
style D:0.010 µF to 0.10 µF
style B:0.12 µF to 2.2 µF
Suffix for lead crimped or taped type
Cap. tol. code
▲ ▲
Part No.
0.010 10.3 4.3 7.4 12.4 7.5 7.5 1.0 0.60
0.012 10.3 4.4 7.5 12.5 7.5 7.5 1.0 0.60
0.015 10.3 4.4 7.5 12.5 7.5 7.5 1.0 0.60
0.018 10.3 4.4 7.5 12.5 7.5 7.5 1.0 0.60
0.022 10.3 4.8 7.9 12.9 7.5 7.5 1.0 0.60
0.027 10.3 5.5 8.0 13.0 7.5 7.5 1.0 0.60
0.033 10.3 6.0 9.0 14.0 7.5 7.5 1.0 0.60
0.039 12.0 4.9 8.0 13.0 10.0 10.0 1.0 0.60
0.047 12.0 5.0 8.3 13.3 10.0 10.0 1.0 0.60
0.056 12.0 5.0 10.0 15.0 10.0 10.0 1.0 0.60
0.068 12.0 5.4 10.5 15.5 10.0 10.0 1.0 0.60
0.082 12.0 5.8 11.0 16.0 10.0 10.0 1.0 0.60
0.10 12.0 6.3 12.0 17.0 10.0 10.0 1.0 0.60
0.12 18.5 5.0 10.0 15.0 15.0 10.0 1.0 0.60
0.15 18.5 5.0 12.4 17.4 15.0 10.0 1.0 0.60
0.18 18.5 5.4 12.5 17.5 15.0 10.0 1.0 0.60
0.22 18.5 5.9 13.0 18.0 15.0 10.0 1.0 0.60
0.27 18.5 6.5 14.3 19.3 15.0 10.0 1.0 0.80
0.33 18.5 7.0 14.9 19.9 15.0 10.0 1.0 0.80
0.39 18.5 7.5 15.4 20.4 15.0 10.0 1.0 0.80
0.47 18.5 7.8 17.0 22.0 15.0 10.0 1.0 0.80
0.56 26.0 6.5 16.0 21.0 22.5 15.0 1.0 0.80
0.68 26.0 7.0 16.5 21.5 22.5 15.0 1.0 0.80
0.82 26.0 7.9 17.3 22.3 22.5 15.0 1.0 0.80
1.0 26.0 8.5 18.0 23.0 22.5 15.0 1.0 0.80
1.2 26.0 9.5 18.9 23.9 22.5 15.0 1.0 0.80
1.5 31.0 9.5 19.0 24.0 27.5 22.5 1.0 0.80
1.8 31.0 11.0 20.5 25.5 27.5 22.5 1.5 0.80
2.2 31.0 11.0 22.0 27.0 27.5 22.5 1.5 0.80
ECQE4103□F( )
ECQE4123□F( )
ECQE4153□F( )
ECQE4183□F( )
ECQE4223□F( )
ECQE4273□F( )
ECQE4333□F( )
ECQE4393□F( )
ECQE4473□F( )
ECQE4563□F( )
ECQE4683□F( )
ECQE4823□F( )
ECQE4104□F( )
ECQE4124□F( )
ECQE4154□F( )
ECQE4184□F( )
ECQE4224□F( )
ECQE4274□F( )
ECQE4334□F( )
ECQE4394□F( )
ECQE4474□F( )
ECQE4564□F( )
ECQE4684□F( )
ECQE4824□F( )
ECQE4105□F( )
ECQE4125□F( )
ECQE4155□F( )
ECQE4185□F( )
ECQE4225□F( )
Cap.
(µF)
1000
500
－
－
500
500
400
－ －
1000
Dimensions (mm)
L max. T max. φd H max.
Straight Crimped lead Straight
F
Crimped lead
S
Straight
G max.
500
Min. order Q'ty
Taping Standard
5 mm Odd size
5 mm Odd size
7.5 mm
Bulk
Metallized Film
p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 35
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
－ FC36 －
Plastic Film Capacitors
●Rated voltage : 630 VDC, Capacitance tolerance : ±5 %(J), ±10 %(K)
Suffix for lead crimped or taped type.
Cap. tol. code
▲ ▲
style D:0.010 µF to 0.047 µF
style B:0.0010 µF to 0.0082 µF, 0.056 µF to 2.2 µF
Part No.
0.0010 10.0 4.5 9.5 14.5 7.5 5.0 1.0 0.60
0.0012 10.0 4.5 10.0 15.0 7.5 5.0 1.0 0.60
0.0015 10.0 4.5 10.0 15.0 7.5 5.0 1.0 0.60
0.0018 10.0 4.5 10.0 15.0 7.5 5.0 1.0 0.60
0.0022 10.0 4.5 10.0 15.0 7.5 5.0 1.0 0.60
0.0027 10.0 4.5 10.0 15.0 7.5 5.0 1.0 0.60
0.0033 10.0 4.5 10.0 15.0 7.5 5.0 1.0 0.60
0.0039 10.0 4.5 10.0 15.0 7.5 5.0 1.0 0.60
0.0047 12.0 4.5 10.0 15.0 10.0 7.5 1.0 0.60
0.0056 12.0 4.5 10.0 15.0 10.0 7.5 1.0 0.60
0.0068 12.0 4.9 10.0 15.0 10.0 7.5 1.0 0.60
0.0082 12.0 4.5 10.0 15.0 10.0 7.5 1.0 0.60
0.010 12.0 4.5 7.5 12.5 10.0 10.0 1.0 0.60
0.012 12.0 4.5 7.8 12.8 10.0 10.0 1.0 0.60
0.015 12.0 5.0 8.2 13.2 10.0 10.0 1.0 0.60
0.018 12.0 4.9 10.0 15.0 10.0 10.0 1.0 0.60
0.022 12.0 5.3 10.5 15.5 10.0 10.0 1.0 0.60
0.027 12.0 5.5 10.9 15.9 10.0 10.0 1.0 0.60
0.033 12.0 6.0 11.9 16.9 10.0 10.0 1.0 0.60
0.039 12.0 6.0 13.4 18.4 10.0 10.0 1.0 0.60
0.047 12.0 6.5 13.5 18.5 10.0 10.0 1.0 0.60
0.056 18.5 5.4 10.5 15.5 15.0 10.0 1.0 0.60
0.068 18.5 5.8 11.0 16.0 15.0 10.0 1.0 0.60
0.082 18.5 6.5 12.0 17.0 15.0 10.0 1.0 0.60
0.10 18.5 6.3 14.0 19.0 15.0 10.0 1.0 0.60
0.12 18.5 6.3 14.5 19.5 15.0 10.0 1.0 0.80
0.15 18.5 7.5 15.4 20.4 15.0 10.0 1.0 0.80
0.18 18.5 8.0 16.0 21.0 15.0 10.0 1.0 0.80
0.22 18.5 9.0 16.5 21.5 15.0 10.0 1.0 0.80
0.27 26.0 7.0 16.5 21.5 22.5 15.0 1.0 0.80
0.33 26.0 7.8 17.0 22.0 22.5 15.0 1.0 0.80
0.39 26.0 8.5 17.9 22.9 22.5 15.0 1.0 0.80
0.47 26.0 9.3 18.5 23.5 22.5 15.0 1.0 0.80
0.56 26.0 10.0 20.0 25.0 22.5 15.0 1.5 0.80
0.68 26.0 11.5 21.0 26.0 22.5 15.0 1.5 0.80
0.82 31.0 11.3 20.5 25.5 27.5 22.5 1.5 0.80
1.0 31.0 12.5 21.9 26.9 27.5 22.5 1.5 0.80
1.2 31.0 13.5 23.0 28.0 27.5 22.5 1.5 0.80
1.5 31.0 15.3 24.7 29.7 27.5 22.5 1.5 0.80
1.8 31.0 16.8 27.0 32.0 27.5 22.5 1.5 0.80
2.2 31.0 19.5 29.0 34.0 27.5 22.5 1.5 0.80
ECQE6102□F( )
ECQE6122□F( )
ECQE6152□F( )
ECQE6182□F( )
ECQE6222□F( )
ECQE6272□F( )
ECQE6332□F( )
ECQE6392□F( )
ECQE6472□F( )
ECQE6562□F( )
ECQE6682□F( )
ECQE6822□F( )
ECQE6103□F( )
ECQE6123□F( )
ECQE6153□F( )
ECQE6183□F( )
ECQE6223□F( )
ECQE6273□F( )
ECQE6333□F( )
ECQE6393□F( )
ECQE6473□F( )
ECQE6563□F( )
ECQE6683□F( )
ECQE6823□F( )
ECQE6104□F( )
ECQE6124□F( )
ECQE6154□F( )
ECQE6184□F( )
ECQE6224□F( )
ECQE6274□F( )
ECQE6334□F( )
ECQE6394□F( )
ECQE6474□F( )
ECQE6564□F( )
ECQE6684□F( )
ECQE6824□F( )
ECQE6105□F( )
ECQE6125□F( )
ECQE6155□F( )
ECQE6185□F( )
ECQE6225□F( )
Cap.
(µF)
1000 －
1000
500
400
300
1000
500
400
－ －
500
－
Dimensions (mm)
L max. T max. φd H max.
Straight Crimped lead Straight
F
Crimped lead
S
Straight
G max.
500
Min. order Q'ty
Taping Standard
5 mm Odd size
5 mm Odd size
7.5 mm
Bulk
p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 36
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
－ FC37 －
Plastic Film Capacitors
■Rating, Dimensions & Quantity/Ammo Box
●Rated voltage : 1000 VDC, Note) 125 VAC, Capacitance tolerance : ±5 %(J), ±10 %(K)
Note) This type has two rated voltage, one is DC rated voltage another is AC rated voltage..
DC rated voltage is 1000 V, AC rated voltage is 125 V.
Making for rated voltage is「1000 V, 125 V 」
When capacitors use in secondary side of power source, and in case of applying voltage in altering current (50 Hz or 60 Hz sine wave)
to a capacitor, please refer to the page of ''Permissible voltage (R.M.S) in altering current corresponding to DC rated voltage''.
When capacitors use in primary side of power source, the rated voltage is shown 125 VAC. Voltage to be applied to capacitors in only
sine wave (50 Hz or 60 Hz).
AC rated capacitors complying with clause 1 of ''Electrical Appliance and Material Safety Law''. And not complying with clause 2 of
''Electrical Appliance and Material Safety Law'', in this case please use ECQUL type or ECQUG type
Part No.
0.010 15.5 6.0 11.0 16.0 12.5 12.5 1.0 0.60
0.012 15.5 6.0 12.0 17.0 12.5 12.5 1.0 0.60
0.015 15.5 7.0 12.5 17.5 12.5 12.5 1.0 0.60
0.018 15.5 7.5 13.0 20.0 12.5 12.5 1.0 0.80
0.022 15.5 7.5 15.5 22.5 12.5 12.5 1.0 0.80
0.027 21.0 6.0 13.0 18.0 17.5 12.5 1.0 0.80
0.033 21.0 6.5 14.0 19.0 17.5 12.5 1.0 0.80
0.039 21.0 7.0 14.5 19.5 17.5 12.5 1.0 0.80
0.047 21.0 7.5 15.5 20.5 17.5 12.5 1.0 0.80
0.056 21.0 7.5 17.0 22.0 17.5 12.5 1.0 0.80
0.068 21.0 8.5 18.0 23.0 17.5 12.5 1.0 0.80
0.082 21.0 9.0 18.5 23.5 17.5 12.5 1.0 0.80
0.10 21.0 10.0 20.0 25.0 17.5 12.5 1.0 0.80
0.12 26.0 9.0 18.5 23.5 22.5 17.5 1.0 0.80
0.15 26.0 10.0 20.0 25.0 22.5 17.5 1.5 0.80
0.18 26.0 10.5 22.0 27.0 22.5 17.5 1.5 0.80
0.22 26.0 12.0 23.0 28.0 22.5 17.5 1.5 0.80
ECQE10103□F( )
ECQE10123□F( )
ECQE10153□F( )
ECQE10183□F( )
ECQE10223□F( )
ECQE10273□F( )
ECQE10333□F( )
ECQE10393□F( )
ECQE10473□F( )
ECQE10563□F( )
ECQE10683□F( )
ECQE10823□F( )
ECQE10104□F( )
ECQE10124□F( )
ECQE10154□F( )
ECQE10184□F( )
ECQE10224□F( )
Cap.
(µF)
Min. order Q'ty
500
400
500
400
300
－
Dimensions (mm)
L max. T max. ø d 7.5 mm
H max.
Straight Crimped lead Straight
F
Crimped lead
S
Straight
G max.
500
Bulk Taping
Style D: 0.010 µF to 0.022 µF
Style B: 0.027 µF to 0.22 µF
Suffix for lead crimped or taped type.
Cap. tol. code
▲ ▲
Metallized Film
p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 37
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
－ FC38 －
Plastic Film Capacitors
■Rating, Dimensions & Quantity/Ammo Box
●Rated voltage : 1250 VDC, Note) 125 VAC, Capacitance tolerance : ±5 %(J), ±10 %(K)
Note) This type has two rated voltage, one is DC rated voltage another is AC rated voltage..
DC rated voltage is 1250 V, AC rated voltage is 125 V.
Making for rated voltage is「1250 V, 125 V 」
When capacitors use in secondary side of power source, and in case of applying voltage in altering current (50 Hz or 60 Hz sine wave)
to a capacitor, please refer to the page of ''Permissible voltage (R.M.S) in altering current corresponding to DC rated voltage''.
When capacitors use in primary side of power source, the rated voltage is shown 125 VAC. Voltage to be applied to capacitors in only
sine wave (50 Hz or 60 Hz).
AC rated capacitors complying with clause 1 of ''Electrical Appliance and Material Safety Law''. And not complying with clause 2 of
''Electrical Appliance and Material Safety Law'', in this case please use ECQUL type or ECQUG type
Style D: 0.0010 µF to 0.0068 µF
Style B: 0.0082 µF to 0.22 µF
Part No.
0.0010 15.5 6.0 11.0 16.0 12.5 10.0 1.0 0.60
0.0012 15.5 6.0 11.0 16.0 12.5 10.0 1.0 0.60
0.0015 15.5 6.0 11.0 16.0 12.5 10.0 1.0 0.60
0.0018 15.5 6.0 11.0 16.0 12.5 10.0 1.0 0.60
0.0022 15.5 6.0 11.5 16.5 12.5 10.0 1.0 0.60
0.0027 15.5 6.5 12.0 17.0 12.5 10.0 1.0 0.60
0.0033 15.5 6.0 11.5 16.5 12.5 10.0 1.0 0.60
0.0039 15.5 6.5 12.0 17.0 12.5 10.0 1.0 0.60
0.0047 15.5 7.0 12.5 17.5 12.5 10.0 1.0 0.60
0.0056 15.5 7.5 13.0 18.0 12.5 10.0 1.0 0.60
0.0068 15.5 7.5 15.0 20.0 12.5 10.0 1.0 0.60
0.0082 21.0 5.0 12.0 17.0 17.5 12.5 1.0 0.60
0.010 21.0 5.0 12.5 17.5 17.5 12.5 1.0 0.60
0.012 21.0 5.5 13.0 18.0 17.5 12.5 1.0 0.60
0.015 21.0 6.0 13.5 18.5 17.5 12.5 1.0 0.60
0.018 21.0 6.5 14.5 19.5 17.5 12.5 1.0 0.80
0.022 21.0 7.0 15.0 20.0 17.5 12.5 1.0 0.80
0.027 26.0 6.0 15.5 20.5 22.5 17.5 1.0 0.80
0.033 26.0 6.5 16.0 21.0 22.5 17.5 1.0 0.80
0.039 26.0 7.0 16.5 21.5 22.5 17.5 1.0 0.80
0.047 26.0 8.0 17.0 22.0 22.5 17.5 1.0 0.80
0.056 31.0 7.5 17.0 22.0 27.5 22.5 1.0 0.80
0.068 31.0 8.0 17.5 22.5 27.5 22.5 1.0 0.80
0.082 31.0 9.0 18.5 23.5 27.5 22.5 1.0 0.80
0.10 31.0 10.0 19.5 24.5 27.5 22.5 1.0 0.80
0.12 31.0 11.5 20.5 25.5 27.5 22.5 1.5 0.80
0.15 31.0 12.0 23.0 28.0 27.5 22.5 1.5 0.80
0.18 31.0 13.0 24.5 29.5 27.5 22.5 1.5 0.80
0.22 31.0 14.5 26.5 31.5 27.5 22.5 1.5 0.80
ECQE12102□F( )
ECQE12122□F( )
ECQE12152□F( )
ECQE12182□F( )
ECQE12222□F( )
ECQE12272□F( )
ECQE12332□F( )
ECQE12392□F( )
ECQE12472□F( )
ECQE12562□F( )
ECQE12682□F( )
ECQE12822□F( )
ECQE12103□F( )
ECQE12123□F( )
ECQE12153□F( )
ECQE12183□F( )
ECQE12223□F( )
ECQE12273□F( )
ECQE12333□F( )
ECQE12393□F( )
ECQE12473□F( )
ECQE12563□F( )
ECQE12683□F( )
ECQE12823□F( )
ECQE12104□F( )
ECQE12124□F( )
ECQE12154□F( )
ECQE12184□F( )
ECQE12224□F( )
Cap.
(µF)
Min. order Q'ty
500
400
500
Dimensions (mm)
L max. T max. ø d 7.5 mm
H max.
Straight Crimped lead Straight
F
Crimped lead
S
Straight
G max.
Bulk Taping
500
Suffix for lead crimped or taped type.
Cap. tol. code
▲ ▲
p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 38
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
－ FC39 －
Plastic Film Capacitors
■Rating, Dimensions & Quantity/Ammo Box
●Rated voltage : 125 VAC, Capacitance tolerance : ±5 %(J), ±10 %(K)
●Noise suppression Capacitors (Across-the-line)
style D:0.010 µF to 0.068 µF
Suffix for lead crimped or taped type.
Cap. tol. code
MF( )
Table 1
Notice for AC rated
AC rated capacitors complying with clause 1 of ''Electrical Appliance and Material Safety Law''.
As for clause 2 of ''Electrical Appliance and Material Safety Law'', please use ECQUL type or ECQUG type.
When using these capacitors as a across-the-line capacitor, it shall be required to follow either item 1. or item 2. condition.
1. Capacitor shall be connected in parallel with varistor (Specified varistor voltage in table 1.)
2. Voltage applied for capacitor shall not exceed other than specified in table 1, when using these capacitors.
Cap. Rated Voltage
125 VAC
Varistor voltage
250 V
Pulse voltage
250 V0–P
Part No.
0.010 10.5 4.5 7.5 12.5 7.5 7.5 1.0 0.60
0.012 10.5 4.4 7.5 12.5 7.5 7.5 1.0 0.60
0.015 10.5 4.4 7.5 12.5 7.5 7.5 1.0 0.60
0.018 10.5 4.4 7.5 12.5 7.5 7.5 1.0 0.60
0.022 10.5 4.4 7.5 12.5 7.5 7.5 1.0 0.60
0.027 10.5 4.4 7.5 12.5 7.5 7.5 1.0 0.60
0.033 10.5 4.5 7.8 12.8 7.5 7.5 1.0 0.60
0.039 10.5 4.5 7.8 12.8 7.5 7.5 1.0 0.60
0.047 10.5 5.5 8.0 13.0 7.5 7.5 1.0 0.60
0.056 10.5 5.9 8.5 13.5 7.5 7.5 1.0 0.60
0.068 10.5 6.3 9.4 14.4 7.5 7.5 1.0 0.60
ECQE1A103□F( )
ECQE1A123□F( )
ECQE1A153□F( )
ECQE1A183□F( )
ECQE1A223□F( )
ECQE1A273□F( )
ECQE1A333□F( )
ECQE1A393□F( )
ECQE1A473□F( )
ECQE1A563□F( )
ECQE1A683□F( )
Cap.
(µF)
1000
－
1000
500
Dimensions (mm)
L max. T max. φd H max.
Straight Crimped lead Straight
F
Crimped lead
S
Straight
G max.
500
Min. order Q'ty
Taping Standard
5 mm Odd size
5 mm Odd size
7.5 mm
Bulk
Metallized Film
p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 39
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
－ FC40 －
Plastic Film Capacitors
●Rated voltage : 250 VAC, Capacitance tolerance : ±5 %(J), ±10 %(K)
Noise suppression Capacitors (Across-the-line)
Style D:0.010 µF to 0.047 µF
Style B:0.056 µF to 0.47 µF
Table 1
❈Please consult us about Crimed lead type of 0.56 µF to 2.2 µF.
Notice for AC rated
AC rated capacitors complying with clause 1 of ''Electrical Appliance and Material Safety Law''.
As for clause 2 of ''Electrical Appliance and Material Safety Law'', please use ECQUL type or ECQUG type.
When using these capacitors as a across-the-line capacitor, it shall be required to follow either item 1. or item 2. condition.
1. Capacitor shall be connected in parallel with varistor (Specified varistor voltage in table 1.)
2. Voltage applied for capacitor shall not exceed other than specified in table 1, when using these capacitors.
Cap. Rated Voltage
250 VAC
Varistor voltage
470 V
Pulse voltage
630 V0–P
Suffix for lead crimped or taped type.
Cap. tol. code
MF( )
Part No.
0.010 12.5 5.5 10.8 15.8 10.0 10.0 1.0 0.60
0.012 12.5 6.0 11.5 16.5 10.0 10.0 1.0 0.60
0.015 12.5 6.3 9.9 14.9 10.0 10.0 1.0 0.60
0.018 12.5 6.0 11.9 16.9 10.0 10.0 1.0 0.60
0.022 12.5 6.0 11.5 16.5 10.0 10.0 1.0 0.60
0.027 12.5 5.5 10.9 15.9 10.0 10.0 1.0 0.60
0.033 12.5 6.0 11.9 16.9 10.0 10.0 1.0 0.60
0.039 12.5 6.0 13.4 18.4 10.0 10.0 1.0 0.60
0.047 12.5 6.5 14.4 19.4 10.0 10.0 1.0 0.60
0.056 18.5 5.4 10.5 15.5 15.0 10.0 1.0 0.60
0.068 18.5 5.8 11.0 16.0 15.0 10.0 1.0 0.60
0.082 18.5 6.3 12.0 17.0 15.0 10.0 1.0 0.60
0.10 18.5 6.3 14.0 19.0 15.0 10.0 1.0 0.60
0.12 18.5 6.8 14.5 19.5 15.0 10.0 1.0 0.80
0.15 18.5 7.5 15.4 20.4 15.0 10.0 1.0 0.80
0.18 18.5 8.0 16.0 21.0 15.0 10.0 1.0 0.80
0.22 18.5 9.0 16.9 21.9 15.0 10.0 1.0 0.80
0.27 26.0 7.0 16.5 21.5 22.5 15.0 1.0 0.80
0.33 26.0 7.8 17.0 22.0 22.5 15.0 1.0 0.80
0.39 26.0 8.5 17.9 22.9 22.5 15.0 1.0 0.80
0.47 26.0 9.3 18.5 23.5 22.5 15.0 1.0 0.80
0.56 26.0 10.0 20.0 ─ 22.5 ─ 1.0 0.80
0.68 26.0 11.5 21.0 ─ 22.5 ─ 1.0 0.80
0.82 26.0 13.0 22.5 ─ 22.5 ─ 1.0 0.80
1.0 31.0 12.5 21.9 ─ 27.5 ─ 1.5 0.80
1.2 31.0 13.5 23.0 ─ 27.5 ─ 1.5 0.80
1.5 31.0 15.3 24.7 ─ 27.5 ─ 1.5 0.80
1.8 31.0 16.8 27.0 ─ 27.5 ─ 1.5 0.80
2.2 31.0 19.5 29.0 ─ 27.5 ─ 1.5 0.80
ECQE2A103□F( )
ECQE2A123□F( )
ECQE2A153□F( )
ECQE2A183□F( )
ECQE2A223□F( )
ECQE2A273□F( )
ECQE2A333□F( )
ECQE2A393□F( )
ECQE2A473□F( )
ECQE2A563□F( )
ECQE2A683□F( )
ECQE2A823□F( )
ECQE2A104□F( )
ECQE2A124□F( )
ECQE2A154□F( )
ECQE2A184□F( )
ECQE2A224□F( )
ECQE2A274□F( )
ECQE2A334□F( )
ECQE2A394□F( )
ECQE2A474□F( )
ECQE2A564P( )( )
ECQE2A684P( )( )
ECQE2A824P( )( )
ECQE2A105P( )( )
ECQE2A125P( )( )
ECQE2A155P( )( )
ECQE2A185P( )( )
ECQE2A225P( )( )
Cap.
(µF)
500
1000
500
400
300
－
－
Dimensions (mm)
L max. T max. φd H max.
Straight Crimped lead Straight
F
Crimped lead
S
Straight
G max.
500
Min. order Q'ty
Taping Standard
5 mm Odd size
7.5 mm
Bulk
p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 40
Temperature Characteristics Frequency Characteristics
0.01
0.1
1
10
100
1000
10000
1 10 100 1000 10000
0
2
4
6
8
10
1 10 100 1000 10000
-10
-5
0
5
10
1 10 100 1000 10000
1.E+06
1.E+07
1.E+08
1.E+09
1.E+10
1.E+11
1.E+12
-60 -40 -20 0 20 40 60 80 100
0
2
4
6
8
10
-60 -40 -20 0 20 40 60 80 100
-10
-5
0
5
10
-60 -40 -20 0 20 40 60 80 100
ECQE(F) Type 100VDC Series (Metallized Polyester Film)
Erectrical Characteristics
at 1kHz
Temperature (Degree C)
Capacitance change (%) Dissipation factor (%)
Temperature (Degree C)
at 1kHz
at DC100V
Temperature (Degree C)
Insuration resistance (ohm)
Capacitance change (%)
Frequency (kHz)
Frequency (kHz)
Dissipation factor (%)
Frequency (kHz)
Impedance (ohm)
10uF
4.7uF
1.0uF
10uF
4.7uF
1.0uF
10uF
4.7uF
1.0uF
10uF
4.7uF
1.0uF
1.0uF
4.7uF
10uF
1.0uF
4.7uF
10uF
Rating
Voltage
Capacitance
Value(uF) Code dV/dt(V/us) Current(o-p)
(A)
0.56 564 12.32
0.68 684 15.0
0.82 824 18.0
1.00 105 22.0
1.20 125 13.2
1.50 155 17.1
1.80 185 19.8
2.20 225 24.2
2.70 275 29.7
3.30 335 36.3
3.90 395 23.4
4.70 475 28.2
5.60 565 33.6
6.80 685 40.8
8.20 825 49.2
10.00 106 60.0
Pulse Handling Capability (dV/dt)
(Max 10000cycles)
Voltage Derating by Temperature
Permissible Current Permissible Voltage
6
22
100VDC
11
0
20
40
60
80
100
120
-60 -40 -20 0 20 40 60 80 100 120
0.1
1
10
100
10 100 1000
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
10 100 1000
* Please consult Panasonic if your condition exceeds the above spec.
ECQE(F) Type 100VDC Series (Metallized Polyester Film)
Applicable Specifications
Frequency (kHz)
Permissible Current (Arms)
Permissible Voltage (Vrms)
(at sinewave)
Frequency (kHz)
Rated Voltage (VDC)
Surface Temperature of Capacitor(Degree C)
1.0uF
2.2uF
4.7uF
10uF
1.0uF
2.2uF
4.7uF
10uF
From 0.56uF to 10uF
Temperature Characteristics Frequency Characteristics
0.01
0.1
1
10
100
1000
10000
1 10 100 1000 10000 100000
0
2
4
6
8
10
1 10 100 1000 10000
-10
-5
0
5
10
1 10 100 1000 10000
1.E+06
1.E+07
1.E+08
1.E+09
1.E+10
1.E+11
1.E+12
-60 -40 -20 0 20 40 60 80 100
0
2
4
6
8
10
-60 -40 -20 0 20 40 60 80 100
-10
-5
0
5
10
-60 -40 -20 0 20 40 60 80 100
ECQE(F) Type 250VDC Series (Metallized Polyester Film)
Erectrical Characteristics
at 1kHz
Temperature (Degree C)
Capacitance change (%) Dissipation factor (%)
Temperature (Degree C)
at 1kHz
at DC100V
Temperature (Degree C)
Insuration resistance (ohm)
Capacitance change (%)
Frequency (kHz)
Frequency (kHz)
Dissipation factor (%)
Frequency (kHz)
Impedance (ohm)
10uF
1.0uF
0.1uF
10uF
1.0uF
0.1uF
10uF
1.0uF
0.01uF
10uF
1.0uF
0.1uF
0.1uF
1.0uF
10uF
0.1uF
1.0uF
10uF
0.01uF
0.01uF
0.1uF
0.01uF
0.01uF
0.01uF
Rating
Voltage
Capacitance
Value(uF) Code dV/dt(V/us) Current(o-p)
(A)
0.010 103 0.48
0.015 153 0.72
0.022 223 1.06
0.033 333 1.58
0.047 473 2.26
0.068 683 3.26
0.100 104 4.80
0.150 154 7.20
0.220 224 7.26
0.330 334 10.89
0.470 474 8.46
0.680 684 12.24
1.000 105 18.00
1.500 155 27.00
2.200 225 22.00
3.300 335 33.00
4.700 475 47.00
6.800 685 54.40
10.000 106 80.00
250VDC
Pulse Handling Capability (dV/dt) Voltage Derating by Temperature
(Max 10000cycles)
48
8
10
18
33
Permissible Current Permissible Voltage
0
50
100
150
200
250
300
-60 -40 -20 0 20 40 60 80 100 120
1
10
100
10 100 1000
0
1
2
3
4
5
10 100 1000
* Please consult Panasonic if your condition exceeds the above spec.
ECQE(F) Type 250VDC Series (Metallized Polyester Film)
Applicable Specifications
Frequency (kHz)
Permissible Current (Arms)
Permissible Voltage (Vrms)
(at sinewave)
Frequency (kHz)
Rated Voltage (VDC)
Surface Temperature of Capacitor(Degree C)
1.0uF
2.2uF
4.7uF
10uF
From 0.01uF to 10uF
0.47uF
0.22uF
0.10uF
0.047u
0.022u
0.01uF
0.01uF
0.022uF
0.047uF
0.10uF
0.22uF
0.47uF
1.0uF
2.2uF
4.7uF
10uF
Temperature Characteristics Frequency Characteristics
0.01
0.1
1
10
100
1000
10000
1 10 100 1000 10000 100000
0
2
4
6
8
10
1 10 100 1000 10000
-10
-5
0
5
10
-60 -40 -20 0 20 40 60 80 100
-10
-5
0
5
10
1 10 100 1000 10000
1.E+07
1.E+08
1.E+09
1.E+10
1.E+11
1.E+12
1.E+13
-60 -40 -20 0 20 40 60 80 100
0
2
4
6
8
10
-60 -40 -20 0 20 40 60 80 100
ECQE(F) Type 400VDC Series (Metallized Polyester Film)
Erectrical Characteristics
at 1kHz
Temperature (Degree C)
Capacitance change (%) Dissipation factor (%)
Temperature (Degree C)
at 1kHz
at DC100V
Temperature (Degree C)
Insuration resistance (ohm)
Capacitance change (%)
Frequency (kHz)
Frequency (kHz)
Dissipation factor (%)
Frequency (kHz)
Impedance (ohm)
2.2uF
1.0uF
0.1uF
2.2uF
1.0uF
0.1uF
2.2uF
1.0uF
0.1uF
0.01uF
0.01uF
0.01uF
0.01uF
0.1uF
1.0uF
2.2uF
0.01uF
0.1uF
1.0uF
2.2uF
2.2uF
1.0uF
0.1uF
0.01uF
Rating
Voltage
Capacitance
Value(uF) Code dV/dt(V/us) Current(o-p)
(A)
0.010 103 1.31
0.015 153 1.97
0.022 223 2.88
0.033 333 4.32
0.047 473 3.67
0.068 683 5.30
0.100 104 7.80
0.150 154 5.55
0.220 224 8.14
0.330 334 12.21
0.470 474 17.39
0.680 684 14.96
1.000 105 22.00
1.200 155 27.00
2.200 225 39.60
Permissible Voltage
Voltage Derating by Temperature
131
Permissible Current
Pulse Handling Capability (dV/dt)
(Max 10000cycles)
400VDC
78
37
22
18
0
100
200
300
400
500
-60 -40 -20 0 20 40 60 80 100 120
0
0.5
1
1.5
2
2.5
3
10 100 1000
1
10
100
10 100 1000
* Please consult Panasonic if your condition exceeds the above spec.
ECQE(F) Type 400VDC Series (Metallized Polyester Film)
Applicable Specifications
Frequency (kHz)
Permissible Current (Arms)
Permissible Voltage (Vrms)
(at sinewave)
Frequency (kHz)
Rated Voltage (VDC)
Surface Temperature of Capacitor(Degree C)
From 0.01uF to 2.2uF
2.2uF
1.0uF
0.47uF
0.22uF
0.1uF
0.047uF
0.022uF
0.01uF
0.01uF
0.022uF
0.047uF
0.1uF
0.22uF
0.47uF
1.0uF
2.2uF
Temperature Characteristics Frequency Characteristics
0.01
0.1
1
10
100
1000
10000
1 10 100 1000 10000 100000
0
2
4
6
8
10
1 10 100 1000 10000
-10
-5
0
5
10
1 10 100 1000 10000
1.E+07
1.E+08
1.E+09
1.E+10
1.E+11
1.E+12
1.E+13
-60 -40 -20 0 20 40 60 80 100
0
2
4
6
8
10
-60 -40 -20 0 20 40 60 80 100
-10
-5
0
5
10
-60 -40 -20 0 20 40 60 80 100
ECQE(F) Type 630VDC Series (Metallized Polyester Film)
Erectrical Characteristics
at 1kHz
Temperature (Degree C)
Capacitance change (%) Dissipation factor (%)
Temperature (Degree C)
at 1kHz
at DC100V
Temperature (Degree C)
Insuration resistance (ohm)
Capacitance change (%)
Frequency (kHz)
Frequency (kHz)
Dissipation factor (%)
Frequency (kHz)
Impedance (ohm)
2.2uF
1.0uF
0.1uF
2.2uF
1.0uF
0.1uF
1.0uF
0.1uF
0.01uF
0.01uF
0.01uF
0.01uF
0.1uF
1.0uF
2.2uF
0.01uF
0.1uF
1.0uF
2.2uF
2.2uF
1.0uF
0.1uF
0.01uF
2.2uF
Rating
Voltage
Capacitance
Value(uF) Code dV/dt(V/us) Current(o-p)
(A)
0.010 103 2.73
0.015 153 4.10
0.022 223 6.01
0.033 333 9.01
0.047 473 12.83
0.068 683 7.89
0.100 104 11.60
0.150 154 17.40
0.220 224 25.52
0.330 334 20.79
0.470 474 29.61
0.680 684 42.84
1.000 105 48.00
1.500 155 72.00
2.200 225 105.60
(Max 10000cycles)
273
Voltage Derating by Temperature
630VDC
Permissible Current Permissible Voltage
116
63
48
Pulse Handling Capability (dV/dt)
0
100
200
300
400
500
600
700
800
-60 -40 -20 0 20 40 60 80 100 120
1
10
100
10 100 1000
0
1
2
3
4
5
10 100 1000
* Please consult Panasonic if your condition exceeds the above spec.
ECQE(F) Type 630VDC Series (Metallized Polyester Film)
Applicable Specifications
Frequency (kHz)
Permissible Current (Arms)
Permissible Voltage (Vrms)
(at sinewave)
Frequency (kHz)
Rated Voltage (VDC)
Surface Temperature of Capacitor(Degree C)
From 0.01uF to 2.2uF
2.2uF
1.0uF
0.47uF
0.22uF
0.1uF
0.047uF
0.022uF
0.01uF
0.01uF
0.022uF
0.047uF
0.1uF
0.22uF
0.47uF
1.0uF
2.2uF
Temperature Characteristics Frequency Characteristics
0.01
0.1
1
10
100
1000
10000
1 10 100 1000 10000 100000
0
2
4
6
8
10
1 10 100 1000 10000
-10
-5
0
5
10
1 10 100 1000 10000
1.E+07
1.E+08
1.E+09
1.E+10
1.E+11
1.E+12
1.E+13
-60 -40 -20 0 20 40 60 80 100
0
2
4
6
8
10
-10
-5
0
5
10
-60 -40 -20 0 20 40 60 80 100
ECQE(F) Type 125VAC Series (Metallized Polyester Film)
Erectrical Characteristics
at 1kHz
Temperature (Degree C)
Capacitance change (%) Dissipation factor (%)
Temperature (Degree C)
at 1kHz
at DC100V
Temperature (Degree C)
Insuration resistance (ohm)
Capacitance change (%)
Frequency (kHz)
Frequency (kHz)
Dissipation factor (%)
Frequency (kHz)
Impedance (ohm)
0.47uF
0.1uF
0.047uF
0.47uF
0.1uF
0.047uF
0.47uF
0.1uF
0.01uF
0.47uF
0.1uF
0.047uF
0.047uF
0.1uF
0.47uF
0.047uF
0.1uF
0.47uF
0.01uF
0.01uF
0.047uF
0.01uF
0.01uF
0.01uF
Temperature Characteristics Frequency Characteristics
0.01
0.1
1
10
100
1000
10000
1 10 100 1000 10000 100000
0
2
4
6
8
10
1 10 100 1000 10000
-10
-5
0
5
10
1 10 100 1000 10000
1.E+07
1.E+08
1.E+09
1.E+10
1.E+11
1.E+12
1.E+13
-60 -40 -20 0 20 40 60 80 100
0
2
4
6
8
10
-60 -40 -20 0 20 40 60 80 100
-10
-5
0
5
10
-60 -40 -20 0 20 40 60 80 100
ECQE(F) Type 250VAC Series (Metallized Polyester Film)
Erectrical Characteristics
at 1kHz
Temperature (Degree C)
Capacitance change (%) Dissipation factor (%)
Temperature (Degree C)
at 1kHz
at DC100V
Temperature (Degree C)
Insuration resistance (ohm)
Capacitance change (%)
Frequency (kHz)
Frequency (kHz)
Dissipation factor (%)
Frequency (kHz)
Impedance (ohm)
0.47uF
0.1uF
0.047uF
0.47uF
0.1uF
0.047uF
0.47uF
0.1uF
0.01uF
0.47uF
0.1uF
0.047uF
0.047uF
0.1uF
0.47uF
0.047uF
0.1uF
0.47uF
0.01uF
0.01uF
0.047uF
0.01uF
0.01uF
0.01uF
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Aluminum Electrolytic Capacitors/ FR
– EEE-82 –
010 Sleeve
L 14 min. 3 min. =
=
L 16 : L±1.5
L 20 : L±2.0
Pressure relief
06.3 +
–
08
0D±0.5
F±0.5
0D±0.5
fd±0.05
■ Country of origin
Malaysia
Radial Lead Type
Series: FR Type: A
■ Specifi cations
Category Temp. Range –40 °C to +105 °C
Rated W.V. Range 6.3 V.DC to 100 V.DC
Nominal Cap. Range 4.7 μF to 8200 μF
Capacitance Tolerance ±20 % (120 Hz/+20 °C)
DC Leakage Cur rent I < 0.01 CV (μA) After 2 minutes
tan d
W.V. 6.3 10 16 25 35 50 63 100 (120 Hz/+20 °C) tan d 0.22 0.19 0.16 0.14 0.12 0.10 0.09 0.08
Add 0.02 per 1000 μF for products of 1000 μF or more.
Endurance
After following life test with DC voltage and +105 °C±2 °C ripple current value applied. (The sum
of DC and ripple peak voltage shall not exceed the rated working voltage) when the capacitors
are restored to 20 °C, the capacitors shall meet the limits specifi ed below.
Duration
05×11/ 06.3×11.2 : 5000 hours
08×11.5/ 010×12.5 : 6000 hours (✽ Only EEUFR1V331U (010×12.5) 5000 hours)
08×15/ 010×16 : 8000 hours, 08×20 : 9000 hours
010×20 to 010×25/ 012.5×20 to 012.5×35/ 016×20 to 016×25 : 10000 hours
Capacitance change ±25 % of initial measured value (6.3 V to 10 V : ±30 %)
tan d < 200 % of initial specifi ed value
DC leakage current < initial specifi ed value
Shelf Life After storage for 1000 hours at +105 °C±2 °C with no voltage applied and then being stabilized
at +20 °C, capacitors shall meet the limits specifi ed in Endurance. (With voltage treatment)
■ Di men sions in mm (not to scale)
W.V.(V.DC) Cap (μF) Frequency (Hz)
60 120 1 k 10 k 100 k
6.3 to 100
4.7 to 33 0.45 0.55 0.75 0.90 1.00
47 to 330 0.60 0.70 0.85 0.95 1.00
390 to 1000 0.65 0.75 0.90 0.98 1.00
1200 to 8200 0.75 0.80 0.95 1.00 1.00
■ Frequency correction factor for ripple current
Body Dia. 0D 5 6.3 8 10 12.5 16
Body Length L — — — — 12.5 to 25 30 to 35 —
Lead Dia. 0d 0.5 0.5 0.6 0.6 0.6 0.8 0.8
Lead space F 2.0 2.5 3.5 5.0 5.0 7.5
■ Features
● Low ESR (Same as FM Series)
● Endurance : 5000 h to 10000 h at +105 °C
● RoHS directive compliant
■ Attention
Not applicable for automotive
(Unit : mm)
06 Nov. 2014
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Aluminum Electrolytic Capacitors/ FR
– EEE-83 –
■ Case size/Impedance/Ripple current
W.V.(V.DC) 6.3 V to 35 V 50 V
Case size
(0D×L)
Imped ance
(Ω/100 kHz)
Ripple Current
(mA r.m.s./100 kHz)
Imped ance
(Ω/100 kHz)
Ripple Current
(mA r.m.s./100 kHz)
+20 °C –10 °C +105 °C +20 °C –10 °C +105 °C
5 × 11 0.300 1.000 280 0.340 1.130 250
6.3 × 11.2 0.130 0.430 455 0.140 0.460 405
8 × 11.5 0.056 0.168 950 0.061 0.183 870
8 × 15 0.041 0.123 1240 0.045 0.135 1140
8 × 20 0.030 0.090 1560 0.033 0.099 1430
10 × 12.5 0.043 0.114 1290 0.042 0.126 1170
10 × 16 0.028 0.078 1790 0.030 0.090 1650
10 × 20 0.020 0.057 2180 0.023 0.069 1890
10 × 25 0.018 0.054 2470 0.022 0.066 2150
12.5 × 20 0.018 0.045 2600 0.022 0.055 2260
12.5 × 25 0.015 0.038 3190 0.018 0.045 2660
12.5 × 30 0.013 0.033 3630 0.016 0.040 3160
12.5 × 35 0.012 0.030 3750 0.014 0.035 3270
16 × 20 0.017 0.043 3300 0.019 0.048 2870
16 × 25 0.014 0.035 3820 0.016 0.040 3320
W.V.(V.DC) 63 V
Case size
(0D×L)
Imped ance
(Ω/100 kHz)
Ripple Current
(mA r.m.s./100 kHz)
+20 °C –10 °C +105 °C
5 × 11 0.510 2.040 175
6.3 × 11.2 0.210 0.840 284
8 × 11.5 0.092 0.368 566
8 × 15 0.068 0.272 741
8 × 20 0.050 0.200 930
10 × 12.5 0.063 0.252 761
10 × 16 0.045 0.180 1073
10 × 20 0.035 0.140 1229
10 × 25 0.033 0.132 1500
12.5 × 20 0.033 0.125 1582
12.5 × 25 0.027 0.092 1995
12.5 × 30 0.024 0.082 2528
12.5 × 35 0.021 0.071 2780
16 × 20 0.029 0.093 2153
16 × 25 0.024 0.074 2988
W.V.(V.DC) 100 V
Case size
(0D×L)
Imped ance
(Ω/100 kHz)
Ripple Current
(mA r.m.s./100 kHz)
+20 °C –10 °C +105 °C
10 × 20 0.084 0.336 1500
06 Nov. 2014
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Aluminum Electrolytic Capacitors/ FR
– EEE-84 –
■ Standard Prod ucts
W.V. Cap.
(±20 %)
Case size Specifi cation Lead Length
Part No.
Min. Packaging Q'ty
Dia. Length
Ripple
Current
(100 kHz)
(+105 °C)
Impedance
(100 kHz)
(+20 °C)
Endurance
Lead
Dia.
Lead Space
Straight
Leads Taping Straight Taping
✽B
Taping
✽H
(V) (μF) (mm) (mm) (mA r.m.s.) (Ω) (hours) (mm) (mm) (mm) (mm) (pcs) (pcs)
6.3
150 5 11 280 0.300 5000 0.5 2.0 5.0 2.5 EEUFR0J151( ) 200 2000
220 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR0J221( ) 200 2000
330 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR0J331( ) 200 2000
470 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR0J471( ) 200 2000
820 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR0J821( ) 200 1000
1000 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR0J102( ) 200 1000
1200
8 15 1240 0.041 8000 0.6 3.5 5.0 EEUFR0J122L( ) 200 1000
10 12.5 1290 0.043 6000 0.6 5.0 5.0 EEUFR0J122( ) 200 500
1500 8 20 1560 0.030 9000 0.6 3.5 5.0 EEUFR0J152L( ) 200 1000
1800 10 16 1790 0.028 8000 0.6 5.0 5.0 EEUFR0J182( ) 200 500
2200 10 20 2180 0.020 10000 0.6 5.0 5.0 EEUFR0J222( ) 200 500
2700 10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR0J272L( ) 200 500
3300 10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR0J332L( ) 200 500
3900 12.5 20 2600 0.018 10000 0.6 5.0 5.0 EEUFR0J392( ) 200 500
4700 12.5 25 3190 0.015 10000 0.6 5.0 5.0 EEUFR0J472( ) 200 500
5600 12.5 30 3630 0.013 10000 0.8 5.0 EEUFR0J562L 100
6800
12.5 35 3750 0.012 10000 0.8 5.0 EEUFR0J682L 100
16 20 3300 0.017 10000 0.8 7.5 7.5 EEUFR0J682S( ) 100 250
8200 16 25 3820 0.014 10000 0.8 7.5 7.5 EEUFR0J822( ) 100 250
10
100 5 11 280 0.300 5000 0.5 2.0 5.0 2.5 EEUFR1A101( ) 200 2000
150 5 11 280 0.300 5000 0.5 2.0 5.0 2.5 EEUFR1A151( ) 200 2000
220 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR1A221( ) 200 2000
270 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR1A271( ) 200 2000
470 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR1A471( ) 200 1000
680 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR1A681( ) 200 1000
820 10 12.5 1290 0.043 6000 0.6 5.0 5.0 EEUFR1A821( ) 200 500
1000
10 16 1790 0.028 8000 0.6 5.0 5.0 EEUFR1A102( ) 200 500
8 15 1240 0.041 8000 0.6 3.5 5.0 EEUFR1A102L( ) 200 1000
1500
8 20 1560 0.030 9000 0.6 3.5 5.0 EEUFR1A152L( ) 200 1000
10 16 1790 0.028 8000 0.6 5.0 5.0 EEUFR1A152( ) 200 500
1800 10 20 2180 0.020 10000 0.6 5.0 5.0 EEUFR1A182( ) 200 500
2200 10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR1A222L( ) 200 500
3300 12.5 20 2600 0.018 10000 0.6 5.0 5.0 EEUFR1A332( ) 200 500
3900 12.5 25 3190 0.015 10000 0.6 5.0 5.0 EEUFR1A392( ) 200 500
4700
12.5 30 3630 0.013 10000 0.8 5.0 EEUFR1A472L 100
16 20 3300 0.017 10000 0.8 7.5 7.5 EEUFR1A472S( ) 100 250
5600 12.5 35 3750 0.012 10000 0.8 5.0 EEUFR1A562L 100
6800 12.5 35 3750 0.012 10000 0.8 5.0 EEUFR1A682L 100
16 25 3820 0.014 10000 0.8 7.5 7.5 EEUFR1A682( ) 100 250
· When requesting taped product, please put the letter "B" or "H" be tween the "( )". Lead wire pitch ✽B=5 mm, 7.5 mm, H=2.5 mm.
· Please refer to the page of “Taping Dimensions”.
06 Nov. 2014
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Aluminum Electrolytic Capacitors/ FR
– EEE-85 –
■ Standard Prod ucts
W.V. Cap.
(±20 %)
Case size Specifi cation Lead Length
Part No.
Min. Packaging Q'ty
Dia. Length
Ripple
Current
(100 kHz)
(+105 °C)
Impedance
(100 kHz)
(+20 °C)
Endurance
Lead
Dia.
Lead Space
Straight
Leads Taping Straight Taping
✽B
Taping
✽H
(V) (μF) (mm) (mm) (mA r.m.s.) (Ω) (hours) (mm) (mm) (mm) (mm) (pcs) (pcs)
16
68 5 11 280 0.300 5000 0.5 2.0 5.0 2.5 EEUFR1C680( ) 200 2000
100 5 11 280 0.300 5000 0.5 2.0 5.0 2.5 EEUFR1C101( ) 200 2000
120 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR1C121( ) 200 2000
220 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR1C221( ) 200 2000
470 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR1C471( ) 200 1000
680 8 15 1240 0.041 8000 0.6 3.5 5.0 EEUFR1C681L( ) 200 1000
10 12.5 1290 0.043 6000 0.6 5.0 5.0 EEUFR1C681( ) 200 500
1000 8 20 1560 0.030 9000 0.6 3.5 5.0 EEUFR1C102L( ) 200 1000
10 16 1790 0.028 8000 0.6 5.0 5.0 EEUFR1C102( ) 200 500
1500 10 20 2180 0.020 10000 0.6 5.0 5.0 EEUFR1C152( ) 200 500
10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR1C152L( ) 200 500
1800 10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR1C182L( ) 200 500
2200 12.5 20 2600 0.018 10000 0.6 5.0 5.0 EEUFR1C222( ) 200 500
2700 12.5 25 3190 0.015 10000 0.6 5.0 5.0 EEUFR1C272( ) 200 500
3300 12.5 30 3630 0.013 10000 0.8 5.0 EEUFR1C332L 100
16 20 3300 0.017 10000 0.8 7.5 7.5 EEUFR1C332S( ) 100 250
3900 12.5 35 3750 0.012 10000 0.8 5.0 EEUFR1C392L 100
16 20 3300 0.017 10000 0.8 7.5 7.5 EEUFR1C392S( ) 100 250
4700 12.5 35 3750 0.012 10000 0.8 5.0 EEUFR1C472L 100
16 25 3820 0.014 10000 0.8 7.5 7.5 EEUFR1C472( ) 100 250
5600 16 25 3820 0.014 10000 0.8 7.5 7.5 EEUFR1C562( ) 100 250
25
47 5 11 280 0.300 5000 0.5 2.0 5.0 2.5 EEUFR1E470( ) 200 2000
68 5 11 280 0.300 5000 0.5 2.0 5.0 2.5 EEUFR1E680( ) 200 2000
100 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR1E101( ) 200 2000
150 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR1E151( ) 200 2000
220 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR1E221( ) 200 1000
330 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR1E331( ) 200 1000
390 8 15 1240 0.041 8000 0.6 3.5 5.0 EEUFR1E391L( ) 200 1000
470
8 15 1240 0.041 8000 0.6 3.5 5.0 EEUFR1E471Y( ) 200 1000
8 20 1560 0.030 9000 0.6 3.5 5.0 EEUFR1E471L( ) 200 1000
10 12.5 1290 0.043 6000 0.6 5.0 5.0 EEUFR1E471( ) 200 500
560 8 20 1560 0.030 9000 0.6 3.5 5.0 EEUFR1E561L( ) 200 1000
680 8 20 1560 0.030 9000 0.6 3.5 5.0 EEUFR1E681L( ) 200 1000
10 16 1790 0.028 8000 0.6 5.0 5.0 EEUFR1E681( ) 200 500
820 10 20 2180 0.020 10000 0.6 5.0 5.0 EEUFR1E821( ) 200 500
1000 10 20 2180 0.020 10000 0.6 5.0 5.0 EEUFR1E102( ) 200 500
10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR1E102L( ) 200 500
1200 10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR1E122L( ) 200 500
1500 12.5 20 2600 0.018 10000 0.6 5.0 5.0 EEUFR1E152( ) 200 500
1800 12.5 25 3190 0.015 10000 0.6 5.0 5.0 EEUFR1E182( ) 200 500
16 20 3300 0.017 10000 0.8 7.5 7.5 EEUFR1E182S( ) 100 250
2200 12.5 30 3630 0.013 10000 0.8 5.0 EEUFR1E222L 100
16 20 3300 0.017 10000 0.8 7.5 7.5 EEUFR1E222S( ) 100 250
2700 12.5 35 3750 0.012 10000 0.8 5.0 EEUFR1E272L 100
16 20 3300 0.017 10000 0.8 7.5 7.5 EEUFR1E272S( ) 100 250
3300 16 25 3820 0.014 10000 0.8 7.5 7.5 EEUFR1E332( ) 100 250
· When requesting taped product, please put the letter "B" or "H" be tween the "( )". Lead wire pitch ✽B=5 mm, 7.5 mm, H=2.5 mm.
· Please refer to the page of “Taping Dimensions”.
06 Nov. 2014
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Aluminum Electrolytic Capacitors/ FR
– EEE-86 –
■ Standard Prod ucts
W.V. Cap.
(±20 %)
Case size Specifi cation Lead Length
Part No.
Min. Packaging Q'ty
Dia. Length
Ripple
Current
(100 kHz)
(+105 °C)
Impedance
(100 kHz)
(+20 °C)
Endurance
Lead
Dia.
Lead Space
Straight
Leads Taping Straight Taping
✽B
Taping
✽H
(V) (μF) (mm) (mm) (mA r.m.s.) (Ω) (hours) (mm) (mm) (mm) (mm) (pcs) (pcs)
35
33 5 11 280 0.300 5000 0.5 2.0 5.0 2.5 EEUFR1V330( ) 200 2000
68 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR1V680( ) 200 2000
100 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR1V101( ) 200 1000
180 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR1V181( ) 200 1000
220 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR1V221( ) 200 1000
270 8 15 1240 0.041 8000 0.6 3.5 5.0 EEUFR1V271L( ) 200 1000
10 12.5 1290 0.043 6000 0.6 5.0 5.0 EEUFR1V271( ) 200 500
330 10 12.5 1330 0.043 5000 0.6 5.0 5.0 EEUFR1V331U( ) 200 500
390 8 20 1560 0.030 9000 0.6 3.5 5.0 EEUFR1V391L( ) 200 1000
470 8 20 1560 0.030 9000 0.6 3.5 5.0 EEUFR1V471L( ) 200 1000
10 16 1790 0.028 8000 0.6 5.0 5.0 EEUFR1V471( ) 200 500
560 10 20 2180 0.020 10000 0.6 5.0 5.0 EEUFR1V561( ) 200 500
680 10 20 2180 0.020 10000 0.6 5.0 5.0 EEUFR1V681( ) 200 500
10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR1V681L( ) 200 500
820 10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR1V821L( ) 200 500
1000 12.5 20 2600 0.018 10000 0.6 5.0 5.0 EEUFR1V102( ) 200 500
1200 12.5 25 3190 0.015 10000 0.6 5.0 5.0 EEUFR1V122( ) 200 500
1500 12.5 30 3630 0.013 10000 0.8 5.0 EEUFR1V152L 100
16 20 3300 0.017 10000 0.8 7.5 7.5 EEUFR1V152S( ) 100 250
1800 12.5 35 3750 0.012 10000 0.8 5.0 EEUFR1V182L 100
16 25 3820 0.014 10000 0.8 7.5 7.5 EEUFR1V182( ) 100 250
2200 12.5 35 3750 0.012 10000 0.8 5.0 EEUFR1V222L 100
16 25 3820 0.014 10000 0.8 7.5 7.5 EEUFR1V222( ) 100 250
50
4.7 5 11 185 0.620 5000 0.5 2.0 5.0 2.5 EEUFR1H4R7( ) 200 2000
10 5 11 250 0.340 5000 0.5 2.0 5.0 2.5 EEUFR1H100( ) 200 2000
22 5 11 250 0.340 5000 0.5 2.0 5.0 2.5 EEUFR1H220( ) 200 2000
47 6.3 11.2 405 0.140 5000 0.5 2.5 5.0 EEUFR1H470( ) 200 2000
56 6.3 11.2 405 0.140 5000 0.5 2.5 5.0 2.5 EEUFR1H560( ) 200 2000
100 8 11.5 870 0.061 6000 0.6 3.5 5.0 EEUFR1H101( ) 200 1000
120 8 15 1140 0.045 8000 0.6 3.5 5.0 EEUFR1H121L( ) 200 1000
150 10 12.5 1170 0.042 6000 0.6 5.0 5.0 EEUFR1H151( ) 200 500
180 8 20 1430 0.033 9000 0.6 3.5 5.0 EEUFR1H181L( ) 200 1000
220 10 16 1650 0.030 8000 0.6 5.0 5.0 EEUFR1H221( ) 200 500
270 10 20 1890 0.023 10000 0.6 5.0 5.0 EEUFR1H271( ) 200 500
330 10 25 2150 0.022 10000 0.6 5.0 5.0 EEUFR1H331L( ) 200 500
470 12.5 20 2260 0.022 10000 0.6 5.0 5.0 EEUFR1H471( ) 200 500
560 12.5 25 2660 0.018 10000 0.6 5.0 5.0 EEUFR1H561( ) 200 500
680 12.5 30 3160 0.016 10000 0.8 5.0 EEUFR1H681L 100
820 12.5 35 3270 0.014 10000 0.8 5.0 EEUFR1H821L 100
16 20 2870 0.019 10000 0.8 7.5 7.5 EEUFR1H821S( ) 100 250
1000 16 25 3320 0.016 10000 0.8 7.5 7.5 EEUFR1H102( ) 100 250
63
18 5 11 175 0.510 5000 0.5 2.0 5.0 2.5 EEUFR1J180( ) 200 2000
47 6.3 11.2 284 0.210 5000 0.5 2.5 5.0 2.5 EEUFR1J470( ) 200 2000
82 8 11.5 566 0.092 6000 0.6 3.5 5.0 EEUFR1J820( ) 200 1000
100 8 15 741 0.068 8000 0.6 3.5 5.0 EEUFR1J101L( ) 200 1000
10 12.5 761 0.063 6000 0.6 5.0 5.0 EEUFR1J101( ) 200 500
120 8 20 930 0.050 9000 0.6 3.5 5.0 EEUFR1J121L( ) 200 1000
10 16 1073 0.045 8000 0.6 5.0 5.0 EEUFR1J121( ) 200 500
150 8 20 930 0.050 9000 0.6 3.5 5.0 EEUFR1J151L( ) 200 1000
10 16 1073 0.045 8000 0.6 5.0 5.0 EEUFR1J151( ) 200 500
180 10 20 1229 0.035 10000 0.6 5.0 5.0 EEUFR1J181( ) 200 500
220 10 25 1500 0.033 10000 0.6 5.0 5.0 EEUFR1J221L( ) 200 500
270
10 20 1229 0.035 10000 0.6 5.0 5.0 EEUFR1J271U( ) 200 500
10 25 1500 0.033 10000 0.6 5.0 5.0 EEUFR1J271L( ) 200 500
12.5 20 1582 0.033 10000 0.6 5.0 5.0 EEUFR1J271( ) 200 500
330 12.5 20 1582 0.033 10000 0.6 5.0 5.0 EEUFR1J331( ) 200 500
390 12.5 25 1995 0.027 10000 0.6 5.0 5.0 EEUFR1J391( ) 200 500
470 12.5 25 1995 0.027 10000 0.6 5.0 5.0 EEUFR1J471( ) 200 500
560 12.5 30 2528 0.024 10000 0.8 5.0 EEUFR1J561L 100
16 20 2153 0.029 10000 0.8 7.5 7.5 EEUFR1J561S( ) 100 250
680 12.5 35 2780 0.021 10000 0.8 5.0 EEUFR1J681L 100
820 16 25 2988 0.024 10000 0.8 7.5 7.5 EEUFR1J821( ) 100 250
100 100 10 20 1500 0.084 10000 0.6 5.0 5.0 EEUFR2A101( ) 200 500
· When requesting taped product, please put the letter "B" or "H" be tween the "( )". Lead wire pitch ✽B=5 mm, 7.5 mm, H=2.5 mm.
· Please refer to the page of “Taping Dimensions”.
06 Nov. 2014
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Aluminum Electrolytic Capacitors/ M
– EEE-111 –
010 Sleeve
L 14 min. 3 min. =
06.3
=L 16
: L±1.0
L 20 : L±2.0
Pressure relief +
–
08
0D+0.5
F±0.5
0D+0.5
fd±0.05
■ Features
● Endurance : 85 °C 2000 h
● Smaller than series SU
● RoHS directive compliant
Radial Lead Type
Series: M Type: A
■ Specifi cations
Category Temp. Range –40 °C to + 85 °C –25 °C to +85 °C
Rated W.V. Range 6.3 V.DC to 100 V.DC 160 V.DC to 450 V.DC
Nominal Cap. Range 2.2 μF to 22000 μF 1 μF to 470 μF
Capacitance Tolerance ±20 % (120 Hz/+20 °C)
DC Leakage Cur rent I < 0.01 CV or 3 (μA) After 2 minutes
(Whichever is greater) I < 0.06 CV +10 (μA) After 2 minutes
tan d Please see the attached standard products list
Endurance
After applying rated working voltage for 2000 hours at +85°C±2 °C, when the capacitors are
restored to 20 °C, capacitors shall meet the following limits.
Capacitance change ±20 % of initial measured value
tan d <150 % of initial specifi ed value
DC leakage current >
NXP Semiconductors LPC2468
Single-chip 16-bit/32-bit micro
20. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3
4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 5
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 8
7 Functional description . . . . . . . . . . . . . . . . . . 24
7.1 Architectural overview . . . . . . . . . . . . . . . . . . 24
7.2 On-chip flash programming memory . . . . . . . 25
7.3 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 25
7.4 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 25
7.5 Interrupt controller . . . . . . . . . . . . . . . . . . . . . 27
7.5.1 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 28
7.6 Pin connect block . . . . . . . . . . . . . . . . . . . . . . 28
7.7 External memory controller. . . . . . . . . . . . . . . 28
7.7.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.8 General purpose DMA controller . . . . . . . . . . 29
7.8.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
7.9 Fast general purpose parallel I/O . . . . . . . . . . 30
7.9.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
7.10 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
7.10.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
7.11 USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 32
7.11.1 USB device controller . . . . . . . . . . . . . . . . . . . 32
7.11.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7.11.2 USB host controller. . . . . . . . . . . . . . . . . . . . . 32
7.11.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
7.11.3 USB OTG controller . . . . . . . . . . . . . . . . . . . . 33
7.11.3.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
7.12 CAN controller and acceptance filters . . . . . . 33
7.12.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
7.13 10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
7.13.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
7.14 10-bit DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
7.14.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
7.15 UARTs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
7.15.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
7.16 SPI serial I/O controller. . . . . . . . . . . . . . . . . . 35
7.16.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
7.17 SSP serial I/O controller . . . . . . . . . . . . . . . . . 35
7.17.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
7.18 SD/MMC card interface . . . . . . . . . . . . . . . . . 35
7.18.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
7.19 I2C-bus serial I/O controller . . . . . . . . . . . . . . 36
7.19.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
7.20 I2S-bus serial I/O controllers . . . . . . . . . . . . . 36
7.20.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
7.21 General purpose 32-bit timers/external event
counters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
7.21.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
7.22 Pulse width modulator . . . . . . . . . . . . . . . . . . 38
7.22.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
7.23 Watchdog timer . . . . . . . . . . . . . . . . . . . . . . . 39
7.23.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
7.24 RTC and battery RAM . . . . . . . . . . . . . . . . . . 39
7.24.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
7.25 Clocking and power control . . . . . . . . . . . . . . 40
7.25.1 Crystal oscillators. . . . . . . . . . . . . . . . . . . . . . 40
7.25.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . . 40
7.25.1.2 Main oscillator . . . . . . . . . . . . . . . . . . . . . . . . 40
7.25.1.3 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 41
7.25.2 PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
7.25.3 Wake-up timer . . . . . . . . . . . . . . . . . . . . . . . . 41
7.25.4 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 42
7.25.4.1 Idle mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
7.25.4.2 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 42
7.25.4.3 Power-down mode . . . . . . . . . . . . . . . . . . . . . 42
7.25.4.4 Deep power-down mode . . . . . . . . . . . . . . . . 43
7.25.4.5 Power domains . . . . . . . . . . . . . . . . . . . . . . . 43
7.26 System control . . . . . . . . . . . . . . . . . . . . . . . . 44
7.26.1 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
7.26.2 Brownout detection . . . . . . . . . . . . . . . . . . . . 44
7.26.3 Code security (Code Read Protection - CRP) 44
7.26.4 AHB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
7.26.5 External interrupt inputs . . . . . . . . . . . . . . . . . 45
7.26.6 Memory mapping control . . . . . . . . . . . . . . . . 45
7.27 Emulation and debugging . . . . . . . . . . . . . . . 45
7.27.1 EmbeddedICE . . . . . . . . . . . . . . . . . . . . . . . . 45
7.27.2 Embedded trace. . . . . . . . . . . . . . . . . . . . . . . 46
7.27.3 RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . . 46
8 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 47
9 Thermal characteristics . . . . . . . . . . . . . . . . . 48
10 Static characteristics . . . . . . . . . . . . . . . . . . . 49
10.1 Power-down mode . . . . . . . . . . . . . . . . . . . . . 52
10.2 Deep power-down mode . . . . . . . . . . . . . . . . 53
10.3 Electrical pin characteristics. . . . . . . . . . . . . . 55
11 Dynamic characteristics. . . . . . . . . . . . . . . . . 56
11.1 Internal oscillators . . . . . . . . . . . . . . . . . . . . . 57
11.2 I/O pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
11.3 USB interface. . . . . . . . . . . . . . . . . . . . . . . . . 57
11.4 Flash memory . . . . . . . . . . . . . . . . . . . . . . . . 58
NXP Semiconductors LPC2468
Single-chip 16-bit/32-bit micro
© NXP B.V. 2013. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 11 January 2013
Document identifier: LPC2468
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
11.5 Static external memory interface . . . . . . . . . . 59
11.6 Dynamic external memory interface . . . . . . . . 61
11.7 Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
12 ADC electrical characteristics . . . . . . . . . . . . 65
13 DAC electrical characteristics . . . . . . . . . . . . 68
14 Application information. . . . . . . . . . . . . . . . . . 69
14.1 Suggested USB interface solutions . . . . . . . . 69
14.2 Crystal oscillator XTAL input and component
selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
14.3 RTC 32 kHz oscillator component selection. . 75
14.4 XTAL and RTCX Printed Circuit Board (PCB)
layout guidelines. . . . . . . . . . . . . . . . . . . . . . . 76
14.5 Standard I/O pin configuration . . . . . . . . . . . . 76
14.6 Reset pin configuration. . . . . . . . . . . . . . . . . . 77
15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 78
16 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 80
17 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 81
18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 82
18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 82
18.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
18.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
18.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 83
19 Contact information. . . . . . . . . . . . . . . . . . . . . 83
20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
1. General description
The LPC2141/42/44/46/48 microcontrollers are based on a 16-bit/32-bit ARM7TDMI-S
CPU with real-time emulation and embedded trace support, that combine the
microcontroller with embedded high-speed flash memory ranging from 32 kB to 512 kB. A
128-bit wide memory interface and a unique accelerator architecture enable 32-bit code
execution at the maximum clock rate. For critical code size applications, the alternative
16-bit Thumb mode reduces code by more than 30 % with minimal performance penalty.
Due to their tiny size and low power consumption, LPC2141/42/44/46/48 are ideal for
applications where miniaturization is a key requirement, such as access control and
point-of-sale. Serial communications interfaces ranging from a USB 2.0 Full-speed
device, multiple UARTs, SPI, SSP to I2C-bus and on-chip SRAM of 8 kB up to 40 kB,
make these devices very well suited for communication gateways and protocol
converters, soft modems, voice recognition and low end imaging, providing both large
buffer size and high processing power. Various 32-bit timers, single or dual 10-bit ADC(s),
10-bit DAC, PWM channels and 45 fast GPIO lines with up to nine edge or level sensitive
external interrupt pins make these microcontrollers suitable for industrial control and
medical systems.
2. Features and benefits
2.1 Key features
16-bit/32-bit ARM7TDMI-S microcontroller in a tiny LQFP64 package.
8 kB to 40 kB of on-chip static RAM and 32 kB to 512 kB of on-chip flash memory.
128-bit wide interface/accelerator enables high-speed 60 MHz operation.
In-System Programming/In-Application Programming (ISP/IAP) via on-chip boot
loader software. Single flash sector or full chip erase in 400 ms and programming of
256 B in 1 ms.
EmbeddedICE RT and Embedded Trace interfaces offer real-time debugging with the
on-chip RealMonitor software and high-speed tracing of instruction execution.
USB 2.0 Full-speed compliant device controller with 2 kB of endpoint RAM.
In addition, the LPC2146/48 provides 8 kB of on-chip RAM accessible to USB by DMA.
One or two (LPC2141/42 vs. LPC2144/46/48) 10-bit ADCs provide a total of 6/14
analog inputs, with conversion times as low as 2.44 s per channel.
Single 10-bit DAC provides variable analog output (LPC2142/44/46/48 only).
Two 32-bit timers/external event counters (with four capture and four compare
channels each), PWM unit (six outputs) and watchdog.
Low power Real-Time Clock (RTC) with independent power and 32 kHz clock input.
LPC2141/42/44/46/48
Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash
with ISP/IAP, USB 2.0 full-speed device, 10-bit ADC and DAC
Rev. 5 — 12 August 2011 Product data sheet
LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 12 August 2011 2 of 45
NXP Semiconductors LPC2141/42/44/46/48
Single-chip 16-bit/32-bit microcontrollers
Multiple serial interfaces including two UARTs (16C550), two Fast I2C-bus (400 kbit/s),
SPI and SSP with buffering and variable data length capabilities.
Vectored Interrupt Controller (VIC) with configurable priorities and vector addresses.
Up to 45 of 5 V tolerant fast general purpose I/O pins in a tiny LQFP64 package.
Up to 21 external interrupt pins available.
60 MHz maximum CPU clock available from programmable on-chip PLL with settling
time of 100 s.
On-chip integrated oscillator operates with an external crystal from 1 MHz to 25 MHz.
Power saving modes include Idle and Power-down.
Individual enable/disable of peripheral functions as well as peripheral clock scaling for
additional power optimization.
Processor wake-up from Power-down mode via external interrupt or BOD.
Single power supply chip with POR and BOD circuits:
CPU operating voltage range of 3.0 V to 3.6 V (3.3 V 10 %) with 5 V tolerant I/O
pads.
3. Ordering information
3.1 Ordering options
[1] While the USB DMA is the primary user of the additional 8 kB RAM, this RAM is also accessible at any time by the CPU as a general
purpose RAM for data and code storage.
Table 1. Ordering information
Type number Package
Name Description Version
LPC2141FBD64 LQFP64 plastic low profile quad flat package; 64 leads;
body 10 10 1.4 mm
SOT314-2
LPC2142FBD64
LPC2144FBD64
LPC2146FBD64
LPC2148FBD64
Table 2. Ordering options
Type number Flash
memory
RAM Endpoint
USB RAM
ADC (channels
overall)
DAC Temperature
range
LPC2141FBD64 32 kB 8 kB 2 kB 1 (6 channels) - 40 C to +85 C
LPC2142FBD64 64 kB 16 kB 2 kB 1 (6 channels) 1 40 C to +85 C
LPC2144FBD64 128 kB 16 kB 2 kB 2 (14 channels) 1 40 C to +85 C
LPC2146FBD64 256 kB 32 kB + 8 kB shared with
USB DMA[1]
2 kB 2 (14 channels) 1 40 C to +85 C
LPC2148FBD64 512 kB 32 kB + 8 kB shared with
USB DMA[1]
2 kB 2 (14 channels) 1 40 C to +85 C
LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 12 August 2011 3 of 45
NXP Semiconductors LPC2141/42/44/46/48
Single-chip 16-bit/32-bit microcontrollers
4. Block diagram
(1) Pins shared with GPIO.
(2) LPC2144/46/48 only.
(3) USB DMA controller with 8 kB of RAM accessible as general purpose RAM and/or DMA is available in LPC2146/48 only.
(4) LPC2142/44/46/48 only.
Fig 1. Block diagram
002aab560
system
clock
TRST(1)
TMS(1)
TCK(1)
TDI(1)
TDO(1)
XTAL2
XTAL1
AMBA AHB
(Advanced High-performance Bus)
INTERNAL
FLASH
CONTROLLER
AHB BRIDGE
EMULATION TRACE
MODULE
TEST/DEBUG
INTERFACE
AHB
AHB TO APB DECODER
BRIDGE
APB
DIVIDER
VECTORED
INTERRUPT
CONTROLLER
SYSTEM
FUNCTIONS
PLL0
USB
clock
PLL1
SYSTEM
CONTROL
32 kB/64 kB/128 kB/
256 kB/512 kB
FLASH
ARM7TDMI-S
LPC2141/42/44/46/48
INTERNAL
SRAM
CONTROLLER
8 kB/16 kB/
32 kB
SRAM
ARM7 local bus
SCL0, SCL1
SDA0, SDA1
4 × CAP0
4 × CAP1
8 × MAT0
8 × MAT1
I
2C-BUS SERIAL
INTERFACES 0 AND 1
CAPTURE/COMPARE
(W/EXTERNAL CLOCK)
TIMER 0/TIMER 1
EINT3 to EINT0 EXTERNAL
INTERRUPTS
D+
D−
UP_LED
CONNECT
VBUS
USB 2.0 FULL-SPEED
DEVICE CONTROLLER
WITH DMA(3)
SCK0, SCK1
MOSI0, MOSI1
MISO0, MISO1
AD0[7:6] and
AD0[4:1]
AD1[7:0](2)
SSEL0, SSEL1
SPI AND SSP
SERIAL INTERFACES
A/D CONVERTERS
0 AND 1(2)
TXD0, TXD1
RXD0, RXD1
DSR1(2),CTS1(2),
RTS1(2), DTR1(2)
DCD1(2),RI1(2)
AOUT(4) D/A CONVERTER UART0/UART1
P0[31:28] and
P0[25:0]
P1[31:16]
RTXC2
RTXC1
VBAT
REAL-TIME CLOCK GENERAL
PURPOSE I/O
PWM6 to PWM0 WATCHDOG
TIMER PWM0
P0[31:28] and
P0[25:0]
P1[31:16]
FAST GENERAL
PURPOSE I/O
8 kB RAM
SHARED WITH
USB DMA(3)
RST
LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 12 August 2011 4 of 45
NXP Semiconductors LPC2141/42/44/46/48
Single-chip 16-bit/32-bit microcontrollers
5. Pinning information
5.1 Pinning
Fig 2. LPC2141 pinning
LPC2141
P0.21/PWM5/CAP1.3 P1.20/TRACESYNC
P0.22/CAP0.0/MAT0.0 P0.17/CAP1.2/SCK1/MAT1.2
RTCX1 P0.16/EINT0/MAT0.2/CAP0.2
P1.19/TRACEPKT3 P0.15/EINT2
RTCX2 P1.21/PIPESTAT0
VSS VDD
VDDA VSS
P1.18/TRACEPKT2 P0.14/EINT1/SDA1
P0.25/AD0.4 P1.22/PIPESTAT1
D+ P0.13/MAT1.1
D− P0.12/MAT1.0
P1.17/TRACEPKT1 P0.11/CAP1.1/SCL1
P0.28/AD0.1/CAP0.2/MAT0.2 P1.23/PIPESTAT2
P0.29/AD0.2/CAP0.3/MAT0.3 P0.10/CAP1.0
P0.30/AD0.3/EINT3/CAP0.0 P0.9/RXD1/PWM6/EINT3
P1.16/TRACEPKT0 P0.8/TXD1/PWM4 P0.31/UP_LED/CONNECT P1.27/TDO
VSS VREF
P0.0/TXD0/PWM1 XTAL1
P1.31/TRST XTAL2
P0.1/RXD0/PWM3/EINT0 P1.28/TDI
P0.2/SCL0/CAP0.0
VSSA
VDD P0.23/VBUS
P1.26/RTCK RESET
VSS P1.29/TCK
P0.3/SDA0/MAT0.0/EINT1 P0.20/MAT1.3/SSEL1/EINT3
P0.4/SCK0/CAP0.1/AD0.6 P0.19/MAT1.2/MOSI1/CAP1.2
P1.25/EXTIN0 P0.18/CAP1.3/MISO1/MAT1.3
P0.5/MISO0/MAT0.1/AD0.7 P1.30/TMS
P0.6/MOSI0/CAP0.2
VDD
P0.7/SSEL0/PWM2/EINT2
VSS
P1.24/TRACECLK VBAT
002aab733
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 12 August 2011 5 of 45
NXP Semiconductors LPC2141/42/44/46/48
Single-chip 16-bit/32-bit microcontrollers
Fig 3. LPC2142 pinning
LPC2142
P0.21/PWM5/CAP1.3 P1.20/TRACESYNC
P0.22/CAP0.0/MAT0.0 P0.17/CAP1.2/SCK1/MAT1.2
RTCX1 P0.16/EINT0/MAT0.2/CAP0.2
P1.19/TRACEPKT3 P0.15/EINT2
RTCX2 P1.21/PIPESTAT0
VSS VDD
VDDA VSS
P1.18/TRACEPKT2 P0.14/EINT1/SDA1
P0.25/AD0.4/AOUT P1.22/PIPESTAT1
D+ P0.13/MAT1.1
D− P0.12/MAT1.0
P1.17/TRACEPKT1 P0.11/CAP1.1/SCL1
P0.28/AD0.1/CAP0.2/MAT0.2 P1.23/PIPESTAT2
P0.29/AD0.2/CAP0.3/MAT0.3 P0.10/CAP1.0
P0.30/AD0.3/EINT3/CAP0.0 P0.9/RXD1/PWM6/EINT3
P1.16/TRACEPKT0 P0.8/TXD1/PWM4 P0.31/UP_LED/CONNECT P1.27/TDO
VSS VREF
P0.0/TXD0/PWM1 XTAL1
P1.31/TRST XTAL2
P0.1/RXD0/PWM3/EINT0 P1.28/TDI
P0.2/SCL0/CAP0.0
VSSA
VDD P0.23/VBUS
P1.26/RTCK RESET
VSS P1.29/TCK
P0.3/SDA0/MAT0.0/EINT1 P0.20/MAT1.3/SSEL1/EINT3
P0.4/SCK0/CAP0.1/AD0.6 P0.19/MAT1.2/MOSI1/CAP1.2
P1.25/EXTIN0 P0.18/CAP1.3/MISO1/MAT1.3
P0.5/MISO0/MAT0.1/AD0.7 P1.30/TMS
P0.6/MOSI0/CAP0.2
VDD
P0.7/SSEL0/PWM2/EINT2
VSS
P1.24/TRACECLK VBAT
002aab734
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 12 August 2011 6 of 45
NXP Semiconductors LPC2141/42/44/46/48
Single-chip 16-bit/32-bit microcontrollers
Fig 4. LPC2144/46/48 pinning
LPC2144/2146/2148
P0.21/PWM5/AD1.6/CAP1.3 P1.20/TRACESYNC
P0.22/AD1.7/CAP0.0/MAT0.0 P0.17/CAP1.2/SCK1/MAT1.2
RTCX1 P0.16/EINT0/MAT0.2/CAP0.2
P1.19/TRACEPKT3 P0.15/RI1/EINT2/AD1.5
RTCX2 P1.21/PIPESTAT0
VSS VDD
VDDA VSS
P1.18/TRACEPKT2 P0.14/DCD1/EINT1/SDA1
P0.25/AD0.4/AOUT P1.22/PIPESTAT1
D+ P0.13/DTR1/MAT1.1/AD1.4
D− P0.12/DSR1/MAT1.0/AD1.3
P1.17/TRACEPKT1 P0.11/CTS1/CAP1.1/SCL1
P0.28/AD0.1/CAP0.2/MAT0.2 P1.23/PIPESTAT2
P0.29/AD0.2/CAP0.3/MAT0.3 P0.10/RTS1/CAP1.0/AD1.2
P0.30/AD0.3/EINT3/CAP0.0 P0.9/RXD1/PWM6/EINT3
P1.16/TRACEPKT0 P0.8/TXD1/PWM4/AD1.1 P0.31/UP_LED/CONNECT P1.27/TDO
VSS VREF
P0.0/TXD0/PWM1 XTAL1
P1.31/TRST XTAL2
P0.1/RXD0/PWM3/EINT0 P1.28/TDI
P0.2/SCL0/CAP0.0
VSSA
VDD P0.23/VBUS
P1.26/RTCK RESET
VSS P1.29/TCK
P0.3/SDA0/MAT0.0/EINT1 P0.20/MAT1.3/SSEL1/EINT3
P0.4/SCK0/CAP0.1/AD0.6 P0.19/MAT1.2/MOSI1/CAP1.2
P1.25/EXTIN0 P0.18/CAP1.3/MISO1/MAT1.3
P0.5/MISO0/MAT0.1/AD0.7 P1.30/TMS
P0.6/MOSI0/CAP0.2/AD1.0
VDD
P0.7/SSEL0/PWM2/EINT2
VSS
P1.24/TRACECLK VBAT
002aab735
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 12 August 2011 7 of 45
NXP Semiconductors LPC2141/42/44/46/48
Single-chip 16-bit/32-bit microcontrollers
5.2 Pin description
Table 3. Pin description
Symbol Pin Type Description
P0.0 to P0.31 I/O Port 0: Port 0 is a 32-bit I/O port with individual direction controls for
each bit. Total of 31 pins of the Port 0 can be used as a general
purpose bidirectional digital I/Os while P0.31 is output only pin. The
operation of port 0 pins depends upon the pin function selected via the
pin connect block.
Pins P0.24, P0.26 and P0.27 are not available.
P0.0/TXD0/
PWM1
19[1] I/O P0.0 — General purpose input/output digital pin (GPIO).
O TXD0 — Transmitter output for UART0.
O PWM1 — Pulse Width Modulator output 1.
P0.1/RXD0/
PWM3/EINT0
21[2] I/O P0.1 — General purpose input/output digital pin (GPIO).
I RXD0 — Receiver input for UART0.
O PWM3 — Pulse Width Modulator output 3.
I EINT0 — External interrupt 0 input.
P0.2/SCL0/
CAP0.0
22[3] I/O P0.2 — General purpose input/output digital pin (GPIO).
I/O SCL0 — I
2C0 clock input/output. Open-drain output (for I2C-bus
compliance).
I CAP0.0 — Capture input for Timer 0, channel 0.
P0.3/SDA0/
MAT0.0/EINT1
26[3] I/O P0.3 — General purpose input/output digital pin (GPIO).
I/O SDA0 — I
2C0 data input/output. Open-drain output (for I2C-bus
compliance).
O MAT0.0 — Match output for Timer 0, channel 0.
I EINT1 — External interrupt 1 input.
P0.4/SCK0/
CAP0.1/AD0.6
27[4] I/O P0.4 — General purpose input/output digital pin (GPIO).
I/O SCK0 — Serial clock for SPI0. SPI clock output from master or input
to slave.
I CAP0.1 — Capture input for Timer 0, channel 1.
I AD0.6 — ADC 0, input 6.
P0.5/MISO0/
MAT0.1/AD0.7
29[4] I/O P0.5 — General purpose input/output digital pin (GPIO).
I/O MISO0 — Master In Slave Out for SPI0. Data input to SPI master or
data output from SPI slave.
O MAT0.1 — Match output for Timer 0, channel 1.
I AD0.7 — ADC 0, input 7.
P0.6/MOSI0/
CAP0.2/AD1.0
30[4] I/O P0.6 — General purpose input/output digital pin (GPIO).
I/O MOSI0 — Master Out Slave In for SPI0. Data output from SPI master
or data input to SPI slave.
I CAP0.2 — Capture input for Timer 0, channel 2.
I AD1.0 — ADC 1, input 0. Available in LPC2144/46/48 only.
P0.7/SSEL0/
PWM2/EINT2
31[2] I/O P0.7 — General purpose input/output digital pin (GPIO).
I SSEL0 — Slave Select for SPI0. Selects the SPI interface as a slave.
O PWM2 — Pulse Width Modulator output 2.
I EINT2 — External interrupt 2 input.
LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 12 August 2011 8 of 45
NXP Semiconductors LPC2141/42/44/46/48
Single-chip 16-bit/32-bit microcontrollers
P0.8/TXD1/
PWM4/AD1.1
33[4] I/O P0.8 — General purpose input/output digital pin (GPIO).
O TXD1 — Transmitter output for UART1.
O PWM4 — Pulse Width Modulator output 4.
I AD1.1 — ADC 1, input 1. Available in LPC2144/46/48 only.
P0.9/RXD1/
PWM6/EINT3
34[2] I/O P0.9 — General purpose input/output digital pin (GPIO).
I RXD1 — Receiver input for UART1.
O PWM6 — Pulse Width Modulator output 6.
I EINT3 — External interrupt 3 input.
P0.10/RTS1/
CAP1.0/AD1.2
35[4] I/O P0.10 — General purpose input/output digital pin (GPIO).
O RTS1 — Request to Send output for UART1. LPC2144/46/48 only.
I CAP1.0 — Capture input for Timer 1, channel 0.
I AD1.2 — ADC 1, input 2. Available in LPC2144/46/48 only.
P0.11/CTS1/
CAP1.1/SCL1
37[3] I/O P0.11 — General purpose input/output digital pin (GPIO).
I CTS1 — Clear to Send input for UART1. Available in LPC2144/46/48
only.
I CAP1.1 — Capture input for Timer 1, channel 1.
I/O SCL1 — I
2C1 clock input/output. Open-drain output (for I2C-bus
compliance)
P0.12/DSR1/
MAT1.0/AD1.3
38[4] I/O P0.12 — General purpose input/output digital pin (GPIO).
I DSR1 — Data Set Ready input for UART1. Available in
LPC2144/46/48 only.
O MAT1.0 — Match output for Timer 1, channel 0.
I AD1.3 — ADC 1 input 3. Available in LPC2144/46/48 only.
P0.13/DTR1/
MAT1.1/AD1.4
39[4] I/O P0.13 — General purpose input/output digital pin (GPIO).
O DTR1 — Data Terminal Ready output for UART1. LPC2144/46/48
only.
O MAT1.1 — Match output for Timer 1, channel 1.
I AD1.4 — ADC 1 input 4. Available in LPC2144/46/48 only.
P0.14/DCD1/
EINT1/SDA1
41[3] I/O P0.14 — General purpose input/output digital pin (GPIO).
I DCD1 — Data Carrier Detect input for UART1. LPC2144/46/48 only.
I EINT1 — External interrupt 1 input.
I/O SDA1 — I
2C1 data input/output. Open-drain output (for I2C-bus
compliance).
Note: LOW on this pin while RESET is LOW forces on-chip boot
loader to take over control of the part after reset.
P0.15/RI1/
EINT2/AD1.5
45[4] I/O P0.15 — General purpose input/output digital pin (GPIO).
I RI1 — Ring Indicator input for UART1. Available in LPC2144/46/48
only.
I EINT2 — External interrupt 2 input.
I AD1.5 — ADC 1, input 5. Available in LPC2144/46/48 only.
Table 3. Pin description …continued
Symbol Pin Type Description
LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 12 August 2011 9 of 45
NXP Semiconductors LPC2141/42/44/46/48
Single-chip 16-bit/32-bit microcontrollers
P0.16/EINT0/
MAT0.2/CAP0.2
46[2] I/O P0.16 — General purpose input/output digital pin (GPIO).
I EINT0 — External interrupt 0 input.
O MAT0.2 — Match output for Timer 0, channel 2.
I CAP0.2 — Capture input for Timer 0, channel 2.
P0.17/CAP1.2/
SCK1/MAT1.2
47[1] I/O P0.17 — General purpose input/output digital pin (GPIO).
I CAP1.2 — Capture input for Timer 1, channel 2.
I/O SCK1 — Serial Clock for SSP. Clock output from master or input to
slave.
O MAT1.2 — Match output for Timer 1, channel 2.
P0.18/CAP1.3/
MISO1/MAT1.3
53[1] I/O P0.18 — General purpose input/output digital pin (GPIO).
I CAP1.3 — Capture input for Timer 1, channel 3.
I/O MISO1 — Master In Slave Out for SSP. Data input to SPI master or
data output from SSP slave.
O MAT1.3 — Match output for Timer 1, channel 3.
P0.19/MAT1.2/
MOSI1/CAP1.2
54[1] I/O P0.19 — General purpose input/output digital pin (GPIO).
O MAT1.2 — Match output for Timer 1, channel 2.
I/O MOSI1 — Master Out Slave In for SSP. Data output from SSP master
or data input to SSP slave.
I CAP1.2 — Capture input for Timer 1, channel 2.
P0.20/MAT1.3/
SSEL1/EINT3
55[2] I/O P0.20 — General purpose input/output digital pin (GPIO).
O MAT1.3 — Match output for Timer 1, channel 3.
I SSEL1 — Slave Select for SSP. Selects the SSP interface as a slave.
I EINT3 — External interrupt 3 input.
P0.21/PWM5/
AD1.6/CAP1.3
1[4] I/O P0.21 — General purpose input/output digital pin (GPIO).
O PWM5 — Pulse Width Modulator output 5.
I AD1.6 — ADC 1, input 6. Available in LPC2144/46/48 only.
I CAP1.3 — Capture input for Timer 1, channel 3.
P0.22/AD1.7/
CAP0.0/MAT0.0
2[4] I/O P0.22 — General purpose input/output digital pin (GPIO).
I AD1.7 — ADC 1, input 7. Available in LPC2144/46/48 only.
I CAP0.0 — Capture input for Timer 0, channel 0.
O MAT0.0 — Match output for Timer 0, channel 0.
P0.23/VBUS 58[1] I/O P0.23 — General purpose input/output digital pin (GPIO).
I VBUS — Indicates the presence of USB bus power.
Note: This signal must be HIGH for USB reset to occur.
P0.25/AD0.4/
AOUT
9[5] I/O P0.25 — General purpose input/output digital pin (GPIO).
I AD0.4 — ADC 0, input 4.
O AOUT — DAC output. Available in LPC2142/44/46/48 only.
P0.28/AD0.1/
CAP0.2/MAT0.2
13[4] I/O P0.28 — General purpose input/output digital pin (GPIO).
I AD0.1 — ADC 0, input 1.
I CAP0.2 — Capture input for Timer 0, channel 2.
O MAT0.2 — Match output for Timer 0, channel 2.
Table 3. Pin description …continued
Symbol Pin Type Description
LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 12 August 2011 10 of 45
NXP Semiconductors LPC2141/42/44/46/48
Single-chip 16-bit/32-bit microcontrollers
P0.29/AD0.2/
CAP0.3/MAT0.3
14[4] I/O P0.29 — General purpose input/output digital pin (GPIO).
I AD0.2 — ADC 0, input 2.
I CAP0.3 — Capture input for Timer 0, channel 3.
O MAT0.3 — Match output for Timer 0, channel 3.
P0.30/AD0.3/
EINT3/CAP0.0
15[4] I/O P0.30 — General purpose input/output digital pin (GPIO).
I AD0.3 — ADC 0, input 3.
I EINT3 — External interrupt 3 input.
I CAP0.0 — Capture input for Timer 0, channel 0.
P0.31/UP_LED/
CONNECT
17[6] O P0.31 — General purpose output only digital pin (GPO).
O UP_LED — USB GoodLink LED indicator. It is LOW when device is
configured (non-control endpoints enabled). It is HIGH when the
device is not configured or during global suspend.
O CONNECT — Signal used to switch an external 1.5 k resistor under
the software control. Used with the SoftConnect USB feature.
Important: This is an digital output only pin. This pin MUST NOT be
externally pulled LOW when RESET pin is LOW or the JTAG port will
be disabled.
P1.0 to P1.31 I/O Port 1: Port 1 is a 32-bit bidirectional I/O port with individual direction
controls for each bit. The operation of port 1 pins depends upon the
pin function selected via the pin connect block. Pins 0 through 15 of
port 1 are not available.
P1.16/
TRACEPKT0
16[6] I/O P1.16 — General purpose input/output digital pin (GPIO). Standard
I/O port with internal pull-up.
O TRACEPKT0 — Trace Packet, bit 0.
P1.17/
TRACEPKT1
12[6] I/O P1.17 — General purpose input/output digital pin (GPIO). Standard
I/O port with internal pull-up.
O TRACEPKT1 — Trace Packet, bit 1.
P1.18/
TRACEPKT2
8[6] I/O P1.18 — General purpose input/output digital pin (GPIO). Standard
I/O port with internal pull-up.
O TRACEPKT2 — Trace Packet, bit 2.
P1.19/
TRACEPKT3
4[6] I/O P1.19 — General purpose input/output digital pin (GPIO). Standard
I/O port with internal pull-up.
O TRACEPKT3 — Trace Packet, bit 3.
P1.20/
TRACESYNC
48[6] I/O P1.20 — General purpose input/output digital pin (GPIO). Standard
I/O port with internal pull-up.
O TRACESYNC — Trace Synchronization.
Note: LOW on this pin while RESET is LOW enables pins P1.25:16 to
operate as Trace port after reset.
P1.21/
PIPESTAT0
44[6] I/O P1.21 — General purpose input/output digital pin (GPIO). Standard
I/O port with internal pull-up.
O PIPESTAT0 — Pipeline Status, bit 0.
P1.22/
PIPESTAT1
40[6] I/O P1.22 — General purpose input/output digital pin (GPIO). Standard
I/O port with internal pull-up.
O PIPESTAT1 — Pipeline Status, bit 1.
Table 3. Pin description …continued
Symbol Pin Type Description
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Single-chip 16-bit/32-bit microcontrollers
P1.23/
PIPESTAT2
36[6] I/O P1.23 — General purpose input/output digital pin (GPIO). Standard
I/O port with internal pull-up.
O PIPESTAT2 — Pipeline Status, bit 2.
P1.24/
TRACECLK
32[6] I/O P1.24 — General purpose input/output digital pin (GPIO). Standard
I/O port with internal pull-up.
O TRACECLK — Trace Clock.
P1.25/EXTIN0 28[6] I/O P1.25 — General purpose input/output digital pin (GPIO). Standard
I/O port with internal pull-up.
I EXTIN0 — External Trigger Input.
P1.26/RTCK 24[6] I/O P1.26 — General purpose input/output digital pin (GPIO).
I/O RTCK — Returned Test Clock output. Extra signal added to the JTAG
port. Assists debugger synchronization when processor frequency
varies. Bidirectional pin with internal pull-up.
Note: LOW on RTCK while RESET is LOW enables pins P1[31:26] to
operate as Debug port after reset.
P1.27/TDO 64[6] I/O P1.27 — General purpose input/output digital pin (GPIO).
O TDO — Test Data out for JTAG interface.
P1.28/TDI 60[6] I/O P1.28 — General purpose input/output digital pin (GPIO).
I TDI — Test Data in for JTAG interface.
P1.29/TCK 56[6] I/O P1.29 — General purpose input/output digital pin (GPIO).
I TCK — Test Clock for JTAG interface. This clock must be slower than
16 of the CPU clock (CCLK) for the JTAG interface to operate.
P1.30/TMS 52[6] I/O P1.30 — General purpose input/output digital pin (GPIO).
I TMS — Test Mode Select for JTAG interface.
P1.31/TRST 20[6] I/O P1.31 — General purpose input/output digital pin (GPIO).
I TRST — Test Reset for JTAG interface.
D+ 10[7] I/O USB bidirectional D+ line.
D 11[7] I/O USB bidirectional D line.
RESET 57[8] I External reset input: A LOW on this pin resets the device, causing
I/O ports and peripherals to take on their default states, and processor
execution to begin at address 0. TTL with hysteresis, 5 V tolerant.
XTAL1 62[9] I Input to the oscillator circuit and internal clock generator circuits.
XTAL2 61[9] O Output from the oscillator amplifier.
RTCX1 3[9][10] I Input to the RTC oscillator circuit.
RTCX2 5[9][10] O Output from the RTC oscillator circuit.
VSS 6, 18, 25, 42,
50
I Ground: 0 V reference.
VSSA 59 I Analog ground: 0 V reference. This should nominally be the same
voltage as VSS, but should be isolated to minimize noise and error.
VDD 23, 43, 51 I 3.3 V power supply: This is the power supply voltage for the core and
I/O ports.
Table 3. Pin description …continued
Symbol Pin Type Description
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[1] 5 V tolerant pad (no built-in pull-up resistor) providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control.
[2] 5 V tolerant pad (no built-in pull-up resistor) providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control. If
configured for an input function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns.
[3] Open-drain 5 V tolerant digital I/O I2C-bus 400 kHz specification compatible pad. It requires external pull-up to provide an output
functionality.
[4] 5 V tolerant pad (no built-in pull-up resistor) providing digital I/O (with TTL levels and hysteresis and 10 ns slew rate control) and analog
input function. If configured for an input function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns. When
configured as an ADC input, digital section of the pad is disabled.
[5] 5 V tolerant pad (no built-in pull-up resistor) providing digital I/O (with TTL levels and hysteresis and 10 ns slew rate control) and analog
output function. When configured as the DAC output, digital section of the pad is disabled.
[6] 5 V tolerant pad with built-in pull-up resistor providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control.
The pull-up resistor’s value typically ranges from 60 k to 300 k.
[7] Pad is designed in accordance with the Universal Serial Bus (USB) specification, revision 2.0 (Full-speed and Low-speed mode only).
[8] 5 V tolerant pad providing digital input (with TTL levels and hysteresis) function only.
[9] Pad provides special analog functionality.
[10] When unused, the RTCX1 pin can be grounded or left floating. For lowest power leave it floating.
The other RTC pin, RTCX2, should be left floating.
VDDA 7 I Analog 3.3 V power supply: This should be nominally the same
voltage as VDD but should be isolated to minimize noise and error.
This voltage is only used to power the on-chip ADC(s) and DAC.
VREF 63 I ADC reference voltage: This should be nominally less than or equal
to the VDD voltage but should be isolated to minimize noise and error.
Level on this pin is used as a reference for ADC(s) and DAC.
VBAT 49 I RTC power supply voltage: 3.3 V on this pin supplies the power to
the RTC.
Table 3. Pin description …continued
Symbol Pin Type Description
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6. Functional description
6.1 Architectural overview
The ARM7TDMI-S is a general purpose 32-bit microprocessor, which offers high
performance and very low power consumption. The ARM architecture is based on
Reduced Instruction Set Computer (RISC) principles, and the instruction set and related
decode mechanism are much simpler than those of microprogrammed Complex
Instruction Set Computers (CISC). This simplicity results in a high instruction throughput
and impressive real-time interrupt response from a small and cost-effective processor
core.
Pipeline techniques are employed so that all parts of the processing and memory systems
can operate continuously. Typically, while one instruction is being executed, its successor
is being decoded, and a third instruction is being fetched from memory.
The ARM7TDMI-S processor also employs a unique architectural strategy known as
Thumb, which makes it ideally suited to high-volume applications with memory
restrictions, or applications where code density is an issue.
The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the
ARM7TDMI-S processor has two instruction sets:
• The standard 32-bit ARM set.
• A 16-bit Thumb set.
The Thumb set’s 16-bit instruction length allows it to approach twice the density of
standard ARM code while retaining most of the ARM’s performance advantage over a
traditional 16-bit processor using 16-bit registers. This is possible because Thumb code
operates on the same 32-bit register set as ARM code.
Thumb code is able to provide up to 65 % of the code size of ARM, and 160 % of the
performance of an equivalent ARM processor connected to a 16-bit memory system.
The particular flash implementation in the LPC2141/42/44/46/48 allows for full speed
execution also in ARM mode. It is recommended to program performance critical and
short code sections (such as interrupt service routines and DSP algorithms) in ARM
mode. The impact on the overall code size will be minimal but the speed can be increased
by 30 % over Thumb mode.
6.2 On-chip flash program memory
The LPC2141/42/44/46/48 incorporate a 32 kB, 64 kB, 128 kB, 256 kB and 512 kB flash
memory system respectively. This memory may be used for both code and data storage.
Programming of the flash memory may be accomplished in several ways. It may be
programmed In System via the serial port. The application program may also erase and/or
program the flash while the application is running, allowing a great degree of flexibility for
data storage field firmware upgrades, etc. Due to the architectural solution chosen for an
on-chip boot loader, flash memory available for user’s code on LPC2141/42/44/46/48 is
32 kB, 64 kB, 128 kB, 256 kB and 500 kB respectively.
The LPC2141/42/44/46/48 flash memory provides a minimum of 100000 erase/write
cycles and 20 years of data-retention.
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6.3 On-chip static RAM
On-chip static RAM may be used for code and/or data storage. The SRAM may be
accessed as 8-bit, 16-bit, and 32-bit. The LPC2141, LPC2142/44 and LPC2146/48
provide 8 kB, 16 kB and 32 kB of static RAM respectively.
In case of LPC2146/48 only, an 8 kB SRAM block intended to be utilized mainly by the
USB can also be used as a general purpose RAM for data storage and code storage and
execution.
6.4 Memory map
The LPC2141/42/44/46/48 memory map incorporates several distinct regions, as shown
in Figure 5.
In addition, the CPU interrupt vectors may be remapped to allow them to reside in either
flash memory (the default) or on-chip static RAM. This is described in Section 6.19
“System control”.
Fig 5. LPC2141/42/44/46/48 memory map
AHB PERIPHERALS
VPB PERIPHERALS
RESERVED ADDRESS SPACE
BOOT BLOCK (12 kB REMAPPED FROM
ON-CHIP FLASH MEMORY
RESERVED ADDRESS SPACE
0xFFFF FFFF
0xF000 0000
0xE000 0000
0xC000 0000
0x8000 0000
0x7FFF FFFF
0x7FD0 2000
TOTAL OF 512 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2148) 0x0004 0000
0x0007 FFFF
TOTAL OF 256 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2146) 0x0002 0000
0x0003 FFFF
TOTAL OF 128 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2144) 0x0001 0000
0x0001 FFFF
TOTAL OF 64 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2142) 0x0000 8000
0x0000 FFFF
TOTAL OF 32 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2141) 0x0000 0000
0x0000 7FFF
RESERVED ADDRESS SPACE 0x0008 0000
0x3FFF FFFF
8 kB ON-CHIP STATIC RAM (LPC2141) 0x4000 0000
0x4000 1FFF
16 kB ON-CHIP STATIC RAM (LPC2142/2144) 0x4000 2000
0x4000 3FFF
32 kB ON-CHIP STATIC RAM (LPC2146/2148) 0x4000 4000
0x4000 7FFF
RESERVED ADDRESS SPACE 0x4000 8000
0x7FCF FFFF
8 kB ON-CHIP USB DMA RAM (LPC2146/2148) 0x7FD0 0000
0x7FD0 1FFF
0x7FFF D000
0x7FFF CFFF
4.0 GB
3.75 GB
3.5 GB
3.0 GB
2.0 GB
1.0 GB
0.0 GB
002aab558
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6.5 Interrupt controller
The Vectored Interrupt Controller (VIC) accepts all of the interrupt request inputs and
categorizes them as Fast Interrupt reQuest (FIQ), vectored Interrupt ReQuest (IRQ), and
non-vectored IRQ as defined by programmable settings. The programmable assignment
scheme means that priorities of interrupts from the various peripherals can be dynamically
assigned and adjusted.
FIQ has the highest priority. If more than one request is assigned to FIQ, the VIC
combines the requests to produce the FIQ signal to the ARM processor. The fastest
possible FIQ latency is achieved when only one request is classified as FIQ, because then
the FIQ service routine does not need to branch into the interrupt service routine but can
run from the interrupt vector location. If more than one request is assigned to the FIQ
class, the FIQ service routine will read a word from the VIC that identifies which FIQ
source(s) is (are) requesting an interrupt.
Vectored IRQs have the middle priority. Sixteen of the interrupt requests can be assigned
to this category. Any of the interrupt requests can be assigned to any of the 16 vectored
IRQ slots, among which slot 0 has the highest priority and slot 15 has the lowest.
Non-vectored IRQs have the lowest priority.
The VIC combines the requests from all the vectored and non-vectored IRQs to produce
the IRQ signal to the ARM processor. The IRQ service routine can start by reading a
register from the VIC and jumping there. If any of the vectored IRQs are pending, the VIC
provides the address of the highest-priority requesting IRQs service routine, otherwise it
provides the address of a default routine that is shared by all the non-vectored IRQs. The
default routine can read another VIC register to see what IRQs are active.
6.5.1 Interrupt sources
Each peripheral device has one interrupt line connected to the Vectored Interrupt
Controller, but may have several internal interrupt flags. Individual interrupt flags may also
represent more than one interrupt source.
6.6 Pin connect block
The pin connect block allows selected pins of the microcontroller to have more than one
function. Configuration registers control the multiplexers to allow connection between the
pin and the on chip peripherals. Peripherals should be connected to the appropriate pins
prior to being activated, and prior to any related interrupt(s) being enabled. Activity of any
enabled peripheral function that is not mapped to a related pin should be considered
undefined.
The Pin Control Module with its pin select registers defines the functionality of the
microcontroller in a given hardware environment.
After reset all pins of Port 0 and Port 1 are configured as input with the following
exceptions: If debug is enabled, the JTAG pins will assume their JTAG functionality; if
trace is enabled, the Trace pins will assume their trace functionality. The pins associated
with the I2C0 and I2C1 interface are open drain.
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6.7 Fast general purpose parallel I/O (GPIO)
Device pins that are not connected to a specific peripheral function are controlled by the
GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate
registers allow setting or clearing any number of outputs simultaneously. The value of the
output register may be read back, as well as the current state of the port pins.
LPC2141/42/44/46/48 introduce accelerated GPIO functions over prior LPC2000 devices:
• GPIO registers are relocated to the ARM local bus for the fastest possible I/O timing.
• Mask registers allow treating sets of port bits as a group, leaving other bits
unchanged.
• All GPIO registers are byte addressable.
• Entire port value can be written in one instruction.
6.7.1 Features
• Bit-level set and clear registers allow a single instruction set or clear of any number of
bits in one port.
• Direction control of individual bits.
• Separate control of output set and clear.
• All I/O default to inputs after reset.
6.8 10-bit ADC
The LPC2141/42 contain one and the LPC2144/46/48 contain two analog to digital
converters. These converters are single 10-bit successive approximation analog to digital
converters. While ADC0 has six channels, ADC1 has eight channels. Therefore, total
number of available ADC inputs for LPC2141/42 is 6 and for LPC2144/46/48 is 14.
6.8.1 Features
• 10 bit successive approximation analog to digital converter.
• Measurement range of 0 V to VREF (2.5 V VREF VDDA).
• Each converter capable of performing more than 400000 10-bit samples per second.
• Every analog input has a dedicated result register to reduce interrupt overhead.
• Burst conversion mode for single or multiple inputs.
• Optional conversion on transition on input pin or timer match signal.
• Global Start command for both converters (LPC2142/44/46/48 only).
6.9 10-bit DAC
The DAC enables the LPC2141/42/44/46/48 to generate a variable analog output. The
maximum DAC output voltage is the VREF voltage.
6.9.1 Features
• 10-bit DAC.
• Buffered output.
• Power-down mode available.
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• Selectable speed versus power.
6.10 USB 2.0 device controller
The USB is a 4-wire serial bus that supports communication between a host and a
number (127 max) of peripherals. The host controller allocates the USB bandwidth to
attached devices through a token based protocol. The bus supports hot plugging,
unplugging, and dynamic configuration of the devices. All transactions are initiated by the
host controller.
The LPC2141/42/44/46/48 is equipped with a USB device controller that enables
12 Mbit/s data exchange with a USB host controller. It consists of a register interface,
serial interface engine, endpoint buffer memory and DMA controller. The serial interface
engine decodes the USB data stream and writes data to the appropriate end point buffer
memory. The status of a completed USB transfer or error condition is indicated via status
registers. An interrupt is also generated if enabled.
A DMA controller (available in LPC2146/48 only) can transfer data between an endpoint
buffer and the USB RAM.
6.10.1 Features
• Fully compliant with USB 2.0 Full-speed specification.
• Supports 32 physical (16 logical) endpoints.
• Supports control, bulk, interrupt and isochronous endpoints.
• Scalable realization of endpoints at run time.
• Endpoint maximum packet size selection (up to USB maximum specification) by
software at run time.
• RAM message buffer size based on endpoint realization and maximum packet size.
• Supports SoftConnect and GoodLink LED indicator. These two functions are sharing
one pin.
• Supports bus-powered capability with low suspend current.
• Supports DMA transfer on all non-control endpoints (LPC2146/48 only).
• One duplex DMA channel serves all endpoints (LPC2146/48 only).
• Allows dynamic switching between CPU controlled and DMA modes (only in
LPC2146/48).
• Double buffer implementation for bulk and isochronous endpoints.
6.11 UARTs
The LPC2141/42/44/46/48 each contain two UARTs. In addition to standard transmit and
receive data lines, the LPC2144/46/48 UART1 also provides a full modem control
handshake interface.
Compared to previous LPC2000 microcontrollers, UARTs in LPC2141/42/44/46/48
introduce a fractional baud rate generator for both UARTs, enabling these microcontrollers
to achieve standard baud rates such as 115200 with any crystal frequency above 2 MHz.
In addition, auto-CTS/RTS flow-control functions are fully implemented in hardware
(UART1 in LPC2144/46/48 only).
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6.11.1 Features
• 16 B Receive and Transmit FIFOs.
• Register locations conform to 16C550 industry standard.
• Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B
• Built-in fractional baud rate generator covering wide range of baud rates without a
need for external crystals of particular values.
• Transmission FIFO control enables implementation of software (XON/XOFF) flow
control on both UARTs.
• LPC2144/46/48 UART1 equipped with standard modem interface signals. This
module also provides full support for hardware flow control (auto-CTS/RTS).
6.12 I2C-bus serial I/O controller
The LPC2141/42/44/46/48 each contain two I2C-bus controllers.
The I2C-bus is bidirectional, for inter-IC control using only two wires: a Serial Clock Line
(SCL), and a Serial DAta line (SDA). Each device is recognized by a unique address and
can operate as either a receiver-only device (e.g., an LCD driver or a transmitter with the
capability to both receive and send information (such as memory)). Transmitters and/or
receivers can operate in either master or slave mode, depending on whether the chip has
to initiate a data transfer or is only addressed. The I2C-bus is a multi-master bus, it can be
controlled by more than one bus master connected to it.
The I2C-bus implemented in LPC2141/42/44/46/48 supports bit rates up to 400 kbit/s
(Fast I2C-bus).
6.12.1 Features
• Compliant with standard I2C-bus interface.
• Easy to configure as master, slave, or master/slave.
• Programmable clocks allow versatile rate control.
• Bidirectional data transfer between masters and slaves.
• Multi-master bus (no central master).
• Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus.
• Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus.
• Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer.
• The I2C-bus can be used for test and diagnostic purposes.
6.13 SPI serial I/O controller
The LPC2141/42/44/46/48 each contain one SPI controller. The SPI is a full duplex serial
interface, designed to handle multiple masters and slaves connected to a given bus. Only
a single master and a single slave can communicate on the interface during a given data
transfer. During a data transfer the master always sends a byte of data to the slave, and
the slave always sends a byte of data to the master.
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6.13.1 Features
• Compliant with SPI specification.
• Synchronous, Serial, Full Duplex, Communication.
• Combined SPI master and slave.
• Maximum data bit rate of one eighth of the input clock rate.
6.14 SSP serial I/O controller
The LPC2141/42/44/46/48 each contain one Serial Synchronous Port controller (SSP).
The SSP controller is capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can
interact with multiple masters and slaves on the bus. However, only a single master and a
single slave can communicate on the bus during a given data transfer. The SSP supports
full duplex transfers, with data frames of 4 bits to 16 bits of data flowing from the master to
the slave and from the slave to the master. Often only one of these data flows carries
meaningful data.
6.14.1 Features
• Compatible with Motorola’s SPI, TI’s 4-wire SSI and National Semiconductor’s
Microwire buses.
• Synchronous serial communication.
• Master or slave operation.
• 8-frame FIFOs for both transmit and receive.
• Four bits to 16 bits per frame.
6.15 General purpose timers/external event counters
The Timer/Counter is designed to count cycles of the peripheral clock (PCLK) or an
externally supplied clock and optionally generate interrupts or perform other actions at
specified timer values, based on four match registers. It also includes four capture inputs
to trap the timer value when an input signal transitions, optionally generating an interrupt.
Multiple pins can be selected to perform a single capture or match function, providing an
application with ‘or’ and ‘and’, as well as ‘broadcast’ functions among them.
The LPC2141/42/44/46/48 can count external events on one of the capture inputs if the
minimum external pulse is equal or longer than a period of the PCLK. In this configuration,
unused capture lines can be selected as regular timer capture inputs, or used as external
interrupts.
6.15.1 Features
• A 32-bit timer/counter with a programmable 32-bit prescaler.
• External event counter or timer operation.
• Four 32-bit capture channels per timer/counter that can take a snapshot of the timer
value when an input signal transitions. A capture event may also optionally generate
an interrupt.
• Four 32-bit match registers that allow:
– Continuous operation with optional interrupt generation on match.
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– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Four external outputs per timer/counter corresponding to match registers, with the
following capabilities:
– Set LOW on match.
– Set HIGH on match.
– Toggle on match.
– Do nothing on match.
6.16 Watchdog timer
The purpose of the watchdog is to reset the microcontroller within a reasonable amount of
time if it enters an erroneous state. When enabled, the watchdog will generate a system
reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined
amount of time.
6.16.1 Features
• Internally resets chip if not periodically reloaded.
• Debug mode.
• Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be
disabled.
• Incorrect/Incomplete feed sequence causes reset/interrupt if enabled.
• Flag to indicate watchdog reset.
• Programmable 32-bit timer with internal pre-scaler.
• Selectable time period from (Tcy(PCLK) 256 4) to (Tcy(PCLK) 232 4) in multiples of
Tcy(PCLK) 4.
6.17 Real-time clock
The RTC is designed to provide a set of counters to measure time when normal or idle
operating mode is selected. The RTC has been designed to use little power, making it
suitable for battery powered systems where the CPU is not running continuously (Idle
mode).
6.17.1 Features
• Measures the passage of time to maintain a calendar and clock.
• Ultra-low power design to support battery powered systems.
• Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and
Day of Year.
• Can use either the RTC dedicated 32 kHz oscillator input or clock derived from the
external crystal/oscillator input at XTAL1. Programmable reference clock divider
allows fine adjustment of the RTC.
• Dedicated power supply pin can be connected to a battery or the main 3.3 V.
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NXP Semiconductors LPC2141/42/44/46/48
Single-chip 16-bit/32-bit microcontrollers
6.18 Pulse width modulator
The PWM is based on the standard timer block and inherits all of its features, although
only the PWM function is pinned out on the LPC2141/42/44/46/48. The timer is designed
to count cycles of the peripheral clock (PCLK) and optionally generate interrupts or
perform other actions when specified timer values occur, based on seven match registers.
The PWM function is also based on match register events.
The ability to separately control rising and falling edge locations allows the PWM to be
used for more applications. For instance, multi-phase motor control typically requires
three non-overlapping PWM outputs with individual control of all three pulse widths and
positions.
Two match registers can be used to provide a single edge controlled PWM output. One
match register (MR0) controls the PWM cycle rate, by resetting the count upon match.
The other match register controls the PWM edge position. Additional single edge
controlled PWM outputs require only one match register each, since the repetition rate is
the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a
rising edge at the beginning of each PWM cycle, when an MR0 match occurs.
Three match registers can be used to provide a PWM output with both edges controlled.
Again, the MR0 match register controls the PWM cycle rate. The other match registers
control the two PWM edge positions. Additional double edge controlled PWM outputs
require only two match registers each, since the repetition rate is the same for all PWM
outputs.
With double edge controlled PWM outputs, specific match registers control the rising and
falling edge of the output. This allows both positive going PWM pulses (when the rising
edge occurs prior to the falling edge), and negative going PWM pulses (when the falling
edge occurs prior to the rising edge).
6.18.1 Features
• Seven match registers allow up to six single edge controlled or three double edge
controlled PWM outputs, or a mix of both types.
• The match registers also allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Supports single edge controlled and/or double edge controlled PWM outputs. Single
edge controlled PWM outputs all go HIGH at the beginning of each cycle unless the
output is a constant LOW. Double edge controlled PWM outputs can have either edge
occur at any position within a cycle. This allows for both positive going and negative
going pulses.
• Pulse period and width can be any number of timer counts. This allows complete
flexibility in the trade-off between resolution and repetition rate. All PWM outputs will
occur at the same repetition rate.
• Double edge controlled PWM outputs can be programmed to be either positive going
or negative going pulses.
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Product data sheet Rev. 5 — 12 August 2011 22 of 45
NXP Semiconductors LPC2141/42/44/46/48
Single-chip 16-bit/32-bit microcontrollers
• Match register updates are synchronized with pulse outputs to prevent generation of
erroneous pulses. Software must ‘release’ new match values before they can become
effective.
• May be used as a standard timer if the PWM mode is not enabled.
• A 32-bit Timer/Counter with a programmable 32-bit Prescaler.
6.19 System control
6.19.1 Crystal oscillator
On-chip integrated oscillator operates with external crystal in range of 1 MHz to 25 MHz.
The oscillator output frequency is called fosc and the ARM processor clock frequency is
referred to as CCLK for purposes of rate equations, etc. fosc and CCLK are the same
value unless the PLL is running and connected. Refer to Section 6.19.2 “PLL” for
additional information.
6.19.2 PLL
The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input
frequency is multiplied up into the range of 10 MHz to 60 MHz with a Current Controlled
Oscillator (CCO). The multiplier can be an integer value from 1 to 32 (in practice, the
multiplier value cannot be higher than 6 on this family of microcontrollers due to the upper
frequency limit of the CPU). The CCO operates in the range of 156 MHz to 320 MHz, so
there is an additional divider in the loop to keep the CCO within its frequency range while
the PLL is providing the desired output frequency. The output divider may be set to divide
by 2, 4, 8, or 16 to produce the output clock. Since the minimum output divider value is 2,
it is insured that the PLL output has a 50 % duty cycle. The PLL is turned off and
bypassed following a chip reset and may be enabled by software. The program must
configure and activate the PLL, wait for the PLL to Lock, then connect to the PLL as a
clock source. The PLL settling time is 100 s.
6.19.3 Reset and wake-up timer
Reset has two sources on the LPC2141/42/44/46/48: the RESET pin and watchdog reset.
The RESET pin is a Schmitt trigger input pin with an additional glitch filter. Assertion of
chip reset by any source starts the Wake-up Timer (see Wake-up Timer description
below), causing the internal chip reset to remain asserted until the external reset is
de-asserted, the oscillator is running, a fixed number of clocks have passed, and the
on-chip flash controller has completed its initialization.
When the internal reset is removed, the processor begins executing at address 0, which is
the reset vector. At that point, all of the processor and peripheral registers have been
initialized to predetermined values.
The Wake-up Timer ensures that the oscillator and other analog functions required for
chip operation are fully functional before the processor is allowed to execute instructions.
This is important at power on, all types of reset, and whenever any of the aforementioned
functions are turned off for any reason. Since the oscillator and other functions are turned
off during Power-down mode, any wake-up of the processor from Power-down mode
makes use of the Wake-up Timer.
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NXP Semiconductors LPC2141/42/44/46/48
Single-chip 16-bit/32-bit microcontrollers
The Wake-up Timer monitors the crystal oscillator as the means of checking whether it is
safe to begin code execution. When power is applied to the chip, or some event caused
the chip to exit Power-down mode, some time is required for the oscillator to produce a
signal of sufficient amplitude to drive the clock logic. The amount of time depends on
many factors, including the rate of VDD ramp (in the case of power on), the type of crystal
and its electrical characteristics (if a quartz crystal is used), as well as any other external
circuitry (e.g. capacitors), and the characteristics of the oscillator itself under the existing
ambient conditions.
6.19.4 Brownout detector
The LPC2141/42/44/46/48 include 2-stage monitoring of the voltage on the VDD pins. If
this voltage falls below 2.9 V, the BOD asserts an interrupt signal to the VIC. This signal
can be enabled for interrupt; if not, software can monitor the signal by reading dedicated
register.
The second stage of low voltage detection asserts reset to inactivate the
LPC2141/42/44/46/48 when the voltage on the VDD pins falls below 2.6 V. This reset
prevents alteration of the flash as operation of the various elements of the chip would
otherwise become unreliable due to low voltage. The BOD circuit maintains this reset
down below 1 V, at which point the POR circuitry maintains the overall reset.
Both the 2.9 V and 2.6 V thresholds include some hysteresis. In normal operation, this
hysteresis allows the 2.9 V detection to reliably interrupt, or a regularly-executed event
loop to sense the condition.
6.19.5 Code security
This feature of the LPC2141/42/44/46/48 allow an application to control whether it can be
debugged or protected from observation.
If after reset on-chip boot loader detects a valid checksum in flash and reads 0x8765 4321
from address 0x1FC in flash, debugging will be disabled and thus the code in flash will be
protected from observation. Once debugging is disabled, it can be enabled only by
performing a full chip erase using the ISP.
6.19.6 External interrupt inputs
The LPC2141/42/44/46/48 include up to nine edge or level sensitive External Interrupt
Inputs as selectable pin functions. When the pins are combined, external events can be
processed as four independent interrupt signals. The External Interrupt Inputs can
optionally be used to wake-up the processor from Power-down mode.
Additionally capture input pins can also be used as external interrupts without the option
to wake the device up from Power-down mode.
6.19.7 Memory mapping control
The Memory Mapping Control alters the mapping of the interrupt vectors that appear
beginning at address 0x0000 0000. Vectors may be mapped to the bottom of the on-chip
flash memory, or to the on-chip static RAM. This allows code running in different memory
spaces to have control of the interrupts.
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NXP Semiconductors LPC2141/42/44/46/48
Single-chip 16-bit/32-bit microcontrollers
6.19.8 Power control
The LPC2141/42/44/46/48 supports two reduced power modes: Idle mode and
Power-down mode.
In Idle mode, execution of instructions is suspended until either a reset or interrupt occurs.
Peripheral functions continue operation during Idle mode and may generate interrupts to
cause the processor to resume execution. Idle mode eliminates power used by the
processor itself, memory systems and related controllers, and internal buses.
In Power-down mode, the oscillator is shut down and the chip receives no internal clocks.
The processor state and registers, peripheral registers, and internal SRAM values are
preserved throughout Power-down mode and the logic levels of chip output pins remain
static. The Power-down mode can be terminated and normal operation resumed by either
a reset or certain specific interrupts that are able to function without clocks. Since all
dynamic operation of the chip is suspended, Power-down mode reduces chip power
consumption to nearly zero.
Selecting an external 32 kHz clock instead of the PCLK as a clock-source for the on-chip
RTC will enable the microcontroller to have the RTC active during Power-down mode.
Power-down current is increased with RTC active. However, it is significantly lower than in
Idle mode.
A Power Control for Peripherals feature allows individual peripherals to be turned off if
they are not needed in the application, resulting in additional power savings during active
and Idle mode.
6.19.9 APB bus
The APB divider determines the relationship between the processor clock (CCLK) and the
clock used by peripheral devices (PCLK). The APB divider serves two purposes. The first
is to provide peripherals with the desired PCLK via APB bus so that they can operate at
the speed chosen for the ARM processor. In order to achieve this, the APB bus may be
slowed down to 12 to 14 of the processor clock rate. Because the APB bus must work
properly at power-up (and its timing cannot be altered if it does not work since the APB
divider control registers reside on the APB bus), the default condition at reset is for the
APB bus to run at 14 of the processor clock rate. The second purpose of the APB divider
is to allow power savings when an application does not require any peripherals to run at
the full processor rate. Because the APB divider is connected to the PLL output, the PLL
remains active (if it was running) during Idle mode.
6.20 Emulation and debugging
The LPC2141/42/44/46/48 support emulation and debugging via a JTAG serial port. A
trace port allows tracing program execution. Debugging and trace functions are
multiplexed only with GPIOs on Port 1. This means that all communication, timer and
interface peripherals residing on Port 0 are available during the development and
debugging phase as they are when the application is run in the embedded system itself.
6.20.1 EmbeddedICE
Standard ARM EmbeddedICE logic provides on-chip debug support. The debugging of
the target system requires a host computer running the debugger software and an
EmbeddedICE protocol convertor. EmbeddedICE protocol convertor converts the remote
debug protocol commands to the JTAG data needed to access the ARM core.
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NXP Semiconductors LPC2141/42/44/46/48
Single-chip 16-bit/32-bit microcontrollers
The ARM core has a Debug Communication Channel (DCC) function built-in. The DCC
allows a program running on the target to communicate with the host debugger or another
separate host without stopping the program flow or even entering the debug state. The
DCC is accessed as a co-processor 14 by the program running on the ARM7TDMI-S
core. The DCC allows the JTAG port to be used for sending and receiving data without
affecting the normal program flow. The DCC data and control registers are mapped in to
addresses in the EmbeddedICE logic.
This clock must be slower than 16 of the CPU clock (CCLK) for the JTAG interface to
operate.
6.20.2 Embedded trace
Since the LPC2141/42/44/46/48 have significant amounts of on-chip memory, it is not
possible to determine how the processor core is operating simply by observing the
external pins. The Embedded Trace Macrocell (ETM) provides real-time trace capability
for deeply embedded processor cores. It outputs information about processor execution to
the trace port.
The ETM is connected directly to the ARM core and not to the main AMBA system bus. It
compresses the trace information and exports it through a narrow trace port. An external
trace port analyzer must capture the trace information under software debugger control.
Instruction trace (or PC trace) shows the flow of execution of the processor and provides a
list of all the instructions that were executed. Instruction trace is significantly compressed
by only broadcasting branch addresses as well as a set of status signals that indicate the
pipeline status on a cycle by cycle basis. Trace information generation can be controlled
by selecting the trigger resource. Trigger resources include address comparators,
counters and sequencers. Since trace information is compressed the software debugger
requires a static image of the code being executed. Self-modifying code can not be traced
because of this restriction.
6.20.3 RealMonitor
RealMonitor is a configurable software module, developed by ARM Inc., which enables
real-time debug. It is a lightweight debug monitor that runs in the background while users
debug their foreground application. It communicates with the host using the DCC, which is
present in the EmbeddedICE logic. The LPC2141/42/44/46/48 contain a specific
configuration of RealMonitor software programmed into the on-chip flash memory.
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Product data sheet Rev. 5 — 12 August 2011 26 of 45
NXP Semiconductors LPC2141/42/44/46/48
Single-chip 16-bit/32-bit microcontrollers
7. Limiting values
[1] The following applies to the Limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[2] Including voltage on outputs in 3-state mode.
[3] Not to exceed 4.6 V.
[4] The peak current is limited to 25 times the corresponding maximum current.
[5] Dependent on package type.
[6] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol Parameter Conditions Min Max Unit
VDD supply voltage (core and external rail) 0.5 +3.6 V
VDDA analog 3.3 V pad supply voltage 0.5 +4.6 V
Vi(VBAT) input voltage on pin VBAT for the RTC 0.5 +4.6 V
Vi(VREF) input voltage on pin VREF 0.5 +4.6 V
VIA analog input voltage on ADC related
pins
0.5 +5.1 V
VI input voltage 5 V tolerant I/O
pins; only valid
when the VDD
supply voltage is
present
[2] 0.5 +6.0 V
other I/O pins [2][3] 0.5 VDD + 0.5 V
IDD supply current per supply pin [4] - 100 mA
ISS ground current per ground pin [4] - 100 mA
Isink sink current for I2C-bus; DC;
T = 85 C
- 20 mA
Tstg storage temperature [5] 65 +150 C
Ptot(pack) total power dissipation (per package) based on package
heat transfer, not
device power
consumption
- 1.5 W
Vesd electrostatic discharge voltage human body model [6]
all pins 4000 +4000 V
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Single-chip 16-bit/32-bit microcontrollers
8. Static characteristics
Table 5. Static characteristics
Tamb = 40 C to +85 C for commercial applications, unless otherwise specified.
Symbol Parameter Conditions Min Typ[1] Max Unit
VDD supply voltage [2] 3.0 3.3 3.6 V
VDDA analog supply voltage 3.3 V pad 3.0 3.3 3.6 V
Vi(VBAT) input voltage on pin
VBAT
[3] 2.0 3.3 3.6 V
Vi(VREF) input voltage on pin
VREF
2.5 3.3 VDDA V
Standard port pins, RESET, P1.26/RTCK
IIL LOW-level input current VI = 0 V; no pull-up - - 3 A
IIH HIGH-level input current VI = VDD; no pull-down - - 3 A
IOZ OFF-state output
current
VO = 0 V; VO = VDD; no
pull-up/down
--3 A
Ilatch I/O latch-up current (0.5VDD) < VI < (1.5VDD);
Tj
< 125 C
- - 100 mA
VI input voltage pin configured to provide a
digital function
[4][5][6]
[7]
0- 5.5 V
VO output voltage output active 0 - VDD V
VIH HIGH-level input voltage 2.0 - - V
VIL LOW-level input voltage - - 0.8 V
Vhys hysteresis voltage 0.4 - - V
VOH HIGH-level output
voltage
IOH = 4 mA [8] VDD 0.4 - - V
VOL LOW-level output
voltage
IOL = 4 mA [8] --0.4 V
IOH HIGH-level output
current
VOH = VDD 0.4 V [8] 4 - - mA
IOL LOW-level output
current
VOL = 0.4 V [8] 4- - mA
IOHS HIGH-level short-circuit
output current
VOH =0V [9] - - 45 mA
IOLS LOW-level short-circuit
output current
VOL = VDDA [9] --50 mA
Ipd pull-down current VI =5V [10] 10 50 150 A
Ipu pull-up current VI =0V [11] 15 50 85 A
VDD < VI <5V [10] 000 A
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Single-chip 16-bit/32-bit microcontrollers
IDD(act) active mode supply
current
VDD = 3.3 V; Tamb = 25 C;
code
while(1){}
executed from flash, no active
peripherals
CCLK = 10 MHz
- 15 50
mA
CCLK = 60 MHz - 40 70 mA
VDD = 3.3 V; Tamb = 25 C;
code executed from flash; USB
enabled and active; all other
peripherals disabled
CCLK = 12 MHz
- 27 70
mA
CCLK = 60 MHz - 57 90 mA
IDD(pd) Power-down mode
supply current
VDD = 3.3 V; Tamb = 25 C - 40 100 A
VDD = 3.3 V; Tamb = 85 C -250 500 A
IBATpd Power-down mode
battery supply current
RTC clock = 32 kHz
(from RTCXn pins);
Tamb = 25 C
VDD = 3.0 V; Vi(VBAT) = 2.5 V
[12] - 15 30
A
VDD = 3.0 V; Vi(VBAT) = 3.0 V - 20 40 A
IBATact active mode battery
supply current
CCLK = 60 MHz;
PCLK = 15 MHz;
PCLK enabled to RTCK;
RTC clock = 32 kHz
(from RTCXn pins);
Tamb = 25 C
VDD = 3.0 V; Vi(VBAT) = 3.0 V
[12] - 78 -
A
IBATact(opt) optimized active mode
battery supply current
PCLK disabled to RTCK in the
PCONP register;
RTC clock = 32 kHz
(from RTCXn pins);
Tamb = 25 C; Vi(VBAT) = 3.3 V
CCLK = 25 MHz
[12][13] - 23 -
A
CCLK = 60 MHz - 30 - A
I
2C-bus pins
VIH HIGH-level input voltage 0.7VDD --V
VIL LOW-level input voltage - - 0.3VDD V
Vhys hysteresis voltage - 0.05VDD - V
VOL LOW-level output
voltage
IOLS = 3 mA [8] --0.4 V
ILI input leakage current VI = VDD [14] - 24 A
VI = 5 V - 10 22 A
Oscillator pins
Vi(XTAL1) input voltage on pin
XTAL1
0.5 1.8 1.95 V
Table 5. Static characteristics …continued
Tamb = 40 C to +85 C for commercial applications, unless otherwise specified.
Symbol Parameter Conditions Min Typ[1] Max Unit
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Single-chip 16-bit/32-bit microcontrollers
[1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
[2] Core and external rail.
[3] The RTC typically fails when Vi(VBAT) drops below 1.6 V.
[4] Including voltage on outputs in 3-state mode.
[5] VDD supply voltages must be present.
[6] 3-state outputs go into 3-state mode when VDD is grounded.
[7] Please also see the errata note mentioned in errata sheet.
[8] Accounts for 100 mV voltage drop in all supply lines.
[9] Allowed as long as the current limit does not exceed the maximum current allowed by the device.
[10] Minimum condition for VI = 4.5 V, maximum condition for VI = 5.5 V.
[11] Applies to P1.16 to P1.31.
[12] On pin VBAT.
[13] Optimized for low battery consumption.
[14] To VSS.
[15] Includes external resistors of 33 ± 1 % on D+ and D.
Vo(XTAL2) output voltage on pin
XTAL2
0.5 1.8 1.95 V
Vi(RTCX1) input voltage on pin
RTCX1
0.5 1.8 1.95 V
Vo(RTCX2) output voltage on pin
RTCX2
0.5 1.8 1.95 V
USB pins
IOZ OFF-state output
current
0V 85 C [12] 15 50 100 A
VDD(3V3) < VI <5V [11] 00 0 A
I
2C-bus pins (P0[27] and P0[28])
VIH HIGH-level input
voltage
0.7VDD(3V3) - -V
VIL LOW-level input voltage - - 0.3VDD(3V3) V
Vhys hysteresis voltage - 0.05VDD(3V3) - V
VOL LOW-level output
voltage
IOLS = 3 mA [9] -- 0.4 V
ILI input leakage current VI = VDD(3V3) [13] -2 4 A
VI = 5 V - 10 22 A
Oscillator pins
Vi(XTAL1) input voltage on pin
XTAL1
0.5 1.8 1.95 V
Vo(XTAL2) output voltage on pin
XTAL2
0.5 1.8 1.95 V
Vi(RTCX1) input voltage on pin
RTCX1
0.5 1.8 1.95 V
Vo(RTCX2) output voltage on pin
RTCX2
0.5 1.8 1.95 V
Table 8. Static characteristics …continued
Tamb = 40 C to +85 C for standard devices, 40 C to +125 C for LPC2364HBD only, unless otherwise specified.
Symbol Parameter Conditions Min Typ[1] Max Unit
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NXP Semiconductors LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
[1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
[2] The RTC typically fails when Vi(VBAT) drops below 1.6 V.
[3] VDD(DCDC)(3V3) = 3.3 V; VDD(3V3) = 3.3 V; Vi(VBAT) = 3.3 V; Tamb = 25 C.
[4] On pin VBAT.
[5] Including voltage on outputs in 3-state mode.
[6] VDD(3V3) supply voltages must be present.
[7] 3-state outputs go into 3-state mode when VDD(3V3) is grounded.
[8] Please also see the errata note in errata sheet.
[9] Accounts for 100 mV voltage drop in all supply lines.
[10] Allowed as long as the current limit does not exceed the maximum current allowed by the device.
[11] Minimum condition for VI = 4.5 V, maximum condition for VI = 5.5 V.
[12] LPC2364HBD only.
[13] To VSS.
[14] Includes external resistors of 33 1 % on D+ and D.
USB pins (LPC2364/66/68 only)
IOZ OFF-state output
current
0V 85 C [3] 1 -60 MHz
IRC; 40 C to +85 C 3.96 4 4.04 MHz
IRC; > 85 C [3] 3.98 4.02 4.06 MHz
External clock
fosc oscillator frequency 1 - 25 MHz
Tcy(clk) clock cycle time 40 - 1000 ns
tCHCX clock HIGH time Tcy(clk) 0.4 - - ns
tCLCX clock LOW time Tcy(clk) 0.4 - - ns
tCLCH clock rise time - - 5 ns
tCHCL clock fall time - - 5 ns
I
2C-bus pins (P0[27] and P0[28])
tf(o) output fall time VIH to VIL 20 + 0.1 Cb
[4] - - ns
SSP interface
tsu(SPI_MISO) SPI_MISO set-up time Tamb = 25 C; measured
in SPI Master mode; see
Figure 15
- 11- ns
Fig 13. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)
tCHCL tCLCX
tCHCX
Tcy(clk)
tCLCH
002aaa907
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Single-chip 16-bit/32-bit microcontrollers
11.1 Internal oscillators
[1] Parameters are valid over operating temperature range unless otherwise specified.
[2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
11.2 I/O pins
[1] Applies to standard I/O pins and RESET pin.
11.3 USB interface
[1] Characterized but not implemented as production test. Guaranteed by design.
Table 10. Dynamic characteristic: internal oscillators
Tamb = 40 C to +85 C; 3.0 V VDD(3V3) 3.6 V.[1]
Symbol Parameter Conditions Min Typ[2] Max Unit
fosc(RC) internal RC oscillator frequency - 3.96 4.02 4.04 MHz
fi(RTC) RTC input frequency - - 32.768 - kHz
Table 11. Dynamic characteristic: I/O pins[1]
Tamb = 40 C to +85 C; VDD(3V3) over specified ranges.
Symbol Parameter Conditions Min Typ Max Unit
tr rise time pin configured as output 3.0 - 5.0 ns
tf fall time pin configured as output 2.5 - 5.0 ns
Table 12. Dynamic characteristics of USB pins (full-speed) (LPC2364/66/68 only)
CL = 50 pF; Rpu = 1.5 k on D+ to VDD(3V3), unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
tr rise time 10 % to 90 % 8.5 - 13.8 ns
tf fall time 10 % to 90 % 7.7 - 13.7 ns
tFRFM differential rise and fall time
matching
tr / tf - -109 %
VCRS output signal crossover voltage 1.3 - 2.0 V
tFEOPT source SE0 interval of EOP see Figure 14 160 - 175 ns
tFDEOP source jitter for differential transition
to SE0 transition
see Figure 14 2 - +5 ns
tJR1 receiver jitter to next transition 18.5 - +18.5 ns
tJR2 receiver jitter for paired transitions 10 % to 90 % 9 - +9 ns
tEOPR1 EOP width at receiver must reject as
EOP; see
Figure 14
[1] 40 - - ns
tEOPR2 EOP width at receiver must accept as
EOP; see
Figure 14
[1] 82 - - ns
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11.4 Flash memory
[1] Number of program/erase cycles.
[2] Programming times are given for writing 256 bytes from RAM to the flash. Data must be written to the flash in blocks of 256 bytes.
Table 13. Dynamic characteristics of flash
Tamb = 40 C to +85 C for standard devices, 40 C to +125 C for LPC2364HBD only, unless otherwise specified;
VDD(3V3) = 3.0 V to 3.6 V; all voltages are measured with respect to ground.
Symbol Parameter Conditions Min Typ Max Unit
Nendu endurance [1] 10000 100000 - cycles
tret retention time powered; 100 cycles 10 - - years
unpowered; 100 cycles 20 - - years
ter erase time sector or multiple
consecutive sectors
95 100 105 ms
tprog programming time [2] 0.95 1 1.05 ms
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11.5 Timing
Fig 14. Differential data-to-EOP transition skew and EOP width
002aab561
TPERIOD
differential
data lines
crossover point
source EOP width: tFEOPT
receiver EOP width: tEOPR1, tEOPR2
crossover point
extended
differential data to
SE0/EOP skew
n × TPERIOD + tFDEOP
Fig 15. MISO line set-up time in SSP Master mode
tsu(SPI_MISO)
SCK
shifting edges
MOSI
MISO
002aad326
sampling edges
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12. ADC electrical characteristics
[1] Conditions: VSSA = 0 V, VDDA = 3.3 V.
[2] The ADC is monotonic, there are no missing codes.
[3] The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 16.
[4] The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after
appropriate adjustment of gain and offset errors. See Figure 16.
[5] The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the
ideal curve. See Figure 16.
[6] The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset
error, and the straight line which fits the ideal transfer curve. See Figure 16.
[7] The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated
ADC and the ideal transfer curve. See Figure 16.
[8] See Figure 17.
Table 14. ADC characteristics
VDDA = 2.5 V to 3.6 V; Tamb = 40 C to +85 C, unless otherwise specified; ADC frequency 4.5 MHz.
Symbol Parameter Conditions Min Typ Max Unit
VIA analog input voltage 0 - VDDA V
Cia analog input capacitance - - 1 pF
ED differential linearity error [1][2][3] - - 1 LSB
EL(adj) integral non-linearity [1][4] - - 2 LSB
EO offset error [1][5] - - 3 LSB
EG gain error [1][6] - - 0.5 %
ET absolute error [1][7] - - 4 LSB
Rvsi voltage source interface
resistance
[8] --40 k
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(1) Example of an actual transfer curve.
(2) The ideal transfer curve.
(3) Differential linearity error (ED).
(4) Integral non-linearity (EL(adj)).
(5) Center of a step of the actual transfer curve.
Fig 16. ADC characteristics
1023
1022
1021
1020
1019
(2)
(1)
123456 7 1018 1019 1020 1021 1022 1023 1024
7
6
5
4
3
2
1
0
1018
(5)
(4)
(3)
1 LSB
(ideal)
code
out
offset
error
EO
gain
error
EG
offset error
EO
VIA (LSBideal)
002aae604
Vi(VREF) − VSSA
1024
1 LSB =
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Fig 17. Suggested ADC interface - LPC2364/65/66/67/68 AD0[y] pin
LPC23XX
AD0[y]SAMPLE
AD0[y] 20 kΩ
3 pF 5 pF
Rvsi
VSS
VEXT
002aac610
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13. DAC electrical characteristics
14. Application information
14.1 Suggested USB interface solutions (LPC2364/66/68 only)
Table 15. DAC electrical characteristics
VDDA = 3.0 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified
Symbol Parameter Conditions Min Typ Max Unit
ED differential linearity error - 1 - LSB
EL(adj) integral non-linearity - 1.5 - LSB
EO offset error - 0.6 - %
EG gain error - 0.6 - %
CL load capacitance - 200 - pF
RL load resistance 1 - - k
Fig 18. LPC2364/66/68 USB interface on a self-powered device
LPC23XX
USB-B
connector
USB_D+
USB_CONNECT
SoftConnect switch
USB_D−
VBUS
VSS
VDD(3V3)
R1
1.5 kΩ
RS = 33 Ω
002aac578
RS = 33 Ω
USB_UP_LED
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14.2 Crystal oscillator XTAL input and component selection
The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a
clock in slave mode, it is recommended that the input be coupled through a capacitor with
Ci
= 100 pF. To limit the input voltage to the specified range, choose an additional
capacitor to ground Cg which attenuates the input voltage by a factor Ci
/ (Ci
+ Cg). In
slave mode, a minimum of 200 mV (RMS) is needed.
In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF
(Figure 20), with an amplitude between 200 mV (RMS) and 1000 mV (RMS). This
corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V.
The XTAL2 pin in this configuration can be left unconnected.
External components and models used in oscillation mode are shown in Figure 21 and in
Table 16 and Table 17. Since the feedback resistance is integrated on chip, only a crystal
and the capacitances CX1 and CX2 need to be connected externally in case of
fundamental mode oscillation (the fundamental frequency is represented by L, CL and
RS). Capacitance CP in Figure 21 represents the parallel package capacitance and should
not be larger than 7 pF. Parameters FOSC, CL, RS and CP are supplied by the crystal
manufacturer.
Fig 19. LPC2364/66/68 USB interface on a bus-powered device
LPC23XX
VDD(3V3)
R1
1.5 kΩ
R2
USB_UP_LED
002aac579
USB-B
connector USB_D+
USB_D−
VBUS
VSS
RS = 33 Ω
RS = 33 Ω
Fig 20. Slave mode operation of the on-chip oscillator
LPC2xxx
XTAL1
Ci
100 pF
Cg
002aae718
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Fig 21. Oscillator modes and models: oscillation mode of operation and external crystal
model used for CX1/CX2 evaluation
Table 16. Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters): low frequency mode
Fundamental oscillation
frequency FOSC
Crystal load
capacitance CL
Maximum crystal
series resistance RS
External load
capacitors CX1/CX2
1 MHz to 5 MHz 10 pF < 300 18 pF, 18 pF
20 pF < 300 39 pF, 39 pF
30 pF < 300 57 pF, 57 pF
5 MHz to 10 MHz 10 pF < 300 18 pF, 18 pF
20 pF < 200 39 pF, 39 pF
30 pF < 100 57 pF, 57 pF
10 MHz to 15 MHz 10 pF < 160 18 pF, 18 pF
20 pF < 60 39 pF, 39 pF
15 MHz to 20 MHz 10 pF < 80 18 pF, 18 pF
Table 17. Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters): high frequency mode
Fundamental oscillation
frequency FOSC
Crystal load
capacitance CL
Maximum crystal
series resistance RS
External load
capacitors CX1, CX2
15 MHz to 20 MHz 10 pF < 180 18 pF, 18 pF
20 pF < 100 39 pF, 39 pF
20 MHz to 25 MHz 10 pF < 160 18 pF, 18 pF
20 pF < 80 39 pF, 39 pF
002aag469
LPC2xxx
XTAL1 XTAL2
CX1 CX2
XTAL
= CL CP
RS
L
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14.3 RTC 32 kHz oscillator component selection
The RTC external oscillator circuit is shown in Figure 22. Since the feedback resistance is
integrated on chip, only a crystal, the capacitances CX1 and CX2 need to be connected
externally to the microcontroller.
Table 18 gives the crystal parameters that should be used. CL is the typical load
capacitance of the crystal and is usually specified by the crystal manufacturer. The actual
CL influences oscillation frequency. When using a crystal that is manufactured for a
different load capacitance, the circuit will oscillate at a slightly different frequency
(depending on the quality of the crystal) compared to the specified one. Therefore for an
accurate time reference it is advised to use the load capacitors as specified in Table 18
that belong to a specific CL. The value of external capacitances CX1 and CX2 specified in
this table are calculated from the internal parasitic capacitances and the CL. Parasitics
from PCB and package are not taken into account.
14.4 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of Cx1 and Cx2 should be chosen smaller
accordingly to the increase in parasitics of the PCB layout.
Fig 22. RTC oscillator modes and models: oscillation mode of operation and external
crystal model used for CX1/CX2 evaluation
Table 18. Recommended values for the RTC external 32 kHz oscillator CX1/CX2 components
Crystal load capacitance
CL
Maximum crystal series
resistance RS
External load capacitors CX1/CX2
11 pF < 100 k 18 pF, 18 pF
13 pF < 100 k 22 pF, 22 pF
15 pF < 100 k 27 pF, 27 pF
002aaf495
LPC2xxx
RTCX1 RTCX2
CX1 CX2
32 kHz XTAL
= CL CP
RS
L
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14.5 Standard I/O pin configuration
Figure 23 shows the possible pin modes for standard I/O pins with analog input function:
• Digital output driver
• Digital input: Pull-up enabled/disabled
• Digital input: Pull-down enabled/disabled
• Analog input (for ADC input channels)
The default configuration for standard I/O pins is input with pull-up enabled. The weak
MOS devices provide a drive capability equivalent to pull-up and pull-down resistors.
Fig 23. Standard I/O pin configuration with analog input
PIN
VDD
ESD
VSS
ESD
VDD
weak
pull-up
weak
pull-down
output enable
output
pull-up enable
pull-down enable
data input
analog input
select analog input
002aaf496
pin configured
as digital output
driver
pin configured
as digital input
pin configured
as analog input
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14.6 Reset pin configuration
Fig 24. Reset pin configuration
VSS
reset
002aaf274
VDD
VDD
VDD
Rpu ESD
ESD
20 ns RC
GLITCH FILTER PIN
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Single-chip 16-bit/32-bit microcontrollers
15. Package outline
Fig 25. Package outline SOT407-1 (LQFP100)
UNIT
A
max. A1 A2 A3 bp c E(1) e HE L Lp ywv Z θ
OUTLINE REFERENCES
VERSION
EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 1.6 0.15
0.05
1.45
1.35 0.25 0.27
0.17
0.20
0.09
14.1
13.9 0.5 16.25
15.75
1.15
0.85
7
0
o
1 0.2 0.08 0.08 o
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT407-1 136E20 MS-026 00-02-01
03-02-20
D(1) (1)(1)
14.1
13.9
HD
16.25
15.75
Z E
1.15
0.85
D
bp
e
θ
E
A1
A
Lp
detail X
L
(A ) 3
B
25
c
DH
bp
EH A2
v M B
D
ZD
A
ZE
e
v M A
X
1
100
76
75 51
50
26
y
pin 1 index
w M
w M
0 5 10 mm
scale
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1
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Single-chip 16-bit/32-bit microcontrollers
Fig 26. Package outline SOT926-1 (TFBGA100)
OUTLINE REFERENCES
VERSION
EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOT926-1 - - - - - - - - -
SOT926-1
05-12-09
05-12-22
UNIT A
max
mm 1.2 0.4
0.3
0.8
0.65
0.5
0.4
9.1
8.9
9.1
8.9
A1
DIMENSIONS (mm are the original dimensions)
TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
A2 b D E e2
7.2
e
0.8
e1
7.2
v
0.15
w
0.05
y
0.08
y1
0.1
0 2.5 5 mm
scale
b
e2
e1
e
e
1/2 e
1/2 e
∅ v M AC B
∅ w M C
ball A1
index area
A
B
C
D
E
F
H
K
G
J
13579 2 4 6 8 10
ball A1
index area
B A
E
D
C
y1 C y
X
detail X
A
A1
A2
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16. Abbreviations
Table 19. Abbreviations
Acronym Description
ADC Analog-to-Digital Converter
AHB Advanced High-performance Bus
AMBA Advanced Microcontroller Bus Architecture
APB Advanced Peripheral Bus
BOD BrownOut Detection
CAN Controller Area Network
DAC Digital-to-Analog Converter
DCC Debug Communication Channel
DMA Direct Memory Access
DSP Digital Signal Processing
EOP End Of Packet
ETM Embedded Trace Macrocell
GPIO General Purpose Input/Output
IrDA Infrared Data Association
JTAG Joint Test Action Group
MII Media Independent Interface
MIIM Media Independent Interface Management
PHY Physical Layer
PLL Phase-Locked Loop
PWM Pulse Width Modulator
RMII Reduced Media Independent Interface
SE0 Single Ended Zero
SPI Serial Peripheral Interface
SSI Serial Synchronous Interface
SSP Synchronous Serial Port
TTL Transistor-Transistor Logic
UART Universal Asynchronous Receiver/Transmitter
USB Universal Serial Bus
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17. Revision history
Table 20. Revision history
Document ID Release date Data sheet status Change
notice
Supersedes
LPC2364_65_66_67_68 v.7.1 20131016 Product data sheet - LPC2364_65_66_67_68 v.7
Modifications: • Table 4 “Pin description”, Table note 6: Changed glitch filter spec from 5 ns to 10 ns.
• Table 9 “Dynamic characteristics”: Changed min clock cycle time from 42 to 40.
LPC2364_65_66_67_68 v.7 20111020 Product data sheet - LPC2364_65_66_67_68 v.6
Modifications: • Table 13 “Dynamic characteristics of flash”: Added characteristics for ter and tprog.
• Table 4 “Pin description”: Updated description for USB_UP_LED.
• Table 4 “Pin description”: Added Table note 12 “If the RTC is not used, these pins can
be left floating.” for RTCX1 and RTCX2 pins.
• Table 4 “Pin description”: Added Table note 8 “This pin has a built-in pull-up resistor.”
for DBGEN, TMS, TDI, TRST, and RTCK pins.
• Table 4 “Pin description”: Added Table note 7 “This pin has no built-in pull-up and no
built-in pull-down resistor.” for TCK and TDO pins.
• Table 5 “Limiting values”: Added “non-operating” to conditions column of Tstg.
• Table 5 “Limiting values”: Updated Table note 5 “The maximum non-operating
storage temperature is different than the temperature for required shelf life which
should be determined based on required shelf lifetime. Please refer to the JEDEC
spec (J-STD-033B.1) for further details.”.
• Table 5 “Limiting values”: Updated storage temperature min/max to 65/+150.
• Added Table 7 “Thermal resistance value (C/W): ±15 %”.
• Added Table 10 “Dynamic characteristic: internal oscillators”.
• Added Table 11 “Dynamic characteristic: I/O pins[1]”.
• Table 8 “Static characteristics”: Changed Vhys typ value from 0.5VDD(3V3) to
0.05VDD(3V3).
• Table 13 “Dynamic characteristics of flash”: Updated table.
• Added Section 9 “Thermal characteristics”.
• Added Section 10.3 “Electrical pin characteristics”.
• Added Section 14.2 “Crystal oscillator XTAL input and component selection”.
• Added Section 14.3 “RTC 32 kHz oscillator component selection”.
• Added Section 14.4 “XTAL and RTCX Printed Circuit Board (PCB) layout guidelines”.
• Added Section 14.5 “Standard I/O pin configuration”.
• Added Section 14.6 “Reset pin configuration”.
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LPC2364_65_66_67_68 v.6 20100201 Product data sheet - LPC2364_65_66_67_68 v.5
Modifications: • Table 5 “Limiting values”: Changed VESD min/max to 2500/+2500.
• Table 6: Updated min, typical and max values for oscillator pins.
• Table 6: Updated conditions and typical values for IDD(DCDC)pd(3V3), IBATact;
IDD(DCDC)dpd(3V3) and IBAT added.
• Table 9 “Dynamic characteristics of flash”: Changed flash endurance spec from
100000 to 10000 minimum cycles.
• Added Table 11 “DAC electrical characteristics”.
• Section 7.2 “On-chip flash programming memory”: Removed text regarding flash
endurance minimum specs.
• Added Section 7.24.4.4 “Deep power-down mode”.
• Section 7.25.2 “Brownout detection”: Changed VDD(3V3) to VDD(DCDC)(3V3).
• Added Section 9.2 “Deep power-down mode”.
• Added Section 13.2 “XTAL1 input”.
• Added Section 13.3 “XTAL and RTC Printed-Circuit Board (PCB) layout guidelines”.
• Added table note for XTAL1 and XTAL2 pins in Table 3.
LPC2364_65_66_67_68 v.5 20090409 Product data sheet - LPC2364_65_66_67_68 v.4
Modifications: • Added part LPC2364HBD100.
• Section 7.2: Added sentence clarifying SRAM speeds for LPC2364HBD.
• Table 5: Updated Vesd min/max.
• Table 6: Updated ZDRV Table note [14].
• Table 6: Vhys, moved 0.4 from typ to min column.
• Table 6: Ipu, added specs for >85 C.
• Table 6: Removed Rpu.
• Table 7: CCLK and IRC, added specs for >85 C.
• Added Table 9.
• Updated Figure 14.
• Updated Figure 11.
LPC2364_65_66_67_68 v.4 20080417 Product data sheet - LPC2364_66_68 v.3
LPC2364_66_68 v.3 20071220 Product data sheet - LPC2364_66_68 v.2
LPC2364_66_68 v.2 20071001 Preliminary data sheet - LPC2364_66_68 v.1
LPC2364_66_68 v.1 20070103 Preliminary data sheet - -
Table 20. Revision history …continued
Document ID Release date Data sheet status Change
notice
Supersedes
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18. Legal information
18.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 7.1 — 16 October 2013 67 of 69
NXP Semiconductors LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I
2C-bus — logo is a trademark of NXP B.V.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 7.1 — 16 October 2013 68 of 69
continued >>
NXP Semiconductors LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
20. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3
4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 4
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 6
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . 10
7 Functional description . . . . . . . . . . . . . . . . . . 18
7.1 Architectural overview . . . . . . . . . . . . . . . . . . 18
7.2 On-chip flash programming memory . . . . . . . 19
7.3 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 19
7.4 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.5 Interrupt controller . . . . . . . . . . . . . . . . . . . . . 20
7.5.1 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 21
7.6 Pin connect block . . . . . . . . . . . . . . . . . . . . . . 21
7.7 General purpose DMA controller . . . . . . . . . . 21
7.7.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7.8 Fast general purpose parallel I/O . . . . . . . . . . 22
7.8.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
7.9 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
7.9.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
7.10 USB interface (LPC2364/66/68 only) . . . . . . . 24
7.10.1 USB device controller . . . . . . . . . . . . . . . . . . . 24
7.10.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
7.11 CAN controller and acceptance filters
(LPC2364/66/68 only). . . . . . . . . . . . . . . . . . . 25
7.11.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
7.12 10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
7.12.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
7.13 10-bit DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
7.13.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
7.14 UARTs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
7.14.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
7.15 SPI serial I/O controller. . . . . . . . . . . . . . . . . . 26
7.15.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
7.16 SSP serial I/O controller . . . . . . . . . . . . . . . . . 27
7.16.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
7.17 SD/MMC card interface (LPC2367/68 only) . . 27
7.17.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
7.18 I2C-bus serial I/O controllers. . . . . . . . . . . . . . 27
7.18.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.19 I2S-bus serial I/O controllers. . . . . . . . . . . . . . 28
7.19.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.20 General purpose 32-bit timers/external
event counters . . . . . . . . . . . . . . . . . . . . . . . . 29
7.20.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
7.21 Pulse width modulator . . . . . . . . . . . . . . . . . . 29
7.21.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
7.22 Watchdog timer . . . . . . . . . . . . . . . . . . . . . . . 30
7.22.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
7.23 RTC and battery RAM . . . . . . . . . . . . . . . . . . 31
7.23.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
7.24 Clocking and power control . . . . . . . . . . . . . . 31
7.24.1 Crystal oscillators. . . . . . . . . . . . . . . . . . . . . . 31
7.24.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . . 32
7.24.1.2 Main oscillator . . . . . . . . . . . . . . . . . . . . . . . . 32
7.24.1.3 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 32
7.24.2 PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7.24.3 Wake-up timer . . . . . . . . . . . . . . . . . . . . . . . . 32
7.24.4 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 33
7.24.4.1 Idle mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
7.24.4.2 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 33
7.24.4.3 Power-down mode . . . . . . . . . . . . . . . . . . . . . 34
7.24.4.4 Deep power-down mode . . . . . . . . . . . . . . . . 34
7.24.4.5 Power domains . . . . . . . . . . . . . . . . . . . . . . . 34
7.25 System control . . . . . . . . . . . . . . . . . . . . . . . . 35
7.25.1 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
7.25.2 Brownout detection . . . . . . . . . . . . . . . . . . . . 35
7.25.3 Code security
(Code Read Protection - CRP) . . . . . . . . . . . 36
7.25.4 AHB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
7.25.5 External interrupt inputs . . . . . . . . . . . . . . . . . 36
7.25.6 Memory mapping control . . . . . . . . . . . . . . . . 37
7.26 Emulation and debugging . . . . . . . . . . . . . . . 37
7.26.1 EmbeddedICE . . . . . . . . . . . . . . . . . . . . . . . . 37
7.26.2 Embedded trace. . . . . . . . . . . . . . . . . . . . . . . 37
7.26.3 RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . . 38
8 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 39
9 Thermal characteristics . . . . . . . . . . . . . . . . . 40
10 Static characteristics . . . . . . . . . . . . . . . . . . . 41
10.1 Power-down mode . . . . . . . . . . . . . . . . . . . . . 44
10.2 Deep power-down mode . . . . . . . . . . . . . . . . 45
10.3 Electrical pin characteristics. . . . . . . . . . . . . . 47
11 Dynamic characteristics. . . . . . . . . . . . . . . . . 48
11.1 Internal oscillators . . . . . . . . . . . . . . . . . . . . . 49
11.2 I/O pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
11.3 USB interface. . . . . . . . . . . . . . . . . . . . . . . . . 49
11.4 Flash memory . . . . . . . . . . . . . . . . . . . . . . . . 50
11.5 Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
12 ADC electrical characteristics . . . . . . . . . . . . 52
13 DAC electrical characteristics . . . . . . . . . . . . 55
14 Application information . . . . . . . . . . . . . . . . . 55
NXP Semiconductors LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
© NXP B.V. 2013. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 16 October 2013
Document identifier: LPC2364_65_66_67_68
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
14.1 Suggested USB interface solutions
(LPC2364/66/68 only). . . . . . . . . . . . . . . . . . . 55
14.2 Crystal oscillator XTAL input and component
selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
14.3 RTC 32 kHz oscillator component selection. . 58
14.4 XTAL and RTCX Printed Circuit Board
(PCB) layout guidelines . . . . . . . . . . . . . . . . . 58
14.5 Standard I/O pin configuration . . . . . . . . . . . . 59
14.6 Reset pin configuration. . . . . . . . . . . . . . . . . . 60
15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 61
16 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 63
17 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 64
18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 66
18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 66
18.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
18.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
18.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 67
19 Contact information. . . . . . . . . . . . . . . . . . . . . 67
20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
©2002 Fairchild Semiconductor Corporation
www.fairchildsemi.com
Rev. 1.0.1
Features
• 5V ±1% Reference
• Oscillator Sync Terminal
• Internal Soft Start
• Deadtime Control
• Under Voltage Lockout
Description
The KA3525A is a monolithic integrated circuit that
includes all of the control circuits necessary for a pulse width
modulating regulator. There are a voltage reference, an error
amplifier, a pulse width modulator, an oscillator, an under
voltage lockout, a soft start circuit, and the output driver in
the chip.
16-DIP
1
Internal Block Diagram
16
15
12
1
2
9
8
10
5
7
3 6 4
14
11
13
U.V.L.O. BAND GAP
REF 5V
LATCH
S R
F/F Q
Q 5K
VC
OUTPUT A
OUTPUT B
OSCILLATOR
DISCHARGE
5K
ERR
AMP
PWM
COMP
_
+
_
+
CT
VREF
VCC
GND
EA(-)
EA(+)
EAOUT
C
(SOFT
START)
SHUT DOWN
SYNC RT OSC
OUTPUT
KA3525A
SMPS Controller
KA3525A
2
Absolute Maximum Ratings
Electrical Characteristics
(VCC = 20V, TA = 0 to +70°C, unless otherwise specified)
Parameter Symbol Value Unit
Supply Voltage VCC 40 V
Collector Supply Voltage VC 40 V
Output Current, Sink or Source IO 500 mA
Reference Output Current IREF 50 mA
Oscillator Charging Current ICHG(OSC) 5 mA
Power Dissipation (TA = 25°C) PD 1000 m/W
Operating Temperature TOPR 0 ~ +70 °C
Storage Temperature TSTG -65 ~ +150 °C
Lead Temperature (Soldering, 10sec) TLEAD +300 °C
Parameter Symbol Conditions Min. Typ. Max. Unit
REFERENCE SECTION
Reference Output Voltage VREF TJ = 25°C 5.0 5.1 5.2 V
Line Regulation ∆VREF VCC = 8 to 35V - 9 20 mV
Load Regulation ∆VREF IREF = 0 to 20mA - 20 50 mV
Short Circuit Output Current ISC VREF = 0, TJ = 25°C - 80 100 mA
Total Output Variation (Note1) ∆VREF Line, Load and Temperature 4.95 - 5.25 V
Temperature Stability (Note1) STT - - 20 50 mV
Long Term Stability (Note1) ST TJ = 125°C ,1KHRS - 20 50 mV
OSCILLATOR SECTION
Initial Accuracy (Note1, 2) ACCUR TJ = 25°C - ±3 ±6 %
Frequency Change With Voltage ∆f/∆VCC VCC = 8 to 35V (Note1, 2) - ±0.8 ±2 %
Maximum Frequency f(MAX) RT = 2kΩ, CT = 470pF 400 430 - kHz
Minimum Frequency f(MIN) RT = 200kΩ, CT = 0.1uF - 60 120 Hz
Clock Amplitude (Note1, 2) V(CLK) - 34- V
Clock Width (Note1, 2) tW(CLK) TJ = 25°C 0.3 0.6 1 µs
Sync Threshold VTH(SYNC) - 1.2 2 2.8 V
Sync Input Current II(SYNC) Sync = 3.5V - 1.3 2.5 mA
KA3525A
3
Electrical Characteristics (Continued)
(VCC = 20V, TA = 0 to +70°C, unless otherwise specified)
Note :
1. These parameters. although guaranteed over the recommended operating conditions, are not 100% tested in production
2. Tested at fOSC=40kHz (RT =3.6K, CT =0.01uF, RI = 0Ω)
Parameter Symbol Conditions Min. Typ. Max. Unit
ERROR AMPLIFIER SECTION (VCM = 5.1V)
Input Offset Voltage VIO - - 1.5 10 mV
Input Bias Current IBIAS - - 1 10 µA
Input Offset Current IIO - - 0.1 1 µA
Open Loop Voltage Gain GVO RL ≥ 10MΩ 60 80 - dB
Common Mode Rejection Ratio CMRR VCM = 1.5 to 5.2V 60 90 - dB
Power Supply Rejection Ratio PSRR VCC = 8 to 3.5V 50 60 - dB
PWM COMPARATOR SECTION
Minimum Duty Cycle D(MIN) - - - 0%
Maximum Duty Cycle D(MAX) - 45 49 - %
Input Threshold Voltage (Note2) VTH1 Zero Duty Cycle 0.7 0.9 - V
Input Threshold Voltage (Note2) VTH2 Max Duty Cycle - 3.2 3.6 V
SOFT-START SECTION
Soft Start Current ISOFT VSD = 0V, VSS = 0V 25 51 80 µA
Soft Start Low Level Voltage VSL VSD = 25V - 0.3 0.7 V
Shutdown Threshold Voltage VTH(SD) - 0.9 1.3 1.7 V
Shutdown Input Current IN(SD) VSD = 2.5V - 0.3 1 mA
OUTPUT SECTION
Low Output Voltage I VOL I ISINK = 20mA - 0.1 0.4 V
Low Output Voltage II VOL II ISINK = 100mA - 0.05 2 V
High Output Voltage I VCH I ISOURCE = 20mA 18 19 - V
High Output Voltage II VCH II ISOURCE = 100mA 17 18 - V
Under Voltage Lockout VUV V8 and V9 = High 6 7 8 V
Collector Leakage Current ILKG VCC = 35V - 80 200 µA
Rise Time (Note1) tR CL = 1uF, TJ = 25°C - 80 600 ns
Fall Time (Note1) tF CL = 1uF, TJ = 25°C - 70 300 ns
STANDBY CURRENT
Supply Current ICC VCC = 35V - 12 20 mA
KA3525A
4
Test Circuit
16
15
12
1
2
9
8
10
5 7
13
11
14
3 6
BAND GAP
REF 5V U.V.L.O.
A
B
0.1
Vcc
0.1
3k
RWM
ADJ
10k
1.5K
10K
0.01
5.0uF
5.0k
5.0k
5.0k
100
F/F
ERR
AMP ERR
AMP
OSCILLATOR
LATCH
S
S R
SOFT START +
SHUTDOWN
VREF
CT
RAMP
0.009 0.1
+
3.6k
0.001
DEAD
TIME
OUT B
10k
10k
OUT A
VC
CLOCK
_
+
+
_
RT
KA3525A
5
Mechanical Dimensions
Package
#1
#8 #9
#16
6.40 ±0.20
7.62
0.300
2.54
0.100
0.252 ±0.008
0~15° 0.25 +0.10
–0.05
0.010 +0.004
–0.002
3.30 ±0.30
0.130 ±0.012
3.25 ±0.20
0.128 ±0.008 19.40 ±0.20 0.764 ±0.008
19.80
0.780 MAX
5.08
0.200
0.38
0.014
MAX
MIN
0.81
0.032 ( ) 0.46 ±0.10
0.018 ±0.004
0.059 ±0.004
1.50 ±0.10
16-DIP
KA3525A
10/2/02 0.0m 001
Stock#DSxxxxxxxx
2002 Fairchild Semiconductor Corporation
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, and (c) whose failure to
perform when properly used in accordance with
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
www.fairchildsemi.com
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER
DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
Ordering Information
Product Number Package Operating Temperature
KA3525A 16-DIP 0 ~ +70°C
©2006 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FPS Rev.1.0.6 TM is a trademark of Fairchild Semiconductor Corporation.
Features
• Internal Avalanche Rugged Sense FET
• Advanced Burst-Mode operation consumes under 1 W at
240VAC & 0.5W load
• Precision Fixed Operating Frequency (66kHz)
• Internal Start-up Circuit
• Improved Pulse by Pulse Current Limiting
• Over Voltage Protection (OVP)
• Over Load Protection (OLP)
• Internal Thermal Shutdown Function (TSD)
• Auto-Restart Mode
• Under Voltage Lock Out (UVLO) with hysteresis
• Low Operating Current (2.5mA)
• Built-in Soft Start
Application
• SMPS for LCD monitor and STB
• Adaptor
Description
The FSDM0565RB is an integrated Pulse Width Modulator
(PWM) and Sense FET specifically designed for high
performance offline Switch Mode Power Supplies (SMPS)
with minimal external components. This device is an
integrated high voltage power switching regulator which
combine an avalanche rugged Sense FET with a current mode
PWM control block. The PWM controller includes integrated
fixed frequency oscillator, under voltage lockout, leading edge
blanking (LEB), optimized gate driver, internal soft start,
temperature compensated precise current sources for a loop
compensation and self protection circuitry. Compared with
discrete MOSFET and PWM controller solution, it can reduce
total cost, component count, size and weight simultaneously
increasing efficiency, productivity, and system reliability. This
device is a basic platform well suited for cost effective
designs of flyback converters.
Table 1. Maximum Output Power
Notes:
1. Typical continuous power in a non-ventilated enclosed
adapter measured at 50°C ambient.
2. Maximum practical continuous power in an open frame
design at 50°C ambient.
3. 230 VAC or 100/115 VAC with doubler.
Typical Circuit
Figure 1. Typical Flyback Application
OUTPUT POWER TABLE
PRODUCT
230VAC ±15%(3) 85-265VAC
Adapter(1)
Open
Frame(2)
Adapter(1)
Open
Frame(2)
FSDM0565RB 60W 70W 50W 60W
FSDM0565RBI 60W 70W 50W 60W
FSDM07652RB 70W 80W 60W 70W
Drain
Source
Vstr
Vfb Vcc
PWM
AC
IN DC
OUT
FSDM0565RB
Green Mode Fairchild Power Switch (FPSTM)
FSDM0565RB
2
Internal Block Diagram
Figure 2. Functional Block Diagram of FSDM0565RB
8V/12V
3 1
2
4
5
Vref Internal
Bias
S
Q
Q
R
OSC
Vcc Vref
Idelay IFB
VSD
TSD
Vovp
Vcc
VCL
S
Q
Q
R
R
2.5R
Vcc good
Vcc Drain
N.C
FB
GND
Gate
driver
6
Vstr
Istart
Vcc good
0.5/0.7V
LEB
PWM
Soft start
+
-
FSDM0565RB
3
Pin Definitions
Pin Configuration
Figure 3. Pin Configuration (Top View)
Pin Number Pin Name Pin Function Description
1 Drain This pin is the high voltage power Sense FET drain. It is designed to drive the
transformer directly.
2 GND This pin is the control ground and the Sense FET source.
3 Vcc
This pin is the positive supply voltage input. During start up, the power is supplied
by an internal high voltage current source that is connected to the Vstr pin.
When Vcc reaches 12V, the internal high voltage current source is disabled and
the power is supplied from the auxiliary transformer winding.
4 Vfb
This pin is internally connected to the inverting input of the PWM comparator.
The collector of an opto-coupler is typically tied to this pin. For stable operation,
a capacitor should be placed between this pin and GND. If the voltage of this pin
reaches 6.0V, the over load protection is activated resulting in shutdown of the
FPSTM.
5 N.C -
6 Vstr
This pin is connected directly to the high voltage DC link. At startup, the internal
high voltage current source supplies internal bias and charges the external capacitor
that is connected to the Vcc pin. Once Vcc reaches 12V, the internal current
source is disabled.
6.Vstr
5.N.C.
4.Vfb
3.Vcc
2.GND
1.Drain
TO-220F-6L
6.Vstr
5.N.C.
4.Vfb
3.Vcc
2.GND
1.Drain
I2-PAK-6L
FSDM0565RB
4
Absolute Maximum Ratings
(Ta=25°C, unless otherwise specified)
Notes:
1. Repetitive rating: Pulse width limited by maximum junction temperature
2. L=14mH, starting Tj=25°C
3. L=13uH, starting Tj=25°C
Thermal Impedance
Notes:
1. Free standing with no heat-sink under natural convection.
2. Infinite cooling condition - Refer to the SEMI G30-88.
Parameter Symbol Value Unit
Drain-source voltage VDSS 650 V
Vstr Max Voltage VSTR 650 V
Pulsed Drain current (Tc=25°C)(1) IDM 11 ADC
Continuous Drain Current(Tc=25°C) ID
2.8 A
Continuous Drain Current(Tc=100°C) 1.7 A
Single pulsed avalanche energy (2) EAS 190 mJ
Single pulsed avalanche current (3) IAS - A
Supply voltage VCC 20 V
Input voltage range VFB -0.3 to VCC V
Total power dissipation(Tc=25°C) PD(Watt H/S)
45
(TO-220-6L) W
75
(I2-PAK-6L)
Operating junction temperature Tj Internally limited °C
Operating ambient temperature TA -25 to +85 °C
Storage temperature range TSTG -55 to +150 °C
ESD Capability, HBM Model (All pins
excepts for Vstr and Vfb)
- 2.0
(GND-Vstr/Vfb=1.5kV)
kV
ESD Capability, Machine Model (All pins
excepts for Vstr and Vfb)
- 300
(GND-Vstr/Vfb=225V)
V
Parameter Symbol Package Value Unit
Junction-to-Ambient Thermal θJA(1) TO-220F-6L 49.90 °C/W
I2-PAK-6L 30
Junction-to-Case Thermal θJC(2) TO-220F-6L 2.78 °C/W
I2-PAK-6L 1.67
FSDM0565RB
5
Electrical Characteristics
(Ta = 25°C unless otherwise specified)
Parameter Symbol Condition Min. Typ. Max. Unit
Sense FET SECTION
Drain source breakdown voltage BVDSS VGS = 0V, ID = 250μA 650 - - V
Zero gate voltage drain current IDSS
VDS = 650V, VGS = 0V - - 500 μA
VDS= 520V
VGS = 0V, TC = 125°C - - 500 μA
Static drain source on resistance (1) RDS(ON) VGS = 10V, ID = 2.5A - 1.76 2.2 Ω
Output capacitance COSS
VGS = 0V, VDS = 25V,
f = 1MHz - 78 - pF
Turn on delay time TD(ON) VDD= 325V, ID= 5A
(MOSFET switching
time is essentially
independent of
operating temperature)
- 22 -
ns
Rise time TR - 52 -
Turn off delay time TD(OFF) - 95 -
Fall time TF - 50 -
CONTROL SECTION
Initial frequency FOSC VFB = 3V 60 66 72 kHz
Voltage stability FSTABLE 13V ≤ Vcc ≤ 18V 0 1 3 %
Temperature stability (2) ΔFOSC -25°C ≤ Ta ≤ 85°C 0 ±5 ±10 %
Maximum duty cycle DMAX - 77 82 87 %
Minimum duty cycle DMIN - - - 0%
Start threshold voltage VSTART VFB=GND 11 12 13 V
Stop threshold voltage VSTOP VFB=GND 7 8 9 V
Feedback source current IFB VFB=GND 0.7 0.9 1.1 mA
Soft-start time TS Vfb=3 - 10 15 ms
Leading Edge Blanking time TLEB - - 250 - ns
BURST MODE SECTION
Burst Mode Voltages (2)
VBURH Vcc=14V - 0.7 - V
VBURL Vcc=14V - 0.5 - V
PROTECTION SECTION
Peak current limit (4) IOVER VFB=5V, VCC=14V 2.0 2.25 2.5 A
Over voltage protection VOVP - 18 19 20 V
Thermal shutdown temperature (2) TSD 130 145 160 °C
Shutdown feedback voltage VSD VFB ≥ 5.5V 5.5 6.0 6.5 V
Shutdown delay current IDELAY VFB=5V 2.8 3.5 4.2 μA
FSDM0565RB
6
Notes:
1. Pulse test : Pulse width ≤ 300μS, duty ≤ 2%
2. These parameters, although guaranteed at the design, are not tested in mass production.
3. These parameters, although guaranteed, are tested in EDS(wafer test) process.
4. These parameters indicate the inductor current.
5. This parameter is the current flowing into the control IC.
TOTAL DEVICE SECTION
Operating supply current (5)
IOP VFB=GND, VCC=14V
IOP(MIN) VFB=GND, VCC=10V - 2.5 5 mA
IOP(MAX) VFB=GND, VCC=18V
FSDM0565RB
7
Comparison Between FS6M07652RTC and FSDM0565RB
Function FS6M07652RTC FSDM0565RB FSDM0565RB Advantages
Soft-Start Adjustable soft-start
time using an
external capacitor
Internal soft-start with
typically 10ms (fixed)
• Gradually increasing current limit
during soft-start further reduces peak
current and voltage component
stresses
• Eliminates external components used
for soft-start in most applications
• Reduces or eliminates output
overshoot
Burst Mode Operation • Built into controller
• Output voltage
drops to around
half
• Built into controller
• Output voltage fixed
• Improve light load efficiency
• Reduces no-load consumption
FSDM0565RB
8
Typical Performance Characteristics
(These Characteristic Graphs are Normalized at Ta= 25°C)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-25 0 25 50 75 100 125 150
Junction Temperature(℃)
Operating Frequency
(Fosc)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-25 0 25 50 75 100 125 150
Junction Temperature(℃)
Start Thershold Voltage
(Vstart)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-25 0 25 50 75 100 125 150
Junction Temperature(℃)
Stop Threshold Voltage
(Vstop)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-25 0 25 50 75 100 125 150
Junction Temperature(℃)
Maximum Duty Cycle
(Dmax)
Operating Current vs. Temp Start Threshold Voltage vs. Temp
Stop Threshold Voltage vs. Temp Operating Freqency vs. Temp
Maximum Duty vs. Temp Feedback Source Current vs. Temp
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-25 0 25 50 75 100 125 150
Junction Temperature(℃)
Operating Current
(Iop)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-25 0 25 50 75 100 125 150
Junction Temperature(℃)
FB Source Current
(Ifb)
FSDM0565RB
9
Typical Performance Characteristics (Continued)
(These Characteristic Graphs are Normalized at Ta= 25°C)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-25 0 25 50 75 100 125 150
Junction Temperature(℃)
Shutdown Delay Current
(Idelay)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-25 0 25 50 75 100 125 150
Junction Temperature(℃)
Over Voltage Protection
(Vovp)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-50 -25 0 25 50 75 100 125
Junction Temperature(℃)
Peak Current Limit(Self protection)
(Iover)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-25 0 25 50 75 100 125 150
Junction Temperature(℃)
FB Burst Mode Enable Voltage
(Vfbe)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-25 0 25 50 75 100 125 150
Junction Temperature(℃)
FB Burst Mode Disable Voltage
(Vfbd)
ShutDown Feedback Voltage vs. Temp ShutDown Delay Current vs. Temp
Over Voltage Protection vs. Temp Burst Mode Enable Voltage vs. Temp
Burst Mode Disable Voltage vs. Temp Current Limit vs. Temp
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-25 0 25 50 75 100 125 150
Junction Temperature(℃)
Shutdown FB Voltage
(Vsd)
FSDM0565RB
10
Typical Performance Characteristics (Continued)
(These Characteristic Graphs are Normalized at Ta= 25°C)
Soft Start Time vs. Temp
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-50 -25 0 25 50 75 100 125
Junction Temperature(℃)
Soft Start Time
(Normalized to 25℃)
FSDM0565RB
11
Functional Description
1. Startup : In previous generations of Fairchild Power
Switches (FPSTM) the Vcc pin had an external start-up
resistor to the DC input voltage line. In this generation the
startup resistor is replaced by an internal high voltage current
source. At startup, an internal high voltage current source
supplies the internal bias and charges the external capacitor
(Cvcc) that is connected to the Vcc pin as illustrated in
Figure 4. When Vcc reaches 12V, the FSDM0565RB begins
switching and the internal high voltage current source is
disabled. Then, the FSDM0565RB continues its normal
switching operation and the power is supplied from the
auxiliary transformer winding unless Vcc goes below the
stop voltage of 8V.
Figure 4. Internal startup circuit
2. Feedback Control : FSDM0565RB employs current
mode control, as shown in Figure 5. An opto-coupler (such
as the H11A817A) and shunt regulator (such as the KA431)
are typically used to implement the feedback network.
Comparing the feedback voltage with the voltage across the
Rsense resistor plus an offset voltage makes it possible to
control the switching duty cycle. When the reference pin
voltage of the KA431 exceeds the internal reference voltage
of 2.5V, the H11A817A LED current increases, thus pulling
down the feedback voltage and reducing the duty cycle. This
event typically happens when the input voltage is increased
or the output load is decreased.
2.1 Pulse-by-pulse current limit: Because current mode
control is employed, the peak current through the Sense FET
is limited by the inverting input of PWM comparator (Vfb*)
as shown in Figure 5. Assuming that the 0.9mA current
source flows only through the internal resistor (2.5R +R= 2.8
kΩ), the cathode voltage of diode D2 is about 2.5V. Since D1
is blocked when the feedback voltage (Vfb) exceeds 2.5V,
the maximum voltage of the cathode of D2 is clamped at this
voltage, thus clamping Vfb*. Therefore, the peak value of
the current through the Sense FET is limited.
2.2 Leading edge blanking (LEB) : At the instant the
internal Sense FET is turned on, there usually exists a high
current spike through the Sense FET, caused by primary-side
capacitance and secondary-side rectifier reverse recovery.
Excessive voltage across the Rsense resistor would lead to
incorrect feedback operation in the current mode PWM
control. To counter this effect, the FSDM0565RB employs a
leading edge blanking (LEB) circuit. This circuit inhibits the
PWM comparator for a short time (TLEB) after the Sense
FET is turned on.
Figure 5. Pulse width modulation (PWM) circuit
3. Protection Circuit : The FSDM0565RB has several self
protective functions such as over load protection (OLP), over
voltage protection (OVP) and thermal shutdown (TSD).
Because these protection circuits are fully integrated into the
IC without external components, the reliability can be
improved without increasing cost. Once the fault condition
occurs, switching is terminated and the Sense FET remains
off. This causes Vcc to fall. When Vcc reaches the UVLO
stop voltage, 8V, the protection is reset and the internal high
voltage current source charges the Vcc capacitor via the Vstr
pin. When Vcc reaches the UVLO start voltage,12V, the
FSDM0565RB resumes its normal operation. In this manner,
the auto-restart can alternately enable and disable the
switching of the power Sense FET until the fault condition is
eliminated (see Figure 6).
8V/12V
3
Vref
Internal
Bias
Vcc
6 Vstr
Istart
Vcc good
VDC
CVcc
4 OSC
Vcc Vref
Idelay IFB
VSD
R
2.5R
Gate
driver
OLP
D1 D2
+
Vfb*
-
Vfb
KA431
CB
Vo
H11A817A
Rsense
SenseFET
FSDM0565RB
12
Figure 6. Auto restart operation
3.1 Over Load Protection (OLP) : Overload is defined as
the load current exceeding a pre-set level due to an
unexpected event. In this situation, the protection circuit
should be activated in order to protect the SMPS. However,
even when the SMPS is in the normal operation, the over
load protection circuit can be activated during the load
transition. In order to avoid this undesired operation, the over
load protection circuit is designed to be activated after a
specified time to determine whether it is a transient situation
or an overload situation. Because of the pulse-by-pulse
current limit capability, the maximum peak current through
the Sense FET is limited, and therefore the maximum input
power is restricted with a given input voltage. If the output
consumes beyond this maximum power, the output voltage
(Vo) decreases below the set voltage. This reduces the
current through the opto-coupler LED, which also reduces
the opto-coupler transistor current, thus increasing the
feedback voltage (Vfb). If Vfb exceeds 2.5V, D1 is blocked
and the 3.5uA current source starts to charge CB slowly up to
Vcc. In this condition, Vfb continues increasing until it
reaches 6V, when the switching operation is terminated as
shown in Figure 7. The delay time for shutdown is the time
required to charge CB from 2.5V to 6.0V with 3.5uA. In
general, a 10 ~ 50 ms delay time is typical for most
applications.
Figure 7. Over load protection
3.2 Over voltage Protection (OVP) : If the secondary side
feedback circuit were to malfunction or a solder defect
caused an open in the feedback path, the current through the
opto-coupler transistor becomes almost zero. Then, Vfb
climbs up in a similar manner to the over load situation,
forcing the preset maximum current to be supplied to the
SMPS until the over load protection is activated. Because
more energy than required is provided to the output, the
output voltage may exceed the rated voltage before the over
load protection is activated, resulting in the breakdown of the
devices in the secondary side. In order to prevent this
situation, an over voltage protection (OVP) circuit is
employed. In general, Vcc is proportional to the output
voltage and the FSDM0565RB uses Vcc instead of directly
monitoring the output voltage. If VCC exceeds 19V, an OVP
circuit is activated resulting in the termination of the
switching operation. In order to avoid undesired activation of
OVP during normal operation, Vcc should be designed to be
below 19V.
3.3 Thermal Shutdown (TSD) : The Sense FET and the
control IC are built in one package. This makes it easy for
the control IC to detect the heat generation from the Sense
FET. When the temperature exceeds approximately 150°C,
the thermal shutdown is activated.
4. Soft Start : The FSDM0565RB has an internal soft start
circuit that increases PWM comparator inverting input
voltage together with the Sense FET current slowly after it
starts up. The typical soft start time is 10msec, The pulse
width to the power switching device is progressively
increased to establish the correct working conditions for
transformers, inductors, and capacitors. The voltage on the
output capacitors is progressively increased with the
intention of smoothly establishing the required output
voltage. It also helps to prevent transformer saturation and
reduce the stress on the secondary diode during startup.
Fault
situation
8V
12V
Vcc
Vds
t
Fault
occurs Fault
removed
Normal
operation
Normal
operation
Power
on
VFB
t
2.5V
6.0V
Over load protection
T12= Cfb*(6.0-2.5)/I delay
T1 T2
FSDM0565RB
13
5. Burst operation : In order to minimize power dissipation
in standby mode, the FSDM0565RB enters burst mode
operation. As the load decreases, the feedback voltage
decreases. As shown in Figure 8, the device automatically
enters burst mode when the feedback voltage drops below
VBURL(500mV). At this point switching stops and the
output voltages start to drop at a rate dependent on standby
current load. This causes the feedback voltage to rise. Once
it passes VBURH(700mV) switching resumes. The feedback
voltage then falls and the process repeats. Burst mode
operation alternately enables and disables switching of the
power Sense FET thereby reducing switching loss in
Standby mode.
Figure 8. Waveforms of burst operation
VFB
Vds
0.5V
0.7V
Ids
Vo
Voset
time
Switching
disabled
T1 T2 T3
Switching
disabled T4
FSDM0565RB
14
Typical application circuit
Features
• High efficiency (>81% at 85Vac input)
• Low zero load power consumption (<300mW at 240Vac input)
• Low standby mode power consumption (<800mW at 240Vac input and 0.3W load)
• Low component count
• Enhanced system reliability through various protection functions
• Internal soft-start (10ms)
Key Design Notes
• Resistors R102 and R105 are employed to prevent start-up at low input voltage. After startup, there is no power loss in these
resistors since the startup pin is internally disconnected after startup.
• The delay time for over load protection is designed to be about 50ms with C106 of 47nF. If a faster triggering of OLP is
required, C106 can be reduced to 10nF.
• Zener diode ZD102 is used for a safety test such as UL. When the drain pin and feedback pin are shorted, the zener diode
fails and remains short, which causes the fuse (F1) blown and prevents explosion of the opto-coupler (IC301). This zener
diode also increases the immunity against line surge.
1. Schematic
Application Output power Input voltage Output voltage (Max current)
LCD Monitor 40W Universal input
(85-265Vac)
5V (2.0A)
12V (2.5A)
3
4
C102
220nF
275VAC
LF101
23mH
C101
220nF
275VAC
RT1
5D-9
F1
FUSE
250V
2A
C103
100uF
400V
R102
30kΩ
R105
40kΩ
R103
56kΩ
2W
C104
2.2nF
1kV D101
UF 4007
C106
47nF
50V
C105
22uF
50V
D102
TVR10G
R104
5Ω
1
2
3
4
5
T1
EER3016
BD101
2KBP06M3N257
1
2
R101
560kΩ
1W
IC1
FSDM0565RB
Vstr
NC
Vfb
Vcc
Drain
GND
1
2
3 4
5
6
ZD101
22V
8
10
D202
MBRF10100
C201
1000uF
25V
C202
1000uF
25V
L201
12V, 2.5A
6
7
D201
MBRF1045
C203
1000uF
10V
C204
1000uF
10V
L202
5V, 2A
R201
1kΩ
R202
1.2kΩ
R204
5.6kΩ
R203
12kΩ C205
47nF
R205
5.6kΩ
C301
4.7nF
IC301
H11A817A IC201
KA431
ZD102
10V
FSDM0565RB
15
2. Transformer Schematic Diagram
3.Winding Specification
4.Electrical Characteristics
5. Core & Bobbin
Core : EER 3016
Bobbin : EER3016
Ae(mm2) : 96
No Pin (s→f) Wire Turns Winding Method
Na 4 → 5 0.2φ × 1 8 Center Winding
Insulation: Polyester Tape t = 0.050mm, 2Layers
Np/2 2 → 1 0.4φ × 1 18 Solenoid Winding
Insulation: Polyester Tape t = 0.050mm, 2Layers
N12V 10 → 8 0.3φ × 3 7 Center Winding
Insulation: Polyester Tape t = 0.050mm, 2Layers
N5V 7 → 6 0.3φ × 3 3 Center Winding
Insulation: Polyester Tape t = 0.050mm, 2Layers
Np/2 3 → 2 0.4φ × 1 18 Solenoid Winding
Outer Insulation: Polyester Tape t = 0.050mm, 2Layers
Pin Specification Remarks
Inductance 1 - 3 520uH ± 10% 100kHz, 1V
Leakage Inductance 1 - 3 10uH Max 2nd all short
EER3016
Np
/2 N12V
Na
1
2
3
4
5 6
7
8
9
10
Np
/2
N5V
FSDM0565RB
16
6.Demo Circuit Part List
Part Value Note Part Value Note
Fuse C301 4.7nF Polyester Film Cap.
F101 2A/250V
NTC Inductor
RT101 5D-9 L201 5uH Wire 1.2mm
Resistor L202 5uH Wire 1.2mm
R101 560K 1W
R102 30K 1/4W
R103 56K 2W
R104 5 1/4W Diode
R105 40K 1/4W D101 UF4007
R201 1K 1/4W D102 TVR10G
R202 1.2K 1/4W D201 MBRF1045
R203 12K 1/4W D202 MBRF10100
R204 5.6K 1/4W ZD101 Zener Diode 22V
R205 5.6K 1/4W ZD102 Zener Diode 10V
Bridge Diode
BD101 2KBP06M 3N257 Bridge Diode
Capacitor
C101 220nF/275VAC Box Capacitor Line Filter
C102 220nF/275VAC Box Capacitor LF101 23mH Wire 0.4mm
C103 100uF/400V Electrolytic Capacitor IC
C104 2.2nF/1kV Ceramic Capacitor IC101 FSDM0565RB FPSTM(5A,650V)
C105 22uF/50V Electrolytic Capacitor IC201 KA431(TL431) Voltage reference
C106 47nF/50V Ceramic Capacitor IC301 H11A817A Opto-coupler
C201 1000uF/25V Electrolytic Capacitor
C202 1000uF/25V Electrolytic Capacitor
C203 1000uF/10V Electrolytic Capacitor
C204 1000uF/10V Electrolytic Capacitor
C205 47nF/50V Ceramic Capacitor
FSDM0565RB
17
7. Layout
Figure 9. Layout Considerations for FSDM0565RB
Figure 10. Layout Considerations for FSDM0565RB
FSDM0565RB
18
Package Dimensions
TO-220F-6L(Forming)
FSDM0565RB
19
Package Dimensions (Continued)
I2-PAK-6L(Forming)
FSDM0565RB
1/9/06 0.0m 001
© 2006 Fairchild Semiconductor Corporation
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, and (c) whose failure to
perform when properly used in accordance with
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
www.fairchildsemi.com
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER
DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
Ordering Information
WDTU : Forming Type
Product Number Package Marking Code BVdss Rds(on)Max.
FSDM0565RBWDTU TO-220F-6L(Forming) DM0565R 650V 2.2 Ω
FSDM0565RBIWDTU I2-PAK-6L (Forming) DM0565R 650V 2.2 Ω
Data Sheet: JN5148-001
IEEE802.15.4 Wireless Microcontroller
© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 1
Overview Features: Transceiver
• 2.4GHz IEEE802.15.4 compliant
• Time of Flight ranging engine
• 128-bit AES security processor
• MAC accelerator with packet
formatting, CRCs, address check,
auto-acks, timers
• 500 & 667kbps data rate modes
• Integrated sleep oscillator for low
power
• On chip power regulation for 2.0V
to 3.6V battery operation
• Deep sleep current 100nA
• Sleep current with active sleep
timer 1.25µA
• <$0.50 external component cost
• Rx current 17.5mA
• Tx current 15.0mA
• Receiver sensitivity -95dBm
• Transmit power 2.5dBm
Features: Microcontroller
• Low power 32-bit RISC CPU, 4 to
32MHz clock speed
• Variable instruction width for high
coding efficiency
• Multi-stage instruction pipeline
• 128kB ROM and 128kB RAM for
bootloaded program code & data
• JTAG debug interface
• 4-input 12-bit ADC, 2 12-bit
DACs, 2 comparators
• 3 application timer/counters,
• 2 UARTs
• SPI port with 5 selects
• 2-wire serial interface
• 4-wire digital audio interface
• Watchdog timer
• Low power pulse counters
• Up to 21 DIO
Industrial temp (-40°C to +85°C)
8x8mm 56-lead Punched QFN
Lead-free and RoHS compliant
The JN5148-001 is an ultra low power, high performance wireless
microcontroller targeted at JenNet and ZigBee PRO networking
applications. The device features an enhanced 32-bit RISC processor
offering high coding efficiency through variable width instructions, a multistage
instruction pipeline and low power operation with programmable clock
speeds. It also includes a 2.4GHz IEEE802.15.4 compliant transceiver,
128kB of ROM, 128kB of RAM, and a rich mix of analogue and digital
peripherals. The large memory footprint allows the device to run both a
network stack (e.g. ZigBee PRO) and an embedded application or in a coprocessor
mode. The operating current is below 18mA, allowing operation
direct from a coin cell.
Enhanced peripherals include low power pulse counters running in sleep
mode designed for pulse counting in AMR applications and a unique Time
of Flight ranging engine, allowing accurate location services to be
implemented on wireless sensor networks. It also includes a 4-wire I2
S
audio interface, to interface directly to mainstream audio CODECs, as well
as conventional MCU peripherals.
Block Diagram
32-bit
RISC CPU Timers
UAR Ts
12-bit ADC,
Comparators
12-bit DACs,
Temp Sensor
2-Wire Serial
RAM SPI 128kB
128-bit AES
Encryption
Accelerator
2.4GHz
Radio
ROM
128kB
Power
Management
XTAL
O-QPSK
Modem
IEEE802.15.4
MAC
Accelerator
32-byte
OTP eFuse
4-Wire Audio
Sleep Counters
Time of Flight
Engine
Watchdog
Timer
Benefits
• Single chip integrates
transceiver and
microcontroller for wireless
sensor networks
• Large memory footprint to
run ZigBee PRO or JenNet
together with an application
• Very low current solution for
long battery life
• Highly featured 32-bit RISC
CPU for high performance
and low power
• System BOM is low in
component count and cost
• Extensive user peripherals
Applications
• Robust and secure low power
wireless applications
• ZigBee PRO and JenNet
networks
• Smart metering
(e.g. AMR)
• Home and commercial building
automation
• Location Aware services – e.g.
Asset Tracking
• Industrial systems
• Telemetry
• Remote Control
• Toys and gaming peripherals2 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
Contents
1 Introduction 6
1.1 Wireless Transceiver 6
1.2 RISC CPU and Memory 6
1.3 Peripherals 7
1.4 Block Diagram 8
2 Pin Configurations 9
2.1 Pin Assignment 10
2.2 Pin Descriptions 12
2.2.1 Power Supplies 12
2.2.2 Reset 12
2.2.3 32MHz Oscillator 12
2.2.4 Radio 12
2.2.5 Analogue Peripherals 13
2.2.6 Digital Input/Output 13
3 CPU 15
4 Memory Organisation 16
4.1 ROM 16
4.2 RAM 17
4.3 OTP eFuse Memory 17
4.4 External Memory 17
4.4.1 External Memory Encryption 18
4.5 Peripherals 18
4.6 Unused Memory Addresses 18
5 System Clocks 19
5.1 16MHz System Clock 19
5.1.1 32MHz Oscillator 19
5.1.2 24MHz RC Oscillator 19
5.2 32kHz System Clock 20
5.2.1 32kHz RC Oscillator 20
5.2.2 32kHz Crystal Oscillator 20
5.2.3 32kHz External Clock 20
6 Reset 21
6.1 Internal Power-on Reset 21
6.2 External Reset 22
6.3 Software Reset 22
6.4 Brown-out Detect 23
6.5 Watchdog Timer 23
7 Interrupt System 24
7.1 System Calls 24
7.2 Processor Exceptions 24
7.2.1 Bus Error 24
7.2.2 Alignment 24
7.2.3 Illegal Instruction 24
7.2.4 Stack Overflow 24
7.3 Hardware Interrupts 25© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 3
8 Wireless Transceiver 26
8.1 Radio 26
8.1.1 Radio External Components 27
8.1.2 Antenna Diversity 27
8.2 Modem 29
8.3 Baseband Processor 30
8.3.1 Transmit 30
8.3.2 Reception 30
8.3.3 Auto Acknowledge 31
8.3.4 Beacon Generation 31
8.3.5 Security 31
8.4 Security Coprocessor 31
8.5 Location Awareness 31
8.6 Higher Data Rates 32
9 Digital Input/Output 33
10 Serial Peripheral Interface 35
11 Timers 38
11.1 Peripheral Timer/Counters 38
11.1.1 Pulse Width Modulation Mode 39
11.1.2 Capture Mode 39
11.1.3 Counter/Timer Mode 40
11.1.4 Delta-Sigma Mode 40
11.1.5 Example Timer / Counter Application 41
11.2 Tick Timer 41
11.3 Wakeup Timers 42
11.3.1 RC Oscillator Calibration 43
12 Pulse Counters 44
13 Serial Communications 45
13.1 Interrupts 46
13.2 UART Application 46
14 JTAG Debug Interface 47
15 Two-Wire Serial Interface 48
15.1 Connecting Devices 48
15.2 Clock Stretching 49
15.3 Master Two-wire Serial Interface 49
15.4 Slave Two-wire Serial Interface 50
16 Four-Wire Digital Audio Interface 51
17 Random Number Generator 53
18 Sample FIFO 54
19 Intelligent Peripheral Interface 55
19.1 Data Transfer Format 55
19.2 JN5148 (Slave) Initiated Data Transfer 56
19.3 Remote (Master) Processor Initiated Data Transfer 564 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
20 Analogue Peripherals 58
20.1 Analogue to Digital Converter 59
20.1.1 Operation 59
20.1.2 Supply Monitor 60
20.1.3 Temperature Sensor 60
20.2 Digital to Analogue Converter 60
20.2.1 Operation 60
20.3 Comparators 61
21 Power Management and Sleep Modes 62
21.1 Operating Modes 62
21.1.1 Power Domains 62
21.2 Active Processing Mode 62
21.2.1 CPU Doze 62
21.3 Sleep Mode 62
21.3.1 Wakeup Timer Event 63
21.3.2 DIO Event 63
21.3.3 Comparator Event 63
21.3.4 Pulse Counter 63
21.4 Deep Sleep Mode 63
22 Electrical Characteristics 64
22.1 Maximum Ratings 64
22.2 DC Electrical Characteristics 64
22.2.1 Operating Conditions 64
22.2.2 DC Current Consumption 65
22.2.3 I/O Characteristics 66
22.3 AC Characteristics 66
22.3.1 Reset and Voltage Brown-Out 66
22.3.2 SPI MasterTiming 68
22.3.3 Intelligent Peripheral (SPI Slave) Timing 68
22.3.4 Two-wire Serial Interface 69
22.3.5 Four-Wire Digital Audio Interface 70
22.3.6 Wakeup and Boot Load Timings 70
22.3.7 Bandgap Reference 71
22.3.8 Analogue to Digital Converters 71
22.3.9 Digital to Analogue Converters 72
22.3.10 Comparators 73
22.3.11 32kHz RC Oscillator 73
22.3.12 32kHz Crystal Oscillator 74
22.3.13 32MHz Crystal Oscillator 74
22.3.14 24MHz RC Oscillator 75
22.3.15 Temperature Sensor 75
22.3.16 Radio Transceiver 76© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 5
Appendix A Mechanical and Ordering Information 81
A.1 56-pin QFN Package Drawing 81
A.2 PCB Decal 82
A.3 Ordering Information 83
A.4 Device Package Marking 84
A.5 Tape and Reel Information 85
A.5.1 Tape Orientation and Dimensions 85
A.5.2 Reel Information: 180mm Reel 86
A.5.3 Reel Information: 330mm Reel 87
A.5.4 Dry Pack Requirement for Moisture Sensitive Material 87
Appendix B Development Support 88
B.1 Crystal Oscillators 88
B.1.1 Crystal Equivalent Circuit 88
B.1.2 Crystal Load Capacitance 88
B.1.3 Crystal ESR and Required Transconductance 89
B.2 32MHz Oscillator 90
B.3 32kHz Oscillator 92
B.4 JN5148 Module Reference Designs 94
B.4.1 Schematic Diagram 94
B.4.2 PCB Design and Reflow Profile 96
Related Documents 97
RoHS Compliance 97
Status Information 97
Disclaimers 98
Trademarks 98
Version Control 99
Contact Details 1006 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
1 Introduction
The JN5148-001 is an IEEE802.15.4 wireless microcontroller that provides a fully integrated solution for applications
using the IEEE802.15.4 standard in the 2.4 - 2.5GHz ISM frequency band [1], including JenNet and ZigBee PRO. It
includes all of the functionality required to meet the IEEE802.15.4, JenNet and ZigBee PRO specifications and has
additional processor capability to run a wide range of applications including, but not limited to Smart Energy,
Automatic Meter Reading, Remote Control, Home and Building Automation, Toys and Gaming.
Applications that transfer data wirelessly tend to be more complex than wired ones. Wireless protocols make
stringent demands on frequencies, data formats, timing of data transfers, security and other issues. Application
development must consider the requirements of the wireless network in addition to the product functionality and user
interfaces. To minimise this complexity, NXP provides a series of software libraries and interfaces that control the
transceiver and peripherals of the JN5148. These libraries and interfaces remove the need for the developer to
understand wireless protocols and greatly simplifies the programming complexities of power modes, interrupts and
hardware functionality.
In view of the above, the register details of the JN5148 are not provided in the datasheet.
The device includes a Wireless Transceiver, RISC CPU, on chip memory and an extensive range of peripherals.
Hereafter, the JN5148-001 will be referred to as JN5148.
1.1 Wireless Transceiver
The Wireless Transceiver comprises a 2.45GHz radio, a modem, a baseband controller and a security coprocessor.
In addition, the radio also provides an output to control transmit-receive switching of external devices such as power
amplifiers allowing applications that require increased transmit power to be realised very easily. Appendix B.4,
describes a complete reference design including Printed Circuit Board (PCB) design and Bill Of Materials (BOM).
The security coprocessor provides hardware-based 128-bit AES-CCM* modes as specified by the IEEE802.15.4
2006 standard. Specifically this includes encryption and authentication covered by the MIC –32/ -64/ -128, ENC and
ENC-MIC –32/ -64/ -128 modes of operation.
The transceiver elements (radio, modem and baseband) work together to provide IEEE802.15.4 Medium Access
Control (MAC) under the control of a protocol stack. Applications incorporating IEEE802.15.4 functionality can be
rapidly developed by combining user-developed application software with a protocol stack library.
1.2 RISC CPU and Memory
A 32-bit RISC CPU allows software to be run on chip, its processing power being shared between the IEEE802.15.4
MAC protocol, other higher layer protocols and the user application. The JN5148 has a unified memory architecture,
code memory, data memory, peripheral devices and I/O ports are organised within the same linear address space.
The device contains 128kbytes of ROM, 128kbytes of RAM and a 32-byte One Time Programmable (OTP) eFuse
memory. © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 7
1.3 Peripherals
The following peripherals are available on chip:
• Master SPI port with five select outputs
• Two UARTs with support for hardware or software flow control
• Three programmable Timer/Counters – all three support Pulse Width Modulation (PWM) capability, two have
capture/compare facility
• Two programmable Sleep Timers and a Tick Timer
• Two-wire serial interface (compatible with SMbus and I2
C) supporting master and slave operation
• Four-wire digital audio interface (compatible with I²S)
• Slave SPI port for Intelligent peripheral mode (shared with digital I/O)
• Twenty-one digital I/O lines (multiplexed with peripherals such as timers and UARTs)
• Four channel, 12-bit, Analogue to Digital converter
• Two 12-bit Digital to Analogue converters
• Two programmable analogue comparators
• Internal temperature sensor and battery monitor
• Time Of Flight ranging engine
• Two low power pulse counters
• Random number generator
• Watchdog Timer and Voltage Brown-out
• Sample FIFO for digital audio interface or ADC/DAC
• JTAG hardware debug port
User applications access the peripherals using the Integrated Peripherals API. This allows applications to use a
tested and easily understood view of the peripherals allowing rapid system development. 8 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
1.4 Block Diagram
32-bit RISC CPU
Reset
SPI
Master
MUX
UART0
UART1
Wakeup
Timer1
Wakeup
Timer0
Security
Coprocessor
DIO6/TXD0/JTAG_TDO
DIO7/RXD0/JTAG_TDI
DIO4/CTS0/JTAG_TCK
DIO5/RTS0/JTAG_TMS
DIO19/TXD1/JTAG_TDO
DIO17/CTS1/IP_SEL/DAI_SCK/
JTAG_TCK
DIO18/RTS1/IP_INT/DAI_SDOUT/
JTAG_TMS
Digital
Baseband
Radio
Programmable
Interrupt
Controller
Timer0
2-wire
Interf ace
Timer1
SPICLK
DIO10/TIM0OUT/32KXTALOUT
SPIMOSI
SPIMISO
SPISEL0
DIO0/SPISEL1
DIO3/SPISEL4/RFTX
DIO2/SPISEL3/RFRX
DIO1/SPISEL2/PC0
DIO9/TIM0CAP/32KXTALIN/32KIN
DIO8/TIM0CK_GT/PC1
DIO13/TIM1OUT/ADE/DAI_SDIN
DIO11/TIM1CK_GT/TIM2OUT
DIO12/TIM1CAP/ADO/DAI_WS
DIO14/SIF_CLK/IP_CLK
DIO15/SIF_D/IP_DO
DIO16/RXD1/IP_DI/JTAG_TDI
From Peripherals
RESETN
Wireless
Transceiv er
32MHz Clock
Generator
XTAL_IN
XTAL_OUT
RF_IN
VCOTUNE
Tick Timer
Voltage
Regulators 1.8V VDD1
VDD2
Intelligent
Peripheral
IBAIS
VB_XX
Clock Divider
Multiplier
Timer2
SPISEL1
SPISEL2
SPISEL3
SPISEL4
TXD0
RXD0
RTS0
CTS0
TXD1
RXD1
RTS1
CTS1
TIM0CK_GT
TIM0CAP
TIM0OUT
TIM1CK_GT
TIM1CAP
TIM1OUT
TIM2OUT
SIF_D
SIF_CLK
IP_DO
IP_DI
IP_INT
IP_CLK
IP_SEL
4-wire
Digital
Audio
Interf ace
I2S_OUT
I2S_DIN
I2S_CLK
I2S_SYNC
Pulse
Counters
PC0
PC1
JTAG
Debug
JTAG_TDI
JTAG_TMS
JTAG_TCK
JTAG_TDO
RAM
128kB
ROM
128kB
OTP
eFuse
32kHz
RC
Osc
32kHz Clock
Select 32KIN
32kHz
Clock
Gen
32KXTALIN
32KXTALOUT
Antenna
Div ersity
ADO
ADE
Time
Of
Flight
Sample
FIFO
DIO20/RXD1/JTAG_TDI
24MHz
RC Osc
Comparator2 COMP2P
COMP2M
COMP1P/ Comparator1
EXT_PA_C
COMP1M/
EXT_PA_B
DAC1
DAC2
DAC1
DAC2
ADC
M
U ADC4 X
ADC1
ADC2
ADC3
Temperature
Sensor
Supply Monitor
CPU and 16MHz
System Clock
Watchdog
Timer
Brown-out
Detect
Figure 1: JN5148 Block Diagram
DIO 16/IP_DI© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 9
2 Pin Configurations
DIO16/RXD 1/IP_DI/JTAG_TDI
DIO17/CTS1/IP_SEL/DAI_SC K/JTAG_TCK
VSS3
DIO18/RTS1/IP_INT/DAI_SDOUT/JTAG_TMS
DIO19/TXD1/JTAG_TDO
VSS2
VSSS
XTAL_OUT
XTAL_IN
VB_SYNTH
VCOTUNE
VB_VCO
VDD1
IBIAS
VREF
VB_RF2
RF_IN
VB_RF
COMP1M
COMP1P
ADC1
ADC2
ADC3
ADC4
COMP2M
COMP2P
VB_A
NC
DAC1
DAC2
DIO20/RXD 1/JTAG_TDI
VSS1
SPICLK
SPIMISO
VB_RAM
SPIMOSI
SPISEL0
DIO0/SPISEL1
RESETN
VB_DIG
DIO1/SPISEL2/PC0
DIO2/SPISEL3/RFRX
DIO15/SIF_D/IP_DO
DIO14/SIF_C LK/IP_CLK
DIO13/T IM1OUT/ADE/DAI_SDIN
DIO12/T IM1CAP/ADO/DAI_WS
DIO11/T IM1CK_GT /TIM2OUT
DIO10/T IM0OUT/32KXT ALOUT
DIO9/TIM0CAP/32KXT ALIN/32KIN
VDD2
DIO8/TIM0CK_GT/PC 1
DIO7/RXD0/JT AG_TDI
DIO6/TXD0/JTAG_TDO
DIO5/RTS0/JTAG_TMS
DIO4/CTS0/JTAG_TCK
DIO3/SPISEL4/RFTX
VSSA
(Paddl e)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28 29
30
31
32
33
34
35
36
37
38
39
40
41
42
56
55
54
53
52
51
50
49
48
47
46
45
44
43
Figure 2: 56-pin QFN Configuration (top view)
Note: Please refer to Appendix B.4 JN5148 Module Reference
Design for important applications information regarding the
connection of the PADDLE to the PCB.
DIO 16/IP_DI10 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
2.1 Pin Assignment
Pin No Power supplies Signal
Type
Description
10, 12, 16, 18, 27,
35, 40
VB_SYNTH, VB_VCO, VB_RF2, VB_RF, VB_A, VB_RAM,
VB_DIG
1.8V Regulated supply voltage
13, 49 VDD1, VDD2 3.3V Supplies: VDD1 for analogue,
VDD2 for digital
32, 6, 3, 7, Paddle VSS1, VSS2, VSS3, VSSS, VSSA 0V Grounds (see appendix A.2 for
paddle details)
28 NC No connect
General
39 RESETN CMOS Reset input
8, 9 XTAL_OUT, XTAL_IN 1.8V System crystal oscillator
Radio
11 VCOTUNE 1.8V VCO tuning RC network
14 IBIAS 1.8V Bias current control
17 RF_IN 1.8V RF antenna
Analogue Peripheral I/O
21, 22, 23, 24 ADC1, ADC2, ADC3, ADC4 3.3V ADC inputs
15 VREF 1.8V Analogue peripheral reference
voltage
29, 30 DAC1, DAC2 3.3V DAC outputs
19, 20 COMP1M/EXT_PA_B, COMP1P/EXT_PA_C 3.3V Comparator 1 inputs and
external PA control
25, 26 COMP2M, COMP2P 3.3V Comparator 2 inputs
Digital Peripheral I/O
Primary Alternate Functions
33 SPICLK CMOS SPI Clock Output
36 SPIMOSI CMOS SPI Master Out Slave In Output
34 SPIMISO CMOS SPI Master In Slave Out Input
37 SPISEL0 CMOS SPI Slave Select Output 0
38 DIO0 SPISEL1 CMOS DIO0 or SPI Slave Select Output
1
41 DIO1 SPISEL2 PC0 CMOS DIO1, SPI Slave Select Output 2
or Pulse Counter0 Input
42 DIO2 SPISEL3 RFRX CMOS DIO2, SPI Slave Select Output 3
or Radio Receive Control Output
43 DIO3 SPISEL4 RFTX CMOS DIO3, SPI Slave Select Output 4
or Radio Transmit Control Output
44 DIO4 CTS0 JTAG_TCK CMOS DIO4, UART 0 Clear To Send
Input or JTAG CLK
45 DIO5 RTS0 JTAG_TMS CMOS DIO5, UART 0 Request To Send
Output or JTAG Mode Select
46 DIO6 TXD0 JTAG_TDO CMOS DIO6, UART 0 Transmit Data
Output or JTAG Data Output
47 DIO7 RXD0 JTAG_TDI CMOS DIO7, UART 0 Receive Data
Input or JTAG Data Input
48 DIO8 TIM0CK_GT PC1 CMOS DIO8, Timer0 Clock/Gate Input
or Pulse Counter1 Input
50 DIO9 TIM0CAP 32KXTALIN 32KIN CMOS DIO9, Timer0 Capture Input, 32K
External Crystal Input or 32K
Clock Input© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 11
Pin
No
Digital Peripheral I/O Signal
Type
Description
Primary Alternate Functions
51 DIO10 TIM0OUT 32KXTALOUT CMOS DIO10, Timer0 PWM Output or
32K External Crystal Output
52 DIO11 TIM1CK_GT TIM2OUT CMOS DIO11, Timer1 Clock/Gate
Input or Timer2 PWM Output
53 DIO12 TIM1CAP ADO DAI_WS CMOS DIO12, Timer1 Capture Input,
Antenna Diversity or Digital
Audio Word Select
54 DIO13 TIM1OUT ADE DAI_SDIN CMOS DIO13, Timer1 PWM Output,
Antenna Diversity or Digital
Audio Data Input
55 DIO14 SIF_CLK IP_CLK CMOS DIO14, Serial Interface Clock
or Intelligent Peripheral Clock
Input
56 DIO15 SIF_D IP_DO CMOS DIO15, Serial Interface Data or
Intelligent Peripheral Data Out
1 DIO16 IP_DI CMOS DIO16 or Intelligent Peripheral
Data In
2 DIO17 CTS1 IP_SEL DAI_SCK JTAG_TCK CMOS DIO17, UART 1 Clear To Send
Input, Intelligent Peripheral
Device Select Input or Digital
Audio Clock or JTAG CLK
4 DIO18 RTS1 IP_INT DAI_SDOUT JTAG_TMS CMOS DIO18, UART 1 Request To
Send Output, Intelligent
Peripheral Interrupt Output or
Digital Audio Data Output or
JTAG Mode Select
5 DIO19 TXD1 JTAG_TDO CMOS DIO19 or UART 1 Transmit
Data Output or JTAG Data Out
31 DIO 20 RXD1 JTAG_TDI CMOS DIO 20, UART 1 Receive Data
Input or JTAG data In
The PCB schematic and layout rules detailed in Appendix B.4
must be followed. Failure to do so will likely result in the
JN5148 failing to meet the performance specification detailed
herein and worst case may result in device not functioning in
the end application.12 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
2.2 Pin Descriptions
2.2.1 Power Supplies
The device is powered from the VDD1 and VDD2 pins, each being decoupled with a 100nF ceramic capacitor. VDD1
is the power supply to the analogue circuitry; it should be decoupled to ground. VDD2 is the power supply for the
digital circuitry; and should also be decoupled to ground. A 10uF tantalum capacitor is required. Decoupling pins for
the internal 1.8V regulators are provided which require a 100nF capacitor located as close to the device as practical.
VB_RF, VB_A and VB_SYNTH should be decoupled with an additional 47pF capacitor, while VB_RAM and VB_DIG
require only 100nF. VB_RF and VB_RF2 should be connected together as close to the device as practical, and only
require one 100nF capacitor and one 47pF capacitor. The pin VB_VCO requires a 10nF capacitor in parallel with a
47pF capacitor. Refer to B.4.1 for schematic diagram.
VSSA, VSSS, VSS1, VSS2, VSS3 are the ground pins.
Users are strongly discouraged from connecting their own circuits to the 1.8v regulated supply pins, as the regulators
have been optimised to supply only enough current for the internal circuits.
2.2.2 Reset
RESETN is a bi-directional active low reset pin that is connected to a 40kΩ internal pull-up resistor. It may be pulled
low by an external circuit, or can be driven low by the JN5148 if an internal reset is generated. Typically, it will be
used to provide a system reset signal. Refer to section 6.2, External Reset, for more details.
2.2.3 32MHz Oscillator
A crystal is connected between XTALIN and XTALOUT to form the reference oscillator, which drives the system
clock. A capacitor to analogue ground is required on each of these pins. Refer to section 5.1 16MHz System Clock
for more details. The 32MHz reference frequency is divided down to 16MHz and this is used as the system clock
throughout the device.
2.2.4 Radio
The radio is a single ended design, requiring a capacitor and just two inductors to match to 50Ω microstrip line to the
RF_IN pin.
An external resistor (43kΩ) is required between IBIAS and analogue ground to set various bias currents and
references within the radio.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 13
2.2.5 Analogue Peripherals
Several of the analogue peripherals require a reference voltage to use as part of their operations. They can use
either an internal reference voltage or an external reference connected to VREF. This voltage is referenced to
analogue ground and the performance of the analogue peripherals is dependant on the quality of this reference.
There are four ADC inputs, two pairs of comparator inputs and two DAC outputs. The analogue I/O pins on the
JN5148 can have signals applied up to 0.3v higher than VDD1. A schematic view of the analogue I/O cell is shown in
Figure 3: Analogue I/O Cell
In reset and deep sleep, the analogue peripherals are all off and the DAC outputs are in a high impedance state.
In sleep, the ADC and DACs are off, with the DAC outputs in high impedance state. The comparators may optionally
be used as a wakeup source.
Unused ADC and comparator inputs should be left unconnected.
VDD1
Analogue
I/O Pin
VSSA
Analogue
Peripheral
Figure 3: Analogue I/O Cell
2.2.6 Digital Input/Output
Digital I/O pins on the JN5148 can have signals applied up to 2V higher than VDD2 (with the exception of pins DIO9
and DIO10 that are 3V tolerant) and are therefore TTL-compatible with VDD2 > 3V. For other DC properties of these
pins see section 22.2.3 I/O Characteristics.
When used in their primary function all Digital Input/Output pins are bi-directional and are connected to weak internal
pull up resistors (40kΩ nominal) that can be disabled. When used in their secondary function (selected when the
appropriate peripheral block is enabled through software library calls) then their direction is fixed by the function. The
pull up resistor is enabled or disabled independently of the function and direction; the default state from reset is
enabled.
A schematic view of the digital I/O cell is in Figure 4: DIO Pin Equivalent Schematic.14 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
I
O
IE
VDD2
VSS
Pu
RPU
RPROT
OE
DIO[x] Pin
Figure 4: DIO Pin Equivalent Schematic
In reset, the digital peripherals are all off and the DIO pins are set as high-impedance inputs. During sleep and deep
sleep, the DIO pins retain both their input/output state and output level that was set as sleep commences. If the DIO
pins were enabled as inputs and the interrupts were enabled then these pins may be used to wake up the JN5148
from sleep.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 15
3 CPU
The CPU of the JN5148 is a 32-bit load and store RISC processor. It has been architected for three key
requirements:
• Low power consumption for battery powered applications
• High performance to implement a wireless protocol at the same time as complex applications
• Efficient coding of high-level languages such as C provided with the NXP Software Developer’s Kit
It features a linear 32-bit logical address space with unified memory architecture, accessing both code and data in the
same address space. Registers for peripheral units, such as the timers, UARTs and the baseband processor are
also mapped into this space.
The CPU has access to a block of 15 32-bit General-Purpose (GP) registers together with a small number of special
purpose registers which are used to store processor state and control interrupt handling. The contents of any GP
register can be loaded from or stored to memory, while arithmetic and logical operations, shift and rotate operations,
and signed and unsigned comparisons can be performed either between two registers and stored in a third, or
between registers and a constant carried in the instruction. Operations between general or special-purpose registers
execute in one cycle while those that access memory require a further cycle to allow the memory to respond.
The instruction set manipulates 8, 16 and 32-bit data; this means that programs can use objects of these sizes very
efficiently. Manipulation of 32-bit quantities is particularly useful for protocols and high-end applications allowing
algorithms to be implemented in fewer instructions than on smaller word-size processors, and to execute in fewer
clock cycles. In addition, the CPU supports hardware Multiply that can be used to efficiently implement algorithms
needed by Digital Signal Processing applications.
The instruction set is designed for the efficient implementation of high-level languages such as C. Access to fields in
complex data structures is very efficient due to the provision of several addressing modes, together with the ability to
be able to use any of the GP registers to contain the address of objects. Subroutine parameter passing is also made
more efficient by using GP registers rather than pushing objects onto the stack. The recommended programming
method for the JN5148 is by using C, which is supported by a software developer kit comprising a C compiler, linker
and debugger.
The CPU architecture also contains features that make the processor suitable for embedded, real-time applications.
In some applications, it may be necessary to use a real-time operating system to allow multiple tasks to run on the
processor. To provide protection for device-wide resources being altered by one task and affecting another, the
processor can run in either supervisor or user mode, the former allowing access to all processor registers, while the
latter only allows the GP registers to be manipulated. Supervisor mode is entered on reset or interrupt; tasks starting
up would normally run in user mode in a RTOS environment.
Embedded applications require efficient handling of external hardware events. When using JenOS, prioritised
interrupts are supported, with 15 priority levels, and can be configured as required by the application.
To improve power consumption a number of power-saving modes are implemented in the JN5148, described more
fully in section 21 - Power Management and Sleep Modes. One of these modes is the CPU doze mode; under
software control, the processor can be shut down and on an interrupt it will wake up to service the request.
Additionally, it is possible under software control, to set the speed of the CPU to 4, 8, 16 or 32MHz. This feature can
be used to trade-off processing power against current consumption.16 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
4 Memory Organisation
This section describes the different memories found within the JN5148. The device contains ROM, RAM, OTP eFuse
memory, the wireless transceiver and peripherals all within the same linear address space.
0x00000000
0x00020000
RAM
(128kB)
0xF0000000
0xFFFFFFFF
Unpopulated
ROM
(128kB)
0xF0020000
RAM Echo
0x04000000
Peripherals
0x02000000
Figure 5: JN5148 Memory Map
4.1 ROM
The ROM is 128k bytes in size, and can be accessed by the processor in a single CPU clock cycle. The ROM
contents include bootloader to allow external Flash memory contents to be bootloaded into RAM at runtime, a default
interrupt vector table, an interrupt manager, IEEE802.15.4 MAC and APIs for interfacing on-chip peripherals. The
operation of the boot loader is described in detail in Application Note [7]. The interrupt manager routes interrupt calls
to the application’s soft interrupt vector table contained within RAM. Section 7 contains further information regarding
the handling of interrupts. ROM contents are shown in Figure 6.
Interrupt Vectors
Interrupt Manager
Boot Loader
IEEE802.15.4
Stack
0x00000000
0x00020000
APIs
Spare
Figure 6: Typical ROM contents© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 17
4.2 RAM
The JN5148 contains 128kBytes of high speed RAM. It can be used for both code and data storage and is accessed
by the CPU in a single clock cycle. At reset, a boot loader controls the loading of segments of code and data from an
external memory connected to the SPI port, into RAM. Software can control the power supply to the RAM allowing
the contents to be maintained during a sleep period when other parts of the device are un-powered. Typical RAM
contents are shown in Figure 7.
MAC Data
Interrupt Vector Table
Application
CPU Stack
(Grows Down)
0x04000000
0x04020000
MAC Address
Figure 7: Typical RAM Contents
4.3 OTP eFuse Memory
The JN5148 contains a total of 32bytes of eFuse memory; this is a One Time Programmable (OTP) memory that can
be used to support on chip 64-bit MAC ID and a 128-bit AES security key. A limited number of bits are available for
customer use for storage of configuration information; configuration of these is made through use of software APIs.
For further information on how to program and use the eFuse memory, please contact technical support via the online
tech-support system.
Alternatively, NXP can provide an eFuse programming service for customers that wish to use the eFuse but do not
wish to undertake this for themselves. For further details of this service, please contact your local NXP sales office.
4.4 External Memory
An external memory with an SPI interface may be used to provide storage for program code and data for the device
when external power is removed. The memory is connected to the SPI interface using select line SPISEL0; this
select line is dedicated to the external memory interface and is not available for use with other external devices. See
Figure 8 for connection details.
JN5148 Serial
Memory
SPISEL0
SPIMISO
SPIMOSI
SPICLK
SS
SDO
SDI
CLK
Figure 8: Connecting External Serial Memory18 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
At reset, the contents of this memory are copied into RAM by the software boot loader. The Flash memory devices
that are supported as standard through the JN5148 bootloader are given in Table 1. NXP recommends that where
possible one of these devices should be selected.
Manufacturer Device Number
SST (Silicon Storage Technology) 25VF010A (1Mbit device)
Numonyx M25P10-A (1Mbit device),
M25P40 (4Mbit device)
Table 1: Supported Flash Memories
Applications wishing to use an alternate Flash memory device should refer to application note [2] JN-AN-1038
Programming Flash devices not supported by the JN51xx ROM-based bootloader. This application note provides
guidance on developing an interface to an alternate device.
4.4.1 External Memory Encryption
The contents of the external serial memory may be encrypted. The AES security processor combined with a user
programmable 128-bit encryption key is used to encrypt the contents of the external memory. The encryption key is
stored in eFuse.
When bootloading program code from external serial memory, the JN5148 automatically accesses the encryption key
to execute the decryption process. User program code does not need to handle any of the decryption process; it is
transparent.
With encryption enabled, the time taken to boot code from external flash is increased.
4.5 Peripherals
All peripherals have their registers mapped into the memory space. Access to these registers requires 3 clock
cycles. Applications have access to the peripherals through the software libraries that present a high-level view of
the peripheral’s functions through a series of dedicated software routines. These routines provide both a tested
method for using the peripherals and allow bug-free application code to be developed more rapidly. For details, see
the JN51xx Integrated Peripherals API User Guide (JN-UG-3066)[5].
4.6 Unused Memory Addresses
Any attempt to access an unpopulated memory area will result in a bus error exception (interrupt) being generated.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 19
5 System Clocks
Two system clocks are used to provide timing references into the on-chip subsystems of the JN5148. A 16MHz clock,
generated by a crystal-controlled 32MHz oscillator, is used by the transceiver, processor, memory and digital and
analogue peripherals. A 32kHz clock is used by the sleep timer and during the startup phase of the chip.
5.1 16MHz System Clock
The 16MHz system clock is used by the digital and analogue peripherals and the transceiver. A scaled version
(4,8,16 or 32MHz) of this clock is also used by the processor and memories. For most operations it is necessary to
source this clock from the 32MHz oscillator.
Crystal oscillators are generally slow to start. Hence to provide a faster start-up following a sleep cycle a fast RC
oscillator is provided that can be used as the source for the 16MHz system clock. The oscillator starts very quickly
and is typically 24MHz causing the system clock to run at 12MHz. Using a clock of this speed scales down the speed
of the processor and any peripherals in use. For the SPI interface this causes no functional issues as the generated
SPI clock is slightly slower and is used to clock the external SPI slave. Use of the radio is not possible when using the
24MHz RC oscillator. Additionally, timers and UARTs should not be used as the exact frequency will not be known.
The JN5148 device can be configured to wake up from sleep using the fast RC oscillator and automatically switch
over to use the 32MHz xtal as the clock source, when it has started up. This could allow application code to be
downloaded from the flash before the xtal is ready, typically improving start-up time by 550usec. Alternatively, the
switch over can be controlled by software, or the system could always use the 32MHz oscillator as the clock source.
5.1.1 32MHz Oscillator
The JN5148 contains the necessary on chip components to build a 32MHz reference oscillator with the addition of an
external crystal resonator and two tuning capacitors. The schematic of these components are shown in Figure 9.
The two capacitors, C1 and C2, should typically be 15pF and use a COG dielectric. Due to the small size of these
capacitors, it is important to keep the traces to the external components as short as possible. The on chip
transconductance amplifier is compensated for temperature variation, and is self-biasing by means of the internal
resistor R1. The electrical specification of the oscillator can be found in section 22.3.13. Please refer to Appendix B
for development support with the crystal oscillator circuit.
XTALOUT
C1 C2
R1 XTALIN
JN5148
Figure 9: 32MHz Crystal Oscillator Connections
5.1.2 24MHz RC Oscillator
An on-chip 24MHz RC oscillator is provided. No external components are required for this oscillator. The electrical
specification of the oscillator can be found in section 22.3.14.20 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
5.2 32kHz System Clock
The 32kHz system clock is used for timing the length of a sleep period (see section 21 Power Management and
Sleep Modes) and also to generate the system clock used internally during reset. The clock can be selected from
one of three sources through the application software:
• 32kHz RC Oscillator
• 32kHz Crystal Oscillator
• 32kHz External Clock
Upon a chip reset or power-up the JN5148 defaults to using the internal 32kHz RC Oscillator. If another clock source
is selected then it will remain in use for all 32kHz timing until a chip reset is performed.
5.2.1 32kHz RC Oscillator
The internal 32kHz RC oscillator requires no external components. The internal timing components of the oscillator
have a wide tolerance due to manufacturing process variation and so the oscillator runs nominally at 32kHz ±30%. To
make this useful as a timing source for accurate wakeup from sleep, a frequency calibration factor derived from the
more accurate 16MHz clock may be applied. The calibration factor is derived through software, details can be found
in section 11.3.1. For detailed electrical specifications, see section 22.3.11.
5.2.2 32kHz Crystal Oscillator
In order to obtain more accurate sleep periods, the JN5148 contains the necessary on-chip components to build a
32kHz oscillator with the addition of an external 32.768kHz crystal and two tuning capacitors. The crystal should be
connected between 32KXTALIN and 32KXTALOUT (DIO9 and DIO10), with two equal capacitors to ground, one on
each pin. Due to the small size of the capacitors, it is important to keep the traces to the external components as
short as possible.
The electrical specification of the oscillator can be found in section 22.3.12. The oscillator cell is flexible and can
operate with a range of commonly available 32.768kHz crystals with load capacitances from 6 to 12.5pF. However,
the maximum ESR of the crystal and the supply current are both functions of the actual crystal used, see appendix
B.1 for more details.
32KXTALIN 32KXTALOUT
JN5148
Figure 10: 32kHz crystal oscillator connections
5.2.3 32kHz External Clock
An externally supplied 32kHz reference clock on the 32KIN input (DIO9) may be provided to the JN5148. This would
allow the 32kHz system clock to be sourced from a very stable external oscillator module, allowing more accurate
sleep cycle timings compared to the internal RC oscillator. (See section 22.2.3 I/O Characteristics, DIO9 is a 3V
tolerant input)© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 21
6 Reset
A system reset initialises the device to a pre-defined state and forces the CPU to start program execution from the
reset vector. The reset process that the JN5148 goes through is as follows.
When power is applied, the 32kHz RC oscillator starts up and stabilises, which takes approximately 100µsec. At this
point, the 32MHz crystal oscillator is enabled and power is applied to the processor and peripheral logic. The logic
blocks are held in reset until the 32MHz crystal oscillator stabilises, typically this takes 0.75ms. Then the internal
reset is removed from the CPU and peripheral logic and the CPU starts to run code beginning at the reset vector,
consisting of initialisation code and the resident boot loader. [7] Section 22.3.1 provides detailed electrical data and
timing.
The JN5148 has five sources of reset:
• Internal Power-on Reset
• External Reset
• Software Reset
• Watchdog timer
• Brown-out detect
Note: When the device exits a reset condition, device operating
parameters (voltage, frequency, temperature, etc.) must be met to ensure
operation. If these conditions are not met, then the device must be held in
reset until the operating conditions are met. (See section 22.3)
6.1 Internal Power-on Reset
For the majority of applications the internal power-on reset is capable of generating the required reset signal. When
power is applied to the device, the power-on reset circuit monitors the rise of the VDD supply. When the VDD
reaches the specified threshold, the reset signal is generated and can be observed as a rising edge on the RESETN
pin. This signal is held internally until the power supply and oscillator stabilisation time has elapsed, when the internal
reset signal is then removed and the CPU is allowed to run.
RESETN Pin
Internal RESET
VDD
Figure 11: Internal Power-on Reset
When the supply drops below the power on reset ‘falling’ threshold, it will re-trigger the reset. Use of the external
reset circuit show in Figure 12 is suggested. 22 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
RESETN
C1
R1
JN5148
VDD
18k
470nF
Figure 12: External Reset Generation
The external resistor and capacitor provide a simple reset operation when connected to the RESETN pin.
6.2 External Reset
An external reset is generated by a low level on the RESETN pin. Reset pulses longer than the minimum pulse width
will generate a reset during active or sleep modes. Shorter pulses are not guaranteed to generate a reset. The
JN5148 is held in reset while the RESETN pin is low. When the applied signal reaches the Reset Threshold Voltage
(VRST) on its positive edge, the internal reset process starts.
Multiple devices may connect to the RESETN pin in an open-collector mode. The JN5148 has an internal pull-up
resistor connect to the RESETN pin. The pin is an input for an external reset, an output during the power-on reset
and may optionally be an output during a software reset. No devices should drive the RESETN pin high.
Internal Reset
RESETN pin
Reset
Figure 13: External Reset
6.3 Software Reset
A system reset can be triggered at any time through software control, causing a full chip reset and invalidating the
RAM contents. For example this can be executed within a user’s application upon detection of a system failure. When
performing the reset, the RESETN pin is driven low for 1µsec; depending on the external components this may or
may not be visible on the pin.
In addition, the RESETN line can be driven low by the JN5148 to provide a reset to other devices in the system (e.g.
external sensors) without resetting itself. When the RESETN line is not driven it will pull back high through either the
internal pull-up resistor or any external circuitry. It is essential to ensure that the RESETN line pulls back high within
100µsec after the JN5148 stops driving the line; otherwise a system reset will occur. Due to this, careful consideration
should be taken of any capacitance on this line. For instance, the RC values recommended in section 6.1 may need
to be replaced with a suitable reset IC© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 23
6.4 Brown-out Detect
An internal brown-out detect module is used to monitor the supply voltage to the JN5148; this can be used whilst the
device is awake or is in CPU doze mode. Dips in the supply voltage below a variable threshold can be detected and
can be used to cause the JN5148 to perform a chip reset. Equally, dips in the supply voltage can be detected and
used to cause an interrupt to the processor, when the voltage either drops below the threshold or rises above it.
The brown-out detect is enabled by default from power-up and can extend the reset during power-up. This will keep
the CPU in reset until the voltage exceeds the brown-out threshold voltage. The threshold voltage is configurable to
2.0V, 2.3V, 2.7V and 3.0V and is controllable by software. From power-up the threshold is set by eFuse settings and
the default chip configuration is for the 2.3V threshold. It is recommended that the threshold is set so that, as a
minimum, the chip is held in reset until the voltage reaches the level required by the external memory device on the
SPI interface.
6.5 Watchdog Timer
A watchdog timer is provided to guard against software lockups. It operates by counting cycles of the 32kHz system
clock. A pre-scaler is provided to allow the expiry period to be set between typically 8ms and 16.4 seconds. Failure
to restart the watchdog timer within the pre-configured timer period will cause a chip reset to be performed. A status
bit is set if the watchdog was triggered so that the software can differentiate watchdog initiated resets from other
resets, and can perform any required recovery once it restarts. If the source of the 32kHz system clock is the 32kHz
RC oscillator then the watchdog expiry periods are subject to the variation in period of the RC oscillator.
After power up, reset, start from deep sleep or start from sleep, the watchdog is always enabled with the largest
timeout period and will commence counting as if it had just been restarted. Under software control the watchdog can
be disabled. If it is enabled, the user must regularly restart the watchdog timer to stop it from expiring and causing a
reset. The watchdog runs continuously, even during doze, however the watchdog does not operate during sleep or
deep sleep, or when the hardware debugger has taken control of the CPU. It will recommence automatically if
enabled once the debugger un-stalls the CPU. 24 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
7 Interrupt System
The interrupt system on the JN5148 is a hardware-vectored interrupt system. The JN5148 provides several interrupt
sources, some associated with CPU operations (CPU exceptions) and others which are used by hardware in the
device. When an interrupt occurs, the CPU stops executing the current program and loads its program counter with a
fixed hardware address specific to that interrupt. The interrupt handler or interrupt service routine is stored at this
location and is run on the next CPU cycle. Execution of interrupt service routines is always performed in supervisor
mode. Interrupt sources and their vector locations are listed in Table 2 below:
Interrupt Source Vector Location Interrupt Definition
Bus error 0x08 Typically cause by an attempt to access an invalid address or a
disabled peripheral
Tick timer 0x0e Tick timer interrupt asserted
Alignment error 0x14 Load/store address to non-naturally-aligned location
Illegal instruction 0x1a Attempt to execute an unrecognised instruction
Hardware interrupt 0x20 interrupt asserted
System call 0x26 System call initiated by b.sys instruction
Trap 0x2c caused by the b.trap instruction or the debug unit
Reset 0x38 Caused by software or hardware reset.
Stack Overflow 0x3e Stack overflow
Table 2: Interrupt Vectors
7.1 System Calls
The b.trap and b.sys instructions allow processor exceptions to be generated by software.
A system call exception will be generated when the b.sys instruction is executed. This exception can, for example, be
used to enable a task to switch the processor into supervisor mode when a real time operating system is in use. (See
section 3 for further details.)
The b.trap instruction is commonly used for trapping errors and for debugging.
7.2 Processor Exceptions
7.2.1 Bus Error
A bus error exception is generated when software attempts to access a memory address that does not exist, or is not
populated with memory or peripheral registers or when writing to ROM.
7.2.2 Alignment
Alignment exceptions are generated when software attempts to access objects that are not aligned to natural word
boundaries. 16-bit objects must be stored on even byte boundaries, while 32-bit objects must be stored on quad byte
boundaries. For instance, attempting to read a 16-bit object from address 0xFFF1 will trigger an alignment exception
as will a read of a 32-bit object from 0xFFF1, 0xFFF2 or 0xFFF3. Examples of legal 32-bit object addresses are
0xFFF0, 0xFFF4, 0xFFF8 etc.
7.2.3 Illegal Instruction
If the CPU reads an unrecognised instruction from memory as part of its instruction fetch, it will cause an illegal
instruction exception.
7.2.4 Stack Overflow
When enabled, a stack overflow exception occurs if the stack pointer reaches a programmable location.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 25
7.3 Hardware Interrupts
Hardware interrupts generated from the transceiver, analogue or digital peripherals and DIO pins are individually
masked using the Programmable Interrupt Controller (PIC). Management of interrupts is provided in the peripherals
library [5]. For details of the interrupts generated from each peripheral see the respective section in this datasheet.
Interrupts can be used to wake the JN5148 from sleep. The peripherals, baseband controller, security coprocessor
and PIC are powered down during sleep but the DIO interrupts and optionally the pulse counters, wake-up timers and
analogue comparator interrupts remain powered to bring the JN5148 out of sleep.
Prioritised external interrupt handling (i.e., interrupts from hardware peripherals) is provided to enable an application
to control an events priority to provide for deterministic program execution.
The priority Interrupt controller provides 15 levels of prioritised interrupts. The priority level of all interrupts can be set,
with value 0 being used to indicate that the source can never produce an external interrupt, 1 for the lowest priority
source(s) and 15 for the highest priority source(s). Note that multiple interrupt sources can be assigned the same
priority level if desired.
If while processing an interrupt, a new event occurs at the same or lower priority level, a new external interrupt will
not be triggered. However, if a new higher priority event occurs, the external interrupt will again be asserted,
interrupting the current interrupt service routine.
Once the interrupt service routine is complete, lower priority events can be serviced. 26 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
8 Wireless Transceiver
The wireless transceiver comprises a 2.45GHz radio, modem, a baseband processor, a security coprocessor and
PHY controller. These blocks, with protocol software provided as a library, implement an IEEE802.15.4 standardsbased
wireless transceiver that transmits and receives data over the air in the unlicensed 2.4GHz band.
8.1 Radio
Figure 14 shows the single ended radio architecture.
LNA
synth
PA
ADC Reference
& Bias
Switch
Radio
Calibration
Lim1
Lim2
Lim3
Lim4
sigma
delta
D-Type
Figure 14: Radio Architecture
The radio comprises a low-IF receive path and a direct modulation transmit path, which converge at the TX/RX
switch. The switch connects to the external single ended matching network, which consists of two inductors and a
capacitor, this arrangement creates a 50Ω port and removes the need for a balun. A 50Ω single ended antenna can
be connected directly to this port.
The 32MHz crystal oscillator feeds a divider, which provides the frequency synthesiser with a reference frequency.
The synthesiser contains programmable feedback dividers, phase detector, charge pump and internal Voltage
Controlled Oscillator (VCO). The VCO has no external components, and includes calibration circuitry to compensate
for differences in internal component values due to process and temperature variations. The VCO is controlled by a
Phase Locked Loop (PLL) that has an internal loop filter. A programmable charge pump is also used to tune the loop
characteristic.
The receiver chain starts with the low noise amplifier / mixer combination whose outputs are passed to a lowpass
filter, which provides the channel definition. The signal is then passed to a series of amplifier blocks forming a limiting
strip. The signal is converted to a digital signal before being passed to the Modem. The gain control for the RX path
is derived in the automatic gain control (AGC) block within the Modem, which samples the signal level at various
points down the RX chain. To improve the performance and reduce current consumption, automatic calibration is
applied to various blocks in the RX path.
In the transmit direction, the digital stream from the Modem is passed to a digital sigma-delta modulator which
controls the feedback dividers in the synthesiser, (dual point modulation). The VCO frequency now tracks the applied
modulation. The 2.4 GHz signal from the VCO is then passed to the RF Power Amplifier (PA), whose power control
can be selected from one of three settings. The output of the PA drives the antenna via the RX/TX switch© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 27
8.1.1 Radio External Components
In order to realise the full performance of the radio it is essential that the reference PCB layout and BOM are carefully
followed. See Appendix B.4.
The radio is powered from a number of internal 1.8V regulators fed from the analogue supply VDD1, in order to
provide good noise isolation between the digital logic of the JN5148 and the analogue blocks. These regulators are
also controlled by the baseband controller and protocol software to minimise power consumption. Decoupling for
internal regulators is required as described in section 2.2.1, Power Supplies
For single ended antennas or connectors, a balun is not required, however a matching network is needed.
The RF matching network requires three external components and the IBIAS pin requires one external component as
shown in schematic in B.4.1. These components are critical and should be placed close to the JN5148 pins and
analogue ground as defined in Table 8: JN5148 Printed Antenna Reference Module Components and PCB Layout
Constraints. Specifically, the output of the network comprising L2, C1 and L1 is designed to present an accurate
match to a 50 ohm resistive network as well as provide a DC path to the final output stage or antenna. Users wishing
to match to other active devices such as amplifiers should design their networks to match to 50 ohms at the output of
L1
R1 43K
IBIAS
C20 100nF
L2 2.7nH
VB_RF
VREF
VB_RF2
RF_IN C12 47pF
C3 100nF
VB_RF1
C1 47pF L1 5.6nH
To Coaxial Socket
or Integrated Antenna
VB_RF
Figure 15 External Radio Components
8.1.2 Antenna Diversity
Support is provided for antenna diversity. Antenna diversity is a technique that maximises the performance of an
antenna system. It allows the radio to switch between two antennas that have very low correlation between their
received signals. Typically, this is achieved by spacing two antennas around 0.25 wavelengths apart or by using two
orthogonal polarisations. So, if a packet is transmitted and no acknowledgement is received, the radio system can
switch to the other antenna for the retry, with a different probability of success.
The JN5148 provides an output (ADO) on DIO12 that is asserted on odd numbered retries and optionally its
complement (ADE) on DIO13, that can be used to control an antenna switch; this enables antenna diversity to be
implemented easily (see Figure 16 and Figure 17).28 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
Antenna A Antenna B
A B
COM
SEL
SELB
ADO (DIO[12])
ADE (DIO[13])
Device RF Port
RF Switch: Single-Pole, Double-Throw (SPDT)
Figure 16 Simple Antenna Diversity Implementation using External RF Switch
ADO (DIO[12])
TX Active
RX Active
ADE (DIO[13])
1st TX-RX Cycle 2nd TX-RX Cycle (1st Retry)
Figure 17 Antenna Diversity ADO Signal for TX with Acknowledgement
If two DIO pins cannot be spared, DIO13 can be configured to be a normal DIO pin, and the inverse of ADO
generated with an inverter on the PCB. © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 29
8.2 Modem
The modem performs all the necessary modulation and spreading functions required for digital transmission and
reception of data at 250kbps in the 2450MHz radio frequency band in compliance with the IEEE802.15.4 standard. It
also provides a high data rate modes at 500 and 667kbps.
AGC Demodulation
Symbol
Detection
(Despreading)
Modulation Spreading
TX
RX
TX Data
Interface
RX Data
Interface
VCO
Sigma-Delta
Modulator
IF Signal
Gain
Figure 18 Modem Architecture
Features provided to support network channel selection algorithms include Energy Detection (ED), Link Quality
Indication (LQI) and fully programmable Clear Channel Assessment (CCA).
The Modem provides a digital Receive Signal Strength Indication (RSSI) that facilitates the implementation of the
IEEE 802.15.4 ED function and LQI function.
The ED and LQI are both related to receiver power in the same way, as shown in Fig19. LQI is associated with a
received packet, whereas ED is an indication of signal power on air at a particular moment.
The CCA capability of the Modem supports all modes of operation defined in the IEEE 802.15.4 standard, namely
Energy above ED threshold, Carrier Sense and Carrier Sense and/or energy above ED threshold.
Figure 19 Energy Detect Value vs Receive Power Level30 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
8.3 Baseband Processor
The baseband processor provides all time-critical functions of the IEEE802.15.4 MAC layer. Dedicated hardware
guarantees air interface timing is precise. The MAC layer hardware/software partitioning, enables software to
implement the sequencing of events required by the protocol and to schedule timed events with millisecond
resolution, and the hardware to implement specific events with microsecond timing resolution. The protocol software
layer performs the higher-layer aspects of the protocol, sending management and data messages between endpoint
and coordinator nodes, using the services provided by the baseband processor.
Append
Checksum
Verify
Checksum
CSMA CCA Backoff
Control
Deserialiser
Serialiser
Tx/Rx
Frame
Buffer
Tx
Bitstream
Rx
Bitstream
Protocol Timing Engine
Supervisor
Radio
Status
Control
Processor
Bus
Protocol
Timers
Security Coprocessor
Decrypt
Port
Encrypt
Port
AES
Codec
Figure 20: Baseband Processor
8.3.1 Transmit
A transmission is performed by software writing the data to be transferred into the Tx/Rx Frame Buffer, together with
parameters such as the destination address and the number of retries allowed, and programming one of the protocol
timers to indicate the time at which the frame is to be sent. This time will be determined by the software tracking the
higher-layer aspects of the protocol such as superframe timing and slot boundaries. Once the packet is prepared and
protocol timer set, the supervisor block controls the transmission. When the scheduled time arrives, the supervisor
controls the sequencing of the radio and modem to perform the type of transmission required. It can perform all the
algorithms required by IEEE802.15.4 such as CSMA/CA, GTS without processor intervention including retries and
random backoffs.
When the transmission begins, the header of the frame is constructed from the parameters programmed by the
software and sent with the frame data through the serialiser to the Modem. At the same time, the radio is prepared
for transmission. During the passage of the bitstream to the modem, it passes through a CRC checksum generator
that calculates the checksum on-the-fly, and appends it to the end of the frame.
If using slotted access, it is possible for a transmission to overrun the time in its allocated slot; the Baseband
Processor handles this situation autonomously and notifies the protocol software via interrupt, rather than requiring it
to handle the overrun explicitly.
8.3.2 Reception
During reception, the radio is set to receive on a particular channel. On receipt of data from the modem, the frame is
directed into the Tx/Rx Frame Buffer where both header and frame data can be read by the protocol software. An
interrupt may be provided on receipt of the frame header. As the frame data is being received from the modem it is
passed through a checksum generator; at the end of the reception the checksum result is compared with the
checksum at the end of the message to ensure that the data has been received correctly. An interrupt may be © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 31
provided to indicate successful packet reception. During reception, the modem determines the Link Quality, which is
made available at the end of the reception as part of the requirements of IEEE802.15.4.
8.3.3 Auto Acknowledge
Part of the protocol allows for transmitted frames to be acknowledged by the destination sending an acknowledge
packet within a very short window after the transmitted frame has been received. The JN5148 baseband processor
can automatically construct and send the acknowledgement packet without processor intervention and hence avoid
the protocol software being involved in time-critical processing within the acknowledge sequence. The JN5148
baseband processor can also request an acknowledge for packets being transmitted and handle the reception of
acknowledged packets without processor intervention.
8.3.4 Beacon Generation
In beaconing networks, the baseband processor can automatically generate and send beacon frames; the repetition
rate of the beacons is programmed by the CPU, and the baseband then constructs the beacon contents from data
delivered by the CPU. The baseband processor schedules the beacons and transmits them without CPU
intervention.
8.3.5 Security
The transmission and reception of secured frames using the Advanced Encryption Standard (AES) algorithm is
handled by the security coprocessor and the stack software. The application software must provide the appropriate
encrypt/decrypt keys for the transmission or reception. On transmission, the key can be programmed at the same
time as the rest of the frame data and setup information.
8.4 Security Coprocessor
The security coprocessor is available to the application software to perform encryption/decryption operations. A
hardware implementation of the encryption engine significantly speeds up the processing of the encrypted packets
over a pure software implementation. The AES library for the JN5148 provides operations that utilise the encryption
engine in the device and allow the contents of memory buffers to be transformed. Information such as the type of
security operation to be performed and the encrypt/decrypt key to be used must also be provided.
Processor
Interface
AES
Block
Encrpytion
Controller
AES Encoder
Key Generation
Figure 21: Security Coprocessor Architecture
8.5 Location Awareness
The JN5148 provides the ability for an application to obtain the Time Of Flight (TOF) between two network nodes.
The TOF information is an alternative metric to that of the existing Energy Detect value (RSSI) that has been typically
used for calculating the relative inter-nodal separation, for subsequent use in a location awareness system.
For short ranges RSSI will typically give a better accuracy than TOF, however for distances above 5 to 10 meters
TOF will offer significant improvements in accuracy compared to RSSI. In general, the RSSI error scales with
distance, such that if the distance doubles then the error doubles.32 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
8.6 Higher Data Rates
To support the demands of applications that require high data throughputs such as in audio or data streaming
applications, the JN5148 supports higher data rate modes that offer 500kbps or 667kbps on air transmission rates.
The switching between standard and higher data rates is controlled via software, When operating in a higher data
rate mode standard IEEE802.15.4 features, such as clear channel assessment, can still be used. This allows the
JN5148 in a higher data rate mode to co-exist in an IEEE802.15.4 based network (adhering to the correct bit rates
and frame timing etc.) whilst at the same time providing the benefit of the higher data rate where required.
When operating in a higher data rate mode, the receive sensitivity will be degraded by at least 3dB.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 33
9 Digital Input/Output
There are 21 Digital I/O (DIO) pins, which can be configured as either an input or an output, and each has a
selectable internal pull-up resistor. Most DIO pins are multiplexed with alternate peripheral features of the device,
see section 2.1. Once a peripheral is enabled it takes precedence over the device pins. Refer to the individual
module sections for a full description of the alternate peripherals functions. Following a reset (and whilst the reset
input is held low), all peripherals are off and the DIO pins are configured as inputs with the internals pull-ups turned
on.
When a peripheral is not enabled, the DIO pins associated with it can be used as digital inputs or outputs. Each pin
can be controlled individually by setting the direction and then reading or writing to the pin.
The individual pull-up resistors, RPU, can also be enabled or disabled as needed and the setting is held through sleep
cycles. The pull-ups are generally configured once after reset depending on the external components and
functionality. For instance, outputs should generally have the pull-ups disabled. An input that is always driven should
also have the pull-up disabled.
When configured as an input each pin can be used to generate an interrupt upon a change of state (selectable
transition either from low to high or high to low); the interrupt can be enabled or disabled. When the device is
sleeping, these interrupts become events that can be used to wake the device up. Equally the status of the interrupt
may be read. See section 21 Power Management and Sleep Modes for further details on sleep and wakeup.
The state of all DIO pins can be read, irrespective of whether the DIO is configured as an input or an output.
Throughout a sleep cycle the direction of the DIO, and the state of the outputs, is held. This is based on the resultant
of the GPIO Data/ Direction registers and the effect of any enabled peripherals at the point of entering sleep.
Following a wake-up these directions and output values are maintained under control of the GPIO data / direction
registers. Any peripherals enabled before the sleep cycle are not automatically re-enabled, this must be done through
software after the wake-up.
For example, if DIO0 is configured to be SPISEL1 then it becomes an output. The output value is controlled by the
SPI functional block. If the device then enters a sleep cycle, the DIO will remain an output and hold the value being
output when entering sleep. After wake-up the DIO will still be an output with the same value but controlled from the
GPIO Data/Direction registers. It can be altered with the software functions that adjust the DIO, or the application may
re-configure it to be SPISEL1.
Unused DIO pins are recommended to be set as inputs with the pull-up enabled.
Two DIO pins can optionally be used to provide control signals for RF circuitry (eg switches and PA) in high power
range extenders.
DIO3 / RFTX is asserted when the radio is in the transmit state and similarly, DIO2 / RFRX is asserted when the radio
is in the receiver state.34 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
4-wire
Digital Audio
Interface
Antenna
Diversity
JTAG
Debug
Pulse
Counters
Intelligent
Peripheral
MUX
2-wire
Interface
Timer2
Timer1
Timer0
UART1
UART0
SPI
Master SPISEL1
SPISEL2
SPISEL3
SPISEL4
TXD0
RXD0
RTS0
CTS0
TXD1
RXD1
RTS1
CTS1
TIM0CK_GT
TIM0OUT
TIM0CAP
TIM1CK_GT
TIM1OUT
TIM1CAP
TIM2OUT
SIF_D
SIF_CLK
IP_DO
IP_DI
IP_INT
IP_CLK
IP_SEL
PC0
PC1
JTAG_TDI
JTAG_TMS
JTAG_TCK
JTAG_TDO
ADO
ADE
I2S_OUT
I2S_DIN
I2S_CLK
I2S_SYNC
SPICLK
SPIMOSI
SPIMISO
SPISEL0
DIO0/SPISEL1
DIO1/SPISEL2/PC0
DIO2/SPISEL3/RFRX
DIO3/SPISEL4/RFTX
DIO4/CTS0/JTAG_TCK
DIO5/RTS0/JTAG_TMS
DIO6/TXD0/JTAG_TDO
DIO7/RXD0/JTAG_TDI
DIO8/TIM0CK_GT/PC1
DIO9/TIM0CAP/32KXTALIN/32KIN
DIO10/TIM0OUT/32KXTALOUT
DIO11/TIM1CK_GT/TIM2OUT
DIO12/TIM1CAP/ADO/DAI_WS
DIO13/TIM1OUT/ADE/DAI_SDN
DIO14/SIF_CLK/IP_CLK
DIO15/SIF_D/IP_DO
DIO16/IP_DI
DIO17/CTS1/IP_SEL/DAI_SCK/
JTAG_TCK
DIO18/RTS1/IP_INT/DAI_SDOUT/
JTAG_TMS
DIO19/TXD1/JTAG_TDO
DIO20/RXD1/JTAG_TDI
Figure 22 DIO Block Diagram© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 35
10 Serial Peripheral Interface
The Serial Peripheral Interface (SPI) allows high-speed synchronous data transfer between the JN5148 and
peripheral devices. The JN5148 operates as a master on the SPI bus and all other devices connected to the SPI are
expected to be slave devices under the control of the JN5148 CPU. The SPI includes the following features:
• Full-duplex, three-wire synchronous data transfer
• Programmable bit rates (up to 16Mbit/s)
• Programmable transaction size up to 32-bits
• Standard SPI modes 0,1,2 and 3
• Manual or Automatic slave select generation (up to 5 slaves)
• Maskable transaction complete interrupt
• LSB First or MSB First Data Transfer
• Supports delayed read edges
Clock
Divider
SPI Bus
Cycle
Controller
Data Buffer
DIV
Clock Edge
Select
Data
CHAR_LEN
LSB
SPIMISO
SPIMOSI
SPICLK
Select
Latch
SPISEL [4..0]
16 MHz
Figure 23: SPI Block Diagram
The SPI bus employs a simple shift register data transfer scheme. Data is clocked out of and into the active devices
in a first-in, first-out fashion allowing SPI devices to transmit and receive data simultaneously.
There are three dedicated pins SPICLK, SPIMOSI, SPIMISO that are shared across all devices on the bus. MasterOut-Slave-In
or Master-In-Slave-Out data transfer is relative to the clock signal SPICLK generated by the JN5148.
The JN5148 provides five slave selects, SPISEL0 to SPISEL4 to allow five SPI peripherals on the bus. SPISEL0 is a
dedicated pin; this is generally connected to a serial Flash/ EEPROM memory holding application code that is
downloaded to internal RAM via software from reset. SPISEL1 to 4, are alternate functions of pins DIO0 to 3
respectively.
The interface can transfer from 1 to 32-bits without software intervention and can keep the slave select lines asserted
between transfers when required, to enable longer transfers to be performed.
When the device reset is active, the three outputs SPISEL, SPICLK and SPI_MOSI are tri-stated and SPI_MISO is
set to be an input. The pull-up resistors associated with all four pins will be active at this time. 36 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 SI
C
SO
SS
Slave 0
Flash/
EEPROM
Memory
JN5148
37
38
41
42
43
36
33
34
SI
C
SO
SS
Slave 1
User
Defined
SI
C
SO
SS
Slave 2
User
Defined
SI
C
SO
SS
Slave 3
User
Defined
SI
C
SO
SS
Slave 4
User
Defined
SPIMISO
SPIMOSI
SPICLK
SPISEL4
SPISEL2
SPISEL3
SPISEL1
SPISEL0
Figure 24: Typical JN5148 SPI Peripheral Connection
The data transfer rate on the SPI bus is determined by the SPICLK signal. The JN5148 supports transfers at
selectable data rates from 16MHz to 125kHz selected by a clock divider. Both SPICLK clock phase and polarity are
configurable. The clock phase determines which edge of SPICLK is used by the JN5148 to present new data on the
SPIMOSI line; the opposite edge will be used to read data from the SPIMISO line. The interface should be configured
appropriately for the SPI slave being accessed.
SPICLK
Mode Description
Polarity
(CPOL)
Phase
(CPHA)
0 0 0 SPICLK is low when idle – the first edge is positive.
Valid data is output on SPIMOSI before the first clock and changes every
negative edge. SPIMISO is sampled every positive edge.
0 1 1 SPICLK is low when idle – the first edge is positive.
Valid data is output on SPIMOSI every positive edge. SPIMISO is sampled every
negative edge.
1 0 2 SPICLK is high when idle – the first edge is negative.
Valid data is output on SPIMOSI before the first clock edge and is changed
every positive edge. SPIMISO is sampled every negative edge.
1 1 3 SPICLK is high when idle – the first edge is negative.
Valid data is output on SPIMOSI every negative edge. SPIMISO is sampled
every positive edge.
Table 3 SPI Configurations
If more than one SPISEL line is to be used in a system they must be used in numerical order starting from SPISEL0.
For instance if 3 SPI select lines are to be used, they must be SPISEL0, 1 and 2. A SPISEL line can be automatically
deasserted between transactions if required, or it may stay asserted over a number of transactions. For devices such
as memories where a large amount of data can be received by the master by continually providing SPICLK
transitions, the ability for the select line to stay asserted is an advantage since it keeps the slave enabled over the
whole of the transfer.
A transaction commences with the SPI bus being set to the correct configuration, and then the slave device is
selected. Upon commencement of transmission (1 to 32 bits) data is placed in the FIFO data buffer and clocked out,
at the same time generating the corresponding SPICLK transitions. Since the transfer is full-duplex, the same
number of data bits is being received from the slave as it transmits. The data that is received during this transmission
can be read (1 to 32 bits). If the master simply needs to provide a number of SPICLK transitions to allow data to be © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 37
sent from a slave, it should perform transmit using dummy data. An interrupt can be generated when the transaction
has completed or alternatively the interface can be polled.
If a slave device wishes to signal the JN5148 indicating that it has data to provide, it may be connected to one of the
DIO pins that can be enabled as an interrupt.
Figure 25 shows a complex SPI transfer, reading data from a FLASH device, that can be achieved using the SPI
master interface. The slave select line must stay low for many separate SPI accesses, and therefore manual slave
select mode must be used. The required slave select can then be asserted (active low) at the start of the transfer. A
sequence 8 and 32 bit transfers can be used to issue the command and address to the FLASH device and then to
read data back. Finally, the slave select can be deselected to end the transaction.
0 1 2 3 4 5 6 7
Instruction (0x03)
23 22 21 3 2 1 0
8 9 10 28 29 30 31
24-bit Address
MSB
Instruction Transaction
7 6 5 4 3 2 1 0
MSB
0 1 2 3 4 5 7 8N-1
3 2 1 0
LSB
Read Data Bytes Transaction(s) 1-N
SPISEL
SPICLK
SPIMOSI
SPIMISO
SPISEL
SPICLK
SPIMOSI
SPIMISO
8 9 10
7 6 5
MSB
Byte 1 Byte 2 Byte N
value unused by peripherals
6
Figure 25: Example SPI Waveforms – Reading from FLASH device using Mode 038 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
11 Timers
11.1 Peripheral Timer/Counters
Three general-purpose timer/counter units are available that can be independently configured to operate in one of
five possible modes. Timer 0 and 1 support all 5 modes of operation and Timer 2 supports PWM and Delta-Sigma
modes only. The timers have the following:
• 5-bit prescaler, divides system clock by 2 prescale value as the clock to the timer (prescaler range is 0 to 16)
• Clocked from internal system clock (16MHz)
• 16-bit counter, 16-bit Rise and Fall (period) registers
• Timer: can generate interrupts off Rise and Fall counts. Can be gated by external signal
• Counter: counts number of transitions on external event signal. Can use low-high, high-low or both
transitions
• PWM/Single pulse: outputs repeating Pulse Width Modulation signal or a single pulse. Can set period and
mark-space ratio
• Capture: measures times between transitions of an applied signal
• Delta-Sigma: Return-To-Zero (RTZ) and Non-Return-to-Zero (NRZ) modes
• Timer usage of external IO can be controlled on a pin by pin basis
Interrupt
Generator
Rise
Fall
Delta-Sigma
Counter
Reset Generator
=
Prescaler
INT
Int Enable
SYSCLK
S/w
Reset
System
Reset
Single
Shot
=
S
R
OE
Gate
Gate
Edge
Select
Reset
PWM/DeltaSigma
Capture
Generator
Capture
Enable
PWM/∆−Σ
PWM/∆−Σ
TIMxCK_GT
TIMxOUT
TIMxCAP
Figure 26: Timer Unit Block Diagram© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 39
The clock source for the timer unit is fed from the 16MHz system clock. This clock passes to a 5-bit prescaler where a
value of 0 leaves the clock unmodified and other values divide it by 2 prescale value. For example, a prescale value of
2 applied to the 16MHz system clock source results in a timer clock of 4MHz.
The counter is optionally gated by a signal on the clock/gate input (TIMxCK_GT). If the gate function is selected,
then the counter is frozen when the clock/gate input is high.
An interrupt can be generated whenever the counter is equal to the value in either of the High or Low registers.
The internal Output Enable (OE) signal enables or disables the timer output.
The Timer 0 signals CK_GT, CAP and OUT are alternate functions of pins DIO8, 9 and 10 respectively and Timer 1
signals CK_GT, CAP and OUT are alternate functions of pins DIO11, 12, and 13 respectively. Timer 2 OUT is an
alternate function of DIO11 If operating in timer mode it is not necessary to use any of the DIO pins, allowing the
standard DIO functionality to be available to the application.
Note, timer 0 may only be used as an internal timer or in counter mode (counting events) if an external 32kHz crystal
is used. If timer 2 is used in PWM or Delta-Sigma mode then timer 1 does not have access to its clock/gate pin.
Therefore, it can not operate in counter mode (counting events) or use the gate function.
11.1.1 Pulse Width Modulation Mode
Pulse Width Modulation (PWM) mode allows the user to specify an overall cycle time and pulse length within the
cycle. The pulse can be generated either as a single shot or as a train of pulses with a repetition rate determined by
the cycle time.
In this mode, the cycle time and low periods of the PWM output signal can be set by the values of two independent
16-bit registers (Fall and Rise). The counter increments and its output is compared to the 16-bit Rise and Fall
registers. When the counter is equal to the Rise register, the PWM output is set to high; when the counter reaches
the Fall value, the output returns to low. In continuous mode, when the counter reaches the Fall value, it will reset
and the cycle repeats. The PWM waveform is available on TIMxOUT when the output driver is enabled.
Rise
Fall
Figure 27: PWM Output Timings
11.1.2 Capture Mode
The capture mode can be used to measure the time between transitions of a signal applied to the capture input
(TIMxCAP). When the capture is started, on the next low-to-high transition of the captured signal, the count value is
stored in the Rise register, and on the following high-to-low transition, the counter value is stored in the Fall register.
The pulse width is the difference in counts in the two registers multiplied by the period of the prescaled clock. Upon
reading the capture registers the counter is stopped. The values in the High and Low registers will be updated
whenever there is a corresponding transition on the capture input, and the value stored will be relative to when the
mode was started. Therefore, if multiple pulses are seen on TIMxCAP before the counter is stopped only the last
pulse width will be stored.40 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
CLK
CAPT
x 9 3
x 14
t
RISE t
RISE
t
FALL t
FALL
Rise
Fall
9 5 3 4
7
Capture Mode Enabled
Figure 28: Capture Mode
11.1.3 Counter/Timer Mode
The counter/timer can be used to generate interrupts, based on the timers or event counting, for software to use. As
a timer the clock source is from the system clock, prescaled if required. The timer period is programmed into the Fall
register and the Fall register match interrupt enabled. The timer is started as either a single-shot or a repeating timer,
and generates an interrupt when the counter reaches the Fall register value.
When used to count external events on TIMxCK_GT the clock source is selected from the input pin and the number
of events programmed into the Fall register. The Fall register match interrupt is enabled and the counter started,
usually in single shot mode. An interrupt is generated when the programmed number of transitions is seen on the
input pin. The transitions counted can configured to be rising, falling or both rising and falling edges.
Edges on the event signal must be at least 100nsec apart, i.e. pulses must be wider than 100nsec.
11.1.4 Delta-Sigma Mode
A separate delta-sigma mode is available, allowing a low speed delta-sigma DAC to be implemented with up to 16-bit
resolution. This requires that a resistor-capacitor network is placed between the output DIO pin and digital ground. A
stream of pulses with digital voltage levels is generated which is integrated by the RC network to give an analogue
voltage. A conversion time is defined in terms of a number of clock cycles. The width of the pulses generated is the
period of a clock cycle. The number of pulses output in the cycle, together with the integrator RC values, will
determine the resulting analogue voltage. For example, generating approximately half the number of pulses that
make up a complete conversion period will produce a voltage on the RC output of VDD1/2, provided the RC time
constant is chosen correctly. During a conversion, the pulses will be pseudo-randomly dispersed throughout the
cycle in order to produce a steady voltage on the output of the RC network.
The output signal is asserted for the number of clock periods defined in the High register, with the total period being
216 cycles. For the same value in the High register, the pattern of pulses on subsequent cycles is different, due to the
pseudo-random distribution.
The delta-sigma convertor output can operate in a Return-To-Zero (RTZ) or a Non-Return-to-Zero (NRZ) mode. The
NRZ mode will allow several pulses to be output next to each other. The RTZ mode ensures that each pulse is
separated from the next by at least one period. This improves linearity if the rise and fall times of the output are
different to one another. Essentially, the output signal is low on every other output clock period, and the conversion
cycle time is twice the NRZ cycle time ie 217 clocks. The integrated output will only reach half VDD2 in RTZ mode,
since even at full scale only half the cycle contains pulses. Figure 29 and Figure 30 illustrate the difference between
RTZ and NRZ for the same programmed number of pulses.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 41
1 2 3 1 2 N
Conversion cycle 1
217
N
Conversion cycle 2
3
Figure 29: Return To Zero Mode in Operation
1 2 3 1 2 N
Conversion cycle 1
N 3
216 Conversion cycle 2
Figure 30: Non-Return to Zero Mode
11.1.5 Example Timer / Counter Application
Figure 31 shows an application of the JN5148 timers to provide closed loop speed control. Timer 0 is configured in
PWM mode to provide a variable mark-space ratio switching waveform to the gate of the NFET. This in turn controls
the power in the DC motor.
Timer 1 is configured to count the rising edge events on the clk/gate pin over a constant period. This converts the
tacho pulse stream output into a count proportional to the motor speed. This value is then used by the application
software executing the control algorithm.
If required for other functionality, then the unused IO associated with the timers could be used as general purpose
DIO.
JN5148
Timer 0
Timer 1
CLK/GATE
CLK/GATE
CAPTURE
CAPTURE
PWM
PWM
M Tacho
48
50
52
53
54
1N4007
+12V
IRF521 51
1 pulse/rev
Figure 31: Closed Loop PWM Speed Control Using JN5148 Timers
11.2 Tick Timer
The JN5148 contains a hardware timer that can be used for generating timing interrupts to software. It may be used
to implement regular events such as ticks for software timers or an operating system, as a high-precision timing
reference or can be used to implement system monitor timeouts as used in a watchdog timer. Features include:
• 32-bit counter42 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
• 28-bit match value
• Maskable timer interrupt
• Single-shot, Restartable or Continuous modes of operation
Match Value
Counter
=
Mode
Control
&
&
SysClk
Run
Match
Int
Enable
Tick Timer
Interrupt
Reset
Mode
Figure 32: Tick Timer
The Tick Timer is clocked from a continuous 16MHz clock, which is fed to a 32-bit wide resettable up-counter, gated
by a signal from the mode control block. A match register allows comparison between the counter and a
programmed value. The match value, measured in 16MHz clock cycles is programmed through software, in the
range 0 to 0x0FFFFFFF. The output of the comparison can be used to generate an interrupt if the interrupt is
enabled and used in controlling the counter in the different modes. Upon configuring the timer mode, the counter is
also reset.
If the mode is programmed as single shot, the counter begins to count from zero until the match value is reached.
The match signal will be generated which will cause an interrupt if enabled, and the counter will stop counting. The
counter is restarted by reprogramming the mode.
If the mode is programmed as restartable, the operation of the counter is the same as for the single shot mode,
except that when the match value is reached the counter is reset and begins counting from zero. An interrupt will be
generated when the match value is reached if it is enabled.
Continuous mode operation is similar to restartable, except that when the match value is reached, the counter is not
reset but continues to count. An interrupt will be generated when the match value is reached if enabled.
11.3 Wakeup Timers
Two 32-bit wakeup timers are available in the JN5148 driven from the 32kHz internal clock. They may run during
sleep periods when the majority of the rest of the device is powered down, to time sleep periods or other long period
timings that may be required by the application. The wakeup timers do not run during deep sleep and may optionally
be disabled in sleep mode through software control. When a wakeup timer expires it typically generates an interrupt,
if the device is asleep then the interrupt may be used as an event to end the sleep period. See Section 21 for further
details on how they are used during sleep periods. Features include:
• 35-bit down-counter
• Optionally runs during sleep periods
• Clocked by 32kHz system clock; either 32kHz RC oscillator, 32kHz XTAL oscillator or 32kHz clock input© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 43
A wakeup timer consists of a 35-bit down counter clocked from the selected 32 kHz clock. An interrupt or wakeup
event can be generated when the counter reaches zero. On reaching zero the counter will continue to count down
until stopped, which allows the latency in responding to the interrupt to be measured. If an interrupt or wakeup event
is required, the timer interrupt should be enabled before loading the count value for the period. Once the count value
is loaded and counter started, the counter begins to count down; the counter can be stopped at any time through
software control. The counter will remain at the value it contained when the timer was stopped and no interrupt will
be generated. The status of the timers can be read to indicate if the timers are running and/or have expired; this is
useful when the timer interrupts are masked. This operation will reset any expired status flags.
11.3.1 RC Oscillator Calibration
The RC oscillator that can be used to time sleep periods is designed to require very little power to operate and be
self-contained, requiring no external timing components and hence is lower cost. As a consequence of using on-chip
resistors and capacitors, the inherent absolute accuracy and temperature coefficient is lower than that of a crystal
oscillator, but once calibrated the accuracy approaches that of a crystal oscillator. Sleep time periods should be as
close to the desired time as possible in order to allow the device to wake up in time for important events, for example
beacon transmissions in the IEEE802.15.4 protocol. If the sleep time is accurate, the device can be programmed to
wake up very close to the calculated time of the event and so keep current consumption to a minimum. If the sleep
time is less accurate, it will be necessary to wake up earlier in order to be certain the event will be captured. If the
device wakes earlier, it will be awake for longer and so reduce battery life.
In order to allow sleep time periods to be as close to the desired length as possible, the true frequency of the RC
oscillator needs to be determined to better than the initial 30% accuracy. The calibration factor can then be used to
calculate the true number of nominal 32kHz periods needed to make up a particular sleep time. A calibration
reference counter, clocked from the 16MHz system clock, is provided to allow comparisons to be made between the
32kHz RC clock and the 16MHz system clock when the JN5148 is awake.
Wakeup timer0 counts for a set number of 32kHz clock periods during which time the reference counter runs. When
the wakeup timer reaches zero the reference counter is stopped, allowing software to read the number of 16MHz
clock ticks generated during the time represented by the number of 32kHz ticks programmed in the wakeup timer.
The true period of the 32kHz clock can thus be determined and used when programming a wakeup timer to achieve a
better accuracy and hence more accurate sleep periods
For a RC oscillator running at exactly 32,000Hz the value returned by the calibration procedure should be 10000, for
a calibration period of twenty 32,000Hz clock periods. If the oscillator is running faster than 32,000Hz the count will
be less than 10000, if running slower the value will be higher. For a calibration count of 9000, indicating that the RC
oscillator period is running at approximately 35kHz, to time for a period of 2 seconds the timer should be loaded with
71,111 ((10000/9000) x (32000 x 2)) rather than 64000.44 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
12 Pulse Counters
Two 16-bit counters are provided that can increment during all modes of operation (including sleep), based on pulses
received on 2 dedicated DIO inputs; DIO1 and DIO8. The pulses can be de-bounced using the 32kHz clock to guard
against false counting on slow or noisy edges. Increments occur from a configurable rising or falling edge on the
respective DIO input.
Each counter has an associated 16-bit reference that is loaded by the user. An interrupt (and wakeup event if
asleep) may be generated when a counter reaches its pre-configured reference value. The two counters may
optionally be cascaded together to provide a single 32-bit counter, linked to DIO1. The counters do not saturate at
65535, but naturally roll-over to 0. Additionally, the pulse counting continues when the reference value is reached
without software interaction so that pulses are not missed even if there is a long delay before an interrupt is serviced
or during the wakeup process.
The system can work with signals up to 100kHz, with no debounce, or from 5.3kHz to 1.7kHz with debounce. When
using debounce the 32kHz clock must be active, so for minimum sleep currents the debounce mode should not be
used.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 45
13 Serial Communications
The JN5148 has two independent Universal Asynchronous Receiver/Transmitter (UART) serial communication
interfaces. These provide similar operating features to the industry standard 16550A device operating in FIFO mode.
Each interface performs serial-to-parallel conversion on incoming serial data and parallel-to-serial conversion on
outgoing data from the CPU to external devices. In both directions, a 16-byte deep FIFO buffer allows the CPU to
read and write multiple characters on each transaction. This means that the CPU is freed from handling data on a
character-by-character basis, with the associated high processor overhead. The UARTs have the following features:
• Emulates behaviour of industry standard NS16450 and NS16550A UARTs
• 16 byte transmit and receive FIFO buffers reduce interrupts to CPU, with direct access to fill levels of each
• Adds / deletes standard start, stop and parity communication bits to or from the serial data
• Independently controlled transmit, receive, status and data sent interrupts
• Optional modem flow control signals CTS and RTS
• Fully programmable data formats: baud rate, start, stop and parity settings
• False start bit detection, parity, framing and FIFO overrun error detect and break indication
• Internal diagnostic capabilities: loop-back controls for communications link fault isolation
• Flow control by software or automatically by hardware Processor Bus
Divisor
Latch
Registers
Line
Status
Register
Line
Control
Register
FIFO
Control
Register
Receiver FIFO
Transmitter FIFO
Baud Generator
Logic
Transmitter Shift
Register
Receiver Shift
Register
Transmitter
Logic
Receiver
Logic
RXD
TXD
Modem
Control
Register
Modem
Status
Register Modem
Signals
Logic
RTS
CTS
Interrupt
ID
Register
Interrupt
Enable
Register
Interrupt
Logic
Internal
Interrupt
Figure 33: UART Block Diagram
The serial interface contains programmable fields that can be used to set number of data bits (5, 6,7 or 8), even, odd,
set-at-1, set-at-0 or no-parity detection and generation of single or multiple stop bit, (for 5 bit data, multiple is 1.5 stop
bits; for 6, 7 or 8 data bits, multiple is 2 bits).
The baud rate is programmable up to 1Mbps, standard baud rates such as 4800, 9600, 19.2k, 38.4k etc. can be
configured.
For applications requiring hardware flow control, two control signals are provided: Clear-To-Send (CTS) and RequestTo-Send
(RTS). CTS is an indication sent by an external device to the UART that it is ready to receive data. RTS is
an indication sent by the UART to the external device that it is ready to receive data. RTS is controlled from software,
while the value of CTS can be read. Monitoring and control of CTS and RTS is a software activity, normally
performed as part of interrupt processing. The signals do not control parts of the UART hardware, but simply indicate
to software the state of the UART external interface. Alternatively, the Automatic Flow Control mode can be set 46 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
where the hardware controls the value of the generated RTS (negated if the receive FIFO fill level is greater than a
programmable threshold of 8, 11, 13 or 15 bytes), and only transmits data when the incoming CTS is asserted.
Software can read characters, one byte at a time, from the Receive FIFO and can also write to the Transmit FIFO,
one byte at a time. The Transmit and Receive FIFOs can be cleared and reset independently of each other. The
status of the transmitter can be checked to see if it is empty, and if there is a character being transmitted. The status
of the receiver can also be checked, indicating if conditions such as parity error, framing error or break indication
have occurred. It also shows if an overrun error occurred (receive buffer full and another character arrives) and if
there is data held in the receive FIFO.
UART 0 signals CTS, RTS, TXD and RXD are alternate functions of pins DIO4, 5, 6 and 7 respectively and UART 1
signals CTS, RTS, TXD and RXD are alternate functions of pins DIO17, 18, 19 and 20 respectively. If CTS and RTS
are not required on the devices external pins, then they may be disabled, this allows the DIOx function to be used for
other purposes.
Note: With the automatic flow control threshold set to 15, the hardware flow control within the UART block negates
RTS when the receive FIFO is about to become full. In some instances it has been observed that remote devices that
are transmitting data do not respond quickly enough to the de-asserted CTS and continue to transmit data. In these
instances the data will be lost in a receive FIFO overflow.
13.1 Interrupts
Interrupt generation can be controlled for the UART block, and is divided into four categories:
• Received Data Available: Is set when data in the Rx FIFO queue reaches a particular level (the trigger level can
be configured as 1, 4, 8 or 14) or if no character has been received for 4 character times.
• Transmit FIFO Empty: set when the last character from the Tx FIFO is read and starts to be transmitted.
• Receiver Line Status: set when one of the following occur (1) Parity Error - the character at the head of the
receive FIFO has been received with a parity error, (2) Overrun Error - the Rx FIFO is full and another character
has been received at the Receiver shift register, (3) Framing Error - the character at the head of the receive
FIFO does not have a valid stop bit and (4) Break Interrupt – occurs when the RxD line has been held low for an
entire character.
• Modem Status: Generated when the CTS (Clear To Send) input control line changes.
13.2 UART Application
The following example shows the UART connected to a 9-pin connector compatible with a PC. As the JN5148
device pins do not provide the RS232 line voltage, a level shifter is used.
JN5148
RTS
CTS
TXD
UART0 RXD
RS232
Lev el
Shif ter
1
2
3
4
5
6
7
8
9
CD
RD
TD
DTR
SG
DSR
RTS
CTS
RI
PC COM Port
1 5 Pin Signal
6 9
46
47
45
44
Figure 34: JN5148 Serial Communication Link© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 47
14 JTAG Debug Interface
The JN5148 includes an IEEE1149.1 compliant JTAG port for the sole purpose of software code debug with NXP's
Software Developer’s Kit. The JTAG interface is disabled by default and is enabled under software control.
Therefore, debugging is only possible if enabled by the application. Once enabled, the application executes as
normal until the external debugger controller initiates debug activity.
The Debugger supports breakpoints and watchpoints based on four comparisons between any of program counter,
load/store effective address and load/store data. There is the ability to chain the comparisons together. There is also
the ability, under debugger control to perform the following commands: go, stop, reset, step over/into/out/next, run to
cursor and breakpoints. In addition, under control of the debugger, it is possible to:
• Read and write registers on the wishbone bus
• Read ROM and RAM, and write to RAM
• Read and write CPU internal registers
The Debugger interface is accessed, depending upon the configuration, through the pins used for UART0 or UART1.
This is enabled under software control and is dealt with in JN-AN-1118 JN5148 Application Debugging [4]. The
following table details which DIO are used for the JTAG interface depending upon the configuration.
Signal DIO Assignment
UART0 pins UART1 pins
clock (TCK) 4 17
control (TMS) 5 18
data out (TDO) 6 19
data in (TDI) 7 20
Table 4 Hardware Debugger IO
If doze mode is active when debugging is started, the processor will be woken and then respond to debugger
commands. It is not possible to wake the device from sleep using the debug interface and debugging is not available
while the device is sleeping.
When using the debug interface, program execution is halted, and control of the CPU is handed to the debugger. The
watchdog, tick timer and the three timers described in section 11 are stalled while the debugger is in control of the
CPU.
When control is handed from the CPU to the debugger or back a small number of CPU clock cycles are taken
flushing or reloading the CPU pipeline. Because of this, when a program is halted by the debugger and then restarted
again, a small number of tick timer cycles will elapse.
It is possible to prevent all hardware debugging by blowing the relevant Efuse bit.
The JTAG interface does not support boundary scan testing. It is recommended that the JN5148 is not connected as
part of the board scan chain.48 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
15 Two-Wire Serial Interface
The JN5148 includes industry standard two-wire synchronous Serial Interface operates as a Master (MSIF) or Slave
(SSIF) that provides a simple and efficient method of data exchange between devices. The system uses a serial data
line (SIF_D) and a serial clock line (SIF_CLK) to perform bi-directional data transfers and includes the following
features:
Common to both master and slave:
• Compatible with both I2
C and SMbus peripherals
• Support for 7 and 10-bit addressing modes
• Optional pulse suppression on signal inputs
Master only:
• Multi-master operation
• Software programmable clock frequency
• Clock stretching and wait state generation
• Software programmable acknowledge bit
• Interrupt or bit-polling driven byte-by-byte data-transfers
• Bus busy detection
Slave only:
• Programmable slave address
• Simple byte level transfer protocol
• Write data flow control with optional clock stretching or acknowledge mechanism
• Read data preloaded or provided as required
15.1 Connecting Devices
The clock and data lines, SIF_D and SIF_CLK, are alternate functions of DIO15 and DIO14 respectively. The serial
interface function of these pins is selected when the interface is enabled. They are both bi-directional lines,
connected internally to the positive supply voltage via weak (45kΩ) programmable pull-up resistors. However, it is
recommended that external 4.7kΩ pull-ups be used for reliable operation at high bus speeds, as shown in Figure 35.
When the bus is free, both lines are HIGH. The output stages of devices connected to the bus must have an opendrain
or open-collector in order to perform the wired-AND function. The number of devices connected to the bus is
solely dependent on the bus capacitance limit of 400pF.
SIF_CLK
SIF_D
VDD
D1_OUT
D1_IN CLK1_IN
CLK1_OUT
D2_IN CLK2_IN
CLK2_OUT
DEVICE 1 DEVICE 2
RP RP Pullup
Resistors
D2_OUT
JN5148
SIF
DIO14
DIO15
Figure 35: Connection Details© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 49
15.2 Clock Stretching
Slave devices can use clock stretching to slow down the transfer bit rate. After the master has driven SIF_CLK low,
the slave can drive SIF_CLK low for the required period and then release it. If the slave’s SIF_CLK low period is
greater than the master’s low period the resulting SIF_CLK bus signal low period is stretched thus inserting wait
states.
SIF_CLK
SIF_CLK
SIF_CLK
Master SIF_CLK
Slave SIF_CLK
Wired-AND SIF_CLK
Clock held low
by Slave
Figure 36: Clock Stretching
15.3 Master Two-wire Serial Interface
When operating as a master device, it provides the clock signal and a prescale register determines the clock rate,
allowing operation up to 400kbit/s.
Data transfer is controlled from the processor bus interface at a byte level, with the processor responsible for
indicating when start, stop, read, write and acknowledge control should be generated. Write data written into a
transmit buffer will be written out across the two-wire interface when indicated, and read data received on the
interface is made available in a receive buffer. Indication of when a particular transfer has completed may be
indicated by means of an interrupt or by polling a status bit.
The first byte of data transferred by the device after a start bit is the slave address. The JN5148 supports both 7-bit
and 10-bit slave addresses by generating either one or two address transfers. Only the slave with a matching address
will respond by returning an acknowledge bit.
The master interface provides a true multi-master bus including collision detection and arbitration that prevents data
corruption. If two or more masters simultaneously try to control the bus, a clock synchronization procedure
determines the bus clock. Because of the wired-AND connection of the interface, a high-to-low transition on the bus
affects all connected devices. This means a high-to-low transition on the SIF_CLK line causes all concerned devices
to count off their low period. Once the clock input of a device has gone low, it will hold the SIF_CLK line in that state
until the clock high state is reached when it releases the SIF_CLK line. Due to the wired-AND connection, the
SIF_CLK line will therefore be held low by the device with the longest low period, and held high by the device with the
shortest high period.
SIF_CLK1
SIF_CLK2
SIF_CLK
Master1 SIF_CLK
Master2 SIF_CLK
Wired-AND SIF_CLK
Start counting
low period
Start counting
high period
Wait
State
Figure 37: Multi-Master Clock Synchronisation
After each transfer has completed, the status of the device must be checked to ensure that the data has been
acknowledged correctly, and that there has been no loss of arbitration. (N.B. Loss of arbitration may occur at any
point during the transfer, including data cycles). An interrupt will be generated when arbitration has been lost.50 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
15.4 Slave Two-wire Serial Interface
When operating as a slave device, the interface does not provide a clock signal, although it may drive the clock signal
low if it is required to apply clock stretching.
Only transfers whose address matches the value programmed into the interface’s address register are accepted. The
interface allows both 7 and 10 bit addresses to be programmed, but only responds with an acknowledge to a single
address. Addresses defined as “reserved” will not be responded to, and should not be programmed into the address
register. A list of reserved addresses is shown in Table 5.
Address Name Behaviour
0000 000 General Call/Start Byte Ignored
0000 001 CBUS address Ignored
0000 010 Reserved Ignored
0000 011 Reserved Ignored
0000 1XX Hs-mode master code Ignored
1111 1XX Reserved Ignored
1111 0XX 10-bit address Only responded to if 10 bit address
set in address register
Table 5 : List of two-wire serial interface reserved addresses
Data transfer is controlled from the processor bus interface at a byte level, with the processor responsible for taking
write data from a receive buffer and providing read data to a transmit buffer when indicated. A series of interrupt
status bits are provided to control the flow of data.
For writes, in to the slave interface, it is important that data is taken from the receive buffer by the processor before
the next byte of data arrives. To enable this, the interface may be configured to work in two possible backoff modes:
• Not Acknowledge mode – where the interface returns a Not Acknowledge (NACK) to the master if more data
is received before the previous data has been taken. This will lead to the termination of the current data
transfer.
• Clock Stretching mode – where the interface holds the clock line low until the previous data has been taken.
This will occur after transfer of the next data but before issuing an acknowledge
For reads, from the slave interface, the data may be preloaded into the transmit buffer when it is empty (i.e. at the
start of day, or when the last data has been read), or fetched each time a read transfer is requested. When using data
preload, read data in the buffer must be replenished following a data write, as the transmit and received data is
contained in a shared buffer. The interface will hold the bus using clock stretching when the transmit buffer is empty.
Interrupts may be triggered when:
• Data Buffer read data is required – a byte of data to be read should be provided to avoid the interface from
clock stretching
• Data Buffer read data has been taken – this indicates when the next data may be preloaded into the data
buffer
• Data Buffer write data is available – a byte of data should be taken from the data buffer to avoid data backoff
as defined above
• The last data in a transfer has completed – i.e. the end of a burst of data, when a Stop or Restart is seen
• A protocol error has been spotted on the interface© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 51
16 Four-Wire Digital Audio Interface
The JN5148 includes a four-wire digital audio interface that can be used for interfacing to audio CODECs. The
following features are supported:
• Compatible with the industry standard I²S interface
• Option to support I²S, left justified and right justified modes
• Optional support for connection to mono sample FIFO with data transferred on the left or right channel
• Master only
• Transmit on falling edge and receive on rising edge
• Up to 8MHz maximum clock range
• Maximum system size of 32-bits, allowing up to 16-bits per channel (left or right channels)
• Option for pad bit insertion, allowing length of transfer per channel to be anything from 16 to 32 bits
• Data Transfer size range of 1 to 16-bits per channel
• Option to invert WS (normally 0 for left, but allow 1 for left instead)
• Continuous clock output option to support CODECs which use it as a clock source
• Separate input and output data lines
• Option to invert idle state of WS (to indicate left or right)
The Word Select (WS), Data In (SDIN), Clock (SCK) and Data Out (SDOUT) lines are alternate functions of DIO
lines 12,13,17 and 18 respectively.
Data transfer is always bidirectional. Data placed in the Data Buffer before a transfer command is issued will be
transmitted on SDOUT whilst the data received on SDIN will be placed in the Data Buffer at the end of the transfer.
Indication that a transfer has completed is by means of an interrupt or by polling a status bit.
Left channel data is always sent first, with MSB first on each channel. The interface will always transfer both left and
right channel data. For mono data transfer, the user should pad out the unused channel with 0’s, and ignore any data
returned on the unused channel.
The length of a data transfer is derived as follows:
• When padding is disabled – Data Transfer Length = 2 x Data Transfer Size
• When padding is enabled – Data Transfer Length = 2 x (16 + Extra Pad Length)
Timing of the 3 main modes is shown in Figure 38, Figure 39 and Figure 40. The Data Buffer shows how the data is
stored and how it will be transferred onto the interface. SD Max Size indicates how the maximum transfer size (16
with no additional padding) will transfer, whilst SD 3-bits indicates how 3 bits of data will be aligned when padding is
enabled. Received data in the Data Buffer will always be padded out with 0’s if the Data Transfer Size is less than 16-
bits, and any bits received beyond 16-bits when extra padding is used, will be discarded. In the examples, the polarity
of WS is shown with Left channel = 0, and the idle state is Right Channel. 52 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
Data Buffer Right R2 R1 R0 Left L2 L1 L0
SCK
WS
SD Max Size
SD 3-bits
MSB LSB MSB LSB
Left Right
L2 L1 L0 0 R2 R1 R0
MSB-1 MSB-2 MSB-1 MSB-2
0 0 0
Figure 38: I²S Mode
Data Buffer Right R2 R1 R0 Left L2 L1 L0
SCK
WS
SD Max Size
SD 3-bits
MSB LSB MSB LSB
Left Right
L2 L1 L0 0 R2 R1 R0
MSB-1 MSB-2 MSB-1 MSB-2
0 0 0
Figure 39: Left Justified Mode
Data Buffer Right R2 R1 R0 Left L2 L1 L0
SCK
WS
SD Max Size
SD 3-bits
MSB LSB MSB LSB
Left Right
0 L2 L1 L0 R2 R1 R0
MSB-1 MSB-1
0 0 0
Figure 40: Right Justified Mode© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 53
17 Random Number Generator
A random number generator is provided which creates a 16-bit random number each time it is invoked. Consecutive
calls can be made to build up any length of random number required. Each call takes approximately 0.25msec to
complete. Alternatively, continuous generation mode can be used where a new number is generated approximately
every 0.25msec. In either mode of operation an interrupt can be generated to indicate when the number is available,
or a status bit can be polled.
The random bits are generated by sampling the state of the 32MHz clock every 32kHz system clock edge. As these
clocks are asynchronous to each other, each sampled bit is unpredictable and hence random.54 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
18 Sample FIFO
A 10 deep FIFO is provided to buffer data between the CPU and either the four-wire digital audio interface or the
DAC/ ADC. It supports single channel input and output data, up to 16 bits wide. When used it can reduce the rate at
which the processor has to generate/process data, and this may allow more efficient operation. Interrupts can be
generated based on fill levels and also FIFO empty and full conditions. Normal configuration of the digital audio
interface or the DAC/ ADC is still required when accessing the data via the FIFO.
When used with the DAC / ADC functions a timing signal is generated by the DAC/ ADC functions to control the
transfer of data to and from the FIFO and the analogue peripherals. The transfers will occur at the sample rate
configured within the DAC / ADC functions.
When the FIFO is linked to the four-wire digital audio interface, timer 2 must be used to generate an internal timing
signal to control the flow of data across the interface. The timer does not require any external pins to be enabled. The
timer should be set up to produce a PWM output with a rising edge generated every time a digital audio transfer is
required. The transfer rate is typically configured to be the audio sample rate, e.g. 8kHz. If the transfer rate is too fast
or slow data will be transferred correctly between the FIFO and the digital audio block.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 55
19 Intelligent Peripheral Interface
The Intelligent Peripheral (IP) Interface is provided for systems that are more complex, where there is a processor
that requires a wireless peripheral. As an example, the JN5148 may provide a complete JenNet or ZigBee PRO
wireless network interface to a phone, computer, PDA, set-top box or games console. No resources are required from
the main processor compared to a transceiver as the complete wireless protocol may be run on the internal JN5148
CPU. The wireless peripheral may be controlled via one of the UARTs but the IP interface is intended to provide a
high-speed, low-processor-overhead interface.
The intelligent peripheral interface is a SPI slave interface and uses pins shared with other DIO signals. The
interface is designed to allow message passing and data transfer. Data received and transmitted on the IP interface
is copied directly to and from a dedicated area of memory without intervention from the CPU. This memory area, the
intelligent peripheral memory block, contains 64 32-bit word receive and transmit buffers.
JN5148
Intelligent
Peripheral
Interface SPI
MASTER
System Processor
(e.g. in cellphone, computer)
CPU
IP_DO SPIMISO
IP_INT SPIINT
IP_DI SPIMOSI
IP_SEL SPISEL
IP_CLK SPICLK
Figure 41: Intelligent Peripheral Connection
The interface functions as a SPI slave. It is possible to select the clock edge of IP_CLK on which data on the IP_DIN
line of the interface is sampled, and the state of data output IP_DOUT is changed. The order of transmission is MSB
first. The IP_DO data output is tri-stated when the device is inactive, i.e. the device is not selected via IP_SEL. An
interrupt output line IP_INT is available so that the JN5148 can indicate to an external master that it has data to
transfer. The interface can be clocked at up to 8MHz
The IP interface signals IP_CLK, IP_DO, IP_DI, IP_SEL, IP_INT are alternate functions of pins DIO14 to 18
respectively.
19.1 Data Transfer Format
Transfers are started by the remote processor asserting the IP_SEL line and terminated by the remote processor deasserting
IP_SEL.
Data transfers are bi-directional and traffic in both directions has a format of status byte, data length byte (of the
number of 32-bit words to transfer) and data packet (from the receive and transmit buffers), as shown in Figure 42
The first byte transferred into the JN5148 is a status byte with the format shown in Table 6. This is followed by a
padding byte that should be set to zero. The first byte output by the JN5148 is a padding byte, that should be ignored,
followed by a status byte with the format shown in Table 6
Bit Field Description
7:2 RSVD Reserved, set to 0
1 TXQ 1: Data queued for transmission
0 RXRDY 1: Buffer ready to receive data
Table 6: IP Status Byte Format56 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
If data is queued for transmission and the recipient has indicated that they are ready for it (RXRDY in incoming status
byte was 1), the next byte to be transmitted is the data length in words (N). If either the JN5148 or the remote
processor has no data to transfer, then the data length should be set to zero. The transaction can be terminated by
the master after the status and padding bytes have been sent if it is not possible to send data in either direction. This
may be because neither party has data to send or because the receiver does not have a buffer available. If the data
length is non-zero, the data in the JN5148 transmit memory buffer is sent, beginning at the start of the buffer. At the
same time that data bytes are being sent from the transmit buffer, the JN5148 receive buffer is being filled with
incoming data, beginning from the start of the buffer.
The remote processor, acting as the master, must determine the larger of its incoming or outgoing data transfers and
deassert IP_SEL when all of the transmit and receive data has been transferred. The data is transferred into or out of
the buffers starting from the lowest address in the buffer, and each word is assembled with the MSB first on the serial
data lines. Following a transaction, IP_SEL must be high (deasserted) for at least 400nsec before a further
transaction can begin.
IP_SEL
IP_CLK
IP_DI Status (8-bit) N words of data
IP_DO
data length or 0s (8-bit)
padding (8-bit) Status (8-bit) data length or 0s (8-bit) N words of data
padding (8-bit)
Figure 42: Intelligent Peripheral Data Transfer Waveforms
The N words of data transferred on the interface are also formatted. The first three bytes, of the first word, must be
zero. These are followed by a one byte length field that must be one less than the data length shown in the data
length field in Figure 42, i.e. N-1. Following this are the (N-1) words of data.
The application running on the JN5148 has high level software functions for sending and receiving data on this
interface. The function of generating and interpreting the individual bytes on the interface is handled by hardware
within the device. The remote processor must generate, and interpret, the signals in the interface. For instance, this
may be done with a configurable SPI master interface.
19.2 JN5148 (Slave) Initiated Data Transfer
To send data, the data is written into either buffer 0 or 1 of the intelligent peripheral memory area. Then the buffer
number is written together with the data length. If the call is successful, the interrupt line IP_INT will signal to the
remote processor that there is a message ready to be sent from the JN5148. When a remote processor starts a
transfer to the JN5148 by deasserting IP_SEL, then IP_INT is deasserted. If the transfer is unsuccessful and the
data is not output then IP_INT is reasserted after the transfer to indicate that data is still waiting to be sent.
The interface can be configured to generate an internal interrupt whenever a transaction completes (for example
IP_SEL becomes inactive after a transfer starts). It is also possible to mask the interrupt. The end of the
transmission can be signalled by an interrupt, or the interface can be polled.
To receive data the interface must be firstly initialised and when this is done, the bit RXRDY sent in the status byte
from the IP block will show that data can be received by the JN5148. Successful data arrival can be indicated by an
interrupt, or the interface can be polled. IP_INT is asserted if the JN5148 is configured to be able to receive, and the
remote processor has previously attempted to send data but the RXRDY indicated that it could not be sent.
To send and receive at the same time, the transmit and receive buffers must be set to be different.
19.3 Remote (Master) Processor Initiated Data Transfer
The remote processor (master) must initiate a transfer to send data to the JN5148 (slave) by asserting the slave
select pin, IP_SEL, and generating its status byte on IP_DI with TXRDY set. After receiving the status byte from the
JN5148, the master should check that the JN5148 has a buffer ready by reading the RXRDY bit of the received
status byte. If the RXRDY bit is 0 indicating that the JN5148 cannot accept data, it must terminate the transfer by
deasserting IP_SEL unless it is receiving data from the JN5148. If the RXRDY bit is 1, indicating that the JN5148 can
accept data, then the master should generate a further 8 clocks on IP_CLK in order to transfer its own message
length on IP_DI. The master must continue clocking the interface until sufficient clocks have been generated to send © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 57
all the data specified in the length field to the JN5148. The master must then deassert IP_SEL to show the transfer
is complete.
The master may initiate a transfer to read data from the JN5148 by asserting the slave select pin, IP_SEL, and
generating its status byte on IP_DI with RXRDY set. After receiving the status byte from the JN5148, it should check
that the JN5148 has a buffer ready by reading the TXRDY bit of the received status byte. If the TXRDY bit is 0,
indicating that the JN5148 does not have data to send, it must terminate the transfer by deasserting IP_SEL unless it
is transmitting data to the JN5148. If the TXRDY bit is 1, indicating that the JN5148 can send data, then the master
must generate a further 8 clocks on IP_CLK in order to receive the message length on IP_DO. The master must
continue clocking the interface until sufficient clocks have been generated to receive all the data specified in the
length field from the JN5148. The master should then deassert IP_SEL to show the transfer is complete.
Data can be sent in both directions at once and the master must ensure both transfers have completed before
deasserting IP_SEL.58 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
20 Analogue Peripherals
The JN5148 contains a number of analogue peripherals allowing the direct connection of a wide range of external
sensors, switches and actuators.
ADC
DAC1
DAC2
VREF
Chip
Boundary
Internal Reference
Processor Bus
Supply Voltage
(VDD1)
Vref select
Temp
Sensor
Comparator 2
Comparator 1
COMP2M
COMP1M
COMP1P
COMP2P
DAC1
DAC2
ADC1
ADC2
ADC3
ADC4
Vref
Figure 43: Analogue Peripherals
In order to provide good isolation from digital noise, the analogue peripherals are powered by a separate regulator,
supplied from the analogue supply VDD1 and referenced to analogue ground VSSA.
A common reference Vref for the ADC and DAC can be selected between an internal bandgap reference or an
external voltage reference supplied to the VREF pin. Gain settings for the ADC and DAC are independent of each
other.
The ADC and DAC are clocked from a common clock source derived from the 16MHz clock© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 59
20.1 Analogue to Digital Converter
The 12-bit analogue to digital converter (ADC) uses a successive approximation design to perform high accuracy
conversions as typically required in wireless sensor network applications. It has six multiplexed single-ended input
channels: four available externally, one connected to an internal temperature sensor, and one connected to an
internal supply monitoring circuit.
20.1.1 Operation
The input range of the ADC can be set between 0V to either the reference voltage or twice the reference voltage.
The reference can be either taken from the internal voltage reference or from the external voltage applied to the
VREF pin. For example, an external reference of 1.2V supplied to VREF may be used to set the ADC range between
0V and 2.4V.
VREF Gain Setting Maximum Input Range Supply Voltage Range (VDD)
1.2V
1.6V
1.2V
1.6V
0
0
1
1
1.2V
1.6V
2.4V
3.2V
2.2V - 3.6V
2.2V - 3.6V
2.6V - 3.6V
3.4V - 3.6V
Table 7 ADC/DAC Maximum Input Range
The input clock to the ADC is 16MHz and can be divided down to 2MHz, 1MHz, 500kHz and 250kHz. During an ADC
conversion the selected input channel is sampled for a fixed period and then held. This sampling period is defined as
a number of ADC clock periods and can be programmed to 2, 4, 6 or 8. The conversion rate is ((3 x Sample period)
+ 14) clock periods. For example for 500kHz conversion with sample period of 2 will be (3 x 2) + 14 = 20 clock
periods, 40usecs or 25kHz. . The ADC can be operated in either a single conversion mode or alternatively a new
conversion can be started as soon as the previous one has completed, to give continuous conversions.
If the source resistance of the input voltage is 1kΩ or less, then the default sampling time of 2 clocks should be used.
The input to the ADC can be modelled as a resistor of 5kΩ(typ) and 10kΩ (max) to represent the on-resistance of the
switches and the sampling capacitor 8pF. The sampling time required can then be calculated, by adding the sensor
source resistance to the switch resistance, multiplying by the capacitance giving a time constant. Assuming normal
exponential RC charging, the number of time constants required to give an acceptable error can be calculated, 7 time
constants gives an error of 0.1%, so for 12-bit accuracy 10 time constants should be the target. For a source with
zero resistance, 10 time constants is 800 nsecs, hence the smallest sampling window of 2 clock periods can be used.
ADC
pin
5 K
8 pF
Sample
Switch
ADC
front
end
Figure 44 ADC Input Equivalent Circuit
The ADC sampling period, input range and mode (single shot or continuous) are controlled through software.
When the ADC conversion is complete, an interrupt is generated. Alternatively the conversion status can be polled.
When operating in continuous mode, it is recommended that the interrupt is used to signal the end of a conversion,
since conversion times may range from 10 to 152 µsecs. Polling over this period would be wasteful of processor
bandwidth.
To facilitate averaging of the ADC values, which is a common practice in microcontrollers, a dedicated accumulator
has been added, the user can define the accumulation to occur over 2,4,8 or 16 samples. The end of conversion 60 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
interrupt can be modified to occur at the end of the chosen accumulation period, alternatively polling can still be used.
Software can then be used to apply the appropriate rounding and shifting to generate the average value, as well as
setting up the accumulation function.
For detailed electrical specifications, see section 22.3.8.
20.1.2 Supply Monitor
The internal supply monitor allows the voltage on the analogue supply pin VDD1 to be measured. This is achieved
with a potential divider that reduces the voltage by a factor of 0.666, allowing it to fall inside the input range of the
ADC when set with an input range twice the internal voltage reference. The resistor chain that performs the voltage
reduction is disabled until the measurement is made to avoid a continuous drain on the supply.
20.1.3 Temperature Sensor
The on chip temperature sensor can be used either to provide an absolute measure of the device temperature or to
detect changes in the ambient temperature. In common with most on chip temperature sensors, it is not trimmed and
so the absolute accuracy variation is large; the user may wish to calibrate the sensor prior to use. The sensor forces
a constant current through a forward biased diode to provide a voltage output proportional to the chip die temperature
which can then be measured using the ADC. The measured voltage has a linear relationship to temperature as
described in section 22.3.15.
Because this sensor is on chip, any measurements taken must account for the thermal time constants. For example,
if the device just came out of sleep mode the user application should wait until the temperature has stabilised before
taking a measurement.
20.2 Digital to Analogue Converter
The Digital to Analogue Converter (DAC) provides two output channels and is capable of producing voltages of 0 to
Vref or 0 to 2Vref where Vref is selected between the internal reference and the VREF pin, with a resolution of 12-bits
and a minimum conversion time of 10µsecs (2MHz clock).
20.2.1 Operation
The output range of each DAC can be set independently to swing between 0V to either the reference voltage or twice
the reference voltage. The reference voltage is selected from the internal reference or the VREF pin. For example,
an external reference of 0.8V supplied to VREF may be used to set DAC1 maximum output of 0.8V and DAC2
maximum output of 1.6V.
The DAC output amplifier is capable of driving a capacitive load up to that specified in section 22.3.9
Programmable clock periods allow a trade-off between conversion speed and resolution. The full 12-bit resolution is
achieved with the 250kHz clock rate. See section 22.3.9 electrical characteristics, for more details.
The conversion period of the DACs are given by the same formula as the ADC conversion time and so can vary
between 10 and 152uS. The DAC values may be updated at the same time as the ADC is active.
The clock divider ratio, interrupt enable and reference voltage select are all controlled through software, options
common to both the ADC and DAC. The DAC output range and initial value can be set and the subsequent updates
provided by updating only the DAC value. Polling is available to determine if a DAC channel is busy performing a
conversion. The DAC can be disabled which will power down the DAC cell.
Simultaneous conversions with DAC1 and DAC2 are possible. To use both DACs at the same time it is only
necessary to enable them and supply the digital values via the software. The DACs should not be used in single shot
mode, but continuous conversion mode only, in order to maintain a steady output voltage. © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 61
20.3 Comparators
The JN5148 contains two analogue comparators COMP1 and COMP2 that are designed to have true rail-to-rail
inputs and operate over the full voltage range of the analogue supply VDD1. The hysteresis level (common to both
comparators) can be set to a nominal value of 0mV, 10mV, 20mV or 40mV. In addition, the source of the negative
input signal for each comparator (COMP1M and COMP2M) can be set to the internal voltage reference, the output of
DAC1 or DAC2 (COMP1 or COMP2 respectively) or the appropriate external pin. The comparator outputs are routed
to internal registers and can be polled, or can be used to generate interrupts. The comparators can be disabled to
reduce power consumption.
The comparators have a low power mode where the response time of the comparator is slower than normal and is
specified in section 22.3.10. This mode may be used during non-sleep operation however it is particularly useful in
sleep mode to wake up the JN5148 from sleep where low current consumption is important. The wakeup action and
the configuration for which edge of the comparator output will be active are controlled through software. In sleep
mode the negative input signal source, must be configured to be driven from the external pins.62 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
21 Power Management and Sleep Modes
21.1 Operating Modes
Three operating modes are provided in the JN5148 that enable the system power consumption to be controlled
carefully to maximise battery life.
• Active Processing Mode
• Sleep Mode
• Deep Sleep Mode
The variation in power consumption of the three modes is a result of having a series of power domains within the chip
that may be controllably powered on or off.
21.1.1 Power Domains
The JN5148 has the following power domains:
• VDD Supply Domain: supplies the wake-up timers and controller, DIO blocks, Comparators, 32kHz RC and
crystal oscillators. This domain is driven from the external supply (battery) and is always powered. The wake-up
timers and controller, and the 32kHz RC and crystal oscillators may be powered on or off in sleep mode through
software control.
• Digital Logic Domain: supplies the digital peripherals, CPU, ROM, Baseband controller, Modem and Encryption
processor. It is powered off during sleep mode.
• Analogue Domain: supplies the ADC, DACs and the temperature sensor. It is powered off during sleep mode
and may be powered on or off in active processing mode through software control.
• RAM Domain: supplies the RAM during sleep mode to retain the memory contents. It may be powered on or off
for sleep mode through software control.
• Radio Domain: supplies the radio interface. It is powered during transmit and receive and controlled by the
baseband processor. It is powered off during sleep mode.
The current consumption figures for the different modes of operation of the device is given in section 22.2.2.
21.2 Active Processing Mode
Active processing mode in the JN5148 is where all of the application processing takes place. By default, the CPU will
execute at the selected clock speed executing application firmware. All of the peripherals are available to the
application, as are options to actively enable or disable them to control power consumption; see specific peripheral
sections for details.
Whilst in Active processing mode there is the option to doze the CPU but keep the rest of the chip active; this is
particularly useful for radio transmit and receive operations, where the CPU operation is not required therefore saving
power.
21.2.1 CPU Doze
Whilst in doze mode, CPU operation is stopped but the chip remains powered and the digital peripherals continue to
run. Doze mode is entered through software and is terminated by any interrupt request. Once the interrupt service
routine has been executed, normal program execution resumes. Doze mode uses more power than sleep and deep
sleep modes but requires less time to restart and can therefore be used as a low power alternative to an idle loop.
Whilst in CPU doze the current associated with the CPU is not consumed, therefore the basic device current is
reduced as shown in the figures in section 22.2.2.1.
21.3 Sleep Mode
The JN5148 enters sleep mode through software control. In this mode most of the internal chip functions are
shutdown to save power, however the state of DIO pins are retained, including the output values and pull-up enables, © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 63
and this therefore preserves any interface to the outside world. The DAC outputs are placed into a high impedance
state.
When entering into sleep mode, there is an option to retain the RAM contents throughout the sleep period. If the
wakeup timers are not to be used for a wakeup event and the application does not require them to run continually,
then power can be saved by switching off the 32kHz oscillator if selected as the system clock through software
control. The oscillator will be restarted when a wakeup event occurs.
Whilst in sleep mode one of four possible events can cause a wakeup to occur: transitions on DIO inputs, expiry of
wakeup timers, pulse counters maturing or comparator events. If any of these events occur, and the relevant
interrupt is enabled, then an interrupt is generated that will cause a wakeup from sleep. It is possible for multiple
wakeup sources to trigger an event at the same instant and only one of them will be accountable for the wakeup
period. It is therefore necessary in software to remove all other pending wakeup events prior to requesting entry back
into sleep mode; otherwise, the device will re-awaken immediately.
When wakeup occurs, a similar sequence of events to the reset process described in section 6.1 happens, including
the checking of the supply voltage by the Brown Out Detector 6.4. The 32MHz oscillator is started up, once stable
the power to CPU system is enabled and the reset is removed. Software determines that this is a reset from sleep
and so commences with the wakeup process. If RAM contents were held through sleep, wakeup is quicker as the
application program does not have to be reloaded from Flash memory. See section 22.3.6 for wake-up timings.
21.3.1 Wakeup Timer Event
The JN5148 contains two 35-bit wakeup timers that are counters clocked from the 32kHz oscillator, and can be
programmed to generate a wake-up event. Following a wakeup event, the timers continue to run. These timers are
described in section 11.3.
Timer events can be generated from both of the two timers; one is intended for use by the 802.15.4 protocol, the
other being available for use by the Application running on the CPU. These timers are available to run at any time,
even during sleep mode.
21.3.2 DIO Event
Any DIO pin when used as an input has the capability, by detecting a transition, to generate a wake-up event. Once
this feature has been enabled the type of transition can be specified (rising or falling edge). Even when groups of
DIO lines are configured as alternative functions such as the UARTs or Timers etc, any input line in the group can still
be used to provide a wakeup event. This means that an external device communicating over the UART can wakeup
a sleeping device by asserting its RTS signal pin (which is the CTS input of the JN5148).
21.3.3 Comparator Event
The comparator can generate a wakeup interrupt when a change in the relative levels of the positive and negative
inputs occurs. The ability to wakeup when continuously monitoring analogue signals is useful in ultra-low power
applications. For example, the JN5148 can remain in sleep mode until the voltage drops below a threshold and then
be woken up to deal with the alarm condition.
21.3.4 Pulse Counter
The JN5148 contains two 16 bit pulse counters that can be programmed to generate a wake-up event. Following the
wakeup event the counters will continue to operate and therefore no pulse will be missed during the wake-up
process. These counters are described in section 12.
To minimise sleep current it is possible to disable the 32K RC oscillator and still use the pulse counters to cause a
wake-up event, provided debounce mode is not required.
21.4 Deep Sleep Mode
Deep sleep mode gives the lowest power consumption. All switchable power domains are off and certain functions in
the VDD supply power domain, including the 32kHz oscillator are stopped. This mode can be exited by a power
down, a hardware reset on the RESETN pin, or a DIO event. The DIO event in this mode causes a chip reset to
occur.64 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
22 Electrical Characteristics
22.1 Maximum Ratings
Exceeding these conditions may result in damage to the device.
Parameter Min Max
Device supply voltage VDD1, VDD2 -0.3V 3.6V
Supply voltage at voltage regulator bypass pins
VB_xxx
-0.3V 1.98V
Voltage on analogue pins XTALOUT, XTALIN,
VCOTUNE, RF_IN.
-0.3V VB_xxx + 0.3V
Voltage on analogue pins VREF, ADC1-4, DAC1-2,
COMP1M, COMP1P, COMP2M, COMP2P, IBIAS
-0.3V VDD1 + 0.3V
Voltage on 5v tolerant digital pins SPICLK,
SPIMOSI, SPIMISO, SPISEL0, DIO0-8 & DIO11-20,
RESETN
-0.3V Lower of (VDD2 + 2V)
and 5.5V
Voltage on 3v tolerant digital pins DIO9, DIO10 -0.3V VDD2 + 0.3V
Storage temperature -40ºC 150ºC
Reflow soldering temperature according to
IPC/JEDEC J-STD-020C
260ºC
ESD rating 4 Human Body Model 1 2.0kV
Charged Device Model 2 500V
1) Testing for Human Body Model discharge is performed as specified in JEDEC Standard JESD22-A114.
2) Testing for Charged Device Model discharge is performed as specified in JEDEC Standard JESD22-C101.
22.2 DC Electrical Characteristics
22.2.1 Operating Conditions
Supply Min Max
VDD1, VDD2 2.0V 3.6V
Ambient temperature range -40ºC 85ºC© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 65
22.2.2 DC Current Consumption
VDD = 2.0 to 3.6V, -40 to +85º C
22.2.2.1 Active Processing
Mode: Min Typ Max Unit Notes
CPU processing
32,16,8 or 4MHz
1600 +
280/MHz
µA SPI, GPIOs enabled. When in
CPU doze the current related to
CPU speed is not consumed.
Radio transmit 15.0 mA CPU in software doze – radio
transmitting
Radio receive 17.5 mA CPU in software doze – radio in
receive mode
The following current figures should be added to those above if the feature is being used
ADC 655 µA Temperature sensor and battery
measurements require ADC
DAC 215 / 235 µA One / both
Comparator 73 / 0.8 µA Normal / low-power
UART 90 µA For each UART
Timer 30 µA For each Timer
2-wire serial interface 70 µA
22.2.2.2 Sleep Mode
Mode: Min Typ Max Unit Notes
Sleep mode with I/O wakeup 0.12 µA Waiting on I/O event
Sleep mode with I/O and RC
Oscillator timer wakeup –
measured at 25ºC
1.25 µA As above, but also waiting on timer
event. If both wakeup timers are
enabled then add another 0.05µA
32kHz crystal oscillator 1.5 µA As alternative sleep timer
The following current figures should be added to those above if the feature is being used
RAM retention– measured at
25ºC
2.2 µA For full 128kB retained
Comparator (low-power mode) 0.8 µA Reduced response time
22.2.2.3 Deep Sleep Mode
Mode: Min Typ Max Unit Notes
Deep sleep mode– measured
at 25ºC
100 nA Waiting on chip RESET or I/O
event66 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
22.2.3 I/O Characteristics
VDD = 2.0 to 3.6V, -40 to +85º C
Parameter Min Typ Max Unit Notes
Internal DIO pullup
resistors
22
24
31
35
34
40
56
63
53
63
92
104
kΩ VDD2 = 3.6V, 25C
VDD2 = 3.0V, 25C
VDD2 = 2.2V, 25C
VDD2 = 2.0V, 25C
Digital I/O High Input
(except DIO9, DIO10)
VDD2 x 0.7 Lower of (VDD2 + 2V)
and 5.5V
V 5V Tolerant I/O only
Digital I/O High Input
( DIO9, DIO10)
VDD2 x 0.7 VDD2 V
Digital I/O low Input -0.3 VDD2 x 0.27 V
Digital I/O input hysteresis 140 230 310 mV
DIO High O/P (2.7-3.6V) VDD2 x 0.8 VDD2 V With 4mA load
DIO Low O/P (2.7-3.6V) 0 0.4 V With 4mA load
DIO High O/P (2.2-2.7V) VDD2 x 0.8 VDD2 V With 3mA load
DIO Low O/P (2.2-2.7V) 0 0.4 V With 3mA load
DIO High O/P (2.0-2.2V) VDD2 x 0.8 VDD2 V With 2.5mA load
DIO Low O/P (2.0-2.2V) 0 0.4 V With 2.5mA load
Current sink/source
capability
4
3
2.5
mA VDD2 = 2.7V to 3.6V
VDD2 = 2.2V to 2.7V
VDD2 = 2.0V to 2.2V
IIL - Input Leakage Current 50 nA Vcc = 3.6V, pin low
IIH - Input Leakage Current 50 nA Vcc = 3.6V, pin high
22.3 AC Characteristics
22.3.1 Reset and Voltage Brown-Out
RESETN
Internal RESET
VDD
VPOT
t
STAB
Figure 45: Internal Power-on Reset without showing Brown-Out© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 67
Internal RESET
RESETN VRST
t
STAB
t
RST
Figure 46: Externally Applied Reset
VDD = 2.0 to 3.6V, -40 to +85º C
Parameter Min Typ Max Unit Notes
External Reset pulse width
to initiate reset sequence
(tRST)
1 µs Assumes internal pullup
resistor value of 100K
worst case and ~5pF
external capacitance
External Reset threshold
voltage (VRST)
VDD2 x 0.7 V Minimum voltage to
avoid being reset
Internal Power-on Reset
threshold voltage (VPOT)
1.47
1.42
V Rising
Falling
Reset stabilisation time
(tSTAB)
0.84 ms Note 1
Brown-out Threshold
Voltage (VTH)
1.87
2.16
2.54
2.83
1.95
2.25
2.65
2.95
2.01
2.32
2.73
3.04
V Configurable threshold
with 4 levels
Brown-out Hysteresis
(VHYS)
45
60
85
100
mV Corresponding to the 4
threshold levels
1 Time from release of reset to start of executing ROM code. Loading program from Flash occurs in addition to this.
VTH + VHYS
VTH
DVDD
Internal POR
Internal BOReset
VPOT
Figure 47: Power on Reset followed by Brown-out Detect68 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
22.3.2 SPI MasterTiming
t t SSH SSS
t
CK
t
SI
t
HI
MOSI
(mode=1,3)
SS
MOSI
(mode=0,2)
MISO
(mode=0,2)
MISO
(mode=1,3)
t
VO
t
VO
CLK
(mode=0,1)
t
SI
t
HI
CLK
(mode=2,3)
Figure 48: SPI Timing (Master)
Parameter Symbol Min Max Unit
Clock period tCK 62.5 - ns
Data setup time tSI 16.7 @ 3.3V
18.2 @ 2.7V
21.0 @ 2.0V
- ns
Data hold time tHI 0 ns
Data invalid period tVO - 15 ns
Select set-up period tSSS 60 - ns
Select hold period tSSH 30 (SPICLK = 16MHz)
0 (SPICLK<16MHz, mode=0 or 2)
60 (SPICLK<16MHz, mode=1 or 3)
- ns
22.3.3 Intelligent Peripheral (SPI Slave) Timing
IP_SEL
IP_CLK
IP_DI
IP_DO
t
si t
hi
t
vo
t
sss
t t ssh ck
t
lz t
hz
Figure 49: Intelligent Peripheral (SPI Slave) Timing© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 69
Parameter Symbol Min Max Unit
Clock period tck 125.0 - ns
Data setup time tsi 15 - ns
Data hold time thi 15 ns
Data invalid period tvo - 40 ns
Select set-up period tsss 15 - ns
Select hold period tssh 15 - ns
Select asserted to output data driven tlz 20 ns
Select negated to data output tri-stated thz 20 ns
22.3.4 Two-wire Serial Interface
t
BUF
S Sr P S
t
LOW
t
HD;STA
t
F t
R
t
HD;DAT
t
HIGH
t
SU;DAT
t
SU;STA
t
HD;STA
t
SU;STO
t
SP t
R
t
F
SIF_D
SIF_CLK
Figure 50: Two-wire Serial Interface Timing
Parameter Symbol
Standard Mode Fast Mode
Unit
Min Max Min Max
SIF_CLK clock frequency fSCL 0 100 0 400 kHz
Hold time (repeated) START condition.
After this period, the first clock pulse is
generated
tHD:STA 4 - 0.6 - µs
LOW period of the SIF_CLK clock tLOW 4.7 - 1.3 - µs
HIGH period of the SIF_CLK clock tHIGH 4 - 0.6 - µs
Set-up time for repeated START condition tSU:STA 4.7 - 0.6 - µs
Data setup time SIF_D tSU:DAT 0.25 - 0.1 - µs
Rise Time SIF_D and SIF_CLK tR - 1000 20+0.1Cb 300 ns
Fall Time SIF_D and SIF_CLK tF - 300 20+0.1Cb 300 ns
Set-up time for STOP condition tSU:STO 4 - 0.6 - µs
Bus free time between a STOP and START
condition
tBUF 4.7 - 1.3 - µs
Pulse width of spikes that will be
suppressed by input filters (Note 1)
tSP - 60 - 60 ns
Capacitive load for each bus line Cb - 400 - 400 pF
Noise margin at the LOW level for each
connected device (including hysteresis)
Vnl 0.1VDD - 0.1VDD - V
Noise margin at the HIGH level for each
connected device (including hysteresis)
Vnh 0.2VDD - 0.2VDD - V
Note 1: This figure indicates the pulse width that is guaranteed to be suppressed. Pulse with widths up to 125nsec
may alos get suppressed.70 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
22.3.5 Four-Wire Digital Audio Interface
SCK
WS/SDOUT
SDIN
t
ck
t
dtr
t
sr t
hr
t
hc t
lc
Parameter Symbol
Maximum
Frequency (8MHz) Generic
Unit
Min Max Min Max
DAI_SCK clock period tck 125 - 125 - ns
LOW period of the DAI_SCK clock tlc 43 - 0.35tck - ns
HIGH period of the DAI_SCK clock thc 43 - 0.35tck - ns
Transmit delay time tdtr - 50 - 0.4tck ns
Receive set-up time tsr 25 - 0.2tck - ns
Receive hold time thr 0 - 0 - ns
22.3.6 Wakeup and Boot Load Timings
Parameter Min Typ Max Unit Notes
Time for crystal to stabilise
ready for Boot Load
0.84 ms Reached oscillator
amplitude threshold
Time for crystal to stabilise
ready for radio activity
1.0 ms
Wake up from Deep Sleep
or from Sleep (memory not
held)
0.84 + 0.5*
program size in
kBytes
ms Assumes SPI clock to
external Flash is
16MHz
Wake up from Sleep
(memory held)
0.84 ms
Wake up from CPU Doze
mode
0.2 µs
Wake up from Sleep using
24MHz RC oscillator
(memory held)
0.29 ms© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 71
22.3.7 Bandgap Reference
VDD = 2.0 to 3.6V, -40 to +85ºC
Parameter Min Typ Max Unit Notes
Voltage 1.156 1.192 1.216 V
DC power supply rejection 58 dB at 25ºC
Temperature coefficient -35
+30
ppm/ºC 20 to 85ºC
-40ºC to 20ºC
Point of inflexion +25 ºC
22.3.8 Analogue to Digital Converters
VDD = 3.0V, VREF = 1.2V, -40 to +85ºC
Parameter Min Typ Max Unit Notes
Resolution 12 bits 500kHz Clock
Current consumption 655 µA
Integral nonlinearity ± 5 LSB 0 to Vref range
Differential nonlinearity -1 +2 LSB Guaranteed monotonic
Offset error + 10 mV
Gain error - 20 mV
Internal clock 500 kHz 16MHz input clock, ÷32
No. internal clock periods
to sample input
2, 4, 6 or 8 Programmable
Conversion time 40 µs 500kHz Clock with
sample period of 2
Input voltage range 0.04 Vref
or 2*Vref
V Switchable. Refer to
20.1.1
Vref (Internal) See Section 22.3.7 Bandgap Reference
Vref (External) 1.15 1.2 1.6 V Allowable range into
VREF pin
Input capacitance 8 pF In series with 5K ohms72 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
22.3.9 Digital to Analogue Converters
VDD = 3.0V, VREF = 1.2V, -40 to +85ºC
Parameter Min Typ Max Unit Notes
Resolution 12 bits
Current consumption 215 (single)
235 (both)
µA
Integral nonlinearity ± 2 LSB
Differential nonlinearity -1 +1 LSB Guaranteed monotonic
Offset error ± 10 mV
Gain error ± 10 mV
Internal clock 2MHz,
1MHz,
500kHz,
250kHz
16MHz input clock,
programmable
prescaler
Output settling time to
0.5LSB
5 µs With 10k ohms & 20pF
load
Minimum Update time 10 µs 2MHz Clock with
sample period of 2
Output voltage swing 0 Lower of Vdd-1.2 and Vref V Output voltage swing
Gain =0
Output voltage swing 0 Lower of 2x(Vdd-1.2 ) and
Vdd-0.2 and 2xVref
V Output voltage swing
Gain =1
Vref (Internal) See Section 22.3.7 Bandgap Reference
VREF (External) 0.8 1.2 1.6 V Allowable range into
VREF pin
Resistive load 10 kΩ To ground
Capacitive load 20 pF
Digital input coding Binary© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 73
22.3.10 Comparators
VDD = 2.0 to 3.6V -40 to +85ºC
Parameter Min Typ Max Unit Notes
Analogue response time
(normal)
80 125 ns +/- 250mV overdrive
10pF load
Total response time
(normal) including delay to
Interrupt controller
105 + 125 ns Digital delay can be
up to a max. of two
16MHz clock periods
Analogue response time
(low power)
2.4 µs +/- 250mV overdrive
No digital delay
Hysteresis 4
12
28
10
20
40
16
26
50
mV Programmable in 3
steps and zero
Vref (Internal) See Section 22.3.7 Bandgap Reference V
Common Mode input range 0 Vdd V
Current (normal mode) 54 73 102 µA
Current (low power mode) 0.8 µA
22.3.11 32kHz RC Oscillator
VDD = 2.0 to 3.6V, -40 to +85 ºC
Parameter Min Typ Max Unit Notes
Current consumption of cell
and counter logic
1.45
1.25
1.05
µA 3.6V
3.0V
2.0V
32kHz clock native
accuracy
-30% 32kHz +30% Typical is at 3.0V 25°C
Calibrated 32kHz accuracy ±250 ppm For a 1 second sleep
period calibrating over
20 x 32kHz clock
periods
Variation with temperature -0.010 %/°C
Variation with VDD2 -1.1 %/V74 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
22.3.12 32kHz Crystal Oscillator
VDD = 2.0 to 3.6V, -40 to +85ºC
Parameter Min Typ Max Unit Notes
Current consumption of cell
and counter logic
1.5 µA This is sensitive to the ESR
of the crystal,Vdd and total
capacitance at each pin
Start – up time 0.8 s Assuming xtal with ESR of
less than 40kohms and
CL= 9pF External caps =
15pF
(Vdd/2mV pk-pk) see
Appendix B
Input capacitance 1.4 pF Bondpad and package
Transconductance 17 uA/V
External Capacitors
(CL=9pF)
15 pF Total external capacitance
needs to be 2*CL, allowing
for stray capacitance from
chip, package and PCB
Amplitude at Xout Vdd-0.2 Vp-p
22.3.13 32MHz Crystal Oscillator
VDD = 2.0 to 3.6V, -40 to +85ºC
Parameter Min Typ Max Unit Notes
Current consumption 300 375 450 µA Excluding bandgap ref.
Start – up time 0.84 ms Assuming xtal with ESR of
less than 40ohms and CL=
9pF External caps = 15pF
see Appendix B
Input capacitance 1.4 pF Bondpad and package
Transconductance 3.65 4.30 5.16 mA/V
DC voltages, XTALIN /
XTALOUT
390/425 425/465 470/520 mV
External Capacitors
(CL=9pF)
15 pF Total external capacitance
needs to be 2*CL, allowing
for stray capacitance from
chip, package and PCB
Amplitude detect threshold 320 mVp-p Threshold detection
accessible via API© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 75
22.3.14 24MHz RC Oscillator
VDD = 2.0 to 3.6V, -40 to +85ºC
Parameter Min Typ Max Unit Notes
Current consumption of cell 160 µA
Clock native accuracy -22% 24MHz +28%
Calibrated centre frequency
accuracy
-7% 24MHz +7%
Variation with temperature -0.015 %/°C
Variation with VDD2 0.15 %/V
Startup time 1 us
22.3.15 Temperature Sensor
VDD = 2.0 to 3.6V, -40 to +85ºC
Parameter Min Typ Max Unit Notes
Operating Range -40 - 85 °C
Sensor Gain -1.44 -1.55 -1.66 mV/°C
Accuracy - - ±10 °C
Non-linearity - - 2.5 °C
Output Voltage 630 855 mV Includes absolute variation
due to manufacturing & temp
Typical Voltage 745 mV Typical at 3.0V 25°C
Resolution 0.154 0.182 0.209 °C/LSB 0 to Vref ADC I/P Range76 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
22.3.16 Radio Transceiver
This JN5148 meets all the requirements of the IEEE802.15.4 standard over 2.0 - 3.6V and offers the following
improved RF characteristics. All RF characteristics are measured single ended.
This part also meets the following regulatory body approvals, when used with NXP’s Module Reference Designs.
Compliant with FCC part 15, rules, IC Canada, ETSI ETS 300-328 and Japan ARIB STD-T66
The PCB schematic and layout rules detailed in Appendix
B.4 must be followed. Failure to do so will likely result in the
JN5148 failing to meet the performance specification detailed
herein and worst case may result in device not functioning in the
end application.
Parameter Min Typical Max Notes
RF Port Characteristics
Type Single Ended
Impedance 1 50ohm 2.4-2.5GHz
Frequency range 2.400 GHz 2.485GHz
ESD levels (pin 17) TDB
1) With external matching inductors and assuming PCB layout as in Appendix B.4.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 77
Radio Parameters: 2.0-3.6V, +25ºC
Parameter Min Typical Max Unit Notes
Receiver Characteristics
Receive sensitivity -92 -95 dBm Nominal for 1% PER, as per
802.15.4 section 6.5.3.3
Maximum input signal +5 dBm For 1% PER, measured as
sensitivity
Adjacent channel
rejection (-1/+1 ch)
[CW Interferer]
19/34
[27/49]
dBc For 1% PER, with wanted signal
3dB, above sensitivity. (Note1,2)
(modulated interferer)
Alternate channel
rejection (-2 / +2 ch)
[CW Interferer]
40/45
[54/54]
dBc For 1% PER, with wanted signal
3dB, above sensitivity. (Note1,2)
(modulated interferer)
Other in band rejection
2.4 to 2.4835 GHz,
excluding adj channels
48 dBc For 1% PER with wanted signal
3dB above sensitivity. (Note1)
Out of band rejection 52 dBc For 1% PER with wanted signal
3dB above sensitivity. All
frequencies except wanted/2 which
is 8dB lower. (Note1)
Spurious emissions
(RX)
-61
<-70
-58
dBm Measured conducted into 50ohms
30MHz to 1GHz
1GHz to 12GHz
Intermodulation
protection
40 dB For 1% PER at with wanted signal
3dB above sensitivity. Modulated
Interferers at 2 & 4 channel
separation (Note1)
RSSI linearity -4 +4 dB -95 to -10dBm.
Available through Hardware API
Transmitter Characteristics
Transmit power +0.5 +2.5 dBm
Output power control
range
-35 dB In three 12dB steps (Note3)
Spurious emissions
(TX)
-40
<-70
<-70
dBm Measured conducted into 50ohms
30MHz to 1GHz,
1GHz to12.5GHz,
The following exceptions apply
1.8 to 1.9GHz & 5.15 to 5.3GHz
EVM [Offset] 10 [2.0] 15 % At maximum output power
Transmit Power
Spectral Density
-38 -20 dBc At greater than 3.5MHz offset, as
per 802.15.4, section 6.5.3.178 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
Radio Parameters: 2.0-3.6V, -40ºC
Parameter Min Typical Max Unit Notes
Receiver Characteristics
Receive sensitivity -93.5 -96.5 dBm Nominal for 1% PER, as per
802.15.4 section 6.5.3.3
Maximum input signal +9 dBm For 1% PER, measured as
sensitivity
Adjacent channel
rejection (-1/+1 ch)
[CW Interferer]
19/34
[TBC]
dBc For 1% PER, with wanted signal
3dB, above sensitivity. (Note1,2)
(modulated interferer)
Alternate channel
rejection (-2 / +2 ch)
[CW Interferer]
40/45
[TBC]
dBc For 1% PER, with wanted signal
3dB, above sensitivity. (Note1,2)
(modulated interferer)
Other in band rejection
2.4 to 2.4835 GHz,
excluding adj channels
47 dBc For 1% PER with wanted signal
3dB above sensitivity. (Note1)
Out of band rejection 49 dBc For 1% PER with wanted signal
3dB above sensitivity. All
frequencies except wanted/2 which
is 8dB lower. (Note1)
Spurious emissions
(RX)
-60
<-70
-57
dBm Measured conducted into 50ohms
30MHz to 1GHz
1GHz to 12GHz
Intermodulation
protection
39 dB For 1% PER at with wanted signal
3dB above sensitivity. Modulated
Interferers at 2 & 4 channel
separation (Note1)
RSSI linearity -4 +4 dB -95 to -10dBm.
Available through Hardware API
Transmitter Characteristics
Transmit power +0.75 +2.75 dBm
Output power control
range
-35 dB In three 12dB steps (Note3)
Spurious emissions
(TX)
-38
<-70
<-70
dBm Measured conducted into 50ohms
30MHz to 1GHz,
1GHz to12.5GHz,
The following exceptions apply
1.8 to 1.9GHz & 5.15 to 5.3GHz
EVM [Offset] 9 [2.0] 15 % At maximum output power
Transmit Power
Spectral Density
-38 -20 dBc At greater than 3.5MHz offset, as
per 802.15.4, section 6.5.3.1© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 79
Radio Parameters: 2.0-3.6V, +85ºC
Parameter Min Typical Max Unit Notes
Receiver Characteristics
Receive sensitivity -90 -93 dBm Nominal for 1% PER, as per
802.15.4 section 6.5.3.3
Maximum input signal +3 dBm For 1% PER, measured as
sensitivity
Adjacent channel
rejection (-1/+1 ch)
[CW Interferer]
19/34
[TBC]
dBc For 1% PER, with wanted signal
3dB, above sensitivity. (Note1,2)
(modulated interferer)
Alternate channel
rejection (-2 / +2 ch)
[CW Interferer]
40/45
[TBC]
dBc For 1% PER, with wanted signal
3dB, above sensitivity. (Note1,2)
(modulated interferer)
Other in band rejection
2.4 to 2.4835 GHz,
excluding adj channels
49 dBc For 1% PER with wanted signal
3dB above sensitivity. (Note1)
Out of band rejection 53 dBc For 1% PER with wanted signal
3dB above sensitivity. All
frequencies except wanted/2 which
is 8dB lower. (Note1)
Spurious emissions
(RX)
-62
<-70
-59
dBm Measured conducted into 50ohms
30MHz to 1GHz
1GHz to 12GHz
Intermodulation
protection
41 dB For 1% PER at with wanted signal
3dB above sensitivity. Modulated
Interferers at 2 & 4 channel
separation (Note1)
RSSI linearity -4 +4 dB -95 to -10dBm.
Available through Hardware API
Transmitter Characteristics
Transmit power -0.2 +1.8 dBm
Output power control
range
-35 dB In three 12dB steps (Note3)
Spurious emissions
(TX)
-42
<-70
<-70
dBm Measured conducted into 50ohms
30MHz to 1GHz,
1GHz to12.5GHz,
The following exceptions apply
1.8 to 1.9GHz & 5.15 to 5.3GHz
EVM [Offset] 10 [2.0] 15 % At maximum output power
Transmit Power
Spectral Density
-38 -20 dBc At greater than 3.5MHz offset, as
per 802.15.4, section 6.5.3.180 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
Note1: Blocker rejection is defined as the value, when 1% PER is seen with the wanted signal 3dB above sensitivity,
as per 802.15.4 section 6.5.3.4
Note2: Channels 11,17,24 low/high values reversed.
Note3: Up to an extra 2.5dB of attenuation is available if required.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 81
Appendix A Mechanical and Ordering Information
A.1 56-pin QFN Package Drawing
Figure 51: 56-pin QFN Package Drawings
Controlling Dimension: mm
Symbol
millimetres
Min. Nom. Max.
A ------ ------ 0.9
A1 0.00 0.01 0.05
A2 ------ 0.65 0.7
A3 0.20 Ref.
b 0.2 0.25 0.3
D 8.00 bsc
D1 7.75 bsc
D2 6.20 6.40 6.60
E 8.00 bsc
E1 7.75 bsc
E2 6.20 6.40 6.60
L 0.30 0.40 0.50
e 0.50 bsc
υ1 0° ------ 12°
R 0.09 ------ ------
Tolerances of Form and Position
aaa 0.10
bbb 0.10
ccc 0.0582 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
A.2 PCB Decal
The following PCB decal is recommended; all dimensions are in millimetres (mm).
Figure 52: PCB Decal
The PCB schematic and layout rules detailed in Appendix B.4 must
be followed. Failure to do so will likely result in the JN5148 failing
to meet the performance specification detailed herein and worst
case may result in device not functioning in the end application.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 83
A.3 Ordering Information
The standard qualification for the JN5148 is Industrial temperature range: -40ºC to +85ºC, packaged in a 56-pin QFN
package.
Ordering Code Format:
JN5148/XXX
XXX: ROM Variant
001 Supports all available networking stacks
Ordering Codes:
Part Number Ordering Code Description
JN5148-001 JN5148/001 JN5148 microcontroller
The chip is available in three different reel quantities:
• 500 on 180mm reel
• 1000 on 180mm reel
• 2500 on 330mm reel
Where this Data Sheet is denoted as “Advanced” or “Preliminary”, devices will be either Engineering Samples or
Prototypes. Devices of this status are marked with an Rx suffix after the ROM identifier to identify the revision of
silicon during these product phases - for example JN5148-001R1-T.
The Standard Supply Multiple (SSM) for Engineering Samples or Prototypes is 50 units with a maximum of 250 units.
If the quantity of Engineering Samples or Prototypes ordered is less than a reel quantity, then these will be shipped in
tape form only, with no reel and will not be dry packaged in a moisture sensitive environment.
The SSM for Production status devices is one reel, all reels are dry packaged in a moisture sensitive bag see A.5.3.84 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
A.4 Device Package Marking
The diagram below shows the package markings for JN5148. The package on the left along with the legend
information below it, shows the general format of package marking. The package on the right shows the specific
markings for a JN5148-001 device, that came from assembly build number 1000135 and was manufactured week 12
of 2008.
Jennic
JNXXXX-SSS
FFFFFFF
YYWW
Jennic
JN5148-001
0812
1000135
Figure 53: Device Package Marking
Legend:
JN Jennic
XXXX 4 digit part number
SSS 3 digit software ROM identifier
FFFFFFF 7 digit assembly build number
YY 2 digit year number
WW 2 digit week number
Where this Data Sheet is denoted as “Advanced” or “Preliminary”, devices will be either Engineering Samples or
Prototypes. Devices of this status have an Rx suffix after the software ROM identifier, for example JN5148-001R1.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 85
A.5 Tape and Reel Information
A.5.1 Tape Orientation and Dimensions
The general orientation of the 56QFN package in the tape is as shown in Figure 54.
Figure 54: Tape and Reel Orientation
Figure 55 shows the detailed dimensions of the tape used for 8x8mm 56QFN devices.
ALL DIMENSIONS IN MILLIMETRES UNLESS OTHERWISE STATED
Reference Dimensions (mm)
Ao 8.30 ±0.10
Bo 8.30 ±0.10
Ko 1.10 ±0.10
F 7.50 ±0.10
P1 12.00 ±0.10
W 16.00 ±0.30
(I) Measured from centreline of sprocket hole to centreline of pocket
(II) Cumulative tolerance of 10 sprocket holes is ±0.20mm
(III) Measured from centreline of sprocket hole to centreline of pocket
(IV) Other material available
Figure 55: Tape Dimensions86 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
A.5.2 Reel Information: 180mm Reel
Surface Resistivity Between 10e9 – 10e11 Ohms Square
Material High Impact Polystyrene, environmentally friendly, recyclable
All dimensions and tolerances are fully compliant with EIA-481-B and are specified in millimetres.
6 window design with one window on each side blanked to allow adequate labelling space.
Figure 56: 180mm Reel Dimensions© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 87
A.5.3 Reel Information: 330mm Reel
Surface Resistivity Between 10e9 – 10e11 Ohms Square
Material High Impact Polystyrene with Antistatic Additive
All dimensions and tolerances are fully compliant with EIA-481-B and are specified in millimetres.
3 window design to allow adequate labelling space.
Figure 57: 330mm Reel Dimensions
A.5.4 Dry Pack Requirement for Moisture Sensitive Material
Moisture sensitive material, as classified by JEDEC standard J-STD-033, must be dry packed. The 56 lead QFN
package is MSL2A/260°
C, and is dried before sealing in a moisture barrier bag (MBB) with desiccant bag weighing at
67.5 grams of activated clay and a humidity indicator card (HIC) meeting MIL-L-8835 specification. The MBB has a
moisture-sensitivity caution label to indicate the moisture-sensitive classification of the enclosed devices.88 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
Appendix B Development Support
B.1 Crystal Oscillators
This section covers some of the general background to crystal oscillators, to help the user make informed decisions
concerning the choice of crystal and the associated capacitors.
B.1.1 Crystal Equivalent Circuit
Cs
Lm Rm Cm
C1 C2
Where Cm is the motional capacitance
Lm is the motional inductance. This together with Cm defines the oscillation frequency (series)
Rm is the equivalent series resistance ( ESR ).
CS is the shunt or package capacitance and this is a parasitic
B.1.2 Crystal Load Capacitance
The crystal load capacitance is the total capacitance seen at the crystal pins, from all sources. As the load
capacitance (CL) affects the oscillation frequency by a process known as ‘pulling’, crystal manufacturers specify the
frequency for a given load capacitance only. A typical pulling coefficient is 15ppm/pF, to put this into context the
maximum frequency error in the IEEE802.15.4 specification is +/-40ppm for the transmitted signal. Therefore, it is
important for resonance at 32MHz exactly, that the specified load capacitance is provided.
The load capacitance can be calculated using:
CL =
1 2
1 2
T T
T T
C C
C C
+
×
Total capacitance CT1 = C1 + C1P + C1in
Where C1 is the capacitor component
C1P is the PCB parasitic capacitance. With the recommended layout this is about 1.6pF
C1in is the on-chip parasitic capacitance and is about 1.4pF typically.
Similarly for CT 2
Hence for a 9pF load capacitance, and a tight layout the external capacitors should be 15pF© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 89
B.1.3 Crystal ESR and Required Transconductance
The resistor in the crystal equivalent circuit represents the energy lost. To maintain oscillation, power must be
supplied by the amplifier, but how much? Firstly, the Pi connected capacitors C1 and C2 with CS from the crystal,
apply an impedance transformation to Rm, when viewed from the amplifier. This new value is given by:
2
ˆ
+ = L
S L m m
C
C C R R
The amplifier is a transconductance amplifier, which takes a voltage and produces an output current. The amplifier
together with the capacitors C1 and C2, form a circuit, which provides a negative resistance, when viewed from the
crystal. The value of which is given by:
2
1× 2 ×ω = T T
m
NEG
C C
g R
Where gm is the transconductance
ω is the frequency in rad/s
Derivations of these formulas can be easily found in textbooks.
In order to give quick and reliable oscillator start-up, a common rule of thumb is to set the amplifier negative
resistance to be a minimum of 4 times the effective crystal resistance. This gives
2
T1× T 2 ×ω
m
C C
g ≥
2
4
+
L
S L m
C
C C R
This can be used to give an equation for the required transconductance.
1 2
2 1 2 1 2 2 4 [ ( ) ]
T T
m S T T T T m C C
R C C C C C
g ×
× + + × ≥ ω
Example: Using typical 32MHz crystal parameters of Rm =40Ω, CS =1pF and CT1 =CT 2 =18pF ( for a load
capacitance of 9pF), the equation above gives the required transconductance ( gm ) as 2.59mA/V. The JN5148 has a
typical value for transconductance of 4.3mA/V
The example and equation illustrate the trade-off that exists between the load capacitance and crystal ESR. For
example, a crystal with a higher load capacitance can be used, but the value of max. ESR that can be tolerated is
reduced. Also note, that the circuit sensitivity to external capacitance [ C1 , C2 ] is a square law.
Meeting the criteria for start-up is only one aspect of the way these parameters affect performance, they also affect
the time taken during start-up to reach a given, (or full), amplitude. Unfortunately, there is no simple mathematical
model for this, but the trend is the same. Therefore, both a larger load capacitance and larger crystal ESR will give a
longer start-up time, which has the disadvantages of reduced battery life and increased latency. 90 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
B.2 32MHz Oscillator
The JN5148 contains the necessary on-chip components to build a 32 MHz reference oscillator with the addition of
an external crystal resonator, two tuning capacitors. The schematic of these components are shown in Figure 58.
The two capacitors, C1 and C2, will typically be 15pF ±5% and use a COG dielectric. For a detailed specification of
the crystal required and factors affecting C1 and C2 see Appendix B.1. As with all crystal oscillators the PCB layout is
especially important, both to keep parasitic capacitors to a minimum and to reduce the possibility of PCB noise being
coupled into the oscillator.
XTALOUT
C1 C2
XTALIN R1
JN5148
Figure 58: Crystal oscillator connections
The clock generated by this oscillator provides the reference for most of the JN5148 subsystems, including the
transceiver, processor, memory and digital and analogue peripherals.
32MHz Crystal Requirements
Parameter Min Typ Max Notes
Crystal Frequency 32MHz
Crystal Tolerance 40ppm Including temperature
and ageing
Crystal ESR Range (Rm) 10Ω 60Ω See below for more
details
Crystal Load Capacitance
Range (CL) 6pF 9pF 12pF See below for more
details
Not all Combinations of Crystal Load Capacitance and ESR are Valid
Recommended Crystal Load Capacitance 9pF and max ESR 40 Ω
External Capacitors (C1 & C2)
For recommended Crystal
15pF CL = 9pF, total external
capacitance needs to be
2*CL. , allowing for stray
capacitance from chip,
package and PCB © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 91
As is stated above, not all combinations of crystal load capacitance and ESR are valid, and as explained in Appendix
B.1.3 there is a trade-off that exists between the load capacitance and crystal ESR to achieve reliable performance.
For this reason, we recommend that for a 9pF load capacitance crystals be specified with a maximum ESR of 40
ohms. For lower load capacitances the recommended maximum ESR rises, for example, CL=7pF the max ESR is 61
ohms. For the lower cost crystals in the large HC49 package, a load capacitance of 9 or 10pF is widely available and
the max ESR of 30 ohms specified by many manufacturers is acceptable. Also available in this package style, are
crystals with a load capacitance of 12pF, but in this case the max ESR required is 25 ohms or better.
Below is measurement data showing the variation of the crystal oscillator amplifier transconductance with
temperature and supply voltage, notice how small the variation is. Circuit techniques have been used to apply
compensation, such that the user need only design for nominal conditions.
32MHz Crystal Oscillator
4.1
4.15
4.2
4.25
4.3
4.35
-40 -20 0 20 40 60 80 100
Temperature (C)
Transconductance (mA/V)
32MHz Crystal Oscillator
4.28
4.29
4.3
4.31
2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
Supply Voltage (VDD)
Transconductance (mA/V)92 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
B.3 32kHz Oscillator
In order to obtain more accurate sleep periods, the JN5148 contains the necessary on-chip components to build an
optional 32kHz oscillator with the addition of an external 32.768kHz crystal and two tuning capacitors. The crystal
should be connected between XTAL32K_IN and XTAL32K_OUT (DIO9 and DIO10), with two equal capacitors to
ground, one on each pin. The schematic of these components are shown in Figure 59. The two capacitors, C1 and
C2, will typically be in the range 10 to 22pF ±5% and use a COG dielectric. As with all crystal oscillators the PCB
layout is especially important, both to keep parasitic capacitors to a minimum and to reduce the possibility of PCB
noise being coupled into the oscillator.
XTAL32K_IN XTAL32K_OUT
JN5148
Figure 59: 32kHz crystal oscillator connections
The electrical specification of the oscillator can be found in 22.3.12. The oscillator cell is flexible and can operate with
a range of commonly available 32kHz crystals with load capacitances from 6 to 12.5p, and ESR up to 80KΩ. It
achieves this by using automatic gain control (AGC), which senses the signal swing. As explained in Appendix B.1.3
there is a trade-off that exists between the load capacitance and crystal ESR to achieve reliable performance. The
use of an AGC function allows a wider range of crystal load capacitors and ESR’s to be accommodated than would
otherwise be possible. However, this benefit does mean the supply current varies with the supply voltage (VDD),
value of the total capacitance at each pin, and the crystal ESR. This is described in the table and graphs below.
32kHz Crystal Requirements
Parameter Min Typ Max Notes
Crystal Frequency 32kHz
Supply Current 1.6uA Vdd=3v, temp=25 C, load
cap =9pF, Rm=25K
Supply Current Temp. Coeff. 0.1%/ C Vdd=3v
Crystal ESR Range (Rm) 10KΩ 25KΩ 80KΩ See below for more details
Crystal Load Capacitance
Range (CL)
6pF 9pF 12.5pF See below for more details
Not all Combinations of Crystal Load Capacitance and ESR are Valid © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 93
Three examples of typical crystals are given, each with the value of external capacitors to use, plus the likely supply
current and start-up time that can be expected. Also given is the maximum recommended ESR based on the start-up
criteria given in Appendix B.1.3. The values of the external capacitors can be calculated using the equation in
Appendix B.1.2 .
Load Capacitance Ext Capacitors Current Start-up Time Max ESR
9pF 15pF 1.6uA 0.8Sec 70KΩ
6pF 9pF 1.4uA 0.6sec 80KΩ
12.5pF 22pF 2.4uA 1.1sec 35KΩ
Below is measurement data showing the variation of the crystal oscillator supply current with voltage and with crystal
ESR, for two load capacitances.
32KHz Crystal Oscillator Current
0.6
0.8
1
1.2
1.4
1.6
2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
Supply Voltage (VDD)
Normalised Current (IDD)
32KHz Crystal Oscillator Current
0.6
0.8
1
1.2
1.4
1.6
10 20 30 40 50 60 70 80
Crystal ESR (K ohm)
Normalised Current (IDD)
9pF
12.5pF94 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
B.4 JN5148 Module Reference Designs
For customers wishing to integrate the JN5148 device directly into their system, NXP provide a range of Module
Reference Designs, covering standard and high-power modules fitted with different Antennae
To ensure the correct performance, it is strongly recommended that where possible the design details provided by the
reference designs, are used in their exact form for all end designs, this includes component values, pad dimensions,
track layouts etc. In order to minimise all risks, it is recommended that the entire layout of the appropriate reference
module, if possible, be replicated in the end design.
For full details, consult the Standard Module Reference Design JN-RD-6015 [6].
B.4.1 Schematic Diagram
A schematic diagram of the JN5148 PCB antenna reference module is shown in Figure 60. Details of component
values and PCB layout constraints can be found in Table 8.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15 16 17 18 19 20 21 22 23 24 25 26 27 28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
56 55 54 53 52 51 50 49 48 47 46 45 44 43
SPI Selects
Analogue IO
UART0/JTAG
Timers
Two Wire
Serial Port
RXD1
UART1/JTAG
DIO16
CTS1
VSS3
RTS1
TXD1
VSS2
VSSS
XTAL_OUT
XTAL_IN
VB_SYNTH
VCOTUNE (NC)
VB_VCOR1 43K
IBIAS
C16 100nF
VDD1
C14 100nF
VDD
C13 10uF
C24 47pF
C18 47pF
C2 10nF
C15 100nF
Y1
C11 15pF
C10 15pF
C20 100nF
L2 2.7nH
VB_RF
VREF
VB_RF2
RF_IN
VB_RF
C12 47pF
C3 100nF
VB_RF1
C1M
C1P
ADC1
ADC2
ADC3
ADC4
C2M
C2P
VB_A
C9 47pF
C8 100nF NC
VDD
VDD
RXD1
SPIMOSI
SPIMOSI
SPICLK SPICLK
C6 100nF
C7 100nF
SPISEL3
SPISEL2
VB_DIG
RESETN
SPISEL1
SPISEL0
VB_RAM
SPIMISO
VSS1
DAC2
DAC1
1
2
3
4
8
7
6
5
SS
SD0
WP
VSS SDI
CLK
HOLD
VCC
Serial
Flash
Memory
RXD0
TXD0
RTS0
CTS0
SPISEL4
VDD
SIF_D
SIF_CLK
TIM1OUT
TIM1CAP
TIM1CK_GT
TIM0OUT
TIM0CAP
VDD2
TIM0CK_GT
VSSA
JN5148
C1 47pF L1 5.6nH
To Coaxial Socket
Or Integrated Antenna
Figure 60: JN5148 Printed Antenna Reference Module Schematic Diagram© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 95
Component
Designator
Value/Type Function PCB Layout Constraints
C13 10uF Power source decoupling
C14 100nF Analogue Power decoupling Adjacent to U1 pin 13
C16 100nF Digital power decoupling Adjacent to U1 pin 49
C15 100nF VB Synth decoupling Less than 5mm from U1 pin 10
C18 47pF VB Synth decoupling Less than 5mm from U1 pin 10
C2 10nF VB VCO decoupling Less than 5mm from U1 pin 12
C24 47pF VB VCO decoupling Less than 5mm from U1 pin 12
C3 100nF VB RF decoupling Less than 5mm from U1 pin 16 and U1 pin 18
C12 47pF VB RF decoupling Less than 5mm from U1 pin 16 and U1 pin 18
C8 100nF VB A decoupling Less than 5mm from U1 pin 27
C9 47pF VB A decoupling Less than 5mm from U1 pin 27
C6 100nF VB RAM decoupling Less than 5mm from U1 pin 35
C7 100nF VB Dig decoupling Less than 5mm from U1 pin 40
R1 43k I Bias Resistor Less than 5mm from U1 pin 14
C20 100nF Vref decoupling Less than 5mm from U1 pin 15
U2 4Mbit Serial Flash Memory (Numonyx M25P40)
Y1 32MHz Crystal (AEL X32M000000S025) (CL = 9pF, Max ESR 40R)
C10 15pF +/-5% COG Crystal Load Capacitor Adjacent to pin 8 and Y1 pin 1
C11 15pF +/-5% COG Crystal Load Capacitor Adjacent to pin 9 and Y1 pin 3
R2 Not fitted
C1 47pF AC Coupling
Phycomp 2238-869-15479
Must be copied directly from the reference design.
L1 5.6nH RF Matching Inductor
MuRata LQP15MN5N6B02
L2 2.7nH Load Inductor
MuRata LQP15MN2N7B02
Table 8: JN5148 Printed Antenna Reference Module Components and PCB Layout Constraints
The paddle should be connected directly to ground. Any pads that requiring connection to ground should do so by
connecting directly to the paddle.96 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
B.4.2 PCB Design and Reflow Profile
PCB and land pattern designs are key to the reliability of any electronic circuit design.
The Institute for Interconnecting and Packaging Electronic Circuits (IPC) defines a number of standards for electronic
devices. One of these is the "Surface Mount Design and Land Pattern Standard" IPC-SM-782 [3], commonly referred
to as “IPC782". This specification defines the physical packaging characteristics and land patterns for a range of
surface mounted devices. IPC782 is also a useful reference document for general surface mount design techniques,
containing sections on design requirements, reliability and testability. NXP strongly recommends that this be referred
to when designing the PCB.
The suggested reflow profile is shown in Figure 61. The specific paste manufacturers guidelines on peak flow
temperature, soak times, time above liquidus and ramp rates should also be referenced.
Figure 61: Recommended Reflow Profile for Lead-free Solder Paste or PPF lead frame© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 97
Related Documents
[1] IEEE Std 802.15.4-2003 IEEE Standard for Information Technology – Part 15.4 Wireless Medium Access Control
(MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs).
[2] JN-AN-1038 Programming Flash devices not supported by the JN51xx ROM-based bootloader
[3] IPC-SM-782 Surface Mount Design and Land Pattern Standard
[4] JN-AN-1118 JN5148 Application Debugging
[5] JN-UG-3066 JN51xx Integrated Peripherals API User Guide
[6] JN-RD-6015 Standard Module Reference Design
[7] JN-AN-1003 Boot Loader Operation
RoHS Compliance
JN5148 devices meet the requirements of Directive 2002/95/EC of the European Parliament and of the Council on
the Restriction of Hazardous Substance (RoHS) and of the China RoHS (SJ/T11363 – 2006) requirements which
came into force on 1st March 2007.
Status Information
The status of this Data Sheet is. Production
NXP products progress according to the following format:
Advance
The Data Sheet shows the specification of a product in planning or in development.
The functionality and electrical performance specifications are target values of the design and may be used as a
guide to the final specification. Integrated circuits are identified with an Rx suffix, for example JN5148-001R1.
NXP reserves the right to make changes to the product specification at anytime without notice.
Preliminary
The Data Sheet shows the specification of a product that is commercially available, but is not yet fully qualified.
The functionality of the product is final. The electrical performance specifications are target values and may used as a
guide to the final specification. Integrated circuits are identified with an Rx suffix, for example JN5148-001R1.
NXP reserves the right to make changes to the product specification at anytime without notice.
Production
This is the production Data Sheet for the product.
All functional and electrical performance specifications, where included, including min and max values are derived
from detailed product characterization.
This Data Sheet supersedes all previous document versions.
NXP reserves the right to make changes to the product specification at anytime.98 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation -
lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion
and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP
Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine
whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned
application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks
associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the
products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.
Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause
permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above
those given in the Operating Conditions section or the Electrical Characteristics sections of this document is not warranted. Constant or repeated
exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.
AEC unqualified products — This product has not been qualified to the appropriate Automotive Electronics Council (AEC) standard Q100 or Q101
and should not be used in automotive applications, including but not limited to applications where failure or malfunction of an NXP Semiconductors
product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no
liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the
customer’s own risk.
Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the
Product data sheet
All products are sold subject to NXP Semiconductors’ terms and conditions of sale, supplied at the time of order acknowledgment and published at
http://www.nxp.com/profile/terms.
Trademarks
All trademarks are the property of their respective owners.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 99
Version Control
Version Notes
1.0 12th December 2008 – First issue, released as Advance Information
1.1 15th May 2009 – Major revision
1.2 15th July – Released as Preliminary and revised Electrical Parameters section
1.3 20th January 2010 – Revision to sections 1.1, 2.2.1 & 8.1 – 8.4 and figs 1,2,22 & 47. Also, the bill of
materials and reference design number have been updated.
1.4 2nd April 2010 – Released as Production with revised Electrical Parameters section
1.5 14th September 2010 – Logo updated and support for JenNet added
1.6 24th November 2010 – Ordering information changed
1.7 5th May 2011 – Tape and reel information updated
1.8 12th September 2012 – NXP branding applied
1.9 6th September 2013 – Modified description of interrupts within the CPU in Chapter 3100 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013
Contact Details
NXP Laboratories UK Ltd
(Formerly Jennic Ltd)
Furnival Street
Sheffield
S1 4QT
United Kingdom
Tel: +44 (0)114 281 2655
Fax: +44 (0) 114 281 2951
For the contact details of your local NXP office or distributor, refer to the NXP web site:
www.nxp.com
Data Sheet: JN516x
IEEE802.15.4 Wireless Microcontroller
© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 1
Overview Features: Radio
• 2.4GHz IEEE802.15.4 compliant
• 128-bit AES security processor
• MAC accelerator with packet
formatting, CRCs, address check,
auto-acks, timers
• Integrated ultra low power sleep
oscillator – 0.6µA
• 2.0V to 3.6V battery operation
• Deep sleep current 0.12µA (Wake-up
from IO)
• <$0.15 external component cost
• RX current 17mA , TX 15mA
• Receiver sensitivity -95dBm
• Transmit power 2.5dBm
• Time of Flight engine for ranging
• Antenna Diversity (Auto RX)
Features: Microcontroller
• 32-bit RISC CPU, 1 to 32MHz clock
speed
• Variable instruction width for high
coding efficiency
• Multi-stage instruction pipeline
• JN5161: 64kB/8kB/4kB
• JN5164: 160kB/32kB/4kB
• JN5168: 256kB/32kB/4kB
(Flash/RAM/EEPROM)
• Data EEPROM with guaranteed 100k
write operations.
• RF4CE, JenNet-IP, ZigBee SE and
ZigBee Light Link stacks
• 2-wire I2C compatible serial interface.
Can operate as either master or slave
• 5xPWM (4x timer & 1 timer/counter)
• 2 low power sleep counters
• 2x UART
• SPI Master & Slave port, 3 selects
• Supply voltage monitor with 8
programmable thresholds
• 4-input 10-bit ADC, comparator
• Battery and temperature sensors
• Watchdog & Brown Out Reset
• Up to 20 Digital IO Pins (DIO)
• Infra-red remote control transmitter
Temp range (-40°C to +125°C)
6x6mm 40-lead
Lead-free and RoHS compliant
The JN516x series is a range of ultra low power, high performance wireless
microcontrollers supporting JenNet-IP, ZigBee PRO or RF4CE networking
stacks to facilitate the development of Home Automation, Smart Energy,
Light Link and Remote control applications. They feature an enhanced 32-
bit RISC processor with embedded Flash and EEPROM memory, offering
high coding efficiency through variable width instructions, a multi-stage
instruction pipeline and low power operation with programmable clock
speeds. They also include a 2.4GHz IEEE802.15.4 compliant transceiver
and a comprehensive mix of analogue and digital peripherals. Three
memory configurations are available to suit different applications. The best
in class operating current of 15mA, with a 0.6uA sleep timer mode, gives
excellent battery life allowing operation direct from a coin cell.
The peripherals support a wide range of applications. They include a 2-wire
I
2
C, and SPI ports which can operate as either master or slave, a four
channel ADC with battery and a temperature sensor. It can support a large
switch matrix of up to 100 elements, or alternatively a 20 key capacitive
touch pad.
Block Diagram
32-bit
RISC CPU 4xPWM + Timer
2xUART
10-bit ADC
Battery and
Temp Sensors
2-Wire Serial
(Master/Slave)
SPI
Master & Slave RAM
128-bit AES
Hardware
2.4GHz
Including
Diversity
Flash
Power
Management
XTAL
O-QPSK
Modem
4kB
EEPROM
20 DIO
Sleep Counter
Watchdog
Timer
Voltage Brownout
8/32K 64/160/256K
Radio
4-Channel
IEEE 802.15.4
Baseband
Processor
Encryption
Benefits
• Single chip device to run
stack and application
• Very low current solution for
long battery life – over 10 yrs
• Supports multiple network
stacks
• Highly featured 32-bit RISC
CPU for high performance
and low power
• System BOM is low in
component count and cost
• Flexible sensor interfacing
options
Applications
• Robust and secure low power
wireless applications
• RF4CE Remote Controls
• JenNet-IP networks
• ZigBee SE networks
• ZigBee Light Link networks
• Lighting & Home automation
• Toys and gaming peripherals
• Smart Energy
• Energy harvesting, for
example self powered light
switch2 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
Contents
Benefits 1
Applications 1
1 Introduction 6
1.1 Wireless Transceiver 6
1.2 RISC CPU and Memory 6
1.3 Peripherals 7
1.4 Block Diagram – JN516x 8
2 Pin Configurations 9
2.1 Pin Assignment 10
2.2 Pin Descriptions 12
2.2.1 Power Supplies 12
2.2.2 Reset 12
2.2.3 32MHz Oscillator 12
2.2.4 Radio 12
2.2.5 Analogue Peripherals 13
2.2.6 Digital Input/Output 13
3 CPU 15
4 Memory Organisation 16
4.1 FLASH 16
4.2 RAM 16
4.3 OTP Configuration Memory 16
4.4 EEPROM 17
4.5 External Memory 17
4.6 Peripherals 17
4.7 Unused Memory Addresses 17
5 System Clocks 18
5.1 High-Speed (32MHz) System Clock 18
5.1.1 32MHz Crystal Oscillator 18
5.1.2 High-Speed RC Oscillator 19
5.2 Low-speed (32kHz) System Clock 19
5.2.1 32kHz RC Oscillator 19
5.2.2 32kHz Crystal Oscillator 20
5.2.3 32kHz External Clock 20
6 Reset 21
6.1 Internal Power-On / Brown-out Reset (BOR) 21
6.2 External Reset 22
6.3 Software Reset 22
6.4 Supply Voltage Monitor (SVM) 22
6.5 Watchdog Timer 23
7 Interrupt System 24
7.1 System Calls 24
7.2 Processor Exceptions 24
7.2.1 Bus Error 24© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 3
7.2.2 Alignment 24
7.2.3 Illegal Instruction 24
7.2.4 Stack Overflow 24
7.3 Hardware Interrupts 25
8 Wireless Transceiver 26
8.1 Radio 26
8.1.1 Radio External Components 27
8.1.2 Antenna Diversity 27
8.2 Modem 29
8.3 Baseband Processor 30
8.3.1 Transmit 30
8.3.2 Reception 30
8.3.3 Auto Acknowledge 31
8.3.4 Beacon Generation 31
8.3.5 Security 31
8.4 Security Coprocessor 31
8.5 Time of Flight Engine 31
9 Digital Input/Output 32
10 Serial Peripheral Interface 34
10.1 Serial Peripheral Interface Master 34
10.2 Serial Peripheral Interface Slave 37
11 Timers 38
11.1 Peripheral Timer/Counters 38
11.1.1 Pulse Width Modulation Mode 39
11.1.2 Capture Mode 39
11.1.3 Counter/Timer Mode 40
11.1.4 Delta-Sigma Mode 40
11.1.5 Infra-Red Transmission Mode 41
11.1.6 Example Timer/Counter Application 41
11.2 Tick Timer 42
11.3 Wakeup Timers 42
11.3.1 32 KHZ RC Oscillator Calibration 43
12 Pulse Counters 44
13 Serial Communications 45
13.1 Interrupts 46
13.2 UART Application 46
14 JTAG Test Interface 48
15 Two-Wire Serial Interface (I2
C) 49
15.1 Connecting Devices 49
15.2 Clock Stretching 50
15.3 Master Two-wire Serial Interface 50
15.4 Slave Two-wire Serial Interface 52
16 Random Number Generator 534 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
17 Analogue Peripherals 54
17.1 Analogue to Digital Converter 54
17.1.1 Operation 55
17.1.2 Supply Monitor 56
17.1.3 Temperature Sensor 56
17.1.4 ADC Sample Buffer Mode 56
17.2 Comparator 56
18 Power Management and Sleep Modes 57
18.1 Operating Modes 57
18.1.1 Power Domains 57
18.2 Active Processing Mode 57
18.2.1 CPU Doze 57
18.3 Sleep Mode 57
18.3.1 Wakeup Timer Event 58
18.3.2 DIO Event 58
18.3.3 Comparator Event 58
18.3.4 Pulse Counter 58
18.4 Deep Sleep Mode 58
19 Electrical Characteristics 59
19.1 Maximum Ratings 59
19.2 DC Electrical Characteristics 59
19.2.1 Operating Conditions 59
19.2.2 DC Current Consumption 60
19.2.3 I/O Characteristics 61
19.3 AC Characteristics 61
19.3.1 Reset and Supply Voltage Monitor 61
19.3.2 SPI Master Timing 63
19.3.3 SPI Slave Timing 64
19.3.4 Two-wire Serial Interface 65
19.3.5 Wakeup Timings 65
19.3.6 Bandgap Reference 66
19.3.7 Analogue to Digital Converters 66
19.3.8 Comparator 67
19.3.9 32kHz RC Oscillator 67
19.3.10 32kHz Crystal Oscillator 68
19.3.11 32MHz Crystal Oscillator 68
19.3.12 High-Speed RC Oscillator 69
19.3.13 Temperature Sensor 69
19.3.14 Non-Volatile Memory 69
19.3.15 Radio Transceiver 70
Appendix A Mechanical and Ordering Information 76
A.1 SOT618-1 HVQFN40 40-pin QFN Package Drawing 76
A.2 Footprint Information 77
A.3 Ordering Information 78
A.4 Device Package Marking 79
A.5 Tape and Reel Information 80
A.5.1 Tape Orientation and Dimensions 80
A.5.2 Reel Information: 180mm Reel 81
A.5.3 Reel Information: 330mm Reel 82© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 5
A.5.4 Dry Pack Requirement for Moisture Sensitive Material 82
Appendix B Development Support 83
B.1 Crystal Oscillators 83
B.1.1 Crystal Equivalent Circuit 83
B.1.2 Crystal Load Capacitance 83
B.1.3 Crystal ESR and Required Transconductance 84
B.2 32MHz Oscillator 85
B.3 32kHz Oscillator 87
B.4 JN516x Module Reference Designs 89
B.4.1 Schematic Diagram 89
B.4.2 PCB Design and Reflow Profile 91
B.4.3 Moisture Sensitivity Level (MSL) 91
Related Documents 92
RoHS Compliance 92
Status Information 92
Disclaimers 93
Trademarks 93
Version Control 93
Contact Details 946 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
1 Introduction
The JN516x is an IEEE802.15.4 wireless microcontroller that provides a fully integrated solution for applications using
the IEEE802.15.4 standard in the 2.4 - 2.5GHz ISM frequency band [1], including Zigbee PRO, ZigBee Smart Energy,
ZigBee LightLink, RF4CE and JenNet-IP. There are 3 versions in the range, differing only by memory configuration
JN5161-001: 64kB Flash, 8kB RAM, 4 kB EEPROM, suitable for IEEE802.15.4 and RF4CE applications
JN5164-001: 160kB Flash, 32kB RAM, 4 kB EEPROM suitable for Jennet-IP, IEEE802.15.4 and RF4CE applications
JN5168-001: 256kB Flash, 32kB RAM, 4 kB EEPROM suitable for all applications
Applications that transfer data wirelessly tend to be more complex than wired ones. Wireless protocols make
stringent demands on frequencies, data formats, timing of data transfers, security and other issues. Application
development must consider the requirements of the wireless network in addition to the product functionality and user
interfaces. To minimise this complexity, NXP provides a series of software libraries and interfaces that control the
transceiver and peripherals of the JN516x. These libraries and interfaces remove the need for the developer to
understand wireless protocols and greatly simplifies the programming complexities of power modes, interrupts and
hardware functionality.
In view of the above, it is not necessary to provide the register details of the JN516x in the datasheet.
The device includes a Wireless Transceiver, RISC CPU, on chip memory and an extensive range of peripherals.
1.1 Wireless Transceiver
The Wireless Transceiver comprises a 2.45GHz radio, a modem, a baseband controller and a security coprocessor.
In addition, the radio also provides an output to control transmit-receive switching of external devices such as power
amplifiers allowing applications that require increased transmit power to be realised very easily. Appendix B.4,
describes a complete reference design including Printed Circuit Board (PCB) design and Bill Of Materials (BOM).
The security coprocessor provides hardware-based 128-bit AES-CCM* modes as specified by the IEEE802.15.4
2006 standard. Specifically this includes encryption and authentication covered by the MIC –32/-64/-128, ENC and
ENC-MIC –32/-64/-128 modes of operation.
The transceiver elements (radio, modem and baseband) work together to provide IEEE802.15.4 (2006) MAC and
PHY functionality under the control of a protocol stack. Applications incorporating IEEE802.15.4 functionality can be
developed rapidly by combining user-developed application software with a protocol stack library.
1.2 RISC CPU and Memory
A 32-bit RISC CPU allows software to be run on-chip, its processing power being shared between the IEEE802.15.4
MAC protocol, other higher layer protocols and the user application. The JN516x has a unified memory architecture,
code memory, data memory, peripheral devices and I/O ports are organised within the same linear address space.
The device contains up to 256kbytes of Flash, up to 32kbytes of RAM and 4kbytes EEPROM . © NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 7
1.3 Peripherals
The following peripherals are available on chip:
• Master SPI port with three select outputs
• Slave SPI port
• Two UART’s, one capable of hardware flow control (4-wire, includes RTS/CTS), and the other just 2-wire
(RX/TX)
• One programmable Timer/Counter which supports Pulse Width Modulation (PWM) and capture/compare, plus
four PWM timers which support PWM and Timer modes only.
• Two programmable Sleep Timers and a Tick Timer
• Two-wire serial interface (compatible with SMbus and I2
C) supporting master and slave operation
• Twenty digital I/O lines (multiplexed with peripherals such as timers, SPI and UARTs)
• Two digital outputs (multiplexed with SPI port)
• 10-bit, Analogue to Digital converter with up to four input channels. Autonomous multi-channel sampling
• Programmable analogue comparator
• Internal temperature sensor and battery monitor
• Two low power pulse counters
• Random number generator
• Watchdog Timer and Supply Voltage Monitor
• JTAG hardware debug port
• Infra-red remote control transmitter, supported by one of the PWM timers
• Transmit and receive antenna diversity with automatic receive switching based on received energy detection
• Time of Flight engine for ranging
User applications access the peripherals using the Integrated Peripherals API. This allows applications to use a
tested and easily understood view of the peripherals allowing rapid system development. 8 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
1.4 Block Diagram – JN516x
Wireless
Transceiver
32-bit RISC CPU
MUX
Security
Processor
Digital Baseband
Radio
Programmable
Interrupt
Controller
From Peripherals
RF_IN
VCOTUNE
Tick Timer
Voltage
Regulators 1.8V VDD1
VDD2
IBIAS
VB_XX
EEPROM
4KB
CPU and 16MHz
System Clock
32MHz Xtal
Clock
Generator
XTAL_IN
XTAL_OUT
Clock
Source &
Rate
Select
Highspeed
RC
Osc
Watchdog
Timer
Supply Voltage
Monitor
Reset
Wakeup
Timer1
Wakeup Timer0
RESETN
32kHz Clock
Select 32KIN
Comparator1
COMP1P
COMP1M
ADC
M
U
ADC4 X
ADC1
VREF/ADC2
ADC3
Temperature
Sensor
Supply Monitor
32kHz
RC
Osc
32kHz
Xtal
Osc
32KXTALIN
32KXTALOUT
SPI Slave
DIO0
DIO1
DIO2
DIO3
DIO4
DIO5
DIO6
DIO7
DIO8
DIO9
DIO10
DIO11
DIO12
DIO13
DIO14
DIO15
DIO16
DIO17
DIO18
DIO19
DO0
DO1
TXD0
SPI
Master
UART0
UART1
RXD0
RTS0
CTS0
TxD1
RxD1
TIM0CK_GT
TIM0OUT
TIM0CAP
PWM1
PWM2
PWM3
PWM4
SIF_D
SIF_CLK
PC0
PC1
JTAG_TDI
JTAG_TMS
JTAG_TCK
JTAG_TDO
ADO
ADE
Timer0
PWMs
2-wire
Interface
Pulse
Counters
JTAG
Debug
Antenna
Diversity
SPICLK
SPIMOSI
SPIMISO
SPISEL0
SPICLK
SPIMOSI
SPIMISO
SPISEL0
SPISEL1
SPISEL2
FLASH
256/160/64KB
RAM
32/32/8KB
Figure 1: JN516x Block Diagram© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 9
2 Pin Configurations
1
40 39 38 37 36 35 34 33 32 31
VSSA
2
3
4
5
6
7
8
9
10
30
29
28
27
26
25
24
23
22
21
11 12 13 14 15 16 17 18 19 20
DIO16
DIO17
RESETN
XTAL_OUT
XTAL_IN
VB_SYNTH
VCOTUNE
VB_VCO
VDD1
IBIAS
VREF/ADC2
VB_RF2
RF_IN
VB_RF1
ADC1
DIO0
DIO1
DIO2
DIO3
DO0
VSS1
DO1
DIO18
DIO19
VB_RAM
DIO4
DIO5
DIO6
DIO7
VDD2
DIO15
VSS2
DIO14
DIO13
DIO12
VB_DIG
DIO11
DIO10
DIO9
DIO8
Figure 2: 40-pin QFN Configuration (top view)
Note: Please refer to Appendix B.4 JN516x Module Reference
Design for important applications information regarding the
connection of the PADDLE to the PCB. 10 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
2.1 Pin Assignment
Pin No Power supplies Signal
Type
Description
6, 8,
12, 14,
25, 35
VB_SYNTH, VB_VCO, VB_RF2, VB_RF1, VB_RAM, VB_DIG 1.8V Regulated supply voltage
9, 30 VDD1, VDD2 3.3V Supplies: VDD1 for
analogue, VDD2 for digital
21, 39,
Paddle
VSS1, VSS2, VSSA 0V Grounds (see appendix A.2
for paddle details)
General
3 RESETN CMOS Reset input
4,5 XTAL_OUT, XTAL_IN 1.8V System crystal oscillator
Radio
7 VCOTUNE 1.8V VCO tuning RC network
10 IBIAS 1.8V Bias current control
13 RF_IN 1.8V RF antenna
Analogue Peripheral I/O
15, 16,
17
ADC1, DIO0 (ADC3), DIO1 (ADC4) 3.3V ADC inputs
11 VREF/ADC2 1.8V Analogue peripheral
reference voltage or ADC
input 2
1, 2 DIO16 (COMP1P), DIO17 (COMP1M) 3.3V Comparator inputs
Digital Peripheral I/O
Primary Alternate Functions
16 DIO0 SPISEL1 ADC3 CMOS DIO0, SPI Master Select
Output 1 or ADC input 3
17 DIO1 SPISEL2 ADC4 PC0 CMOS DIO1, SPI Master Select
Output 2, ADC input 4 or
Pulse Counter 0 Input
18 DIO2 RFRX TIM0CK_GT CMOS DIO2, Radio Receive Control
Output or Timer0 Clock/Gate
Input
19 DIO3 RFTX TIM0CAP CMOS DIO3, Radio Transmit
Control Output or Timer0
Capture Input
26 DIO4 CTS0 JTAG_TCK TIM0OUT PC0 CMOS DIO4, UART 0 Clear To
Send Input, JTAG CLK Input,
Timer0 PWM Output, or
Pulse Counter 0 input
27 DIO5 RTS0 JTAG_TMS PWM1 PC1 CMOS DIO5, UART 0 Request To
Send Output, JTAG Mode
Select Input, PWM1 Output
or Pulse Counter 1 Input
28 DIO6 TXD0 JTAG_TDO PWM2 CMOS DIO6, UART 0 Transmit Data
Output, JTAG Data Output or
PWM2 Output
29 DIO7 RXD0 JTAG_TDI PWM3 CMOS DIO7, UART 0 Receive Data
Input, JTAG Data Input or
PWM 3 Output
31 DIO8 TIM0CK_GT PC1 PWM4 CMOS DIO8, Timer0 Clock/Gate
Input, Pulse Counter1 Input
or PWM 4 Output© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 11
32 DIO9 TIM0CAP 32KXTALIN RXD1 32KIN CMOS DIO9, Timer0 Capture Input,
32K External Crystal Input,
UART 1 Receive Data Input
or 32K external clock Input
33 DIO10 TIM0OUT 32KXTALOUT CMOS DIO10, Timer0 PWM Output
or 32K External Crystal
Output
34 DIO11 PWM1 TXD1 CMOS DIO11, PWM1 Output or
UART 1 Transmit Data
Output
36 DIO12 PWM2 CTS0 JTAG_TCK ADO SPISMO
SI
CMOS DIO12, PWM2 Output, UART
0 Clear To Send Input, JTAG
CLK Input, Antenna Diversity
Odd Output or SPI Slave
Master Out Slave In Input
37 DIO13 PWM3 RTS0 JTAG_TMS ADE SPISMI
SO
CMOS DIO13, PWM3 Output, UART
0 Request To Send Output,
JTAG Mode Select Input,
Antenna Diversity Even
output or SPI Slave Master In
Slave Out Output
38 DIO14 SIF_CLK TXD0 TXD1 JTAG_TDO SPISEL
1
SPISSE
L
CMOS DIO14, Serial Interface
Clock, UART 0 Transmit
Data Output, UART 1
Transmit Data Output, JTAG
Data Output, SPI Master
Select Output 1 or SPI Slave
Select Input
40 DIO15 SIF_D RXD0 RXD1 JTAG_TDI SPISEL
2
SPISCL
K
CMOS DIO15, Serial Interface Data,
UART 0 Receive Data Input,
UART 1 Receive Data Input,
JTAG Data Input, SPI Master
Select Output 2 or SPI Slave
Clock Input
1 DIO16 COMP1P SIF_CLK SPISMOSI CMOS DIO16, Comparator Positive
Input, Serial Interface clock
or SPI Slave Master Out
Slave In Input
2 DIO17 COMP1M SIF_D SPISMISO CMOS DIO17, Comparator Negative
Input, Serial Interface Data or
SPI Slave Master In Slave
Out Output
23 DIO18 SPIMOSI CMOS SPI Master Out Slave In
Output
24 DIO19 SPISEL0 CMOS SPI Master Select Output 0
20 DO0 SPICLK PWM2 CMOS SPI Master Clock Output or
PWM2 Output
22 DO1 SPIMISO PWM3 CMOS SPI Master In Slave Out
Input or PWM3 Output
The PCB schematic and layout rules detailed in Appendix B.4
must be followed. Failure to do so will likely result in the
JN516x failing to meet the performance specification detailed
herein and worst case may result in device not functioning in
the end application.12 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
2.2 Pin Descriptions
2.2.1 Power Supplies
The device is powered from the VDD1 and VDD2 pins, each being decoupled with a 100nF ceramic capacitor. VDD1
is the power supply to the analogue circuitry; it should be decoupled to ground. VDD2 is the power supply for the
digital circuitry; and should also be decoupled to ground. In addition, a common 10µF tantalum capacitor is required
for low frequencies. Decoupling pins for the internal 1.8V regulators are provided which each require a100nF
capacitor located as close to the device as practical. VB_SYNTH, VB_RAM and VB_DIG require only a 100nF
capacitor. VB_RF and VB_RF2 should be connected together as close to the device as practical, and require one
100nF capacitor and one 47pF capacitor. The pin VB_VCO requires a 10nF capacitor. Refer to B.4.1 for schematic
diagram.
VSSA (paddle), VSS1, VSS2 are the ground pins.
Users are strongly discouraged from connecting their own circuits to the 1.8v regulated supply pins, as the regulators
have been optimised to supply only enough current for the internal circuits.
2.2.2 Reset
RESETN is an active low reset input pin that is connected to a 500kΩ internal pull-up resistor. It may be pulled low
by an external circuit. Refer to Section 6.2 for more details.
2.2.3 32MHz Oscillator
A crystal is connected between XTAL_IN and XTAL_OUT to form the reference oscillator, which drives the system
clock. A capacitor to analogue ground is required on each of these pins. Refer to Section 5.1 for more details. The
32MHz reference frequency is divided down to 16MHz and this is used as the system clock throughout the device.
2.2.4 Radio
The radio is a single ended design, requiring a capacitor and just two inductors to match to 50Ω microstrip line to the
RF_IN pin.
An external resistor (43kΩ) is required between IBIAS and analogue ground (paddle) to set various bias currents and
references within the radio.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 13
2.2.5 Analogue Peripherals
The ADC requires a reference voltage to use as part of its operation. It can use either an internal reference voltage
or an external reference connected to VREF. This voltage is referenced to analogue ground and the performance of
the analogue peripherals is dependent on the quality of this reference.
There are four ADC inputs and a pair of comparator inputs. ADC1 has a designated input pin but ADC2 uses the
same pin as VREF, invalidating its use as an ADC pin when an external reference voltage is required. The remaining
2 ADC channels are shared with the digital I/Os DIO0 and DIO1 and connect to pins 16 and 17. When these two
ADC channels are selected, the corresponding DIOs must be configured as Inputs with their pull-ups disabled.
Similarly, the comparator shares pins 1 and 2 with DIO16 and DIO17, so when the comparator is selected these pins
must be configured as Inputs with their pull-ups disabled. The analogue I/O pins on the JN516x can have signals
applied up to 0.3v higher than VDD1. A schematic view of the analogue I/O cell is shown in Figure 3. Figure 4
demonstrates a special case, where a digital I/O pin doubles as an input to analogue devices. This applies to ADC3,
ADC4, COMP1P and COMP1M.
In reset, sleep and deep sleep, the analogue peripherals are all off. In sleep, the comparator may optionally be used
as a wakeup source.
Unused ADC and comparator inputs should not be left unconnected, for example connected to analogue ground.
VDD1
Analogue
I/O Pin
VSSA
Analogue
Peripheral
Figure 3: Analogue I/O Cell
2.2.6 Digital Input/Output
For the DC properties of these pins see Section 19.2.3.
When used in their primary function all Digital Input/Output pins are bi-directional and are connected to weak internal
pull up resistors (50kΩ nominal) that can be disabled. When used in their secondary function (selected when the
appropriate peripheral block is enabled through software library calls), their direction is fixed by the function. The pull
up resistor is enabled or disabled independently of the function and direction; the default state from reset is enabled.
A schematic view of the digital I/O cell is in Figure 4. The dotted lines through resistor RESD represent a path that
exists only on DIO0, DIO1, DIO16 and DIO17 which are also inputs to the ADC (ADC3, ADC4) and Comparator
(COMP1P, COMP1M) respectively. To use these DIO pins for their analogue functions, the DIO must be set as an
Input with its pull-up resistor, RPU, disabled.14 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
O
VDD2
Pu
RPU
OE
DIO[x] Pin
RESD
ADC or
COMP1 Input
I
IE
RPROT
VSS VSS
Figure 4: DIO Pin Equivalent Schematic
In reset, the digital peripherals are all off and the DIO pins are set as high-impedance inputs. During sleep and deep
sleep, the DIO pins retain both their input/output state and output level that was set as sleep commences. If the DIO
pins were enabled as inputs and the interrupts were enabled then these pins may be used to wake up the JN516x
from sleep.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 15
3 CPU
The CPU of the JN516x is a 32-bit load and store RISC processor. It has been architected for three key
requirements:
• Low power consumption for battery powered applications
• High performance to implement a wireless protocol at the same time as complex applications
• Efficient coding of high-level languages such as C provided with the Software Developers Kit
It features a linear 32-bit logical address space with unified memory architecture, accessing both code and data in the
same address space. Registers for peripheral units, such as the timers, UART and the baseband processor are also
mapped into this space.
The CPU has access to a block of 15 32-bit General-Purpose (GP) registers together with a small number of special
purpose registers which are used to store processor state and control interrupt handling. The contents of any GP
register can be loaded from or stored to memory, while arithmetic and logical operations, shift and rotate operations,
and signed and unsigned comparisons can be performed either between two registers and stored in a third, or
between registers and a constant carried in the instruction. Operations between general or special-purpose registers
execute in one cycle while those that access memory require a further cycle to allow the memory to respond.
The instruction set manipulates 8, 16 and 32-bit data; this means that programs can use objects of these sizes very
efficiently. Manipulation of 32-bit quantities is particularly useful for protocols and high-end applications allowing
algorithms to be implemented in fewer instructions than on smaller word-size processors, and to execute in fewer
clock cycles. In addition, the CPU supports hardware Multiply that can be used to efficiently implement algorithms
needed by Digital Signal Processing applications.
The instruction set is designed for the efficient implementation of high-level languages such as C. Access to fields in
complex data structures is very efficient due to the provision of several addressing modes, together with the ability to
be able to use any of the GP registers to contain the address of objects. Subroutine parameter passing is also made
more efficient by using GP registers rather than pushing objects onto the stack. The recommended programming
method for the JN516x is by using C, which is supported by a software developer kit comprising a C compiler, linker
and debugger.
The CPU architecture also contains features that make the processor suitable for embedded, real-time applications.
In some applications, it may be necessary to use a real-time operating system to allow multiple tasks to run on the
processor. To provide protection for device-wide resources being altered by one task and affecting another, the
processor can run in either supervisor or user mode, the former allowing access to all processor registers, while the
latter only allows the GP registers to be manipulated. Supervisor mode is entered on reset or interrupt; tasks starting
up would normally run in user mode in a RTOS environment.
Embedded applications require efficient handling of external hardware events. Exception processing (including reset
and interrupt handling) is enhanced by the inclusion of a number of special-purpose registers into which the PC and
status register contents are copied as part of the operation of the exception hardware. This means that the essential
registers for exception handling are stored in one cycle, rather than the slower method of pushing them onto the
processor stack. The PC is also loaded with the vector address for the exception that occurred, allowing the handler
to start executing in the next cycle.
To improve power consumption a number of power-saving modes are implemented in the JN516x, described more
fully in Section 18. One of these modes is the CPU doze mode; under software control, the processor can be shut
down and on an interrupt it will wake up to service the request. Additionally, it is possible under software control, to
set the speed of the CPU to 1, 2, 4, 8, 16 or 32MHz. This feature can be used to trade-off processing power against
current consumption.16 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
4 Memory Organisation
This section describes the different memories found within the JN516x. The device contains Flash, RAM, and
EEPROM memory, the wireless transceiver and peripherals all within the same linear address space.
0xFFFFFFFF
Unpopulated
0xF0008000
RAM
0x04000000
0x02000000
FLASH Boot Code 8K
0x000C0000
0x00000000
0x00080000
Flash & EEPROM Registers
0x01000000
Peripherals
FLASH
Applications
Code
(256KB)
Figure 5: JN5168 Memory Map
4.1 FLASH
The embedded Flash consists of 2 parts: an 8K region used for holding boot code, and a 256K region (JN5168) used
for application code. The sector size of the application code is always 32K, for any size of Flash memory. The
maximum number of write cycles or endurance is, 10k guaranteed and typically 100k, while the data retention is
guaranteed for at least 10 years. The boot code region is pre-programmed by NXP on supplied parts, and contains
code to handle reset, interrupts and other events (see section 7). It also contains a Flash Programming Interface to
allow interaction with the PC-based Flash Programming Utility which allows user code compiled using the supplied
SDK to be programmed into the Application space. For further information, refer to the Flash Programmer User
Guide.[9]. The memory can be erased by a single or multiple sectors and written to in units of 256 bytes, known as
pagewords.
4.2 RAM
The JN516x devices contain up to 32Kbytes of high speed RAM, which can be accessed by the CPU in a single clock
cycle. It is primarily used to hold the CPU Stack together with program variables and data. If necessary, the CPU can
execute code contained within the RAM (although it would normally just execute code directly from the embedded
Flash). Software can control the power supply to the RAM allowing the contents to be maintained during a sleep
period when other parts of the device are un-powered, allowing a quicker resumption of processing once woken.
4.3 OTP Configuration Memory
The JN516x devices contain a quantity of One Time Programmable (OTP) memory as part of the embedded Flash
(Index Sector). This can be used to securely hold such things as a user 64-bit MAC address and a 128-bit AES
security key. By default the 64-bit MAC address is pre-programmed by NXP on supplied parts; however customers © NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 17
can use their own MAC address and override the default one. The user MAC address and other data can be written
to the OTP memory using the Flash programmer [9]. Details on how to obtain and install MAC addresses can be
found in the Flash Programmer User Guide. In addition 384bits are available, organised as three 128bit words, for
customer use for storage of configuration or other information.
4.4 EEPROM
The JN516x devices contain 4Kbytes of EEPROM. The maximum number of write cycles or endurance is, 100k
guaranteed and 1M typically while the data retention is guaranteed for at least 20 years. (The Persistent Data
Manager, includes a wear-levelling algorithm which can help to extend the endurance.) This non-volatile memory is
primarily used to hold persistent data generated from such things as the Network Stack software component (e.g.
network topology, routing tables). As the EEPROM holds its contents through sleep and reset events, this means
more stable operation and faster recovery is possible after outages. Access to the EEPROM is via registers mapped
into the Flash and EEPROM Registers region of the address map. The memory can be erased by a single or multiple
pages of 64 bytes. It can be written to in single or multiple bytes up to 64 bytes. The customer may use part of the
EEPROM to store its own data if desired by interfacing with the Persistent Data Manager. Optionally the PDM can
also store data in an external memory. For further information, please read - JenOS User Guide [12].
4.5 External Memory
An optional external serial non-volatile memory (eg Flash or EEPROM) with a SPI interface may be used to provide
additional storage for program code, such as a new code image or further data for the device when external power is
removed. The memory can be connected to the SPI Master interface using select line SPISEL0 (see fig 6 for details)
JN516x
Serial
Memory
SPISEL0
SPIMISO
SPIMOSI
SPICLK
SS
SDO
SDI
CLK
Figure 6: Connecting External Serial Memory
The contents of the external serial memory may be encrypted. The AES security processor combined with a user
programmable 128-bit encryption key is used to encrypt the contents of the external memory. The encryption key is
stored in the flash memory index section. When bootloading program code from external serial memory, the JN516x
automatically accesses the encryption key to execute the decryption process, user program code does not need to
handle any of the decryption process; it is transparent. For more details, including the how the program code encrypts
data for the external memory, see the application note Boot Loader Operation. [8]
4.6 Peripherals
All peripherals have their registers mapped into the memory space. Access to these registers requires 3 peripheral
clock cycles. Applications have access to the peripherals through the software libraries that present a high-level view
of the peripheral’s functions through a series of dedicated software routines. These routines provide both a tested
method for using the peripherals and allow bug-free application code to be developed more rapidly. For details, see
Peripherals API User Guide [4].
4.7 Unused Memory Addresses
Any attempt to access an unpopulated memory area will result in a bus error exception (interrupt) being generated.18 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
5 System Clocks
Two system clocks are used to drive the on-chip subsystems of the JN516x. The wake-up timers are driven from a
low frequency clock (notionally 32kHz). All other subsystems (transceiver, processor, memory and digital and
analogue peripherals) are driven by a high-speed clock (notionally 32MHz), or a divided-down version of it.
The high-speed clock is either generated by the accurate crystal-controlled oscillator (32MHz) or the less accurate
high-speed RC oscillator ( 27-32MHz calibrated). The low-speed clock is either generated by the accurate crystalcontrolled
oscillator (32.768kHz), the less accurate RC oscillator (centered on 32kHz) or can be supplied externally
5.1 High-Speed (32MHz) System Clock
The selected high-speed system clock is used directly by the radio subsystem, whereas a divided-by-two version is
used by the remainder of the transceiver and the digital and analogue peripherals. The direct or divided down version
of the clock is used to drive the processor and memories (32, 16, 8, 4, 2 or 1MHz).
High Speed
RC Oscillator
32MHz Crystal
Oscillator
Div by 1,2,4,8,16 or 32
Div by 2
PERIPHERAL SYSTEM CLOCK
CPU CLOCK
Figure 7 System and CPU Clocks
Crystal oscillators are generally slow to start. Hence to provide a fast start-up following a sleep cycle or reset, the fast
RC oscillator is always used as the initial source for the high-speed system clock. The oscillator starts very quickly
and will run at 25-32MHz (uncalibrated) or 32MHz +/-5% (calibrated). Although this means that the system clock will
be running at an undefined frequency (slightly slower or faster than nominal), this does not prevent the CPU and
Memory subsystems operating normally, so the program code can execute. However, it is not possible to use the
radio or UARTs, as even after calibration (initiated by the user software calling an API function) there is still a +/-5%
tolerance in the clock rate over voltage and temperature. Other digital peripherals can be used (eg SPI Master/Slave),
but care must be taken if using Timers due to the clock frequency inaccuracy.
Further details of the High-Speed RC Oscillator can be found in section 19.3.11.
On wake-up from sleep, the JN516x uses the Fast RC oscillator. It can then either:
• Automatically switch over to use the 32MHz clock source when it has started up.
• Continue to use the fast RC oscillator until software triggers the switch-over to the 32MHz clock source, for
example when the radio is required.
• Continue to use the RC oscillator until the device goes back into one of the sleep modes.
The use of the fast RC Oscillator at wake-up means there is no need to wait for the 32MHz crystal oscillator to
stabilise Consequently, the application code will start executing quickly using the clock from the high-speed RC
oscillator.
5.1.1 32MHz Crystal Oscillator
The JN516x contains the necessary on chip components to build a 32MHz reference oscillator with the addition of an
external crystal resonator and two tuning capacitors. The schematic of these components are shown in Figure 8.
The two capacitors, C1 and C2, should typically be 15pF and use a COG dielectric. Due to the small size of these
capacitors, it is important to keep the traces to the external components as short as possible. The on chip
transconductance amplifier is compensated for temperature variation, and is self-biasing by means of the internal
resistor R1. This oscillator provides the frequency reference for the radio and therefore it is essential that the
reference PCB layout and BOM are carefully followed. The electrical specification of the oscillator can be found in © NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 19
Section 19.3.11. Please refer to Appendix B for development support with the crystal oscillator circuit. The oscillator
includes a function which flags when the amplitude of oscillation has reached a satisfactory level for full operation,
and this is checked before the source of the high-speed system clock is changed to the 32MHz crystal oscillator
XTALOUT
C1 C2
XTALIN R1
JN516x
Figure 8: 32MHz Crystal Oscillator Connections
For operation over the extended temperature range, 85 to 125 deg C, special care is required; this is because the
temperature characteristics of crystal resonators are generally in excess of +/-40ppm frequency tolerance defined by
the IEEE802.15.4 standard. The oscillator cell contains additional circuitry to compensate for the poor performance of
the crystal resonators above 100 deg C. Full details, including the software API function, can be found in the
application note JN516x Temperature-dependent Operating Guidelines [2]
5.1.2 High-Speed RC Oscillator
An on-chip High-Speed RC oscillator is provided in addition to the 32MHz crystal oscillator for two purposes, to allow
a fast start-up from reset or sleep and to provide a lower current alternative to the crystal oscillator for non-timing
critical applications. By default the oscillator will run at 27MHz typically with a wide tolerance. It can be calibrated,
using a software API function, which will result in a nominal frequency of 32MHz with a +/-1.6% tolerance at 3v and
25 deg C. However, it should be noted that over the full operating range of voltage and temperature this will increase
to +/-5%. The calibration information is retained through speed cycles and when the oscillator is disabled, so typically
the calibration function only needs to be called once. No external components are required for this oscillator. The
electrical specification of the oscillator can be found in Section 19.3.12.
5.2 Low-speed (32kHz) System Clock
The 32kHz system clock is used for timing the length of a sleep period (see Section 18). The clock can be selected
from one of three sources through the application software:
• 32kHz RC Oscillator
• 32kHz Crystal Oscillator
• 32kHz External Clock
Upon a chip reset or power-up the JN516x defaults to using the internal 32kHz RC Oscillator. If another clock source
is selected then it will remain in use for all 32kHz timing until a chip reset is performed.
5.2.1 32kHz RC Oscillator
The internal 32kHz RC oscillator requires no external components. The internal timing components of the oscillator
have a wide tolerance due to manufacturing process variation and so the oscillator runs nominally at 32kHz -10%
/+40%. To make this useful as a timing source for accurate wakeup from sleep, a frequency calibration factor derived
from the more accurate 16MHz clock may be applied. The calibration factor is derived through software, details can
be found in Section 11.3.1. Software must check that the 32kHz RC oscillator is running before using it. The oscillator
has a default current consumption of around 0.5uA, optionally this can be reduced to 0.375uA, however, the 20 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
calibrated accuracy and temperature coefficient will be worse as a consequence. For detailed electrical
specifications, see Section 19.3.9.
5.2.2 32kHz Crystal Oscillator
In order to obtain more accurate sleep periods, the JN516x contains the necessary on-chip components to build a
32kHz oscillator with the addition of an external 32.768kHz crystal and two tuning capacitors. The crystal should be
connected between 32KXTALIN and 32KXTALOUT (DIO9 and DIO10), with two equal capacitors to ground, one on
each pin. Due to the small size of the capacitors, it is important to keep the traces to the external components as
short as possible.
The electrical specification of the oscillator can be found in Section 19.3.10. The oscillator cell is flexible and can
operate with a range of commonly available 32.768kHz crystals with load capacitances from 6 to 12.5pF. However,
the maximum ESR of the crystal and the supply current are both functions of the actual crystal used, see Appendix
B.1 for more details.
32KXTALIN 32KXTALOUT
JN516x
Figure 9: 32kHz Crystal Oscillator Connections
5.2.3 32kHz External Clock
An externally supplied 32kHz reference clock on the 32KXTALIN input (DIO9) may be provided to the JN516x. This
would allow the 32kHz system clock to be sourced from a very stable external oscillator module, allowing more
accurate sleep cycle timings compared to the internal RC oscillator. (See Section 19.2.3)© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 21
6 Reset
A system reset initialises the device to a pre-defined state and forces the CPU to start program execution from the
reset vector. The reset process that the JN516x goes through is as follows.
When power is first applied or when the external reset is released, the High-Speed RC oscillator and 32MHz crystal
oscillator are activated. After a short wait period (13µsec approx) while the High-Speed RC starts up, and so long as
the supply voltage satisfies the default Supply Voltage Monitor (SVM) threshold (2.0V+0.045V hysteresis), the
internal 1.8V regulators are turned on to power the processor and peripheral logic. The regulators are allowed to
stabilise (about 15us) followed by a further wait (150usec approx) to allow the Flash and EEPROM bandgaps to
stabilise and allow their initialisation, including reading the user SVM threshold from the Flash. This is applied to the
SVM and, after a brief pause (approx 2.5usec), the SVM is checked again. If the supply is above the new SVM
threshold, the CPU and peripheral logic is released from reset and the CPU starts to run code beginning at the reset
vector. This runs the bootloader code contained within the flash, which looks for a valid application to run, first from
the internal flash and then from any connected external serial memory over the SPI Master interface. Once found,
required variables are initialised in RAM before the application is called at its AppColdStart entry point. More details
on the bootloader can be found in the application note - Boot Loader Operation. [8]
The JN516x has five sources of reset:
• Internal Power-on / Brown-out Reset (BOR)
• External Reset
• Software Reset
• Watchdog timer
• Supply Voltage detect
Note: When the device exits a reset condition, device operating
parameters (voltage, frequency, temperature, etc.) must be met to ensure
operation. If these conditions are not met, then the device must be held in
reset until the operating conditions are met. (See Section 19.3)
6.1 Internal Power-On / Brown-out Reset (BOR)
For the majority of applications the internal power-on reset is capable of generating the required reset signal. When
power is applied to the device, the power-on reset circuit monitors the rise of the VDD supply. When the VDD
reaches the specified threshold, the reset signal is generated. This signal is held internally until the power supply and
oscillator stabilisation time has elapsed, when the internal reset signal is then removed and the CPU is allowed to
run.
The BOR circuit has the ability to reject spikes on the VDD rail to avoid false triggering of the reset module. Typically
for a negative going square pulse of duration 1uS, the voltage must fall to 1.2v before a reset is generated. Similarly
for a triangular wave pulse of 10us width, the voltage must fall to 1.3v before causing a reset. The exact
characteristics are complex and these are only examples.
Internal RESET
VDD
Figure 10: Internal Power-on Reset
When the supply drops below the power on reset ‘falling’ threshold, it will re-trigger the reset. If necessary, use of the
external reset circuit show in Figure 11 is suggested. 22 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
RESETN
C1
R1
JN516x
VDD
18k
470nF
Figure 11: External Reset Generation
The external resistor and capacitor provide a simple reset operation when connected to the RESETN pin but are not
neccessary.
6.2 External Reset
An external reset is generated by a low level on the RESETN pin. Reset pulses longer than the minimum pulse width
will generate a reset during active or sleep modes. Shorter pulses are not guaranteed to generate a reset. The
JN516x is held in reset while the RESETN pin is low. When the applied signal reaches the Reset Threshold Voltage
(VRST) on its positive edge, the internal reset process starts.
The JN516x has an internal 500kΩ pull-up resistor connect to the RESETN pin. The pin is an input for an external
reset only. By holding the RESETN pin low, the JN516x is held in reset, resulting in a typical current of 6uA.
Internal Reset
RESETN pin
Reset
Figure 12: External Reset
6.3 Software Reset
A system reset can be triggered at any time through software control, causing a full chip reset and invalidating the
RAM contents. For example this can be executed within a user’s application upon detection of a system failure.
6.4 Supply Voltage Monitor (SVM)
An internal Supply Voltage Monitor (SVM) is used to monitor the supply voltage to the JN516x; this can be used
whilst the device is awake or is in CPU doze mode. Dips in the supply voltage below a variable threshold can be
detected and can be used to cause the JN516x to perform a chip reset. Equally, dips in the supply voltage can be © NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 23
detected and used to cause an interrupt to the processor, when the voltage either drops below the threshold or rises
above it.
The supply voltage detect is enabled by default from power-up and can extend the reset during power-up. This will
keep the CPU in reset until the voltage exceeds the SVM threshold voltage. The threshold voltage is configurable to
1.95V, 2.0V, 2.1V, 2.2V, 2.3V, 2.4V, 2.7V and 3.0V and is controllable by software. From power-up the threshold is
set by a setting within the flash and the default chip configuration is for the 2.0V threshold. It is expected that the
threshold is set to the minimum needed by the system..
6.5 Watchdog Timer
A watchdog timer is provided to guard against software lockups. It operates by counting cycles of the high-speed RC
system clock. A pre-scaler is provided to allow the expiry period to be set between typically 8ms and 16.4 seconds
(dependent on high-speed RC accuracy: +30%, -15%). Failure to restart the watchdog timer within the pre-configured
timer period will cause a chip reset to be performed. A status bit is set if the watchdog was triggered so that the
software can differentiate watchdog initiated resets from other resets, and can perform any required recovery once it
restarts. Optionally, the watchdog can cause an exception rather than a reset, this preserves the state of the memory
and is useful for debugging.
After power up, reset, start from deep sleep or start from sleep, the watchdog is always enabled with the largest
timeout period and will commence counting as if it had just been restarted. Under software control the watchdog can
be disabled. If it is enabled, the user must regularly restart the watchdog timer to stop it from expiring and causing a
reset. The watchdog runs continuously, even during doze, however the watchdog does not operate during sleep or
deep sleep, or when the hardware debugger has taken control of the CPU. It will recommence automatically if
enabled once the debugger un-stalls the CPU. 24 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
7 Interrupt System
The interrupt system on the JN516x is a hardware-vectored interrupt system. The JN516x provides several interrupt
sources, some associated with CPU operations (CPU exceptions) and others which are used by hardware in the
device. When an interrupt occurs, the CPU stops executing the current program and loads its program counter with a
fixed hardware address specific to that interrupt. The interrupt handler or interrupt service routine is stored at this
location and is run on the next CPU cycle. Execution of interrupt service routines is always performed in supervisor
mode. Interrupt sources and their vector locations are listed in Table 1 below:
Interrupt Source Vector Location Interrupt Definition
Bus error 0x08 Typically cause by an attempt to access an invalid address or a
disabled peripheral
Tick timer 0x0e Tick timer interrupt asserted
Alignment error 0x14 Load/store address to non-naturally-aligned location
Illegal instruction 0x1a Attempt to execute an unrecognised instruction
Hardware interrupt 0x20 interrupt asserted
System call 0x26 System call initiated by b.sys instruction
Trap 0x2c caused by the b.trap instruction or the debug unit
Reset 0x38 Caused by software or hardware reset.
Stack Overflow 0x3e Stack overflow
Table 1: Interrupt Vectors
7.1 System Calls
The b.trap and b.sys instructions allow processor exceptions to be generated by software.
A system call exception will be generated when the b.sys instruction is executed. This exception can, for example, be
used to enable a task to switch the processor into supervisor mode when a real time operating system is in use. (See
Section 3 for further details.)
The b.trap instruction is commonly used for trapping errors and for debugging.
7.2 Processor Exceptions
7.2.1 Bus Error
A bus error exception is generated when software attempts to access a memory address that does not exist, or is not
populated with memory or peripheral registers.
7.2.2 Alignment
Alignment exceptions are generated when software attempts to access objects that are not aligned to natural word
boundaries. 16-bit objects must be stored on even byte boundaries, while 32-bit objects must be stored on quad byte
boundaries. For instance, attempting to read a 16-bit object from address 0xFFF1 will trigger an alignment exception
as will a read of a 32-bit object from 0xFFF1, 0xFFF2 or 0xFFF3. Examples of legal 32-bit object addresses are
0xFFF0, 0xFFF4, 0xFFF8 etc.
7.2.3 Illegal Instruction
If the CPU reads an unrecognised instruction from memory as part of its instruction fetch, it will cause an illegal
instruction exception.
7.2.4 Stack Overflow
When enabled, a stack overflow exception occurs if the stack pointer reaches a programmable location.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 25
7.3 Hardware Interrupts
Hardware interrupts generated from the transceiver, analogue or digital peripherals and DIO pins are individually
masked using the Programmable Interrupt Controller (PIC). Management of interrupts is provided in the Peripherals
API User Guide [4]. For details of the interrupts generated from each peripheral see the respective section in this
datasheet.
Interrupts can be used to wake the JN516x from sleep. The peripherals, baseband controller, security coprocessor
and PIC are powered down during sleep but the DIO interrupts and optionally the pulse counters, wake-up timers and
analogue comparator interrupts remain powered to bring the JN516x out of sleep.
Prioritised external interrupt handling (i.e., interrupts from hardware peripherals) is provided to enable an application
to control an events priority to provide for deterministic program execution.
The priority Interrupt controller provides 15 levels of prioritised interrupts. The priority level of all interrupts can be set,
with value 0 being used to indicate that the source can never produce an external interrupt, 1 for the lowest priority
source(s) and 15 for the highest priority source(s). Note that multiple interrupt sources can be assigned the same
priority level if desired.
If while processing an interrupt, a new event occurs at the same or lower priority level, a new external interrupt will
not be triggered. However, if a new higher priority event occurs, the external interrupt will again be asserted,
interrupting the current interrupt service routine.
Once the interrupt service routine is complete, lower priority events can be serviced. 26 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
8 Wireless Transceiver
The wireless transceiver comprises a 2.45GHz radio, modem, a baseband processor, a security coprocessor and
PHY controller. These blocks, with protocol software provided as a library, implement an IEEE802.15.4 standardsbased
wireless transceiver that transmits and receives data over the air in the unlicensed 2.4GHz band.
8.1 Radio
Figure 13 shows the single ended radio architecture.
LNA
synth
PA
ADC Reference
& Bias
Switch
Radio
Calibration
Lim1
Lim2
Lim3
Lim4
sigma
delta
D-Type
Figure 13: Radio Architecture
The radio comprises a low-IF receive path and a direct modulation transmit path, which converge at the TX/RX
switch. The switch connects to the external single ended matching network, which consists of two inductors and a
capacitor, this arrangement creates a 50Ω port and removes the need for a balun. A 50Ω single ended antenna can
be connected directly to this port.
The 32MHz crystal oscillator feeds a divider, which provides the frequency synthesiser with a reference frequency.
The synthesiser contains programmable feedback dividers, phase detector, charge pump and internal Voltage
Controlled Oscillator (VCO). The VCO has no external components, and includes calibration circuitry to compensate
for differences in internal component values due to process and temperature variations. The VCO is controlled by a
Phase Locked Loop (PLL) that has an internal loop filter. A programmable charge pump is also used to tune the loop
characteristic.
The receiver chain starts with the low noise amplifier/mixer combination whose outputs are passed to a low pass
filter, which provides the channel definition. The signal is then passed to a series of amplifier blocks forming a limiting
strip. The signal is converted to a digital signal before being passed to the Modem. The gain control for the RX path
is derived in the automatic gain control (AGC) block within the Modem, which samples the signal level at various
points down the RX chain. To improve the performance and reduce current consumption, automatic calibration is
applied to various blocks in the RX path.
In the transmit direction, the digital stream from the Modem is passed to a digital sigma-delta modulator which
controls the feedback dividers in the synthesiser, (dual point modulation). The VCO frequency now tracks the applied
modulation. The 2.4 GHz signal from the VCO is then passed to the RF Power Amplifier (PA), whose power control
can be selected from one of three settings. The output of the PA drives the antenna via the RX/TX switch© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 27
The JN516x radio when enabled is automatically calibrated for optimum performance. In operating environments with
a significant variation in temperature (e.g. greater than 20 deg C) due to diurnal or ambient temperature variation, it is
recommended to recalibrate the radio to maintain performance. Recalibration is only required on Routers and End
Devices that never sleep. End Devices that sleep when idle are automatically recalibrated when they wake. An
Application Note JN516x Temperature-dependent Operating Guidelines [2] describes this in detail and includes a
software API function which can be used to test the temperature using the on-chip temperature sensor and trigger a
recalibration if there has been a significant temperature change since the previous calibration.
8.1.1 Radio External Components
In order to realise the full performance of the radio it is essential that the reference PCB layout and BOM are carefully
followed. See Appendix B.4.
The radio is powered from a number of internal 1.8V regulators fed from the analogue supply VDD1, in order to
provide good noise isolation between the digital logic of the JN516x and the analogue blocks. These regulators are
also controlled by the baseband controller and protocol software to minimise power consumption. Decoupling for
internal regulators is required as described in Section 2.2.1.
For single ended antennas or connectors, a balun is not required, however a matching network is needed.
The RF matching network requires three external components and the IBIAS pin requires one external component as
shown in schematic in B.4.1. These components are critical and should be placed close to the JN516x pins and
analogue ground as defined in Table 12. Specifically, the output of the network comprising L2, C1 and L1 is
designed to present an accurate match to a 50 ohm resistive network as well as provide a DC path to the final output
stage or antenna. Users wishing to match to other active devices such as amplifiers should design their networks to
match to 50 ohms at the output of L1
R1 43K
IBIAS
C20 100nF
L2 3.9nH
VB_RF
VREF
VB_RF2
RF_IN
C3 100nF
C12 47pF
VB_RF1
C1 47pF L1 5.1nH
To Coaxial Socket
or Integrated Antenna
VB_RF
Figure 14: External Radio Components
8.1.2 Antenna Diversity
Support is provided for antenna diversity. Antenna diversity is a technique that maximises the performance of an
antenna system. It allows the radio to switch between two antennas that have very low correlation between their
received signals. Typically, this is achieved by spacing two antennae around 0.25 wavelengths apart or by using two
orthogonal polarisations. So, if a packet is transmitted and no acknowledgement is received, the radio system can
switch to the other antenna for the retry, with a different probability of success.28 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
Additionally antenna diversity can be enabled whilst in receive mode waiting for a packet. The JN516x measures the
received energy in the relevant radio channel every 40μs and the measured energy level is compared with a pre-set
energy threshold, which can be set by the application program. The JN516x device will automatically switch the
antennae if the measurement is below this threshold, except if waiting for an acknowledgement from a previous
transmission or if the process of receiving a packet, when it will wait until this has finished. Also, it will not switch if a
preamble symbol having a signal quality above a minimum specified threshold has not been detected in the last 40μs
Both modes can be used at once and use the same ADO and ADE outputs to control the switch.
The JN516x provides an output (ADO) on DIO12 that is asserted on odd numbered retries and optionally its
complement (ADE) on DIO13, that can be used to control an antenna switch; this enables antenna diversity to be
implemented easily (see Figure 15 and Figure 16).
Antenna A Antenna B
A B
COM
SEL
SELB
ADO (DIO[12])
ADE (DIO[13])
Device RF Port
RF Switch: Single-Pole, Double-Throw (SPDT)
Figure 15: Simple Antenna Diversity Implementation using External RF Switch
ADO (DIO[12])
TX Active
RX Active
ADE (DIO[13])
1st TX-RX Cycle 2nd TX-RX Cycle (1st Retry)
Figure 16: Antenna Diversity ADO Signal for TX with Acknowledgement
If two DIO pins cannot be spared, DIO13 can be configured to be a normal DIO pin, and the inverse of ADO
generated with an inverter on the PCB. © NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 29
8.2 Modem
The modem performs all the necessary modulation and spreading functions required for digital transmission and
reception of data at 250kbps in the 2450MHz radio frequency band in compliance with the IEEE802.15.4 standard.
AGC Demodulation
Symbol
Detection
(Despreading)
Modulation Spreading
TX
RX
TX Data
Interface
RX Data
Interface
VCO
Sigma-Delta
Modulator
IF Signal
Gain
Figure 17: Modem Architecture
Features provided to support network channel selection algorithms include Energy Detection (ED), Link Quality
Indication (LQI) and fully programmable Clear Channel Assessment (CCA).
The Modem provides a digital Receive Signal Strength Indication (RSSI) that facilitates the implementation of the
IEEE 802.15.4 ED function and LQI function.
The ED and LQI are both related to receiver power in the same way, as shown in Figure 18. LQI is associated with a
received packet, whereas ED is an indication of signal power on air at a particular moment.
The CCA capability of the Modem supports all modes of operation defined in the IEEE 802.15.4 standard, namely
Energy above ED threshold, Carrier Sense and Carrier Sense and/or energy above ED threshold.
Figure 18: Energy Detect Value vs Receive Power Level30 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
8.3 Baseband Processor
The baseband processor provides all time-critical functions of the IEEE802.15.4 MAC layer. Dedicated hardware
guarantees air interface timing is precise. The MAC layer hardware/software partitioning, enables software to
implement the sequencing of events required by the protocol and to schedule timed events with millisecond
resolution, and the hardware to implement specific events with microsecond timing resolution. The protocol software
layer performs the higher-layer aspects of the protocol, sending management and data messages between endpoint
and coordinator nodes, using the services provided by the baseband processor.
Supervisor
Append
Checksum Serialiser
DMA
Engine
TX
Stream
Radio
Protocol Timing Engine
CSMA CCA Backoff
Control
Control
RX
Stream Verify
Checksum Deserialiser
Protocol
Timers
Security Coprocessor
AES
Codec
Encrypt
Port
Decrypt
Port
Status
Processor
Bus
Figure 19: Baseband Processor
8.3.1 Transmit
A transmission is performed by software writing the data to be transferred into the Tx Frame Buffer in RAM, together
with parameters such as the destination address and the number of retries allowed, and programming one of the
protocol timers to indicate the time at which the frame is to be sent. This time will be determined by the software
tracking the higher-layer aspects of the protocol such as superframe timing and slot boundaries. Once the packet is
prepared and protocol timer set, the supervisor block controls the transmission. When the scheduled time arrives,
the supervisor controls the sequencing of the radio and modem to perform the type of transmission required, fetching
the packet data directly from RAM. It can perform all the algorithms required by IEEE802.15.4 such as CSMA/CA
without processor intervention including retries and random backoffs.
When the transmission begins, the header of the frame is constructed from the parameters programmed by the
software and sent with the frame data through the serialiser to the Modem. At the same time, the radio is prepared
for transmission. During the passage of the bitstream to the modem, it passes through a CRC checksum generator
that calculates the checksum on-the-fly, and appends it to the end of the frame.
8.3.2 Reception
During reception, the radio is set to receive on a particular channel. On receipt of data from the modem, the frame is
directed into the Rx Frame Buffer in RAM where both header and frame data can be read by the protocol software.
An interrupt may be provided on receipt of the frame header. As the frame data is being received from the modem it
is passed through a checksum generator; at the end of the reception the checksum result is compared with the
checksum at the end of the message to ensure that the data has been received correctly. An interrupt may be
provided to indicate successful packet reception. During reception, the modem determines the Link Quality, which is
made available at the end of the reception as part of the requirements of IEEE802.15.4.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 31
8.3.3 Auto Acknowledge
Part of the protocol allows for transmitted frames to be acknowledged by the destination sending an acknowledge
packet within a very short window after the transmitted frame has been received. The JN516x baseband processor
can automatically construct and send the acknowledgement packet without processor intervention and hence avoid
the protocol software being involved in time-critical processing within the acknowledge sequence. The JN516x
baseband processor can also request an acknowledge for packets being transmitted and handle the reception of
acknowledged packets without processor intervention.
8.3.4 Beacon Generation
In beaconing networks, the baseband processor can automatically generate and send beacon frames; the repetition
rate of the beacons is programmed by the CPU, and the baseband then constructs the beacon contents from data
delivered by the CPU. The baseband processor schedules the beacons and transmits them without CPU
intervention.
8.3.5 Security
The transmission and reception of secured frames using the Advanced Encryption Standard (AES) algorithm is
handled by the security coprocessor and the stack software. The application software must provide the appropriate
encrypt/decrypt keys for the transmission or reception. On transmission, the key can be programmed at the same
time as the rest of the frame data and setup information.
8.4 Security Coprocessor
The security coprocessor is available to the application software to perform encryption/decryption operations. A
hardware implementation of the encryption engine significantly speeds up the processing of the encrypted packets
over a pure software implementation. The AES library for the JN516x provides operations that utilise the encryption
engine in the device and allow the contents of memory buffers to be transformed. Information such as the type of
security operation to be performed and the encrypt/decrypt key to be used must also be provided.
Processor
Interface
AES
Block
Encryption
Controller
AES
Encoder
Key Generation
Figure 20: Security Coprocessor Architecture
8.5 Time of Flight Engine
The JN516x family includes unique hardware functions to enable measurement of the distance between two nodes
using a “Time of Flight” (ToF) function. This function uses dedicated timers and interpolation of the timing of
correlation peaks in the demodulator to measure the delays introduced by the time taken for the radio signals to travel
between nodes. It is also possible to use the received signal strength (RSSI) to indicate the distance. Due to the
characteristics of the transmitted signal and the baseband circuitry, ToF offers a significant improvement in accuracy
for distance measurements above 10m compared with RSSI, while RSSI provides better ranging results below 10m.
Hence, ToF is best suited to long range distance measurement. The raw timing results are made available through
an API function, but the responsibility for converting these into location information lies with the user.
For more information, see the Time-of-flight API User Guide [10]32 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
9 Digital Input/Output
There are 20 Digital I/O (DIO) pins which when used as general-purpose pins can be configured as either an input or
an output, with each having a selectable internal pull-up resistor. In addition, there are 2 Digital Output (DO) pins.
Most DIO pins are shared with the digital and analogue peripherals of the device. When a peripheral is enabled, it
takes control over the device pins allocated to it. However, note that most peripherals have 2 alternative pin
allocations to alleviate clashes between uses, and many peripherals can disable the use of specific pins if not
required. Refer to Section 2.1 and the individual peripheral descriptions for full details of the available pinout
arrangements.
Following a reset (and whilst the RESETN input is held low), all peripherals are forced off and the DIO pins are
configured as inputs with the internal pull-ups turned on.When a peripheral is not enabled, the DIO pins associated
with it can be used as digital inputs or outputs. Each pin can be controlled individually by setting the direction and
then reading or writing to the pin.
The individual pull-up resistors, RPU, can also be enabled or disabled as needed and the setting is held through sleep
cycles. The pull-ups are generally configured once after reset depending on the external components and
functionality. For instance, outputs should generally have the pull-ups disabled. An input that is always driven should
also have the pull-up disabled.
When configured as an input each pin can be used to generate an interrupt upon a change of state (selectable
transition either from low to high or high to low); the interrupt can be enabled or disabled. When the device is
sleeping, these interrupts become events that can be used to wake the device up. Equally the status of the interrupt
may be read. See Section 18 for further details on sleep and wakeup.
The state of all DIO pins can be read, irrespective of whether the DIO is configured as an input or an output.
Throughout a sleep cycle the direction of the DIO, and the state of the outputs, is held. This is based on the resultant
of the GPIO Data/Direction registers and the effect of any enabled peripherals at the point of entering sleep.
Following a wake-up these directions and output values are maintained under control of the GPIO data/direction
registers. Any peripherals enabled before the sleep cycle are not automatically re-enabled, this must be done through
software after the wake-up.
For example, if DIO0 is configured to be SPISEL1 then it becomes an output. The output value is controlled by the
SPI functional block. If the device then enters a sleep cycle, the DIO will remain an output and hold the value being
output when entering sleep. After wake-up the DIO will still be an output with the same value but controlled from the
GPIO Data/Direction registers. It can be altered with the software functions that adjust the DIO, or the application may
re-configure it to be SPISEL1.
Unused DIO pins are recommended to be set as inputs with the pull-up enabled.
Two DIO pins can optionally be used to provide control signals for RF circuitry (e.g. switches and PA) in high power
range extenders.
DIO3/RFTX is asserted when the radio is in the transmit state and similarly, DIO2/RFRX is asserted when the radio is
in the receiver state.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 33
MUX
SPI Slave
DIO0/SPISEL1/ADC3
DIO1/SPISEL2/ADC4/PC0
DIO2/RFRX/TIM0CK_GT
DIO3/RFTX/TIM0CAP
DIO4/CTS0/TIM0OUT/PC0
DIO5/RTS0/PWM1/PC1
DIO6/TXD0/PWM2
DIO7/RXD0/PWM3
DIO8/TIM0CK_GT/PC1/PWM4
DIO9/TIM0CAP/32KXTALIN/RXD1/32KIN
DIO10/TIM0OUT/32KXTALOUT
DIO11/PWM1/TXD1
DIO12/PWM2/CTS0/ADO/SPISMOSI
DIO13/PWM3/RTS0/ADE/SPISMISO
DIO14/SIF_CLK/TXD0/TXD1/SPISEL1/SPISSEL
DIO15/SIF_D/RXD0/RXD1/SPISEL2/SPISCLK
DIO16/COMP1P/SIF_CLK/SPISMOSI
DIO17/COMP1M/SIF_D/SPISMISO
DIO18/SPIMOSI
DIO19/SPISEL0
DO0/SPICLK/PWM2
DO1/SPIMISO/PWM3
TXD0
SPI
Master
UART0
UART1
RXD0
RTS0
CTS0
TxD1
RxD1
TIM0CK_GT
TIM0OUT
TIM0CAP
PWM1
PWM2
PWM3
PWM4
SIF_D
SIF_CLK
PC0
PC1
JTAG_TDI
JTAG_TMS
JTAG_TCK
JTAG_TDO
ADO
ADE
Timer0
PWMs
2-wire
Interface
Pulse
Counters
JTAG
Debug
Antenna
Diversity
SPICLK
SPIMOSI
SPIMISO
SPISEL0
SPICLK
SPIMOSI
SPIMISO
SPISEL0
SPISEL1
SPISEL2
Figure 21 DIO Block Diagram34 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
10 Serial Peripheral Interface
10.1 Serial Peripheral Interface Master
The Serial Peripheral Interface (SPI) allows high-speed synchronous data transfer between the JN516x and
peripheral devices. The JN516x operates as a master on the SPI bus and all other devices connected to the SPI are
expected to be slave devices under the control of the JN516x CPU. The SPI includes the following features:
• Full-duplex, three-wire synchronous data transfer
• Programmable bit rates (up to 16Mbit/s)
• Programmable transaction size up to 32-bits
• Standard SPI modes 0,1,2 and 3
• Manual or Automatic slave select generation (up to 3 slaves)
• Maskable transaction complete interrupt
• LSB First or MSB First Data Transfer
• Supports delayed read edges
Clock
Divider
SPI Bus
Cycle
Controller
Data Buffer
DIV
Clock Edge
Select
Data
CHAR_LEN
LSB
SPIMISO
SPIMOSI
SPICLK
Select
Latch
SPISEL [2..0]
16 MHz
Figure 22: SPI Master Block Diagram
The SPI bus employs a simple shift register data transfer scheme. Data is clocked out of and into the active devices
in a first-in, first-out fashion allowing SPI devices to transmit and receive data simultaneously. Master-Out-Slave-In or
Master-In-Slave-Out data transfer is relative to the clock signal SPICLK generated by the JN516x.
The JN516x provides three slave selects, SPISEL0 to SPISEL2 to allow three SPI peripherals on the bus. SPISEL0
is accessed on DI019. SPISEL1 is accessed, depending upon the configuration, on DIO0 or DIO14. SPISEL2 is
accessed on DIO1 or DIO15. This is enabled under software control. The following table details which DIO are used
for the SPISEL signals depending upon the configuration.
Signal DIO Assignment
Standard pins Alternative pins
SPISEL1 DIO0 DIO14
SPISEL2 DIO1 DIO15
SPICLK DO0
SPIMISO DO1
SPIMOSI DIO18
SPISEL0 DIO19
Table 2: SPI Master IO© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 35
The interface can transfer from 1 to 32-bits without software intervention and can keep the slave select lines asserted
between transfers when required, to enable longer transfers to be performed.
When the device reset is active, all the SPI Master pins are configured as inputs with their pull-up resistors active.
The pins stay in this state until the SPI Master block is enabled, or the pins are configured for some other use. SS
Slave 0
Flash/
EEPROM
Memory
JN5142 SPISE L0 SPISE L1
SPIMOSI
SPICLK
SPIMISO SS
Slave 1
User
Defined
SS
Slave 2
User
Defined
SPISE L2
SI
C
SO
SI
C
SO
SI
C
SO
JN516X
Figure 23: Typical JN516x SPI Peripheral Connection
The data transfer rate on the SPI bus is determined by the SPICLK signal. The JN516x supports transfers at
selectable data rates from 16MHz to 125kHz selected by a clock divider. Both SPICLK clock phase and polarity are
configurable. The clock phase determines which edge of SPICLK is used by the JN516x to present new data on the
SPIMOSI line; the opposite edge will be used to read data from the SPIMISO line. The interface should be configured
appropriately for the SPI slave being accessed.
SPICLK
Polarity Mode Description
(CPOL)
Phase
(CPHA)
0 0 0 SPICLK is low when idle – the first edge is positive.
Valid data is output on SPIMOSI before the first clock and changes every
negative edge. SPIMISO is sampled every positive edge.
0 1 1 SPICLK is low when idle – the first edge is positive.
Valid data is output on SPIMOSI every positive edge. SPIMISO is sampled every
negative edge.
1 0 2 SPICLK is high when idle – the first edge is negative.
Valid data is output on SPIMOSI before the first clock edge and is changed
every positive edge. SPIMISO is sampled every negative edge.
1 1 3 SPICLK is high when idle – the first edge is negative.
Valid data is output on SPIMOSI every negative edge. SPIMISO is sampled
every positive edge.
Table 3: SPI Configurations36 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
If more than one SPISEL line is to be used in a system they must be used in numerical order starting from SPISEL0.
A SPISEL line can be automatically de-asserted between transactions if required, or it may stay asserted over a
number of transactions. For devices such as memories where a large amount of data can be received by the master
by continually providing SPICLK transitions, the ability for the select line to stay asserted is an advantage since it
keeps the slave enabled over the whole of the transfer.
A transaction commences with the SPI bus being set to the correct configuration, and then the slave device is
selected. Upon commencement of transmission (1 to 32 bits) data is placed in the FIFO data buffer and clocked out,
at the same time generating the corresponding SPICLK transitions. Since the transfer is full-duplex, the same
number of data bits is being received from the slave as it transmits. The data that is received during this transmission
can be read (1 to 32 bits). If the master simply needs to provide a number of SPICLK transitions to allow data to be
sent from a slave, it should perform transmit using dummy data. An interrupt can be generated when the transaction
has completed or alternatively the interface can be polled.
If a slave device wishes to signal the JN516x indicating that it has data to provide, it may be connected to one of the
DIO pins that can be enabled as an interrupt.
Figure 24 shows a complex SPI transfer, reading data from a FLASH device that can be achieved using the SPI
master interface. The slave select line must stay low for many separate SPI accesses, and therefore manual slave
select mode must be used. The required slave select can then be asserted (active low) at the start of the transfer. A
sequence 8 and 32 bit transfers can be used to issue the command and address to the FLASH device and then to
read data back. Finally, the slave select can be deselected to end the transaction.
0 1 2 3 4 5 6 7
Instruction (0x03)
23 22 21 3 2 1 0
8 9 10 28 29 30 31
24-bit Address
MSB
Instruction Transaction
7 6 5 4 3 2 1 0
MSB
0 1 2 3 4 5 7 8N-1
3 2 1 0
LSB
Read Data Bytes Transaction(s) 1-N
SPISEL
SPICLK
SPIMOSI
SPIMISO
SPISEL
SPICLK
SPIMOSI
SPIMISO
8 9 10
7 6 5
MSB
Byte 1 Byte 2 Byte N
value unused by peripherals
6
Figure 24: Example SPI Waveforms – Reading from FLASH Device using Mode 0© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 37
10.2 Serial Peripheral Interface Slave
The Serial Peripheral Interface (SPI) Slave Interface allows high-speed synchronous data transfer between the
JN516x and a peripheral device. The JN516x operates as a slave on the SPI bus and an external device connected
to the SPI bus operates as the master. The pins are different from the SPI master interface and are shown in the
following table.
Signal DIO Assignment
Standard pins Alternative pins
SPISCLK DIO15
SPISMISO DIO13 DIO17
SPISMOSI DIO12 DIO16
SPISSEL DIO14
Table 4: SPI Slave IO
The SPI bus employs a simple shift register data transfer scheme, with SPISSEL acting as the active low select
control. Data is clocked out of and into the active devices in a first-in, first-out fashion allowing SPI devices to
transmit and receive data simultaneously. Master-Out-Slave-In or Master-In-Slave-Out data transfer is relative to the
clock signal SPISCLK generated by the external master.
The SPI slave includes the following features:
• Full-duplex synchronous data transfer
• Slaves to external clock up to 8MHz
• Supports 8 bit transfers (MSB or LSB first configurable), with SPISSEL deselected between each transfer
• Internal FIFO up to 255 bytes for transmit and receive
• Standard SPI mode 0, data is sampled on positive clock edge
• Maskable interrupts for receive FIFO not empty, transmit FIFO empty, receive FIFO fill level above
threshold, transmit FIFO fill level below threshold, transmit FIFO overflow, receive FIFO overflow, receive
FIFO underflow, transmit FIFO underflow, receive timeout
• Programmable receive timeout period allows an interrupt to be generated to prompt the receive FIFO to
be read if no further data arrives within the timeout period38 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
11 Timers
11.1 Peripheral Timer/Counters
A general-purpose timer/counter unit, Timer0, is available that can be configured to operate in one of five possible
modes. This has:
• Clocked from internal system clock (16MHz)
• 5-bit prescaler, divides system clock by 2 prescale value as the clock to the timer (prescaler range is 0 to 16)
• 16-bit counter, 16-bit Rise and Fall (period) registers
• Timer: can generate interrupts off Rise and Fall counts. Can be gated by external signal
• Counter: counts number of transitions on external event signal. Can use low-high, high-low or both
transitions
• PWM/Single pulse: outputs repeating Pulse Width Modulation signal or a single pulse. Can set period and
mark-space ratio
• Capture: measures times between transitions of an applied signal
• Delta-Sigma: Return-To-Zero (RTZ) and Non-Return-to-Zero (NRZ) modes
• Timer usage of external IO can be controlled on a pin by pin basis
Four further timers are also available that support the same functionality but have no Counter or Capture mode.
These are referred to as PWM timers. Additionally, is not possible to gate these four timers with an external signal.
>= D Q
Rise
=
<
Fall
Delta Sigma
Interrupt
Generator
Counter
Interrupt Enable
Capture
Generator
Prescaler SYSCLK
TIMxCK_GT
TIMxCAP
Interrupt
PWM/∆Σ
PWM/∆Σ
PWM/∆Σ
Reset
Generator
Edge
Select
EN
EN
TIMxOut
Sw
Reset
System
Reset
Single
Shot
-1
Figure 25: Timer Unit Block Diagram© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 39
The clock source for the Timer0 unit is fed from the 16MHz system clock. This clock passes to a 5-bit prescaler
where a value of 0 leaves the clock unmodified and other values divide it by 2 prescale value. For example, a prescale
value of 2 applied to the 16MHz system clock source results in a timer clock of 4MHz.
The counter is optionally gated by a signal on the clock/gate input (TIM0CK_GT). If the gate function is selected,
then the counter is frozen when the clock/gate input is high.
An interrupt can be generated whenever the counter is equal to the value in either of the High or Low registers.
The following table details which DIO are used for timer0 and the PWM depending upon the configuration.
Signal DIO Assignment
Standard pins Alternative pins
TIM0CK_GT DIO8 DIO2
TIM0CAP DIO9 DIO3
TIM0OUT DIO10 DIO4
PWM1 DIO11 DIO5
PWM2 DIO12 DIO6
PWM3 DIO13 DIO7
PWM4 DIO17 DIO8
Table 5: Timer and PWM IO
The alternative pin locations can be configured separately for each counter/timer under software control, without
affecting the operation or location of the others If operating in timer mode, it is not necessary to use any of the DIO
pins, allowing the standard DIO functionality to be available to the application.
11.1.1 Pulse Width Modulation Mode
Pulse Width Modulation (PWM) mode, as used by PWM timers 1,2 3 and 4 and optionally by Timer0, allows the user
to specify an overall cycle time and pulse length within the cycle. The pulse can be generated either as a single shot
or as a train of pulses with a repetition rate determined by the cycle time.
In this mode, the cycle time and low periods of the PWM output signal can be set by the values of two independent
16-bit registers (Fall and Rise). The counter increments and its output is compared to the 16-bit Rise and Fall
registers. When the counter is equal to the Rise register, the PWM output is set to high; when the counter reaches
the Fall value, the output returns to low. In continuous mode, when the counter reaches the Fall value, it will reset
and the cycle repeats. If either the cycle time or low periods are changed while in continuous mode, the new values
are not used until a full cycle has completed. The PWM waveform is available on PWM1,2,3,4 or TIM0OUT when the
output driver is enabled.
Rise
Fall
Figure 26 PWM Output Timings
11.1.2 Capture Mode
The capture mode can be used to measure the time between transitions of a signal applied to the capture input
(TIM0CAP). When the capture is started, on the next low-to-high transition of the captured signal, the count value is
stored in the Rise register, and on the following high-to-low transition, the counter value is stored in the Fall register.
The pulse width is the difference in counts in the two registers multiplied by the period of the prescaled clock. Upon
reading the capture registers the counter is stopped. The values in the High and Low registers will be updated
whenever there is a corresponding transition on the capture input, and the value stored will be relative to when the
mode was started. Therefore, if multiple pulses are seen on TIM0CAP before the counter is stopped only the last
pulse width will be stored. 40 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
CLK
CAPT
x 9 3
x 14
t
RISE t
RISE
t
FALL t
FALL
Rise
Fall
9 5 3 4
7
Capture Mode Enabled
Figure 27: Capture Mode
11.1.3 Counter/Timer Mode
The counter/timer can be used to generate interrupts, based on the timers or event counting, for software to use. As
a timer the clock source is from the system clock, prescaled if required. The timer period is programmed into the fall
register and the Fall register match interrupt enabled. The timer is started as either a single-shot or a repeating timer,
and generates an interrupt when the counter reaches the Fall register value.
When used to count external events on TIM0CK_GT the clock source is selected from the input pin and the number
of events programmed into the Fall register. The Fall register match interrupt is enabled and the counter started,
usually in single shot mode. An interrupt is generated when the programmed number of transitions is seen on the
input pin. The transitions counted can configured to be rising, falling or both rising and falling edges.
Edges on the event signal must be at least 100nsec apart, i.e. pulses must be wider than 100nsec.
11.1.4 Delta-Sigma Mode
A separate delta-sigma mode is available, allowing a low speed delta-sigma DAC to be implemented with up to 16-bit
resolution. This requires that a resistor-capacitor network is placed between the output DIO pin and digital ground. A
stream of pulses with digital voltage levels is generated which is integrated by the RC network to give an analogue
voltage. A conversion time is defined in terms of a number of clock cycles. The width of the pulses generated is the
period of a clock cycle. The number of pulses output in the cycle, together with the integrator RC values, will
determine the resulting analogue voltage. For example, generating approximately half the number of pulses that
make up a complete conversion period will produce a voltage on the RC output of VDD1/2, provided the RC time
constant is chosen correctly. During a conversion, the pulses will be pseudo-randomly dispersed throughout the
cycle in order to produce a steady voltage on the output of the RC network.
The output signal is asserted for the number of clock periods defined in the High register, with the total period being
216 cycles. For the same value in the High register, the pattern of pulses on subsequent cycles is different, due to the
pseudo-random distribution.
The delta-sigma converter output can operate in a Return-To-Zero (RTZ) or a Non-Return-to-Zero (NRZ) mode. The
NRZ mode will allow several pulses to be output next to each other. The RTZ mode ensures that each pulse is
separated from the next by at least one period. This improves linearity if the rise and fall times of the output are
different to one another. Essentially, the output signal is low on every other output clock period, and the conversion
cycle time is twice the NRZ cycle time i.e. 217 clocks. The integrated output will only reach half VDD2 in RTZ mode,
since even at full scale only half the cycle contains pulses. Figure 28 and Figure 29 illustrate the difference between
RTZ and NRZ for the same programmed number of pulses.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 41
1 2 3 1 2 N
Conversion cycle 1
217
N
Conversion cycle 2
3
Figure 28: Return To Zero Mode in Operation
1 2 3 1 2 N
Conversion cycle 1
N 3
216 Conversion cycle 2
Figure 29: Non-Return to Zero Mode
11.1.5 Infra-Red Transmission Mode
Infra-red transmission mode is a special feature of Timer 2 that is used to facilitate the generation of waveforms for
infra-red remote control transmission. Remote control protocols, such as Philips RC-6, apply On-Off Key (OOK)
modulation to a carrier signal using an encoded bit stream. The infra-red transmission mode supports a variety of
remote control protocols that have different carrier frequency, carrier duty-cycle and data bit encoding requirements.
In this mode, Timer 2 is configured to produce a carrier waveform that is OOK modulated by a programmable bit
sequence of up to 4096 bits stored in RAM. The resultant waveform is output to the associated Timer 2 output pin.
The JN516x Integrated Peripherals API User Guide [4] includes some examples.
11.1.6 Example Timer/Counter Application
Figure 30 shows an application of the JN516x timers to provide closed loop speed control. PWM1 is configured in
PWM mode to provide a variable mark-space ratio switching waveform to the gate of the NFET. This in turn controls
the power in the DC motor.
Timer 0 is configured to count the rising edge events on the clk/gate pin over a constant period. This converts the
tacho pulse stream output into a count proportional to the motor speed. This value is then used by the application
software executing the control algorithm.
If required for other functionality, then the unused IO associated with the timers could be used as general purpose
DIO.
JN516x
PWM1
Timer0
CLK/GATE
CAPTURE
PWM
M Tacho 1N4007
+12V
IRF521
1 pulse/rev
Figure 30: Closed Loop PWM Speed Control Using JN516x Timers42 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
11.2 Tick Timer
The JN516x contains a hardware timer that can be used for generating timing interrupts to software. It may be used
to implement regular events such as ticks for software timers or an operating system, as a high-precision timing
reference or can be used to implement system monitor timeouts as used in a watchdog timer. Features include:
• 32-bit counter
• 28-bit match value
• Maskable timer interrupt
• Single-shot, Restartable or Continuous modes of operation
Match Value
Counter
=
Mode
Control
&
&
SysClk
Run
Match
Int
Enable
Tick Timer
Interrupt
Reset
Mode
Figure 31 Tick Timer
The Tick Timer is clocked from a continuous 16MHz clock, which is fed to a 32-bit wide resettable up-counter, gated
by a signal from the mode control block. A match register allows comparison between the counter and a
programmed value. The match value, measured in 16MHz clock cycles is programmed through software, in the
range 0 to 0x0FFFFFFF. The output of the comparison can be used to generate an interrupt if the interrupt is
enabled and used in controlling the counter in the different modes. Upon configuring the timer mode, the counter is
also reset.
If the mode is programmed as single shot, the counter begins to count from zero until the match value is reached.
The match signal will be generated which will cause an interrupt if enabled, and the counter will stop counting. The
counter is restarted by reprogramming the mode.
If the mode is programmed as restartable, the operation of the counter is the same as for the single shot mode,
except that when the match value is reached the counter is reset and begins counting from zero. An interrupt will be
generated when the match value is reached if it is enabled.
Continuous mode operation is similar to restartable, except that when the match value is reached, the counter is not
reset but continues to count. An interrupt will be generated when the match value is reached if enabled.
11.3 Wakeup Timers
Two -41 bit wakeup timers are available in the JN516x driven from the 32kHz internal clock. They may run during
sleep periods when the majority of the rest of the device is powered down, to time sleep periods or other long period
timings that may be required by the application. The wakeup timers do not run during deep sleep and may optionally © NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 43
be disabled in sleep mode through software control. When a wakeup timer expires it typically generates an interrupt,
if the device is asleep then the interrupt may be used as an event to end the sleep period. See Section 18 for further
details on how they are used during sleep periods. Features include:
• 41-bit down-counter
• Optionally runs during sleep periods
• Clocked by 32kHz system clock; either 32kHz RC oscillator, 32kHz XTAL oscillator or 32kHz clock input
A wakeup timer consists of a 41-bit down counter clocked from the selected 32 kHz clock. An interrupt or wakeup
event can be generated when the counter reaches zero. On reaching zero the counter will continue to count down
until stopped, which allows the latency in responding to the interrupt to be measured. If an interrupt or wakeup event
is required, the timer interrupt should be enabled before loading the count value for the period. Once the count value
is loaded and counter started, the counter begins to count down; the counter can be stopped at any time through
software control. The counter will remain at the value it contained when the timer was stopped and no interrupt will
be generated. The status of the timers can be read to indicate if the timers are running and/or have expired; this is
useful when the timer interrupts are masked. This operation will reset any expired status flags.
11.3.1 32 KHZ RC Oscillator Calibration
The 32 KHZ RC oscillator that can be used to time sleep periods is designed to require very little power to operate
and be self-contained, requiring no external timing components and hence is lower cost. As a consequence of using
on-chip resistors and capacitors, the inherent absolute accuracy and temperature coefficient is lower than that of a
crystal oscillator, but once calibrated the accuracy approaches that of a crystal oscillator. Sleep time periods should
be as close to the desired time as possible in order to allow the device to wake up in time for important events, for
example beacon transmissions in the IEEE802.15.4 protocol. If the sleep time is accurate, the device can be
programmed to wake up very close to the calculated time of the event and so keep current consumption to a
minimum. If the sleep time is less accurate, it will be necessary to wake up earlier in order to be certain the event will
be captured. If the device wakes earlier, it will be awake for longer and so reduce battery life. Please note, that
oscillator has a default current consumption of around 0.5uA, optionally this can be reduced to 0.375uA, which can
improve battery life, however, the calibrated accuracy and temperature coefficient will be worse as a consequence.
For detailed electrical specifications, see Section 19.3.9.
In order to allow sleep time periods to be as close to the desired length as possible, the true frequency of the RC
oscillator needs to be determined to better than the initial 30% accuracy. The calibration factor can then be used to
calculate the true number of nominal 32kHz periods needed to make up a particular sleep time. A calibration
reference counter, clocked from the 16MHz system clock, is provided to allow comparisons to be made between the
32kHz RC clock and the 16MHz system clock when the JN516x is awake and running from the 32MHZ crystal.
Wakeup timer0 counts for a set number of 32kHz clock periods during which time the reference counter runs. When
the wakeup timer reaches zero the reference counter is stopped, allowing software to read the number of 16MHz
clock ticks generated during the time represented by the number of 32kHz ticks programmed in the wakeup timer.
The true period of the 32kHz clock can thus be determined and used when programming a wakeup timer to achieve a
better accuracy and hence more accurate sleep periods
For a RC oscillator running at exactly 32,000Hz the value returned by the calibration procedure should be 10000, for
a calibration period of twenty 32,000Hz clock periods. If the oscillator is running faster than 32,000Hz the count will
be less than 10000, if running slower the value will be higher. For a calibration count of 9000, indicating that the RC
oscillator period is running at approximately 35kHz, to time for a period of 2 seconds the timer should be loaded with
71,111 ((10000/9000) x (32000 x 2)) rather than 64000.44 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
12 Pulse Counters
Two 16-bit counters are provided that can increment during all modes of operation (including sleep). The first, PC0,
increments from pulses received on DIO1 or DIO4. The other pulse counter, PC1 operates from DIO5 or DIO8
depending upon the configuration. This is enabled under software control. The pulses can be de-bounced using the
32kHz clock to guard against false counting on slow or noisy edges. Increments occur from a configurable rising or
falling edge on the respective DIO input.
Each counter has an associated 16-bit reference that is loaded by the user. An interrupt (and wakeup event if
asleep) may be generated when a counter reaches its pre-configured reference value. The two counters may
optionally be cascaded together to provide a single 32-bit counter, linked to any of the four DIO’s. The counters do
not saturate at 65535, but naturally roll-over to 0. Additionally, the pulse counting continues when the reference value
is reached without software interaction so that pulses are not missed even if there is a long delay before an interrupt
is serviced or during the wakeup process.
The system can work with signals up to 100kHz, with no debounce, or from 5.3kHz to 1.7kHz with debounce. When
using debounce the 32kHz clock must be active, so for minimum sleep currents the debounce mode should not be
used.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 45
13 Serial Communications
The JN516x has two Universal Asynchronous Receiver/Transmitter (UART) serial communication interfaces. These
provide similar operating features to the industry standard 16550A device operating in FIFO mode. The interfaces
perform serial-to-parallel conversion on incoming serial data and parallel-to-serial conversion on outgoing data from
the CPU to external devices. In both directions, a configurable FIFO buffer (with a default depth of 16-bytes) allows
the CPU to read and write multiple characters on each transaction. This means that the CPU is freed from handling
data on a character-by-character basis, with the associated high processor overhead. The UARTs have the following
features:
• Emulates behaviour of industry standard NS16450 and NS16550A UARTs
• Configurable transmit and receive FIFO buffers (with default depths of 16-bytes for each), with direct access
to fill levels of each. Adds/deletes standard start, stop and parity bits to or from the serial data
• Independently controlled transmit, receive, status and data sent interrupts
• Optional modem flow control signals CTS and RTS on UART0.
• Fully programmable data formats: baud rate, start, stop and parity settings
• False start bit detection, parity, framing and FIFO overrun error detect and break indication
• Internal diagnostic capabilities: loop-back controls for communications link fault isolation
• Flow control by software or automatically by hardware Processor Bus
Divisor
Latch
Registers
Line
Status
Register
Line
Control
Register
FIFO
Control
Register
Receiver FIFO
Transmitter FIFO
Baud Generator
Logic
Transmitter Shift
Register
Receiver Shift
Register
Transmitter
Logic
Receiver
Logic
RXD
TXD
Modem
Control
Register
Modem
Status
Register Modem
Signals
Logic
RTS
CTS
Interrupt
ID
Register
Interrupt
Enable
Register
Interrupt
Logic
Internal
Interrupt
Figure 32: UART Block Diagram
The serial interfaces contain programmable fields that can be used to set number of data bits (5, 6,7 or 8), even, odd,
set-at-1, set-at-0 or no-parity detection and generation of single or multiple stop bit, (for 5 bit data, multiple is 1.5 stop
bits; for 6, 7 or 8 data bits, multiple is 2 bits).
The baud rate is programmable up to 1Mbps, standard baud rates such as 4800, 9600, 19.2k, 38.4k etc. can be
configured.
For applications requiring hardware flow control, UART0 provides two control signals: Clear-To-Send (CTS) and
Request-To-Send (RTS). CTS is an indication sent by an external device to the UART that it is ready to receive data.
RTS is an indication sent by the UART to the external device that it is ready to receive data. RTS is controlled from
software, while the value of CTS can be read. Monitoring and control of CTS and RTS is a software activity, normally
performed as part of interrupt processing. The signals do not control parts of the UART hardware, but simply indicate
to software the state of the UART external interfaces. Alternatively, the Automatic Flow Control mode can be set 46 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
where the hardware controls the value of the generated RTS (negated if the receive FIFO fill level is greater than a
programmable threshold of 8, 11, 13 or 15 bytes), and only transmits data when the incoming CTS is asserted.
Software can read characters, one byte at a time, from the Receive FIFO and can also write to the Transmit FIFO,
one byte at a time. The Transmit and Receive FIFOs can be cleared and reset independently of each other. The
status of the Transmit FIFO can be checked to see if it is empty, and if there is a character being transmitted. The
status of the Receive FIFO can also be checked, indicating if conditions such as parity error, framing error or break
indication have occurred. It also shows if an overrun error occurred (receive buffer full and another character arrives)
and if there is data held in the receive FIFO.
UART0 and UART1 can both be configured to use standard or alternative DIO lines, as shown in Table 5.
Additionally, UART0 can be configured to be used in 2-wire mode (where CTS0 and RTS0 are not configured), and
UART1 can be configured in 1-wire mode (where RXD1 is not configured). These freed up DIO pins can then be used
for other purposes.
Signal DIO Assignment
Standard pins Alternative pins
CTS0 DIO4 DIO12
RTS0 DIO5 DIO13
TXD0 DIO6 DIO14
RXD0 DIO7 DIO15
TXD1 DIO14 DIO11
RXD1 DIO15 DIO9
Table 6: UART IO
.
Note: With the automatic flow control threshold set to 15, the hardware flow control within the UART’s block negates
RTS when they receive FIFO that is about to become full. In some instances it has been observed that remote
devices that are transmitting data do not respond quickly enough to the de-asserted CTS and continue to transmit
data. In these instances the data will be lost in a receive FIFO overflow.
13.1 Interrupts
Interrupt generation can be controlled for the UART’s block, and is divided into four categories:
• Received Data Available: Is set when data in the Rx FIFO queue reaches a particular level (the trigger level can
be configured as 1, 4, 8 or 14) or if no character has been received for 4 character times.
• Transmit FIFO Empty: set when the last character from the Tx FIFO is read and starts to be transmitted.
• Receiver Line Status: set when one of the following occur (1) Parity Error - the character at the head of the
receive FIFO has been received with a parity error, (2) Overrun Error - the Rx FIFO is full and another character
has been received at the Receiver shift register, (3) Framing Error - the character at the head of the receive
FIFO does not have a valid stop bit and (4) Break Interrupt – occurs when the RxD line has been held low for an
entire character.
• Modem Status: Generated when the CTS (Clear To Send) input control line changes.
13.2 UART Application
The following example shows the UART0 connected to a 9-pin connector compatible with a PC. As the JN516x
device pins do not provide the RS232 line voltage, a level shifter is used.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 47
JN516x
RTS
CTS
TXD
RXD UART0
RS232
Level
Shifter
1
2
3
4
5
6
7
8
9
CD
RD
TD
DTR
SG
DSR
RTS
CTS
RI
PC COM
Port
1 5 Pin Signal
6 9
Figure 33: JN516x Serial Communication Link48 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
14 JTAG Test Interface
The JN516x includes an IEEE1149.1 compliant JTAG port for the purpose of manufacturing test. The software
debugger is not supported with this product.
The JTAG interface does not support boundary scan testing. It is recommended that the JN516x is not connected as
part of the board scan chain.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 49
15 Two-Wire Serial Interface (I2
C)
The JN516x includes industry standard I
2
C two-wire synchronous Serial Interface operates as a Master (MSIF) or
Slave (SSIF) that provides a simple and efficient method of data exchange between devices. The system uses a
serial data line (SIF_D) and a serial clock line (SIF_CLK) to perform bi-directional data transfers and includes the
following features:
Common to both master and slave:
• Compatible with both I2
C and SMbus peripherals
• Support for 7 and 10-bit addressing modes
• Optional pulse suppression on signal inputs (60ns guaranteed, 125ns typical)
Master only:
• Multi-master operation
• Software programmable clock frequency
• Supports Slave clock stretching
• Software programmable acknowledge bit
• Interrupt or bit-polling driven byte-by-byte data-transfers
• Bus busy detection
Slave only:
• Programmable slave address
• Simple byte level transfer protocol
• Write data flow control using acknowledge mechanism
• Read data flow control using clock stretching
• Read data preloaded or provided as required
The Serial Interface is accessed, depending upon the configuration, DIO14 and DIO15 or DIO16 and DIO17. This is
enabled under software control. The following table details which DIO are used for the Serial Interface depending
upon the configuration.
Signal DIO Assignment
Standard pins Alternative pins
SIF_CLK DIO14 DIO16
SIF_D DIO15 DIO17
Table 7: Two-Wire Serial Interface IO
15.1 Connecting Devices
The clock and data lines, SIF_D and SIF_CLK, are alternate functions of DIO15 and DIO14 respectively. The serial
interface function of these pins is selected when the interface is enabled. They are both bi-directional lines,
connected internally to the positive supply voltage via weak (50kΩ) programmable pull-up resistors. However, it is
recommended that external 4.7kΩ pull-ups be used for reliable operation at high bus speeds, as shown in Figure 34.
When the bus is free, both lines are HIGH. The output stages of devices connected to the bus must have an opendrain
or open-collector in order to perform the wired-AND function. The number of devices connected to the bus is
solely dependent on the bus capacitance limit of 400pF.
As this is an optional interface with two alternate positions, the DIO cells have not been customised for I
2
C operation.
In particular, note that there are ESD diodes to the nominal 3 volt supply (VDD2) from the SIF_CLK and SIF_D pins.
Therefore, if the VDD supply is removed from the JN5168 and this then discharges to ground, a path would exist that
could pull down the bus lines (see 2.2.6).50 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
SIF_CLK
SIF_D
VDD
D1_OUT
D1_I
N
CLK1_I
N
CLK1_OUT
D2_I
N
CLK2_I
N
CLK2_OUT
DEVICE 1 DEVICE 2
RP RP Pullup
Resistors
D2_OUT
JN516x
SI
F
DIO14
DIO15
Figure 34: Connection Details
15.2 Clock Stretching
Slave devices can use clock stretching to slow down the read transfer bit rate. After the master has driven SIF_CLK
low, the slave can drive SIF_CLK low for the required period and then release it. If the slave’s SIF_CLK low period is
greater than the master’s low period the resulting SIF_CLK bus signal low period is stretched thus inserting wait
states – see section 15.4 for further details.
SIF_CLK
SIF_CLK
SIF_CLK
Master SIF_CLK
Slave SIF_CLK
Wired-AND SIF_CLK
Clock held low
by Slave
Figure 35: Clock Stretching
15.3 Master Two-wire Serial Interface
When operating as a master device, it provides the clock signal and a prescale register determines the clock rate,
allowing operation up to 400kbit/s.
Data transfer is controlled from the processor bus interface at a byte level, with the processor responsible for
indicating when start, stop, read, write and acknowledge control should be generated. Write data written into a
transmit buffer will be written out across the two-wire interface when indicated, and read data received on the
interface is made available in a receive buffer. Indication of when a particular transfer has completed may be
indicated by means of an interrupt or by polling a status bit.
The first byte of data transferred by the device after a start bit is the slave address. The JN516x supports both 7-bit
and 10-bit slave addresses by generating either one or two address transfers. Only the slave with a matching address
will respond by returning an acknowledge bit.
The master interface provides a true multi-master bus including collision detection and arbitration that prevents data
corruption. If two or more masters simultaneously try to control the bus, a clock synchronization procedure
determines the bus clock. Because of the wired-AND connection of the interface, a high-to-low transition on the bus
affects all connected devices. This means a high-to-low transition on the SIF_CLK line causes all concerned devices
to count off their low period. Once the clock input of a device has gone low, it will hold the SIF_CLK line in that state
until the clock high state is reached when it releases the SIF_CLK line. Due to the wired-AND connection, the
SIF_CLK line will therefore be held low by the device with the longest low period, and held high by the device with the
shortest high period.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 51
SIF_CLK1
SIF_CLK2
SIF_CLK
Master1 SIF_CLK
Master2 SIF_CLK
Wired-AND SIF_CLK
Start counting
low period
Start counting
high period
Wait
State
Figure 36: Multi-Master Clock Synchronisation
After each transfer has completed, the status of the device must be checked to ensure that the data has been
acknowledged correctly, and that there has been no loss of arbitration. (N.B. Loss of arbitration may occur at any
point during the transfer, including data cycles). An interrupt will be generated when arbitration has been lost.52 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
15.4 Slave Two-wire Serial Interface
When operating as a slave device, the interface does not provide a clock signal, although it may drive the clock signal
low if it is required to apply clock stretching during read transfers.
Only transfers whose address matches the value programmed into the interface’s address register are accepted. The
interface allows both 7 and 10 bit addresses to be programmed, but only responds with an acknowledge to a single
address. Addresses defined as “reserved” will not be responded to, and should not be programmed into the address
register. A list of reserved addresses is shown in Table 8.
Address Name Behaviour
0000 000 General Call/Start Byte Ignored
0000 001 CBUS address Ignored
0000 010 Reserved Ignored
0000 011 Reserved Ignored
0000 1XX Hs-mode master code Ignored
1111 1XX Reserved Ignored
1111 0XX 10-bit address Only responded to if 10 bit address
set in address register
Table 8 : List of two-wire serial interface reserved addresses
Data transfer is controlled from the processor bus interface at a byte level, with the processor responsible for taking
write data from a receive buffer and providing read data to a transmit buffer when indicated. A series of interrupt
status bits are provided to control the flow of data.
For writes, in to the slave interface, it is important that data is taken from the receive buffer by the processor before
the next byte of data arrives. To enable this, the interface returns a Not Acknowledge (NACK) to the master if more
data is received before the previous data has been taken. This will lead to the termination of the current data transfer.
For reads, from the slave interface, the data may be preloaded into the transmit buffer when it is empty (i.e. at the
start of day, or when the last data has been read), or fetched each time a read transfer is requested. When using data
preload, read data in the buffer must be replenished following a data write, as the transmit and received data is
contained in a shared buffer. The interface will hold the bus using clock stretching when the transmit buffer is empty.
Interrupts may be triggered when:
• Data Buffer read data is required – a byte of data to be read should be provided to avoid the interface from
clock stretching
• Data Buffer read data has been taken – this indicates when the next data may be preloaded into the data
buffer
• Data Buffer write data is available – a byte of data should be taken from the data buffer to avoid data backoff
as defined above
• The last data in a transfer has completed – i.e. the end of a burst of data, when a Stop or Restart is seen
• A protocol error has been spotted on the interface© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 53
16 Random Number Generator
A random number generator is provided which creates a 16-bit random number each time it is invoked. Consecutive
calls can be made to build up any length of random number required. Each call takes approximately 0.25msec to
complete. Alternatively, continuous generation mode can be used where a new number is generated approximately
every 0.25msec. In either mode of operation an interrupt can be generated to indicate when the number is available,
or a status bit can be polled.
The random bits are generated by sampling the state of the 32MHz clock every 32kHz system clock edge. As these
clocks are asynchronous to each other, each sampled bit is unpredictable and hence random.54 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
17 Analogue Peripherals
The JN516x contains a number of analogue peripherals allowing the direct connection of a wide range of external
sensors and switches.
ADC
Supply Voltage
(VDD1)
COMP1M (DIO17) Comparator 1
COMP1P (DIO16)
ADC1
VREF/ADC2
ADC3 (DIO0)
ADC4 (DIO1)
Vref
Internal Reference
Vref Select
Chip Boundary
Temp
Sensor
Figure 37: Analogue Peripherals
In order to provide good isolation from digital noise, the analogue peripherals and radio are powered by the radio
regulator, which is supplied from the analogue supply VDD1 and referenced to analogue ground VSSA.
A reference signal Vref for the ADC can be selected between an internal bandgap reference or an external voltage
reference supplied to the VREF pin. ADC input 2 cannot be used if an external reference is required, as this uses the
same pin as VREF. Note also that ADC3 and ADC4 use the same pins as DIO0 and DIO1 respectively. These pins
can only be used for the ADC if they are not required for any of their alternative functions. Similarly, the comparator
inputs are shared with DIO16 and DIO17. If used for their analogue functions, these DIOs must be put into a passive
state by setting them to Inputs with their pull-ups disabled.
The ADC is clocked from a common clock source derived from the 16MHz clock.
17.1 Analogue to Digital Converter
The 10-bit analogue to digital converter (ADC) uses a successive approximation design to perform high accuracy
conversions as typically required in wireless sensor network applications. It has six multiplexed single-ended input
channels: four available externally, one connected to an internal temperature sensor, and one connected to an
internal supply monitoring circuit.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 55
17.1.1 Operation
The input range of the ADC can be set between 0V to either the reference voltage or twice the reference voltage.
The reference can be either taken from the internal voltage reference or from the external voltage applied to the
VREF pin. For example, an external reference of 1.2V supplied to VREF may be used to set the ADC range between
0V and 2.4V.
VREF Gain Setting Maximum Input Range Supply Voltage Range (VDD)
1.2V
1.6V
1.2V
1.6V
0
0
1
1
1.2V
1.6V
2.4V
3.2V
2.2V - 3.6V
2.2V - 3.6V
2.6V - 3.6V
3.4V - 3.6V
Table 9: ADC Maximum Input Range
The input clock to the ADC is 16MHz and can be divided down to 2MHz, 1MHz, 500kHz and 250kHz. During an ADC
conversion the selected input channel is sampled for a fixed period and then held. This sampling period is defined as
a number of ADC clock periods and can be programmed to 2, 4, 6 or 8. The conversion rate is ((3 x Sample period)
+ 13) clock periods. For example for 500kHz conversion with sample period of 2 will be (3 x 2) + 13 = 19 clock
periods, 38µsecs or 26.32kHz. The ADC can be operated in either a single conversion mode or alternatively a new
conversion can be started as soon as the previous one has completed, to give continuous conversions.
If the source resistance of the input voltage is 1kΩ or less, then the default sampling time of 2 clocks should be used.
The input to the ADC can be modelled as a resistor of 5kΩ(typ) and 10kΩ (max) to represent the on-resistance of the
switches and the sampling capacitor 8pF. The sampling time required can then be calculated, by adding the sensor
source resistance to the switch resistance, multiplying by the capacitance giving a time constant. Assuming normal
exponential RC charging, the number of time constants required to give an acceptable error can be calculated, 7 time
constants gives an error of 0.091%, so for 10-bit accuracy 7 time constants should be the target. For a source with
zero resistance, 7 time constants is 640 nsecs, hence the smallest sampling window of 2 clock periods can be used.
ADC
pin
5 K
8 pF
Sample
Switch
ADC
front
end
Figure 38: ADC Input Equivalent Circuit
The ADC sampling period, input range and mode (single shot or continuous) are controlled through software.
When the ADC conversion is complete, an interrupt is generated. Alternatively the conversion status can be polled.
When operating in continuous mode, it is recommended that the interrupt is used to signal the end of a conversion,
since conversion times may range from 9.5 to 148 µsecs. Polling over this period would be wasteful of processor
bandwidth.
To facilitate averaging of the ADC values, which is a common practice in microcontrollers, a dedicated accumulator
has been added, the user can define the accumulation to occur over 2,4,8 or 16 samples. The end of conversion
interrupt can be modified to occur at the end of the chosen accumulation period, alternatively polling can still be used.
Software can then be used to apply the appropriate rounding and shifting to generate the average value, as well as
setting up the accumulation function.
For detailed electrical specifications, see Section 19.3.7.56 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
17.1.2 Supply Monitor
The internal supply monitor allows the voltage on the analogue supply pin VDD1 to be measured. This is achieved
with a potential divider that reduces the voltage by a factor of 0.666, allowing it to fall inside the input range of the
ADC when set with an input range twice the internal voltage reference. The resistor chain that performs the voltage
reduction is disabled until the measurement is made to avoid a continuous drain on the supply.
17.1.3 Temperature Sensor
The on chip temperature sensor can be used either to provide an absolute measure of the device temperature or to
detect changes in the ambient temperature. In common with most on chip temperature sensors, it is not trimmed and
so the absolute accuracy variation is large; the user may wish to calibrate the sensor prior to use. The sensor forces
a constant current through a forward biased diode to provide a voltage output proportional to the chip die temperature
which can then be measured using the ADC. The measured voltage has a linear relationship to temperature as
described in Section 19.3.13.
Because this sensor is on chip, any measurements taken must account for the thermal time constants. For example,
if the device just came out of sleep mode the user application should wait until the temperature has stabilised before
taking a measurement.
17.1.4 ADC Sample Buffer Mode
In this mode, the ADC operates in conjunction with a DMA (Direct Memory Access) engine as follows:
• ADC sampling is triggered at a configurable rate using one of the on-chip Timers (Timer 0, 1, 2, 3 or 4)
• ADC samples are automatically stored in a buffer located in RAM using a DMA mechanism
• ADC inputs may be multiplexed between different analogue sources
The 10-bit ADC data samples are transferred into the buffer in RAM as 16-bit words. The maximum number of 16-bit
words that may allocated in RAM for ADC sample storage is 2047.
The buffer may be configured to automatically wrap around to the start when full. Interrupts may be configured to
indicate when the buffer is half-full, full and has overflowed.
The CPU may perform other tasks while the data transfer and storage is being managed independently by the DMA
engine - the CPU only needs to configure the ADC sample buffer mode and deal with the stored samples in the buffer
when an interrupt occurs.
ADC sample buffer mode allows up to six analogue inputs to be multiplexed in combination. These inputs comprise
four external inputs (ADC1-4, corresponding to IO pins), an on-chip temperature sensor and an internal voltage
monitor. Samples from all the selected inputs will be produced on each timer trigger and stored in consecutive RAM
locations.
17.2 Comparator
The JN516x contains one analogue comparator, COMP1, that is designed to have true rail-to-rail inputs and operate
over the full voltage range of the analogue supply VDD1. The hysteresis level can be set to a nominal value of 0mV,
10mV, 20mV or 40mV. The source of the negative input signal for the comparator can be set to the internal voltage
reference, the negative external pin (COMP1M, which uses the same pin as DIO17) or the positive external pin
(COMP1P, on the same pin as DIO16). The source of the positive input signal can be COMP1P or COMP1M.
DIO16 and DIO17 cannot be used if the external comparator inputs are needed. The comparator output is routed to
an internal register and can be polled, or can be used to generate interrupts. The comparator can be disabled to
reduce power consumption. DIO16 and DIO17 should be set to inputs with pull-ups disabled, when using the
comparator.
The comparator also has a low power mode where the response time of the comparator is slower than the normal
mode, but the current required is greatly reduced. These figures are specified in Section 19.3.8. It is the only mode
that may be used during sleep, where a transition of the comparator output will wake the device. The wakeup action
and the configuration for which edge of the comparator output will be active are controlled through software. In sleep
mode the negative input signal source must be configured to be driven from the external pins.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 57
18 Power Management and Sleep Modes
18.1 Operating Modes
Three operating modes are provided in the JN516x that enable the system power consumption to be controlled
carefully to maximise battery life.
• Active Processing Mode
• Sleep Mode
• Deep Sleep Mode
The variation in power consumption of the three modes is a result of having a series of power domains within the chip
that may be controllably powered on or off.
18.1.1 Power Domains
The JN516x has the following power domains:
• VDD Supply Domain: supplies the wake-up timers and controller, DIO blocks, Comparator, SVM and BOR plus
Fast RC, 32kHz RC and crystal oscillators. This domain is driven from the external supply (battery) and is
always powered. The wake-up timers and controller, and the 32kHz RC and crystal oscillators may be powered
on or off in sleep mode through software control.
• Digital Logic Domain: supplies the digital peripherals, CPU, Flash, RAM when in Active Processing Mode,
Baseband controller, Modem and Encryption processor. It is powered off during sleep mode.
• RAM Domain: supplies the RAM when in Active Processing Mode. Also supplies the Ram during sleep mode to
retain the memory contents. It may be powered on or off for sleep mode through software control.
• Radio Domain: supplies the radio interface, ADCs and temperature sensor. It is powered during transmit and
receive and when the analogue peripherals are enabled. It is controlled by the baseband processor and is
powered off during sleep mode.
The current consumption figures for the different modes of operation of the device is given in Section 19.2.2.
18.2 Active Processing Mode
Active processing mode in the JN516x is where all of the application processing takes place. By default, the CPU will
execute at the selected clock speed executing application firmware. All of the peripherals are available to the
application, as are options to actively enable or disable them to control power consumption; see specific peripheral
sections for details.
Whilst in Active processing mode there is the option to doze the CPU but keep the rest of the chip active; this is
particularly useful for radio transmit and receive operations, where the CPU operation is not required therefore saving
power.
18.2.1 CPU Doze
Whilst in doze mode, CPU operation is stopped but the chip remains powered and the digital peripherals continue to
run. Doze mode is entered through software and is terminated by any interrupt request. Once the interrupt service
routine has been executed, normal program execution resumes. Doze mode uses more power than sleep and deep
sleep modes but requires less time to restart and can therefore be used as a low power alternative to an idle loop.
Whilst in CPU doze the current associated with the CPU is not consumed, therefore the basic device current is
reduced as shown in the figures in Section 19.2.2.1.
18.3 Sleep Mode
The JN516x enters sleep mode through software control. In this mode most of the internal chip functions are
shutdown to save power, however the state of DIO pins are retained, including the output values and pull-up enables,
and this therefore preserves any interface to the outside world. 58 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
When entering into sleep mode, there is an option to retain the RAM contents throughout the sleep period. If the
wakeup timers are not to be used for a wakeup event and the application does not require them to run continually,
then power can be saved by switching off the 32kHz oscillator if selected as the 32kHz system clock through software
control. The oscillator will be restarted when a wakeup event occurs.
Whilst in sleep mode one of four possible events can cause a wakeup to occur: transitions on DIO inputs, expiry of
wakeup timers, pulse counters maturing or comparator events. If any of these events occur, and the relevant
interrupt is enabled, then an interrupt is generated that will cause a wakeup from sleep. It is possible for multiple
wakeup sources to trigger an event at the same instant and only one of them will be accountable for the wakeup
period. It is therefore necessary in software to remove all other pending wakeup events prior to requesting entry back
into sleep mode; otherwise, the device will re-awaken immediately.
When wakeup occurs, a similar sequence of events to the reset process described in Section 6.1 happens, including
the checking of the supply voltage by the Supply Voltage Monitor 6.4. The High-Speed RC oscillator is started up,
once stable the power to CPU system is enabled and the reset is removed. Software determines that this is a reset
from sleep and so commences with the wakeup process. If RAM contents were held through sleep, wakeup is quicker
as the software does not have to initialise RAM contents meaning the application can recommence more quickly. See
Section 19.3.5 for wake-up timings.
18.3.1 Wakeup Timer Event
The JN516x contains two 41-bit wakeup timers that are counters clocked from the 32kHz oscillator, and can be
programmed to generate a wake-up event. Following a wakeup event, the timers continue to run. These timers are
described in Section 11.3.
Timer events can be generated from both of the two timers; one is intended for use by the 802.15.4 protocol, the
other being available for use by the Application running on the CPU. These timers are available to run at any time,
even during sleep mode.
18.3.2 DIO Event
Any DIO pin when used as an input has the capability, by detecting a transition, to generate a wake-up event. Once
this feature has been enabled the type of transition can be specified (rising or falling edge). Even when groups of
DIO lines are configured as alternative functions such as the UARTs or Timers etc, any input line in the group can still
be used to provide a wakeup event. This means that an external device communicating over the UART can wakeup
a sleeping device by asserting its RTS signal pin (which is the CTS input of the JN516x).
18.3.3 Comparator Event
The comparator can generate a wakeup interrupt when a change in the relative levels of the positive and negative
inputs occurs. The ability to wakeup when continuously monitoring analogue signals is useful in ultra-low power
applications. For example, the JN516x can remain in sleep mode until the voltage drops below a threshold and then
be woken up to deal with the alarm condition and the comparator has a low current mode to facilitate this.
18.3.4 Pulse Counter
The JN516x contains two 16 bit pulse counters that can be programmed to generate a wake-up event. Following the
wakeup event the counters will continue to operate and therefore no pulse will be missed during the wake-up
process. These counters are described in Section 12.To minimize sleep current it is possible to disable the 32K RC
oscillator and still use the pulse counters to cause a wake-up event, provided debounce mode is not required.
18.4 Deep Sleep Mode
Deep sleep mode gives the lowest power consumption. All switchable power domains are off and most functions in
the VDD supply power domain are stopped, including the 32kHz RC oscillator. However, the Brown-Out Reset
remains active as well as all the DIO cells. This mode can be exited by a hardware reset on the RESETN pin, or an
enabled DIO or comparator wakeup event. In all cases, the wakeup sequence is equivalent to a power-up sequence,
with no knowledge retained from the previous time the device was awake.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 59
19 Electrical Characteristics
19.1 Maximum Ratings
Exceeding these conditions may result in damage to the device.
Parameter Min Max
Device supply voltage VDD1, VDD2 -0.3V 3.6V
Supply voltage at voltage regulator bypass pins
VB_xxx
-0.3V 1.98V
Voltage on analogue pins XTALOUT, XTALIN,
VCOTUNE, RF_IN.
-0.3V VB_xxx + 0.3V
Voltage on analogue pins VREF, ADC1, IBIAS -0.3V VDD1 + 0.3V
Voltage on any digital pin -0.3V VDD2 + 0.3V
Storage temperature -40ºC 150ºC
Reflow soldering temperature according to
IPC/JEDEC J-STD-020C
260ºC
ESD rating Human Body Model 1 2.0kV
Charged Device Model 2 500V
1) Testing for Human Body Model discharge is performed as specified in JEDEC Standard JESD22-A114.
2) Testing for Charged Device Model discharge is performed as specified in JEDEC Standard JESD22-C101.
19.2 DC Electrical Characteristics
19.2.1 Operating Conditions
Supply Min Max
VDD1, VDD2 2.0V 3.6V
Standard Ambient temperature range -40ºC 85ºC
Extended Ambient temperature range -40ºC 125ºC
In the following sections typical is defined as 25ºC and VDD1,2 = 3V
Most parameter values cover the extended temperature range up to 125 ºC, where this is not the case, two values
are given, the value in italics type face is for standard temperature range up to 85ºC and the value in bold is for the
extended range.60 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
19.2.2 DC Current Consumption
VDD = 2.0 to 3.6V, -40 to +125º C
19.2.2.1 Active Processing
Mode: Min Typ Max Unit Notes
CPU processing
32,16,8,4,2 or 1MHz
1700 +
205/MHz
µA GPIOs enabled. When in CPU
doze the current related to CPU
speed is not consumed.
Radio transmit 15.3 mA CPU in software doze – radio
transmitting
Radio receive 17.0 mA CPU in software doze – radio in
receive mode
The following current figures should be added to those above if the feature is being used
ADC 550 µA Temperature sensor and battery
measurements require ADC
Comparator 73/0.8 µA Normal/low-power
UART 60 µA For each UART
Timer 21 µA For each Timer
2-wire serial interface (I2
C) 46 µA
19.2.2.2 Sleep Mode
Mode: Min Typ Max Unit Notes
Sleep mode with I/O wakeup 0.12 µA Waiting on I/O event
Sleep mode with I/O and RC
Oscillator timer wakeup –
measured at 25ºC
0.64 µA As above, but also waiting on timer
event. If both wakeup timers are
enabled then add another 0.05µA
32kHz crystal oscillator 1.4 µA As alternative sleep timer
The following current figures should be added to those above if the feature is being used
RAM retention– measured at
25ºC
0.9 µA
Comparator (low-power mode) 0.8 µA Reduced response time
19.2.2.3 Deep Sleep Mode
Mode: Min Typ Max Unit Notes
Deep sleep mode– measured
at 25ºC
100 nA Waiting on chip RESET or I/O
event© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 61
19.2.3 I/O Characteristics
VDD = 2.0 to 3.6V, -40 to +125º C, italic +85 ºC Bold +125 ºC
Parameter Min Typ Max Unit Notes
Internal DIO pullup
resistors 40 50 60 kΩ
Internal RESETN pullup
resistor
267
325
455
605
410
500
700
930
615. 636
750, 775
1050, 1085
1395, 1441
kΩ VDD2 = 3.6V
VDD2 = 3.0V
VDD2 = 2.2V
VDD2 = 2.0V
Digital I/O High Input VDD2 x 0.7 VDD2 V
Digital I/O low Input -0.3 VDD2 x 0.27 V
Digital I/O input hysteresis 200 310 400 mV
DIO High O/P (2.7-3.6V) VDD2 x 0.8 VDD2 V With 4mA load
DIO Low O/P (2.7-3.6V) 0 0.4 V With 4mA load
DIO High O/P (2.2-2.7V) VDD2 x 0.8 VDD2 V With 3mA load
DIO Low O/P (2.2-2.7V) 0 0.4 V With 3mA load
DIO High O/P (2.0-2.2V) VDD2 x 0.8 VDD2 V With 2.5mA load
DIO Low O/P (2.0-2.2V) 0 0.4 V With 2.5mA load
Current sink/source
capability
4
3
2.5
mA VDD2 = 2.7V to 3.6V
VDD2 = 2.2V to 2.7V
VDD2 = 2.0V to 2.2V
IIL - Input Leakage Current 20, 30 nA Vcc = 3.6V, pin low
IIH - Input Leakage Current 20, 60 nA Vcc = 3.6V, pin high
19.3 AC Characteristics
19.3.1 Reset and Supply Voltage Monitor
Internal RESET
VDD
VPOT
t
STAB
Figure 39: Internal Power-on Reset without Showing Brown-Out62 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
Internal RESET
RESETN VRST
t
STAB
t
RST
Figure 40: Externally Applied Reset
VDD = 2.0 to 3.6V, -40 to +125º C
Parameter Min Typ Max Unit Notes
External Reset pulse width
to initiate reset sequence
(tRST)
1 µs Assumes internal pullup
resistor value of 100K
worst case and ~5pF
external capacitance
External Reset threshold
voltage (VRST)
VDD2 x
0.7
V Minimum voltage to
avoid being reset
Internal Power-on Reset
threshold voltage (VPOT)
Rise/fall time > 10mS
1.44
1.41
V Rising
Falling
Spike Rejection
Square wave pulse 1us
Triangular wave pulse 10us
1.2
1.3
V Depth of pulse to trigger
reset
Reset stabilisation time
(tSTAB)
180 µs Note 1
Chip current when held in
reset (IRESET)
6 uA
Brown-Out Reset
Current Consumption
80 nA
Supply Voltage Monitor
Threshold Voltage (VTH)
1.86
1.92
2.02
2.11
2.21
2.30
2.59
2.88
1.94
2.00
2.10
2.20
2.30
2.40
2.70
3.00
2.00
2.06
2.16
2.27
2.37
2.47
2.78
3.09
V Configurable threshold
with 8 levels
Supply Voltage Monitor
Hysteresis (VHYS)
37
38
45
52
58
65
82
100
mV Corresponding to the 8
threshold levels
1 Time from release of reset to start of executing of bootloader code from internal flash. An extra 15us is incurred if
the BOR circuit has been activated (e.g., if the supply voltage has been ramped up from 0V)".© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 63
VTH + VHYS
VTH
DVDD
Internal BORest
Internal SVM
VPOT
Figure 41 Brown-out Reset Followed By Supply Voltage Montior trigger
19.3.2 SPI Master Timing
t t SSH SSS
t
CK
t
SI
t
HI
MOSI
(mode=1,3)
SS
MOSI
(mode=0,2)
MISO
(mode=0,2)
MISO
(mode=1,3)
t
VO
t
VO
CLK
(mode=0,1)
t
SI
t
HI
CLK
(mode=2,3)
Figure 42: SPI Master Timing
Parameter Symbol Min Max Unit
Clock period tCK 62.5 - ns
Data setup time tSI 16.7 @ 3.3V
18.2 @ 2.7V
21.0 @ 2.0V
- ns
Data hold time tHI 0 ns
Data invalid period tVO - 15 ns
Select set-up period tSSS 60 - ns
Select hold period tSSH 30 (SPICLK = 16MHz)
0 (SPICLK<16MHz, mode=0 or 2)
60 (SPICLK<16MHz, mode=1 or 3)
- ns64 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
19.3.3 SPI Slave Timing
Parameter Symbol Min Max Unit
Clock period tCK 125 - ns
Idle time tIDLE 125 - ns
Data input setup time tSI 10 - ns
Data input hold time tHI 10 - ns
Data output invalid period from SPISCLK falling edge tCKVO - 30 ns
Data output invalid period from SPISSEL falling edge tSELVO 30 ns
Delay from SPISSEL falling edge to SPISCLK rising edge tSELA 30 - ns
Delay from SPISCLK falling edge to SPISSEL rising edge tSELN 30 - ns
…
…
SPISCLK
SPISSEL
SPISMOSI
SPISMISO
…
…
t tSELN IDLE
tSI tHI
tSELA tCK
tSELVO tCKVO
Figure 43: SPI Slave Timing© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 65
19.3.4 Two-wire Serial Interface
t
BUF
S Sr P S
t
LOW
t
HD;STA
t
F t
R
t
HD;DAT
t
HIGH
t
SU;DAT
t
SU;STA
t
HD;STA
t
SU;STO
t
SP t
R
t
F
SIF_D
SIF_CLK
Figure 44: Two-wire Serial Interface Timing
Parameter Symbol
Standard Mode Fast Mode
Unit
Min Max Min Max
SIF_CLK clock frequency fSCL 0 100 0 400 kHz
Hold time (repeated) START condition.
After this period, the first clock pulse is
generated
tHD:STA 4 - 0.6 - µs
LOW period of the SIF_CLK clock tLOW 4.7 - 1.3 - µs
HIGH period of the SIF_CLK clock tHIGH 4 - 0.6 - µs
Set-up time for repeated START condition tSU:STA 4.7 - 0.6 - µs
Data setup time SIF_D tSU:DAT 0.25 - 0.1 - µs
Rise Time SIF_D and SIF_CLK tR - 1000 20+0.1Cb 300 ns
Fall Time SIF_D and SIF_CLK tF - 300 20+0.1Cb 300 ns
Set-up time for STOP condition tSU:STO 4 - 0.6 - µs
Bus free time between a STOP and START
condition
tBUF 4.7 - 1.3 - µs
Pulse width of spikes that will be
suppressed by input filters (Note 1)
tSP - 60 - 60 ns
Capacitive load for each bus line Cb - 400 - 400 pF
Noise margin at the LOW level for each
connected device (including hysteresis)
Vnl 0.1VDD - 0.1VDD - V
Noise margin at the HIGH level for each
connected device (including hysteresis)
Vnh 0.2VDD - 0.2VDD - V
Note 1: This figure indicates the pulse width that is guaranteed to be suppressed. Pulse with widths up to 125nsec
may also get suppressed.
19.3.5 Wakeup Timings
Parameter Min Typ Max Unit Notes
Time for crystal to stabilise
ready to run CPU
0.74 ms Reached oscillator amplitude
threshold. Default bias current
Time for crystal to stabilise
ready for radio activity
1.0 ms
Wake up from Deep Sleep
or from Sleep
170 µs Time to CPU release
Start-up time from reset
RESETN pin, BOR or
SVM
180 µs Time to CPU release
Wake up from CPU Doze
mode
0.2 µs 66 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
19.3.6 Bandgap Reference
VDD = 2.0 to 3.6V, -40 to +125ºC, italic +85 ºC Bold +125 ºC
Parameter Min Typ Max Unit Notes
Voltage 1.198 1.235 1.260 V
DC power supply rejection 58 dB at 25ºC
Temperature coefficient +40
+135
+65
+93
ppm/ºC 20 to 85ºC
-40ºC to 20ºC
20 to 125 ºC
-40ºC to 85ºC
Point of inflexion +80 ºC
19.3.7 Analogue to Digital Converters
VDD = 3.0V, VREF = 1.2V, -40 to +125ºC, italic +85 ºC Bold +125 ºC
Parameter Min Typ Max Unit Notes
Resolution 10 bits 500kHz Clock
Current consumption 550 µA
Integral nonlinearity ± 1.6, 1.8 LSB
Differential nonlinearity -0.5 +0.5 LSB Guaranteed monotonic
Offset error -10
-20
mV 0 to Vref range
0 to 2Vref range
Gain error +10
+20
mV 0 to Vref range
0 to 2Vref range
Internal clock 0.25,0.5 or
1.0
MHz 16MHz input clock,
÷16,32or 64
No. internal clock periods
to sample input
2, 4, 6 or 8 Programmable
Conversion time 9.5 148 µs Programmable
Input voltage range 0.04 Vref
or 2*Vref
V Switchable. Refer to
17.1.1
Vref (Internal) See Section 19.3.6
Vref (External) 1.15 1.2 1.6 V Allowable range into
VREF pin
Input capacitance 8 pF In series with 5K ohms© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 67
19.3.8 Comparator
VDD = 2.0 to 3.6V -40 to +125ºC, italic +85 ºC Bold +125 ºC
Parameter Min Typ Max Unit Notes
Analogue response time
(normal)
90 125,130 ns +/- 250mV overdrive
10pF load
Total response time
(normal) including delay to
Interrupt controller
125
+ 125,130
ns Digital delay can be
up to a max. of two
16MHz clock periods
Analogue response time
(low power)
2.2 2.8 µs +/- 250mV overdrive
No digital delay
Hysteresis 7
14
28
10
20
40
16, 17
28, 30
53, 57
mV Programmable in 3
steps and zero
Vref (Internal) See Section 19.3.6 V
Common Mode input range 0 Vdd V
Current (normal mode) 56 73 96, 100 µA
Current (low power mode) 0.8 1.0, 1.1 µA
19.3.9 32kHz RC Oscillator
VDD = 2.0 to 3.6V, -40 to +125 ºC, italic +85 ºC Bold +125 ºC
Parameter Min Typ Max Unit Notes
Current consumption of cell
and counter logic (default)
590
520
465
720, 800
660, 740
600, 650
nA 3.6V
3.0V
2.0V
Current consumption of cell
and counter logic (low power)
465
375
290
500,550
425,460
330,370
nA 3.6V
3.0V
2.0V
32kHz clock un-calibrated
accuracy
-10% 32kHz +40% Without temperature &
voltage variation (note1)
Calibrated 32kHz accuracy
(default)
Low power
±300
±600
ppm For a 1 second sleep
period calibrating over
20 x 32kHz clock
periods
Variation with temperature -0.010
-0.020
%/°C Default
Low power
Variation with VDD2 -3.0 %/V
Note1: Measured at 3v and 25 deg C 68 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
19.3.10 32kHz Crystal Oscillator
VDD = 2.0 to 3.6V, -40 to +125ºC, italic +85 ºC Bold +125 ºC
Parameter Min Typ Max Unit Notes
Current consumption of cell
and counter logic
1.4 1.75, 2.0 µA This is sensitive to the ESR
of the crystal, Vdd and total
capacitance at each pin
Start – up time 0.6 s Assuming xtal with ESR of
less than 40kohms and
CL= 9pF External caps =
15pF
(Vdd/2mV pk-pk) see
Appendix B
Input capacitance 1.4 pF Bondpad and package
Transconductance 18.5 µA/V
External Capacitors
(CL=9pF)
15 pF Total external capacitance
needs to be 2*CL, allowing
for stray capacitance from
chip, package and PCB
Amplitude at Xout Vdd-0.2 Vp-p
19.3.11 32MHz Crystal Oscillator
VDD = 2.0 to 3.6V, -40 to +125ºC, italic +85 ºC Bold +125 ºC
Parameter Min Typ Max Unit Notes
Current consumption 300 375 450, 500 µA Excluding bandgap ref.
Start – up time 0.74 ms Assuming xtal with ESR of
less than 40ohms and CL=
9pF External caps = 15pF
see Appendix B
Input capacitance 1.4 pF Bondpad and package
Transconductance 3.65, 3.55 4.30 5.16 mA/V
DC voltages,
XTALIN/XTALOUT
390/432
375/412
425/472 470/527 mV
External Capacitors
(CL=9pF)
15 pF Total external capacitance
needs to be 2*CL, allowing
for stray capacitance from
chip, package and PCB
Amplitude detect threshold 320 mVp-p Threshold detection
accessible via API© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 69
19.3.12 High-Speed RC Oscillator
VDD = 2.0 to 3.6V, -40 to +125ºC, italic +85 ºC Bold +125 ºC
Parameter Min Typ Max Unit Notes
Current consumption of cell 81 145 250, 275 µA
Clock native accuracy -16% +18%
Un-calibrated frequency 26.1 MHz
Calibrated centre frequency
accuracy
-1.6% 32.1 +1.6% MHz Without temperature &
voltage variation
Calibrated centre frequency
accuracy
-4% 32.1 +5% MHz Including temperature &
voltage variation
Variation with temperature -0.024, -0.015 +0.009,
+0.006
%/°C
Variation with VDD2 -0.25 +0.25 +0.5, +0.6 %/V
Startup time 2.4 us
19.3.13 Temperature Sensor
VDD = 2.0 to 3.6V, -40 to +125ºC, italic +85 ºC Bold +125 ºC
Parameter Min Typ Max Unit Notes
Operating Range -40 - 125 °C
Sensor Gain -1.56 -1.66 -1.76 mV/°C
Accuracy - - ±7 °C
Non-linearity - - 2.0, 3.0 °C
Output Voltage 610, 540 840 mV Includes absolute variation
due to manufacturing & temp
Typical Voltage 730 mV Typical at 3.0V 25°C
Resolution 0.666 0.706 0.751 °C/LSB 0 to Vref ADC I/P Range
19.3.14 Non-Volatile Memory
VDD = 2.0 to 3.6V, -40 to +125ºC, italic +85 ºC Bold +125 ºC
Parameter Min Typ Max Unit Notes
Flash endurance 10K 100/50K Cycle Program/erase
Flash erase time 100 ms One or more sectors
Flash programming time 1.0 ms 256 bytes
EEPROM endurance 100K 1M/500K °C Program/erase (see 4.4 )
EEPROM erase time 1.8 ms One 64 bytes page
EEPROM programming time 1.1 ms Between 1 & 64 bytes
Retention time powered
unpowered
10
20
Years Flash & EEPROM70 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
19.3.15 Radio Transceiver
This JN516x meets all the requirements of the IEEE802.15.4 standard over 2.0 - 3.6V and offers the following
improved RF characteristics. All RF characteristics are measured single ended.
This part also meets the following regulatory body approvals, when used with NXP’s Module Reference Designs.
Compliant with FCC part 15, rules, IC Canada, ETSI ETS 300-328 and Japan ARIB STD-T66
The PCB schematic and layout rules detailed in Appendix B.4
must be followed. Failure to do so will likely result in the JN516x
failing to meet the performance specification detailed herein and
worst case may result in device not functioning in the end
application.
Parameter Min Typical Max Notes
RF Port Characteristics
Type Single Ended
Impedance 1 50ohm 2.4-2.5GHz
Frequency range 2.400 GHz 2.485GHz
ESD levels (pin 17) 2KV (HBM)
500v (CDM)
1) With external matching inductors and assuming PCB layout as in Appendix B.4.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 71
Radio Parameters: 2.0-3.6V, +25ºC
Parameter Min Typical Max Unit Notes
Receiver Characteristics
Receive sensitivity -92 -95 dBm Nominal for 1% PER, as per
802.15.4 Section 6.5.3.3
Maximum input signal +10 dBm For 1% PER, measured as
sensitivity
Adjacent channel
rejection (-1/+1 ch)
[CW Interferer]
19/34
[27/49]
dBc For 1% PER, with wanted signal
3dB, above sensitivity. (Note1,2)
(modulated interferer)
Alternate channel
rejection (-2/+2 ch)
[CW Interferer]
40/44
[54/54]
dBc For 1% PER, with wanted signal
3dB, above sensitivity. (Note1,2)
(modulated interferer)
Other in band rejection
2.4 to 2.4835 GHz,
excluding adj channels
48 dBc For 1% PER with wanted signal
3dB above sensitivity. (Note1)
Out of band rejection 52 dBc For 1% PER with wanted signal
3dB above sensitivity. All
frequencies except wanted/2 which
is 8dB lower. (Note1)
Spurious emissions
(RX)
-65
<-70
-60
dBm Measured conducted into 50ohms
30MHz to 1GHz
1GHz to 12GHz
Intermodulation
protection
40 dB For 1% PER at with wanted signal
3dB above sensitivity. Modulated
Interferers at 2 & 4 channel
separation (Note1)
RSSI linearity -4 +4 dB -95 to -10dBm.
Available through Hardware API
Transmitter Characteristics
Transmit power +0.5 +2.5 dBm
Output power control
range
-35 dB In three 12dB steps (Note3)
Spurious emissions
(TX)
-40
<-70
<-70
dBm Measured conducted into 50ohms
30MHz to 1GHz,
1GHz to12.5GHz,
The following exceptions apply
1.8 to 1.9GHz & 5.15 to 5.3GHz
EVM [Offset] 3.0 4.5 % At maximum output power
Transmit Power
Spectral Density
-38 -20 dBc At greater than 3.5MHz offset, as
per 802.15.4, Section 6.5.3.172 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
Radio Parameters: 2.0-3.6V, -40ºC
Parameter Min Typical Max Unit Notes
Receiver Characteristics
Receive sensitivity -93.0 -96.0 dBm Nominal for 1% PER, as per
802.15.4 Section 6.5.3.3
Maximum input signal +10 dBm For 1% PER, measured as
sensitivity
Adjacent channel
rejection (-1/+1 ch)
[CW Interferer]
19/34
[TBC]
dBc For 1% PER, with wanted signal
3dB, above sensitivity. (Note1,2)
(modulated interferer)
Alternate channel
rejection (-2/+2 ch)
[CW Interferer]
40/44
[TBC]
dBc For 1% PER, with wanted signal
3dB, above sensitivity. (Note1,2)
(modulated interferer)
Other in band rejection
2.4 to 2.4835 GHz,
excluding adj channels
47 dBc For 1% PER with wanted signal
3dB above sensitivity. (Note1)
Out of band rejection 49 dBc For 1% PER with wanted signal
3dB above sensitivity. All
frequencies except wanted/2 which
is 8dB lower. (Note1)
Spurious emissions
(RX)
-64
<-70
-60
dBm Measured conducted into 50ohms
30MHz to 1GHz
1GHz to 12GHz
Intermodulation
protection
39 dB For 1% PER at with wanted signal
3dB above sensitivity. Modulated
Interferers at 2 & 4 channel
separation (Note1)
RSSI linearity -4 +4 dB -95 to -10dBm.
Available through Hardware API
Transmitter Characteristics
Transmit power 0 +2.00 dBm
Output power control
range
-35 dB In three 12dB steps (Note3)
Spurious emissions
(TX)
-40
<-70
<-70
dBm Measured conducted into 50ohms
30MHz to 1GHz,
1GHz to12.5GHz,
The following exceptions apply
1.8 to 1.9GHz & 5.15 to 5.3GHz
EVM [Offset] 3.0 4.5 % At maximum output power
Transmit Power
Spectral Density
-38 -20 dBc At greater than 3.5MHz offset, as
per 802.15.4, Section 6.5.3.1© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 73
Radio Parameters: 2.0-3.6V, +85ºC
Parameter Min Typical Max Unit Notes
Receiver Characteristics
Receive sensitivity -90 -93 dBm Nominal for 1% PER, as per
802.15.4 Section 6.5.3.3
Maximum input signal +10 dBm For 1% PER, measured as
sensitivity
Adjacent channel
rejection (-1/+1 ch)
[CW Interferer]
19/34
[TBC]
dBc For 1% PER, with wanted signal
3dB, above sensitivity. (Note1,2)
(modulated interferer)
Alternate channel
rejection (-2/+2 ch)
[CW Interferer]
40/44
[TBC]
dBc For 1% PER, with wanted signal
3dB, above sensitivity. (Note1,2)
(modulated interferer)
Other in band rejection
2.4 to 2.4835 GHz,
excluding adj channels
49 dBc For 1% PER with wanted signal
3dB above sensitivity. (Note1)
Out of band rejection 53 dBc For 1% PER with wanted signal
3dB above sensitivity. All
frequencies except wanted/2 which
is 8dB lower. (Note1)
Spurious emissions
(RX)
-66
<-70
-61
dBm Measured conducted into 50ohms
30MHz to 1GHz
1GHz to 12GHz
Intermodulation
protection
41 dB For 1% PER at with wanted signal
3dB above sensitivity. Modulated
Interferers at 2 & 4 channel
separation (Note1)
RSSI linearity -4 +4 dB -95 to -10dBm.
Available through Hardware API
Transmitter Characteristics
Transmit power 0 +2.0 dBm
Output power control
range
-35 dB In three 12dB steps (Note3)
Spurious emissions
(TX)
-40
<-70
<-70
dBm Measured conducted into 50ohms
30MHz to 1GHz,
1GHz to12.5GHz,
The following exceptions apply
1.8 to 1.9GHz & 5.15 to 5.3GHz
EVM [Offset] 3.0 4.5 % At maximum output power
Transmit Power
Spectral Density
-38 -20 dBc At greater than 3.5MHz offset, as
per 802.15.4, Section 6.5.3.174 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
Radio Parameters: 2.0-3.6V, +125ºC
Parameter Min Typical Max Unit Notes
Receiver Characteristics
Receive sensitivity -89 -92 dBm Nominal for 1% PER, as per
802.15.4 Section 6.5.3.3
Maximum input signal +5 dBm For 1% PER, measured as
sensitivity
Adjacent channel
rejection (-1/+1 ch)
[CW Interferer]
20/34
[TBC]
dBc For 1% PER, with wanted signal
3dB, above sensitivity. (Note1,2)
(modulated interferer)
Alternate channel
rejection (-2/+2 ch)
[CW Interferer]
40/44
[TBC]
dBc For 1% PER, with wanted signal
3dB, above sensitivity. (Note1,2)
(modulated interferer)
Other in band rejection
2.4 to 2.4835 GHz,
excluding adj channels
49 dBc For 1% PER with wanted signal
3dB above sensitivity. (Note1)
Out of band rejection 53 dBc For 1% PER with wanted signal
3dB above sensitivity. All
frequencies except wanted/2 which
is 8dB lower. (Note1)
Spurious emissions
(RX)
-66
<-70
-61
dBm Measured conducted into 50ohms
30MHz to 1GHz
1GHz to 12GHz
Intermodulation
protection
41 dB For 1% PER at with wanted signal
3dB above sensitivity. Modulated
Interferers at 2 & 4 channel
separation (Note1)
RSSI linearity -4 +4 dB -95 to -10dBm.
Available through Hardware API
Transmitter Characteristics
Transmit power -0.5 +1.5 dBm
Output power control
range
-35 dB In three 12dB steps (Note3)
Spurious emissions
(TX)
-40
<-70
<-70
dBm Measured conducted into 50ohms
30MHz to 1GHz,
1GHz to12.5GHz,
The following exceptions apply
1.8 to 1.9GHz & 5.15 to 5.3GHz
EVM [Offset] 3.0 4.5 % At maximum output power
Transmit Power
Spectral Density
-38 -20 dBc At greater than 3.5MHz offset, as
per 802.15.4, Section 6.5.3.1© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 75
Note1: Blocker rejection is defined as the value, when 1% PER is seen with the wanted signal 3dB above sensitivity,
as per 802.15.4 Section 6.5.3.4
Note2: Channels 11,17,24 low/high values reversed.
Note3: Up to an extra 2.5dB of attenuation is available if required.76 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
Appendix A Mechanical and Ordering Information
A.1 SOT618-1 HVQFN40 40-pin QFN Package Drawing
Figure 45: 40-pin QFN Package Drawings
UNIT A
max.
A1 b c D Dh E Eh e e1 e2 L v w y y1
mm 1 0.05
0.00
0.30
0.18 0.2 6.1
5.9
4.75
4.45
6.1
5.9
4.75
4.45 0.5 4.5 4.5 0.5
0.3 0.1 0.05 0.05 0.1
Table 10: Package Dimensions
Plastic or metal protrusions of 0.075 mm maximum per side are
not included.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 77
A.2 Footprint Information
Information for reflow soldering. All dimensions are given in the table underneath and are in millimeters
Solder land
Solder land plus solder paste
A
B
C
D
E
F
G
Figure 46: PCB Decal
The PCB schematic and layout rules detailed in Appendix B.4 must
be followed. Failure to do so will likely result in the JN516x failing
to meet the performance specification detailed herein and worst
case may result in device not functioning in the end application.
A B C D E F G
0.5 0.45 0.3 0.25 1.53x1.53 4.1x4.1 1.0x0.25
Table 11: Footprint Dimensions78 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
A.3 Ordering Information
The standard qualification for the JN516x is extended industrial temperature range: -40ºC to +125ºC, packaged in a
40-pin QFN package.
The device is available in two different reel quantities
• Tape mounted 4000 devices on a 330mm reel
• Tape mounted 1000 devices on a 180mm reel
Order Codes:
Part Number Ordering Code Description
JN5161-001 JN5161/001 JN5161 microcontroller
JN5164-001 JN5164/001 JN5164 microcontroller
JN5168-001 JN5168/001 JN5168 microcontroller
The Standard Supply Multiple (SSM) for Engineering Samples or Prototypes is 50 units with a maximum of 250 units.
If the quantity of Engineering Samples or Prototypes ordered is less than a reel quantity, then these will be shipped in
tape form only, with no reel and will not be dry packaged in a moisture sensitive environment.
The SSM for Production status devices is one reel, all reels are dry packaged in a moisture barrier bag see A.5.3.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 79
A.4 Device Package Marking
The diagram below shows the package markings for JN516x. The package on the left along with the legend
information below it, shows the general format of package marking. The package on the right shows the specific
markings for a JN5168 device, that came from assembly build number 01 and was manufactured week 25 of 2011.
J N 5168 A
XXXXXX
XXXXFF
XXXYWWXX
J N 5168 A
RUL 280
0 0 Y U 0 1
qSD 125 -X
NXP
NXP
Figure 47: Device Package Marking
Legend:
JN Family part code
XXXX 4 digit part number
FF 2 digit assembly build number
Y 1 digit year number
WW 2 digit week number
Ordering Code Part Marking
JN5161/001 JN5161A
JN5164/001 JN5164A
JN5168/001 JN5168A80 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
A.5 Tape and Reel Information
A.5.1 Tape Orientation and Dimensions
The general orientation of the 40QFN package in the tape is as shown in Figure 48.
Figure 48: Tape and Reel Orientation
Figure 49 shows the detailed dimensions of the tape used for 6x6mm 40QFN devices.
Reference Dimensions (mm)
Ao 6.30 ±0.10
Bo 6.30 ±0.10
Ko 1.10 ±0.10
F 7.500 ±0.10
P1 12.0 ±0.10
W 16.00 +0.30/-0.3
(I) Measured from centreline of sprocket hole to centreline of pocket
(II) Cumulative tolerance of 10 sprocket holes is ±0.20mm
(III) Measured from centreline of sprocket hole to centreline of pocket
(IV) Other material available
Figure 49: Tape Dimensions© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 81
A.5.2 Reel Information: 180mm Reel
Surface Resistivity Between 1x1010 – 1x1012 Ohms Square
Material High Impact Polystyrene, environmentally friendly, recyclable
All dimensions and tolerances are fully compliant with EIA-481-B and are specified in millimetres.
6 window design with one window on each side blanked to allow adequate labelling space.
Figure 50: Reel Dimensions82 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
A.5.3 Reel Information: 330mm Reel
Surface Resistivity Between 10e9 – 10e11 Ohms Square
Material High Impact Polystyrene with Antistatic Additive
All dimensions and tolerances are fully compliant with EIA-481-B and are specified in millimetres.
3 window design to allow adequate labelling space.
Figure 51: 330mm Reel Dimensions
A.5.4 Dry Pack Requirement for Moisture Sensitive Material
Moisture sensitive material, as classified by JEDEC standard J-STD-033, must be dry packed. The 40 lead QFN
package is MSL2A/260°
C, and is dried before sealing in a moisture barrier bag (MBB) with desiccant bag weighing at
67.5 grams of activated clay and a humidity indicator card (HIC) meeting MIL-L-8835 specification. The MBB has a
moisture-sensitivity caution label to indicate the moisture-sensitive classification of the enclosed devices.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 83
Appendix B Development Support
B.1 Crystal Oscillators
This Section covers some of the general background to crystal oscillators, to help the user make informed decisions
concerning the choice of crystal and the associated capacitors.
B.1.1 Crystal Equivalent Circuit
Cs
Lm Rm Cm
C1 C2
Where Cm is the motional capacitance
Lm is the motional inductance. This together with Cm defines the oscillation frequency (series)
Rm is the equivalent series resistance ( ESR ).
CS is the shunt or package capacitance and this is a parasitic
B.1.2 Crystal Load Capacitance
The crystal load capacitance is the total capacitance seen at the crystal pins, from all sources. As the load
capacitance (CL) affects the oscillation frequency by a process known as ‘pulling’, crystal manufacturers specify the
frequency for a given load capacitance only. A typical pulling coefficient is 15ppm/pF, to put this into context the
maximum frequency error in the IEEE802.15.4 specification is +/-40ppm for the transmitted signal. Therefore, it is
important for resonance at 32MHz exactly, that the specified load capacitance is provided.
The load capacitance can be calculated using:
CL =
1 2
1 2
T T
T T
C C
C C
+
×
Total capacitance CT1 = C1 + C1P + C1in
Where C1 is the capacitor component
C1P is the PCB parasitic capacitance. With the recommended layout this is about 1.6pF
C1in is the on-chip parasitic capacitance and is about 1.4pF typically.
Similarly for CT 2
Hence for a 9pF load capacitance, and a tight layout the external capacitors should be 15pF84 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
B.1.3 Crystal ESR and Required Transconductance
The resistor in the crystal equivalent circuit represents the energy lost. To maintain oscillation, power must be
supplied by the amplifier, but how much? Firstly, the Pi connected capacitors C1 and C2 with CS from the crystal,
apply an impedance transformation to Rm, when viewed from the amplifier. This new value is given by:
2
ˆ
+ = L
S L m m
C
C C R R
The amplifier is a transconductance amplifier, which takes a voltage and produces an output current. The amplifier
together with the capacitors C1 and C2, form a circuit, which provides a negative resistance, when viewed from the
crystal. The value of which is given by:
2
1× 2 ×ω = T T
m
NEG
C C
g R
Where gm is the transconductance
ω is the frequency in rad/s
Derivations of these formulas can be easily found in textbooks.
In order to give quick and reliable oscillator start-up, a common rule of thumb is to set the amplifier negative
resistance to be a minimum of 4 times the effective crystal resistance. This gives
2
T1× T 2 ×ω
m
C C
g ≥
2
4
+
L
S L m
C
C C R
This can be used to give an equation for the required transconductance.
1 2
2 1 2 1 2 2 4 [ ( ) ]
T T
m S T T T T m C C
R C C C C C
g ×
× + + × ≥ ω
Example: Using typical 32MHz crystal parameters of Rm =40Ω, CS =1pF and CT1 =CT 2 =18pF ( for a load
capacitance of 9pF), the equation above gives the required transconductance ( gm ) as 2.59mA/V. The JN516x has a
typical value for transconductance of 4.4mA/V
The example and equation illustrate the trade-off that exists between the load capacitance and crystal ESR. For
example, a crystal with a higher load capacitance can be used, but the value of max. ESR that can be tolerated is
reduced. Also note, that the circuit sensitivity to external capacitance [ C1 , C2 ] is a square law.
Meeting the criteria for start-up is only one aspect of the way these parameters affect performance, they also affect
the time taken during start-up to reach a given, (or full), amplitude. Unfortunately, there is no simple mathematical
model for this, but the trend is the same. Therefore, both a larger load capacitance and larger crystal ESR will give a
longer start-up time, which has the disadvantages of reduced battery life and increased latency. © NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 85
B.2 32MHz Oscillator
The JN516x contains the necessary on-chip components to build a 32 MHz reference oscillator with the addition of an
external crystal resonator, two tuning capacitors. The schematic of these components are shown in Figure 52. The
two capacitors, C1 and C2, will typically be 15pF ±5% and use a COG dielectric. For a detailed specification of the
crystal required and factors affecting C1 and C2 see Appendix B.1. As with all crystal oscillators the PCB layout is
especially important, both to keep parasitic capacitors to a minimum and to reduce the possibility of PCB noise being
coupled into the oscillator.
XTALOUT
C1 C2
XTALIN R1
JN516x
Figure 52: Crystal Oscillator Connections
The clock generated by this oscillator provides the reference for most of the JN516x subsystems, including the
transceiver, processor, memory and digital and analogue peripherals.
32MHz Crystal Requirements
Parameter Min Typ Max Notes
Crystal Frequency 32MHz
Crystal Tolerance 40ppm Including temperature
and ageing
Crystal ESR Range (Rm) 10Ω 60Ω See below for more
details
Crystal Load Capacitance
Range (CL) 6pF 9pF 12pF See below for more
details
Not all Combinations of Crystal Load Capacitance and ESR are Valid
Recommended Crystal Load Capacitance 9pF and max ESR 40 Ω
External Capacitors (C1 & C2)
For recommended Crystal
15pF CL = 9pF, total external
capacitance needs to be
2*CL. , allowing for stray
capacitance from chip,
package and PCB 86 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
As is stated above, not all combinations of crystal load capacitance and ESR are valid, and as explained in Appendix
B.1.3 there is a trade-off that exists between the load capacitance and crystal ESR to achieve reliable performance.
For this reason, we recommend that for a 9pF load capacitance crystals be specified with a maximum ESR of 40
ohms. For lower load capacitances the recommended maximum ESR rises, for example, CL=7pF the max ESR is 61
ohms. For the lower cost crystals in the large HC49 package, a load capacitance of 9 or 10pF is widely available and
the max ESR of 30 ohms specified by many manufacturers is acceptable. Also available in this package style, are
crystals with a load capacitance of 12pF, but in this case the max ESR required is 25 ohms or better.
Below is measurement data showing the variation of the crystal oscillator amplifier transconductance with
temperature and supply voltage, notice how small the variation is. Circuit techniques have been used to apply
compensation, such that the user need only design for nominal conditions.
4.15
4.20
4.25
4.30
4.35
-40 -20 0 20 40 60 80 100 120
Transconductance (mA/V)
Temperature (C)
32MHz Crystal Oscillator
4.27
4.28
4.29
4.3
4.31
4.32
4.33
4.34
4.35
2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
Transconductance (mA/V)
Supply Voltage (VDD)
32MHz Crystal Oscillator © NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 87
B.3 32kHz Oscillator
In order to obtain more accurate sleep periods, the JN516x contains the necessary on-chip components to build an
optional 32kHz oscillator with the addition of an external 32.768kHz crystal and two tuning capacitors. The crystal
should be connected between XTAL32K_IN and XTAL32K_OUT (DIO9 and DIO10), with two equal capacitors to
ground, one on each pin. The schematic of these components are shown in Figure 53. The two capacitors, C1 and
C2, will typically be in the range 10 to 22pF ±5% and use a COG dielectric. As with all crystal oscillators the PCB
layout is especially important, both to keep parasitic capacitors to a minimum and to reduce the possibility of PCB
noise being coupled into the oscillator.
32KXTALIN 32KXTALOUT
JN516x
Figure 53: 32kHz Crystal Oscillator Connections
The electrical specification of the oscillator can be found in 19.3.10. The oscillator cell is flexible and can operate with
a range of commonly available 32kHz crystals with load capacitances from 6 to 12.5p, and ESR up to 80KΩ. It
achieves this by using automatic gain control (AGC), which senses the signal swing. As explained in Appendix B.1.3
there is a trade-off that exists between the load capacitance and crystal ESR to achieve reliable performance. The
use of an AGC function allows a wider range of crystal load capacitors and ESR’s to be accommodated than would
otherwise be possible. However, this benefit does mean the supply current varies with the supply voltage (VDD),
value of the total capacitance at each pin, and the crystal ESR. This is described in the table and graphs below.
32kHz Crystal Requirements
Parameter Min Typ Max Notes
Crystal Frequency 32kHz
Supply Current 1.4µA Vdd=3v, temp=25 C, load
cap =9pF, Rm=25K
Supply Current Temp. Coeff. 0.1%/C Vdd=3v
Crystal ESR Range (Rm) 10KΩ 25KΩ 80KΩ See below for more details
Crystal Load Capacitance
Range (CL)
6pF 9pF 12.5pF See below for more details
Not all Combinations of Crystal Load Capacitance and ESR are Valid 88 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
Three examples of typical crystals are given, each with the value of external capacitors to use, plus the likely supply
current and start-up time that can be expected. Also given is the maximum recommended ESR based on the start-up
criteria given in Appendix B.1.3. The values of the external capacitors can be calculated using the equation in
Appendix B.1.2 .
Load Capacitance Ext Capacitors Current Start-up Time Max ESR
9pF 15pF 1.4µA 0.5sec 70KΩ
6pF 9pF 1.1µA 0.4sec 80KΩ
12.5pF 22pF 2.2µA 1.0sec 35KΩ
Below is measurement data showing the variation of the crystal oscillator supply current with voltage and with crystal
ESR, for two load capacitances.
1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
Current (uA)
Supply Voltage (VDD)
32kHz Crystal Oscillator
0.6
0.8
1
1.2
1.4
1.6
10 20 30 40 50 60 70 80
Normalised Current (IDD)
Crystal ESR (K ohm)
32KHz Crystal Oscillator Current
9pF
12.5pF© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 89
B.4 JN516x Module Reference Designs
For customers wishing to integrate the JN516x device directly into their system, NXP provide a range of Module
Reference Designs, covering standard, medium and high-power modules fitted with different Antennae
To ensure the correct performance, it is strongly recommended that where possible the design details provided by the
reference designs, are used in their exact form for all end designs, this includes component values, pad dimensions,
track layouts etc. In order to minimise all risks, it is recommended that the entire layout of the appropriate reference
module, if possible, be replicated in the end design.
For full details, see [5]. Please contact technical support.
B.4.1 Schematic Diagram
A schematic diagram of the JN516x PCB antenna reference module is shown in figure 53. Details of component
values and PCB layout constraints can be found in Table 12.
1
40 39 38 37 36 35 34 33 32 31
VSSA
2
3
4
5
6
7
8
9
10
30
29
28
27
26
25
24
23
22
21
11 12 13 14 15 16 17 18 19 20
COMP1P
COMP1M
RESETN
XTAL_OUT
XTAL_IN
VB_SYNTH
VCOTUNE (NC)
VB_VCO
VDD1
IBIAS
VREF
VB_RF2
RF_IN
VB_RF
ADC1
SPISEL1
SPISEL2
DIO2
DIO3
DO0
VSS1
DO1
DIO18
DIO19
VB_RAM
CTS0
RTS0
TXD0
RXD0
VDD2
SIF_D
VSS2
SIF_CLK
DIO13
DIO12
VB_DIG
DIO11
TIM0OUT
TIM0CAP
TIM0CK_GT
C7: 100nF
2-wire Serial Port Timer0
C16: 100nF UART0/JTAG
C6: 100nF
SPI Select
Analogue IO
C1: 47pF C3: 100nF L1: 5.1nH
L2: 3.9nH
VB_RF
R1: 43kΩ
To coaxial socket
or integrated antenna
C20: 100nF
C13: 10µF C14: 100nF
VDD
C2: 10nF
C15: 100nF
C10: 15pF
C11: 15pF
Y1
Analogue IO
C4: 47pF
Figure 54 JN516x PCB Antenna Module Reference Design 90 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
Component
Designator Value/Type Function PCB Layout Constraints
C13 10µF Power source decoupling
C14 100nF Analogue Power decoupling Adjacent to U1 pin 9
C16 100nF Digital power decoupling Adjacent to U1 pin 30
C15 100nF VB Synth decoupling Less than 5mm from U1 pin 6
C2 10nF VB VCO decoupling Less than 5mm from U1 pin 8
C3 100nF VB RF decoupling Less than 5mm from U1 pin 12 and U1 pin 14
C4 47pF VB RF decoupling Less than 5mm from U1 pin 12 and U1 pin 14
C6 100nF VB RAM decoupling Less than 5mm from U1 pin 25
C7 100nF VB Dig decoupling Less than 5mm from U1 pin 35
R1 43k Current Bias Resistor Less than 5mm from U1 pin 10
C20 100nF Vref decoupling (optional) Less than 5mm from U1 pin 11
Y1 32MHz Crystal (AEL X32M000000S039 or Epson Toyocom X1E000021016700)
(CL = 9pF, Max ESR 40R)
C10 15pF +/-5% COG Crystal Load Capacitor Adjacent to pin 4 and Y1 pin 1
C11 15pF +/-5% COG Crystal Load Capacitor Adjacent to pin 5 and Y1 pin 3
C1 47pF AC Coupling
Phycomp 2238-869-15479
Must be copied directly from the reference design.
L1 5.1nH RF Matching Inductor
MuRata LQP15MN5N1B02
L2 3.9nH Load Inductor
MuRata LQP15MN3N9B02
Table 12: JN516x Printed Antenna Reference Module Components and PCB Layout Constraints
Note1: For extended temperature operation please contact technical support.
The paddle should be connected directly to ground. Any pads that require connection to ground should do so by
connecting directly to the paddle.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 91
B.4.2 PCB Design and Reflow Profile
PCB and land pattern designs are key to the reliability of any electronic circuit design.
The Institute for Interconnecting and Packaging Electronic Circuits (IPC) defines a number of standards for electronic
devices. One of these is the "Surface Mount Design and Land Pattern Standard" IPC-SM-782 [3], commonly referred
to as “IPC782". This specification defines the physical packaging characteristics and land patterns for a range of
surface mounted devices. IPC782 is also a useful reference document for general surface mount design techniques,
containing sections on design requirements, reliability and testability. NXP strongly recommends that this be referred
to when designing the PCB.
NXP also provide application note AN10366, “HVQFN application information” [6], which describes the reflow
soldering process. The suggested reflow profile, from that application note, is shown in Figure 55. The specific paste
manufacturers guidelines on peak flow temperature, soak times, time above liquids and ramp rates should also be
referenced.
Figure 55: Recommended Reflow Profile for Lead-free Solder Paste (SNAgCu) or PPF Lead Frame
B.4.3 Moisture Sensitivity Level (MSL)
If there is moisture trapped inside a package, and the package is exposed to a reflow temperature profile, the
moisture may turn into steam, which expands rapidly. This may cause damage to the inside of the package
(delamination), and it may result in a cracked semiconductor package body (the popcorn effect). A package’s MSL
depends on the package characteristics and on the temperature it is exposed to during reflow soldering. This is
explained in more detail in [7].
Depending on the damage after this test, an MSL of 1 (not sensitive to moisture) to 6 (very sensitive to moisture) is
attached to the semiconductor package.92 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
Related Documents
[1] IEEE Std 802.15.4-2006 IEEE Standard for Information Technology – Part 15.4 Wireless Medium Access Control
(MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs).
[2] JN-AN-1186 JN516x Temperature Dependent Operating Guidelines
[3] IPC-SM-782 Surface Mount Design and Land Pattern Standard
[4] JN-UG-3087 JN516x Integrated Peripherals API User Guide
[5] JN-RD-6038 Module Reference Design
[6] http://ics.nxp.com/support/documents/logic/pdf/an10366.pdf
[7] http://www.nxp.com/documents/application_note/AN10365.pdf
[8] JN-AN-1003 Boot Loader Operation
[9] JN-UG-3007 Flash Programmer User Guide
[10] JN-UG-3068 Time-of-flight API User Guide
[11] JN-AN-1143 Time-of-flight
[12] JN-UG-3075-JenOS User Guide
RoHS Compliance
JN516x devices meet the requirements of Directive 2002/95/EC of the European Parliament and of the Council on
the Restriction of Hazardous Substance (RoHS) and of the China RoHS (SJ/T11363 – 2006) requirements which
came into force on 1st March 2007.
Status Information
The status of this Data Sheet is. Production
NXP Low Power RF products progress according to the following format:
Advance
The Data Sheet shows the specification of a product in planning or in development.
The functionality and electrical performance specifications are target values of the design and may be used as a
guide to the final specification.
NXP reserves the right to make changes to the product specification at anytime without notice.
Preliminary
The Data Sheet shows the specification of a product that is commercially available, but is not yet fully qualified.
The functionality of the product is final. The electrical performance specifications are target values and may used as a
guide to the final specification.
NXP reserves the right to make changes to the product specification at anytime without notice.
Production
This is the production Data Sheet for the product.
All functional and electrical performance specifications, where included, including min and max values are derived
from detailed product characterization. This Data Sheet supersedes all previous document versions.
NXP reserves the right to make changes to the product specification at anytime without notice.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 93
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any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information
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damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.
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limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior
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and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP
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application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks
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and should not be used in automotive applications, including but not limited to applications where failure or malfunction of an NXP Semiconductors
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shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the
Product data sheet
All products are sold subject to NXP Semiconductors’ terms and conditions of sale, supplied at the time of order acknowledgment and published at
http://www.nxp.com/profile/terms.
Trademarks
All trademarks are the property of their respective owners.
“JenNet” and “JenNet-IP” are trademarks of NXP B.V..
Version Control
Version Notes
1.0 07-01-13 First public version, released as Production
1.1 14-01-13 Minor corrections made
1.2 25-04-13 Additional features included and more information on non-volatile memory
1.3 12-06-13 Minor correction to front page and format of PCB decal diagram94 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013
Contact Details
NXP Laboratories UK Ltd
Furnival Street
Sheffield
S1 4QT
United Kingdom
Tel: +44 (0)114 281 2655
Fax: +44 (0) 114 281 2951
For the contact details of your local NXP office or distributor, refer to the NXP web site:
www.nxp.com
1. General description
The LPC178x/7x is an ARM Cortex-M3 based microcontroller for embedded applications
requiring a high level of integration and low power dissipation.
The ARM Cortex-M3 is a next generation core that offers better performance than the
ARM7 at the same clock rate and other system enhancements such as modernized
debug features and a higher level of support block integration. The ARM Cortex-M3 CPU
incorporates a 3-stage pipeline and has a Harvard architecture with separate local
instruction and data buses, as well as a third bus with slightly lower performance for
peripherals. The ARM Cortex-M3 CPU also includes an internal prefetch unit that
supports speculative branches.
The LPC178x/7x adds a specialized flash memory accelerator to accomplish optimal
performance when executing code from flash. The LPC178x/7x operates at up to
120 MHz CPU frequency.
The peripheral complement of the LPC178x/7x includes up to 512 kB of flash program
memory, up to 96 kB of SRAM data memory, up to 4032 byte of EEPROM data memory,
External Memory Controller (EMC), LCD (LPC178x only), Ethernet, USB
Device/Host/OTG, a General Purpose DMA controller, five UARTs, three SSP controllers,
three I2C-bus interfaces, a Quadrature Encoder Interface, four general purpose timers,
two general purpose PWMs with six outputs each and one motor control PWM, an
ultra-low power RTC with separate battery supply and event recorder, a windowed
watchdog timer, a CRC calculation engine, up to 165 general purpose I/O pins, and more.
The analog peripherals include one eight-channel 12-bit ADC and a 10-bit DAC.
The pinout of LPC178x/7x is intended to allow pin function compatibility with the LPC24xx
and LPC23xx.
For additional documentation, see Section 18 “References”.
2. Features and benefits
Functional replacement for the LPC23xx and LPC24xx family devices.
System:
ARM Cortex-M3 processor, running at frequencies of up to 120 MHz. A Memory
Protection Unit (MPU) supporting eight regions is included.
ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).
LPC178x/7x
32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and
96 kB SRAM; USB Device/Host/OTG; Ethernet; LCD; EMC
Rev. 5 — 9 September 2014 Product data sheetLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 2 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
Multilayer AHB matrix interconnect provides a separate bus for each AHB master.
AHB masters include the CPU, USB, Ethernet, and the General Purpose DMA
controller. This interconnect provides communication with no arbitration delays
unless two masters attempt to access the same slave at the same time.
Split APB bus allows for higher throughput with fewer stalls between the CPU and
DMA. A single level of write buffering allows the CPU to continue without waiting for
completion of APB writes if the APB was not already busy.
Cortex-M3 system tick timer, including an external clock input option.
Standard JTAG test/debug interface as well as Serial Wire Debug and Serial
WireTrace Port options.
Embedded Trace Macrocell (ETM) module supports real-time trace.
Boundary scan for simplified board testing.
Non-maskable Interrupt (NMI) input.
Memory:
Up to 512 kB on-chip flash program memory with In-System Programming (ISP)
and In-Application Programming (IAP) capabilities. The combination of an
enhanced flash memory accelerator and location of the flash memory on the CPU
local code/data bus provides high code performance from flash.
Up to 96 kB on-chip SRAM includes:
64 kB of main SRAM on the CPU with local code/data bus for high-performance
CPU access.
Two 16 kB peripheral SRAM blocks with separate access paths for higher
throughput. These SRAM blocks may be used for DMA memory as well as for
general purpose instruction and data storage.
Up to 4032 byte on-chip EEPROM.
LCD controller, supporting both Super-Twisted Nematic (STN) and Thin-Film
Transistors (TFT) displays.
Dedicated DMA controller.
Selectable display resolution (up to 1024 768 pixels).
Supports up to 24-bit true-color mode.
External Memory Controller (EMC) provides support for asynchronous static memory
devices such as RAM, ROM and flash, as well as dynamic memories such as single
data rate SDRAM with an SDRAM clock of up to 80 MHz.
Eight channel General Purpose DMA controller (GPDMA) on the AHB multilayer
matrix that can be used with the SSP, I2S, UART, CRC engine, Analog-to-Digital and
Digital-to-Analog converter peripherals, timer match signals, GPIO, and for
memory-to-memory transfers.
Serial interfaces:
Ethernet MAC with MII/RMII interface and associated DMA controller. These
functions reside on an independent AHB.
USB 2.0 full-speed dual-port device/host/OTG controller with on-chip PHY and
associated DMA controller.
Five UARTs with fractional baud rate generation, internal FIFO, DMA support, and
RS-485/EIA-485 support. One UART (UART1) has full modem control I/O, and one
UART (USART4) supports IrDA, synchronous mode, and a smart card mode
conforming to ISO7816-3.
Three SSP controllers with FIFO and multi-protocol capabilities. The SSP
controllers can be used with the GPDMA.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 3 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
Three enhanced I2C-bus interfaces, one with a true open-drain output supporting
the full I2C-bus specification and Fast-mode Plus with data rates of 1 Mbit/s, two
with standard port pins. Enhancements include multiple address recognition and
monitor mode.
I
2S-bus (Inter-IC Sound) interface for digital audio input or output. It can be used
with the GPDMA.
CAN controller with two channels.
Digital peripherals:
SD/MMC memory card interface.
Up to 165 General Purpose I/O (GPIO) pins depending on the packaging with
configurable pull-up/down resistors, open-drain mode, and repeater mode. All
GPIOs are located on an AHB bus for fast access and support Cortex-M3
bit-banding. GPIOs can be accessed by the General Purpose DMA Controller. Any
pin of ports 0 and 2 can be used to generate an interrupt.
Two external interrupt inputs configurable as edge/level sensitive. All pins on port 0
and port 2 can be used as edge sensitive interrupt sources.
Four general purpose timers/counters with a total of eight capture inputs and ten
compare outputs. Each timer block has an external count input. Specific timer
events can be selected to generate DMA requests.
Quadrature encoder interface that can monitor one external quadrature encoder.
Two standard PWM/timer blocks with external count input option.
One motor control PWM with support for three-phase motor control.
Real-Time Clock (RTC) with a separate power domain. The RTC is clocked by a
dedicated RTC oscillator. The RTC block includes 20 bytes of battery-powered
backup registers, allowing system status to be stored when the rest of the chip is
powered off. Battery power can be supplied from a standard 3 V lithium button cell.
The RTC will continue working when the battery voltage drops to as low as 2.1 V.
An RTC interrupt can wake up the CPU from any reduced power mode.
Event Recorder that can capture the clock value when an event occurs on any of
three inputs. The event identification and the time it occurred are stored in
registers. The Event Recorder is located in the RTC power domain and can
therefore operate as long as there is RTC power.
Windowed Watchdog Timer (WWDT). Windowed operation, dedicated internal
oscillator, watchdog warning interrupt, and safety features.
CRC Engine block can calculate a CRC on supplied data using one of three
standard polynomials. The CRC engine can be used in conjunction with the DMA
controller to generate a CRC without CPU involvement in the data transfer.
Analog peripherals:
12-bit Analog-to-Digital Converter (ADC) with input multiplexing among eight pins,
conversion rates up to 400 kHz, and multiple result registers. The 12-bit ADC can
be used with the GPDMA controller.
10-bit Digital-to-Analog Converter (DAC) with dedicated conversion timer and
GPDMA support.
Power control:
Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep
power-down.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 4 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
The Wake-up Interrupt Controller (WIC) allows the CPU to automatically wake up
from any priority interrupt that can occur while the clocks are stopped in
Deep-sleep, Power-down, and Deep power-down modes.
Processor wake-up from Power-down mode via any interrupt able to operate
during Power-down mode (includes external interrupts, RTC interrupt, PORT0/2
pin interrupt, and NMI).
Brownout detect with separate threshold for interrupt and forced reset.
On-chip Power-On Reset (POR).
Clock generation:
Clock output function that can reflect the main oscillator clock, IRC clock, RTC
clock, CPU clock, USB clock, or the watchdog timer clock.
On-chip crystal oscillator with an operating range of 1 MHz to 25 MHz.
12 MHz Internal RC oscillator (IRC) trimmed to 1% accuracy that can optionally be
used as a system clock.
An on-chip PLL allows CPU operation up to the maximum CPU rate without the
need for a high-frequency crystal. May be run from the main oscillator or the
internal RC oscillator.
A second, dedicated PLL may be used for USB interface in order to allow added
flexibility for the Main PLL settings.
Versatile pin function selection feature allows many possibilities for using on-chip
peripheral functions.
Unique device serial number for identification purposes.
Single 3.3 V power supply (2.4 V to 3.6 V). Temperature range of 40 C to 85 C.
Available as LQFP208, TFBGA208, TFBGA180, and LQFP144 package.
3. Applications
Communications:
Point-of-sale terminals, web servers, multi-protocol bridges
Industrial/Medical:
Automation controllers, application control, robotics control, HVAC, PLC, inverters,
circuit breakers, medical scanning, security monitoring, motor drive, video intercom
Consumer/Appliance:
Audio, MP3 decoders, alarm systems, displays, printers, scanners, small
appliances, fitness equipment
Automotive:
After-market, car alarms, GPS/fleet monitorsLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 5 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
4. Ordering information
Table 1. Ordering information
Type number Package
Name Description Version
LPC1788
LPC1788FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm SOT459-1
LPC1788FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body
15 ´ 15 ´ 0.7 mm
SOT950-1
LPC1788FET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm SOT570-3
LPC1788FBD144 LQFP144 plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm SOT486-1
LPC1787
LPC1787FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm SOT459-1
LPC1786
LPC1786FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm SOT459-1
LPC1785
LPC1785FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm SOT459-1
LPC1778
LPC1778FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm SOT459-1
LPC1778FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body
15 ´ 15 ´ 0.7 mm
SOT950-1
LPC1778FET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm SOT570-3
LPC1778FBD144 LQFP144 plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm SOT486-1
LPC1777
LPC1777FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm SOT459-1
LPC1776
LPC1776FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm SOT459-1
LPC1776FET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm SOT570-3
LPC1774
LPC1774FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm SOT459-1
LPC1774FBD144 LQFP144 plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm SOT486-1LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 6 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
[1] Maximum data bus width of the External Memory Controller (EMC) depends on package size. Smaller widths may be used.
[2] USART4 not available.
Table 2. LPC178x/7x ordering options
All parts include two CAN channels, three SSP interfaces, three I2C interfaces, one I2S interface, DAC, and an 8-channel
12-bit ADC.
Type number Flash
(kB)
Main
SRAM
(kB)
Peripheral
SRAM
(kB)
Total
SRAM
(kB)
EEPROM
(byte)
Ethernet USB UART EMC
bus
width
(bit)
[1]
LCD QEI SD/
MMC
LPC178x
LPC1788FBD208 512 64 16 2 96 4032 Y H/O/D 5 32 Y Y Y
LPC1788FET208 512 64 16 2 96 4032 Y H/O/D 5 32 Y Y Y
LPC1788FET180 512 64 16 2 96 4032 Y H/O/D 5 16 Y Y Y
LPC1788FBD144 512 64 16 2 96 4032 Y H/O/D 5 8 Y Y Y
LPC1787FBD208 512 64 16 2 96 4032 N H/O/D 5 32 Y Y Y
LPC1786FBD208 256 64 16 80 4032 Y H/O/D 5 32 Y Y Y
LPC1785FBD208 256 64 16 80 4032 N H/O/D 5 32 Y N Y
LPC177x
LPC1778FBD208 512 64 16 2 96 4032 Y H/O/D 5 32 N Y Y
LPC1778FET208 512 64 16 2 96 4032 Y H/O/D 5 32 N Y Y
LPC1778FET180 512 64 16 2 96 4032 Y H/O/D 5 16 N Y Y
LPC1778FBD144 512 64 16 2 96 4032 Y H/O/D 5 8 N Y Y
LPC1777FBD208 512 64 16 2 96 4032 N H/O/D 5 32 N Y Y
LPC1776FBD208 256 64 16 80 4032 Y H/O/D 5 32 N Y Y
LPC1776FET180 256 64 16 80 4032 Y H/O/D 5 16 N Y Y
LPC1774FBD208 128 32 8 40 2048 N D 5 32 N N N
LPC1774FBD144 128 32 8 40 2048 N D 4[2] 8 N N NLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 7 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
5. Block diagram
(1) Not available on all parts. See Table 2.
Fig 1. Block diagram
SRAM
96/80/40 kB
ARM
CORTEX-M3
TEST/DEBUG
INTERFACE
EMULATION
TRACE MODULE
FLASH
ACCELERATOR
FLASH
512/256/128/64 kB
GPDMA
CONTROLLER
I-code
bus
D-code
bus
system
bus
AHB TO
APB
BRIDGE 0
HIGH-SPEED
GPIO AHB TO
APB
BRIDGE 1
4032 B/
2048 B
EEPROM
CLOCK
GENERATION,
POWER CONTROL,
SYSTEM
FUNCTIONS
clocks and
controls
JTAG
interface
debug
port
SSP0/2
USART4(1)
UART2/3
SYSTEM CONTROL
SSP1
UART0/1
I
2C0/1
CAN 0/1
TIMER 0/1
WINDOWED WDT
12-bit ADC
PWM0/1
PIN CONNECT
GPIO INTERRUPT CONTROL
RTC
BACKUP REGISTERS
EVENT RECORDER
32 kHz
OSCILLATOR
APB slave group 1
APB slave group 0
RTC POWER DOMAIN
LPC178x/7x
master
ETHERNET(1)
master
USB
DEVICE/
HOST(1)/OTG(1)
master
002aaf528
slave slave
CRC
slave slave slave
slave
EMC ROM
slave slave
LCD(1)
slave
MULTILAYER AHB MATRIX
I
2C2
TIMER2/3
DAC
I
2S
QUADRATURE ENCODER(1)
MOTOR CONTROL PWM
MPU
SD/MMC(1)
= connected to GPDMALPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 8 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
6. Pinning information
6.1 Pinning
Fig 2. Pin configuration (LQFP208)
Fig 3. Pin configuration (TFBGA208)
LPC178x/7xFBD208
156
53
104
208
157
105
1
52
002aaf518
002aaf529
LPC178x/7x
Transparent top view
ball A1
index area
U
T
R
P
N
M
K
H
L
J
G
F
E
D
C
A
B
2 4 6 8 10 12
13
14
15 17
16
1 3 5 7 9 11LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 9 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
6.2 Pin description
I/O pins on the LPC178x/7x are 5 V tolerant and have input hysteresis unless otherwise
indicated in the table below. Crystal pins, power pins, and reference voltage pins are not
5 V tolerant. In addition, when pins are selected to be ADC inputs, they are no longer 5 V
tolerant and the input voltage must be limited to the voltage at the ADC positive reference
pin (VREFP).
All port pins Pn[m] are multiplexed, and the multiplexed functions appear in Table 3 in the
order defined by the FUNC bits of the corresponding IOCON register up to the highest
used function number. Each port pin can support up to eight multiplexed functions.
IOCON register FUNC values which are reserved are noted as ‘R’ in the pin configuration
table.
Fig 4. Pin configuration (TFBGA180)
Fig 5. Pin configuration (LQFP144)
002aaf519
LPC178x/7x
1 3 5 7 9 11 2 4 6 8 10 12 13 14
ball A1
index area
P
N
M
L
K
J
G
E
H
F
D
C
B
A
Transparent top view
LPC178x/7x
108
37
72
144
109
73
1
36
002aaf520LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 10 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
Table 3. Pin description
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
Description
P0[0] to
P0[31]
I/O Port 0: Port 0 is a 32-bit I/O port with individual direction
controls for each bit. The operation of port 0 pins depends upon
the pin function selected via the pin connect block.
P0[0] 94 U15 M10 66 [3] I;
PU
I/O P0[0] — General purpose digital input/output pin.
I CAN_RD1 — CAN1 receiver input.
O U3_TXD — Transmitter output for UART3.
I/O I2C1_SDA — I
2C1 data input/output (this pin does not use a
specialized I2C pad).
O U0_TXD — Transmitter output for UART0.
P0[1] 96 T14 N11 67 [3] I;
PU
I/O P0[1] — General purpose digital input/output pin.
O CAN_TD1 — CAN1 transmitter output.
I U3_RXD — Receiver input for UART3.
I/O I2C1_SCL — I
2C1 clock input/output (this pin does not use a
specialized I2C pad).
I U0_RXD — Receiver input for UART0.
P0[2] 202 C4 D5 141 [3] I;
PU
I/O P0[2] — General purpose digital input/output pin.
O U0_TXD — Transmitter output for UART0.
O U3_TXD — Transmitter output for UART3.
P0[3] 204 D6 A3 142 [3] I;
PU
I/O P0[3] — General purpose digital input/output pin.
I U0_RXD — Receiver input for UART0.
I U3_RXD — Receiver input for UART3.
P0[4] 168 B12 A11 116 [3] I;
PU
I/O P0[4] — General purpose digital input/output pin.
I/O I2S_RX_SCK — I
2S Receive clock. It is driven by the master
and received by the slave. Corresponds to the signal SCK in the
I
2S-bus specification.
I CAN_RD2 — CAN2 receiver input.
I T2_CAP0 — Capture input for Timer 2, channel 0.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
O LCD_VD[0] — LCD data.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 11 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
P0[5] 166 C12 B11 115 [3] I;
PU
I/O P0[5] — General purpose digital input/output pin.
I/O I2S_RX_WS — I
2S Receive word select. It is driven by the
master and received by the slave. Corresponds to the signal WS
in the I
2S-bus specification.
O CAN_TD2 — CAN2 transmitter output.
I T2_CAP1 — Capture input for Timer 2, channel 1.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
O LCD_VD[1] — LCD data.
P0[6] 164 D13 D11 113 [3] I;
PU
I/O P0[6] — General purpose digital input/output pin.
I/O I2S_RX_SDA — I
2S Receive data. It is driven by the transmitter
and read by the receiver. Corresponds to the signal SD in the
I
2S-bus specification.
I/O SSP1_SSEL — Slave Select for SSP1.
O T2_MAT0 — Match output for Timer 2, channel 0.
O U1_RTS — Request to Send output for UART1. Can also be
configured to be an RS-485/EIA-485 output enable signal for
UART1.
- R — Function reserved.
- R — Function reserved.
O LCD_VD[8] — LCD data.
P0[7] 162 C13 B12 112 [4] I; IA I/O P0[7] — General purpose digital input/output pin.
I/O I2S_TX_SCK — I
2S transmit clock. It is driven by the master
and received by the slave. Corresponds to the signal SCK in the
I
2S-bus specification.
I/O SSP1_SCK — Serial Clock for SSP1.
O T2_MAT1 — Match output for Timer 2, channel 1.
I RTC_EV0 — Event input 0 to Event Monitor/Recorder.
- R — Function reserved.
- R — Function reserved.
O LCD_VD[9] — LCD data.
Table 3. Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 12 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
P0[8] 160 A15 C12 111 [4] I; IA I/O P0[8] — General purpose digital input/output pin.
I/O I2S_TX_WS — I
2S Transmit word select. It is driven by the
master and received by the slave. Corresponds to the signal WS
in the I
2S-bus specification.
I/O SSP1_MISO — Master In Slave Out for SSP1.
O T2_MAT2 — Match output for Timer 2, channel 2.
I RTC_EV1 — Event input 1 to Event Monitor/Recorder.
- R — Function reserved.
- R — Function reserved.
O LCD_VD[16] — LCD data.
P0[9] 158 C14 A13 109 [4] I; IA I/O P0[9] — General purpose digital input/output pin.
I/O I2S_TX_SDA — I
2S transmit data. It is driven by the transmitter
and read by the receiver. Corresponds to the signal SD in the
I
2S-bus specification.
I/O SSP1_MOSI — Master Out Slave In for SSP1.
O T2_MAT3 — Match output for Timer 2, channel 3.
I RTC_EV2 — Event input 2 to Event Monitor/Recorder.
- R — Function reserved.
- R — Function reserved.
O LCD_VD[17] — LCD data.
P0[10] 98 T15 L10 69 [3] I;
PU
I/O P0[10] — General purpose digital input/output pin.
O U2_TXD — Transmitter output for UART2.
I/O I2C2_SDA — I
2C2 data input/output (this pin does not use a
specialized I2C pad).
O T3_MAT0 — Match output for Timer 3, channel 0.
P0[11] 100 R14 P12 70 [3] I;
PU
I/O P0[11] — General purpose digital input/output pin.
I U2_RXD — Receiver input for UART2.
I/O I2C2_SCL — I
2C2 clock input/output (this pin does not use a
specialized I2C pad).
O T3_MAT1 — Match output for Timer 3, channel 1.
P0[12] 41 R1 J4 29 [5] I;
PU
I/O P0[12] — General purpose digital input/output pin.
O USB_PPWR2 — Port Power enable signal for USB port 2.
I/O SSP1_MISO — Master In Slave Out for SSP1.
I ADC0_IN[6] — A/D converter 0, input 6. When configured as an
ADC input, the digital function of the pin must be disabled.
Table 3. Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 13 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
P0[13] 45 R2 J5 32 [5] I;
PU
I/O P0[13] — General purpose digital input/output pin.
O USB_UP_LED2 — USB port 2 GoodLink LED indicator. It is
LOW when the device is configured (non-control endpoints
enabled), or when the host is enabled and has detected a
device on the bus. It is HIGH when the device is not configured,
or when host is enabled and has not detected a device on the
bus, or during global suspend. It transitions between LOW and
HIGH (flashes) when the host is enabled and detects activity on
the bus.
I/O SSP1_MOSI — Master Out Slave In for SSP1.
I ADC0_IN[7] — A/D converter 0, input 7. When configured as an
ADC input, the digital function of the pin must be disabled.
P0[14] 69 T7 M5 48 [3] I;
PU
I/O P0[14] — General purpose digital input/output pin.
O USB_HSTEN2 — Host Enabled status for USB port 2.
I/O SSP1_SSEL — Slave Select for SSP1.
O USB_CONNECT2 — SoftConnect control for USB port 2.
Signal used to switch an external 1.5 k resistor under software
control. Used with the SoftConnect USB feature.
P0[15] 128 J16 H13 89 [3] I;
PU
I/O P0[15] — General purpose digital input/output pin.
O U1_TXD — Transmitter output for UART1.
I/O SSP0_SCK — Serial clock for SSP0.
P0[16] 130 J14 H14 90 [3] I;
PU
I/O P0[16] — General purpose digital input/output pin.
I U1_RXD — Receiver input for UART1.
I/O SSP0_SSEL — Slave Select for SSP0.
P0[17] 126 K17 J12 87 [3] I;
PU
I/O P0[17] — General purpose digital input/output pin.
I U1_CTS — Clear to Send input for UART1.
I/O SSP0_MISO — Master In Slave Out for SSP0.
P0[18] 124 K15 J13 86 [3] I;
PU
I/O P0[18] — General purpose digital input/output pin.
I U1_DCD — Data Carrier Detect input for UART1.
I/O SSP0_MOSI — Master Out Slave In for SSP0.
P0[19] 122 L17 J10 85 [3] I;
PU
I/O P0[19] — General purpose digital input/output pin.
I U1_DSR — Data Set Ready input for UART1.
O SD_CLK — Clock output line for SD card interface.
I/O I2C1_SDA — I
2C1 data input/output (this pin does not use a
specialized I2C pad).
Table 3. Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 14 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
P0[20] 120 M17 K14 83 [3] I;
PU
I/O P0[20] — General purpose digital input/output pin.
O U1_DTR — Data Terminal Ready output for UART1. Can also
be configured to be an RS-485/EIA-485 output enable signal for
UART1.
I/O SD_CMD — Command line for SD card interface.
I/O I2C1_SCL — I
2C1 clock input/output (this pin does not use a
specialized I2C pad).
P0[21] 118 M16 K11 82 [3] I;
PU
I/O P0[21] — General purpose digital input/output pin.
I U1_RI — Ring Indicator input for UART1.
O SD_PWR — Power Supply Enable for external SD card power
supply.
O U4_OE — RS-485/EIA-485 output enable signal for UART4.
I CAN_RD1 — CAN1 receiver input.
I/O U4_SCLK — USART 4 clock input or output in synchronous
mode.
P0[22] 116 N17 L14 80 [6] I;
PU
I/O P0[22] — General purpose digital input/output pin.
O U1_RTS — Request to Send output for UART1. Can also be
configured to be an RS-485/EIA-485 output enable signal for
UART1.
I/O SD_DAT[0] — Data line 0 for SD card interface.
O U4_TXD — Transmitter output for USART4 (input/output in
smart card mode).
O CAN_TD1 — CAN1 transmitter output.
P0[23] 18 H1 F5 13 [5] I;
PU
I/O P0[23] — General purpose digital input/output pin.
I ADC0_IN[0] — A/D converter 0, input 0. When configured as an
ADC input, the digital function of the pin must be disabled.
I/O I2S_RX_SCK — Receive Clock. It is driven by the master and
received by the slave. Corresponds to the signal SCK in the
I
2S-bus specification.
I T3_CAP0 — Capture input for Timer 3, channel 0.
P0[24] 16 G2 E1 11 [5] I;
PU
I/O P0[24] — General purpose digital input/output pin.
I ADC0_IN[1] — A/D converter 0, input 1. When configured as an
ADC input, the digital function of the pin must be disabled.
I/O I2S_RX_WS — Receive Word Select. It is driven by the master
and received by the slave. Corresponds to the signal WS in the
I
2S-bus specification.
I T3_CAP1 — Capture input for Timer 3, channel 1.
Table 3. Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 15 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
P0[25] 14 F1 E4 10 [5] I;
PU
I/O P0[25] — General purpose digital input/output pin.
I ADC0_IN[2] — A/D converter 0, input 2. When configured as an
ADC input, the digital function of the pin must be disabled.
I/O I2S_RX_SDA — Receive data. It is driven by the transmitter
and read by the receiver. Corresponds to the signal SD in the
I
2S-bus specification.
O U3_TXD — Transmitter output for UART3.
P0[26] 12 E1 D1 8 [7] I;
PU
I/O P0[26] — General purpose digital input/output pin.
I ADC0_IN[3] — A/D converter 0, input 3. When configured as an
ADC input, the digital function of the pin must be disabled.
O DAC_OUT — D/A converter output. When configured as the
DAC output, the digital function of the pin must be disabled.
I U3_RXD — Receiver input for UART3.
P0[27] 50 T1 L3 35 [8] I I/O P0[27] — General purpose digital input/output pin.
I/O I2C0_SDA — I
2C0 data input/output (this pin uses a specialized
I2C pad).
I/O USB_SDA1 — I2C serial data for communication with an
external USB transceiver.
P0[28] 48 R3 M1 34 [8] I I/O P0[28] — General purpose digital input/output pin.
I/O I2C0_SCL — I
2C0 clock input/output (this pin uses a
specialized I2C pad).
I/O USB_SCL1 — I2C serial clock for communication with an
external USB transceiver.
P0[29] 61 U4 K5 42 [9] I I/O P0[29] — General purpose digital input/output pin.
I/O USB_D+1 — USB port 1 bidirectional D+ line.
I EINT0 — External interrupt 0 input.
P0[30] 62 R6 N4 43 [9] I I/O P0[30] — General purpose digital input/output pin.
I/O USB_D1 — USB port 1 bidirectional D line.
I EINT1 — External interrupt 1 input.
P0[31] 51 T2 N1 36 [9] I I/O P0[31] — General purpose digital input/output pin.
I/O USB_D+2 — USB port 2 bidirectional D+ line.
P1[0] to
P1[31]
I/O Port 1: Port 1 is a 32 bit I/O port with individual direction
controls for each bit. The operation of port 1 pins depends upon
the pin function selected via the pin connect block
P1[0] 196 A3 B5 136 [3] I;
PU
I/O P1[0] — General purpose digital input/output pin.
O ENET_TXD0 — Ethernet transmit data 0 (RMII/MII interface).
- R — Function reserved.
I T3_CAP1 — Capture input for Timer 3, channel 1.
I/O SSP2_SCK — Serial clock for SSP2.
Table 3. Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 16 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
P1[1] 194 B5 A5 135 [3] I;
PU
I/O P1[1] — General purpose digital input/output pin.
O ENET_TXD1 — Ethernet transmit data 1 (RMII/MII interface).
- R — Function reserved.
O T3_MAT3 — Match output for Timer 3, channel 3.
I/O SSP2_MOSI — Master Out Slave In for SSP2.
P1[2] 185 D9 B7 - [3] I;
PU
I/O P1[2] — General purpose digital input/output pin.
O ENET_TXD2 — Ethernet transmit data 2 (MII interface).
O SD_CLK — Clock output line for SD card interface.
O PWM0[1] — Pulse Width Modulator 0, output 1.
P1[3] 177 A10 A9 - [3] I;
PU
I/O P1[3] — General purpose digital input/output pin.
O ENET_TXD3 — Ethernet transmit data 3 (MII interface).
I/O SD_CMD — Command line for SD card interface.
O PWM0[2] — Pulse Width Modulator 0, output 2.
P1[4] 192 A5 C6 133 [3] I;
PU
I/O P1[4] — General purpose digital input/output pin.
O ENET_TX_EN — Ethernet transmit data enable (RMII/MII
interface).
- R — Function reserved.
O T3_MAT2 — Match output for Timer 3, channel 2.
I/O SSP2_MISO — Master In Slave Out for SSP2.
P1[5] 156 A17 B13 - [3] I;
PU
I/O P1[5] — General purpose digital input/output pin.
O ENET_TX_ER — Ethernet Transmit Error (MII interface).
O SD_PWR — Power Supply Enable for external SD card power
supply.
O PWM0[3] — Pulse Width Modulator 0, output 3.
P1[6] 171 B11 B10 - [3] I;
PU
I/O P1[6] — General purpose digital input/output pin.
I ENET_TX_CLK — Ethernet Transmit Clock (MII interface).
I/O SD_DAT[0] — Data line 0 for SD card interface.
O PWM0[4] — Pulse Width Modulator 0, output 4.
P1[7] 153 D14 C13 - [3] I;
PU
I/O P1[7] — General purpose digital input/output pin.
I ENET_COL — Ethernet Collision detect (MII interface).
I/O SD_DAT[1] — Data line 1 for SD card interface.
O PWM0[5] — Pulse Width Modulator 0, output 5.
Table 3. Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 17 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
P1[8] 190 C7 B6 132 [3] I;
PU
I/O P1[8] — General purpose digital input/output pin.
I ENET_CRS (ENET_CRS_DV) — Ethernet Carrier Sense (MII
interface) or Ethernet Carrier Sense/Data Valid (RMII interface).
- R — Function reserved.
O T3_MAT1 — Match output for Timer 3, channel 1.
I/O SSP2_SSEL — Slave Select for SSP2.
P1[9] 188 A6 D7 131 [3] I;
PU
I/O P1[9] — General purpose digital input/output pin.
I ENET_RXD0 — Ethernet receive data 0 (RMII/MII interface).
- R — Function reserved.
O T3_MAT0 — Match output for Timer 3, channel 0.
P1[10] 186 C8 A7 129 [3] I;
PU
I/O P1[10] — General purpose digital input/output pin.
I ENET_RXD1 — Ethernet receive data 1 (RMII/MII interface).
- R — Function reserved.
I T3_CAP0 — Capture input for Timer 3, channel 0.
P1[11] 163 A14 A12 - [3] I;
PU
I/O P1[11] — General purpose digital input/output pin.
I ENET_RXD2 — Ethernet Receive Data 2 (MII interface).
I/O SD_DAT[2] — Data line 2 for SD card interface.
O PWM0[6] — Pulse Width Modulator 0, output 6.
P1[12] 157 A16 A14 - [3] I;
PU
I/O P1[12] — General purpose digital input/output pin.
I ENET_RXD3 — Ethernet Receive Data (MII interface).
I/O SD_DAT[3] — Data line 3 for SD card interface.
I PWM0_CAP0 — Capture input for PWM0, channel 0.
P1[13] 147 D16 D14 - [3] I;
PU
I/O P1[13] — General purpose digital input/output pin.
I ENET_RX_DV — Ethernet Receive Data Valid (MII interface).
P1[14] 184 A7 D8 128 [3] I;
PU
I/O P1[14] — General purpose digital input/output pin.
I ENET_RX_ER — Ethernet receive error (RMII/MII interface).
- R — Function reserved.
I T2_CAP0 — Capture input for Timer 2, channel 0.
P1[15] 182 A8 A8 126 [3] I;
PU
I/O P1[15] — General purpose digital input/output pin.
I ENET_RX_CLK (ENET_REF_CLK) — Ethernet Receive Clock
(MII interface) or Ethernet Reference Clock (RMII interface).
- R — Function reserved.
I/O I2C2_SDA — I
2C2 data input/output (this pin does not use a
specialized I2C pad).
Table 3. Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 18 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
P1[16] 180 D10 B8 125 [3] I;
PU
I/O P1[16] — General purpose digital input/output pin.
O ENET_MDC — Ethernet MIIM clock.
O I2S_TX_MCLK — I2S transmit master clock.
P1[17] 178 A9 C9 123 [3] I;
PU
I/O P1[17] — General purpose digital input/output pin.
I/O ENET_MDIO — Ethernet MIIM data input and output.
O I2S_RX_MCLK — I2S receive master clock.
P1[18] 66 P7 L5 46 [3] I;
PU
I/O P1[18] — General purpose digital input/output pin.
O USB_UP_LED1 — It is LOW when the device is configured
(non-control endpoints enabled), or when the host is enabled
and has detected a device on the bus. It is HIGH when the
device is not configured, or when host is enabled and has not
detected a device on the bus, or during global suspend. It
transitions between LOW and HIGH (flashes) when the host is
enabled and detects activity on the bus.
O PWM1[1] — Pulse Width Modulator 1, channel 1 output.
I T1_CAP0 — Capture input for Timer 1, channel 0.
- R — Function reserved.
I/O SSP1_MISO — Master In Slave Out for SSP1.
P1[19] 68 U6 P5 47 [3] I;
PU
I/O P1[19] — General purpose digital input/output pin.
O USB_TX_E1 — Transmit Enable signal for USB port 1 (OTG
transceiver).
O USB_PPWR1 — Port Power enable signal for USB port 1.
I T1_CAP1 — Capture input for Timer 1, channel 1.
O MC_0A — Motor control PWM channel 0, output A.
I/O SSP1_SCK — Serial clock for SSP1.
O U2_OE — RS-485/EIA-485 output enable signal for UART2.
P1[20] 70 U7 K6 49 [3] I;
PU
I/O P1[20] — General purpose digital input/output pin.
O USB_TX_DP1 — D+ transmit data for USB port 1 (OTG
transceiver).
O PWM1[2] — Pulse Width Modulator 1, channel 2 output.
I QEI_PHA — Quadrature Encoder Interface PHA input.
I MC_FB0 — Motor control PWM channel 0 feedback input.
I/O SSP0_SCK — Serial clock for SSP0.
O LCD_VD[6] — LCD data.
O LCD_VD[10] — LCD data.
Table 3. Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 19 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
P1[21] 72 R8 N6 50 [3] I;
PU
I/O P1[21] — General purpose digital input/output pin.
O USB_TX_DM1 — D transmit data for USB port 1 (OTG
transceiver).
O PWM1[3] — Pulse Width Modulator 1, channel 3 output.
I/O SSP0_SSEL — Slave Select for SSP0.
I MC_ABORT — Motor control PWM, active low fast abort.
- R — Function reserved.
O LCD_VD[7] — LCD data.
O LCD_VD[11] — LCD data.
P1[22] 74 U8 M6 51 [3] I;
PU
I/O P1[22] — General purpose digital input/output pin.
I USB_RCV1 — Differential receive data for USB port 1 (OTG
transceiver).
I USB_PWRD1 — Power Status for USB port 1 (host power
switch).
O T1_MAT0 — Match output for Timer 1, channel 0.
O MC_0B — Motor control PWM channel 0, output B.
I/O SSP1_MOSI — Master Out Slave In for SSP1.
O LCD_VD[8] — LCD data.
O LCD_VD[12] — LCD data.
P1[23] 76 P9 N7 53 [3] I;
PU
I/O P1[23] — General purpose digital input/output pin.
I USB_RX_DP1 — D+ receive data for USB port 1 (OTG
transceiver).
O PWM1[4] — Pulse Width Modulator 1, channel 4 output.
I QEI_PHB — Quadrature Encoder Interface PHB input.
I MC_FB1 — Motor control PWM channel 1 feedback input.
I/O SSP0_MISO — Master In Slave Out for SSP0.
O LCD_VD[9] — LCD data.
O LCD_VD[13] — LCD data.
P1[24] 78 T9 P7 54 [3] I;
PU
I/O P1[24] — General purpose digital input/output pin.
I USB_RX_DM1 — D receive data for USB port 1 (OTG
transceiver).
O PWM1[5] — Pulse Width Modulator 1, channel 5 output.
I QEI_IDX — Quadrature Encoder Interface INDEX input.
I MC_FB2 — Motor control PWM channel 2 feedback input.
I/O SSP0_MOSI — Master Out Slave in for SSP0.
O LCD_VD[10] — LCD data.
O LCD_VD[14] — LCD data.
Table 3. Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 20 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
P1[25] 80 T10 L7 56 [3] I;
PU
I/O P1[25] — General purpose digital input/output pin.
O USB_LS1 — Low Speed status for USB port 1 (OTG
transceiver).
O USB_HSTEN1 — Host Enabled status for USB port 1.
O T1_MAT1 — Match output for Timer 1, channel 1.
O MC_1A — Motor control PWM channel 1, output A.
O CLKOUT — Selectable clock output.
O LCD_VD[11] — LCD data.
O LCD_VD[15] — LCD data.
P1[26] 82 R10 P8 57 [3] I;
PU
I/O P1[26] — General purpose digital input/output pin.
O USB_SSPND1 — USB port 1 Bus Suspend status (OTG
transceiver).
O PWM1[6] — Pulse Width Modulator 1, channel 6 output.
I T0_CAP0 — Capture input for Timer 0, channel 0.
O MC_1B — Motor control PWM channel 1, output B.
I/O SSP1_SSEL — Slave Select for SSP1.
O LCD_VD[12] — LCD data.
O LCD_VD[20] — LCD data.
P1[27] 88 T12 M9 61 [3] I;
PU
I/O P1[27] — General purpose digital input/output pin.
I USB_INT1 — USB port 1 OTG transceiver interrupt (OTG
transceiver).
I USB_OVRCR1 — USB port 1 Over-Current status.
I T0_CAP1 — Capture input for Timer 0, channel 1.
O CLKOUT — Selectable clock output.
- R — Function reserved.
O LCD_VD[13] — LCD data.
O LCD_VD[21] — LCD data.
P1[28] 90 T13 P10 63 [3] I;
PU
I/O P1[28] — General purpose digital input/output pin.
I/O USB_SCL1 — USB port 1 I2C serial clock (OTG transceiver).
I PWM1_CAP0 — Capture input for PWM1, channel 0.
O T0_MAT0 — Match output for Timer 0, channel 0.
O MC_2A — Motor control PWM channel 2, output A.
I/O SSP0_SSEL — Slave Select for SSP0.
O LCD_VD[14] — LCD data.
O LCD_VD[22] — LCD data.
Table 3. Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 21 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
P1[29] 92 U14 N10 64 [3] I;
PU
I/O P1[29] — General purpose digital input/output pin.
I/O USB_SDA1 — USB port 1 I2C serial data (OTG transceiver).
I PWM1_CAP1 — Capture input for PWM1, channel 1.
O T0_MAT1 — Match output for Timer 0, channel 1.
O MC_2B — Motor control PWM channel 2, output B.
O U4_TXD — Transmitter output for USART4 (input/output in
smart card mode).
O LCD_VD[15] — LCD data.
O LCD_VD[23] — LCD data.
P1[30] 42 P2 K3 30 [5] I;
PU
I/O P1[30] — General purpose digital input/output pin.
I USB_PWRD2 — Power Status for USB port 2.
I USB_VBUS — Monitors the presence of USB bus power.
This signal must be HIGH for USB reset to occur.
I ADC0_IN[4] — A/D converter 0, input 4. When configured as an
ADC input, the digital function of the pin must be disabled.
I/O I2C0_SDA — I
2C0 data input/output (this pin does not use a
specialized I2C pad).
O U3_OE — RS-485/EIA-485 output enable signal for UART3.
P1[31] 40 P1 K2 28 [5] I;
PU
I/O P1[31] — General purpose digital input/output pin.
I USB_OVRCR2 — Over-Current status for USB port 2.
I/O SSP1_SCK — Serial Clock for SSP1.
I ADC0_IN[5] — A/D converter 0, input 5. When configured as an
ADC input, the digital function of the pin must be disabled.
I/O I2C0_SCL — I
2C0 clock input/output (this pin does not use a
specialized I2C pad).
P2[0] to
P2[31]
I/O Port 2: Port 2 is a 32 bit I/O port with individual direction
controls for each bit. The operation of port 1 pins depends upon
the pin function selected via the pin connect block.
P2[0] 154 B17 D12 107 [3] I;
PU
I/O P2[0] — General purpose digital input/output pin.
O PWM1[1] — Pulse Width Modulator 1, channel 1 output.
O U1_TXD — Transmitter output for UART1.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
O LCD_PWR — LCD panel power enable.
Table 3. Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 22 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
P2[1] 152 E14 C14 106 [3] I;
PU
I/O P2[1] — General purpose digital input/output pin.
O PWM1[2] — Pulse Width Modulator 1, channel 2 output.
I U1_RXD — Receiver input for UART1.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
O LCD_LE — Line end signal.
P2[2] 150 D15 E11 105 [3] I;
PU
I/O P2[2] — General purpose digital input/output pin.
O PWM1[3] — Pulse Width Modulator 1, channel 3 output.
I U1_CTS — Clear to Send input for UART1.
O T2_MAT3 — Match output for Timer 2, channel 3.
- R — Function reserved.
O TRACEDATA[3] — Trace data, bit 3.
- R — Function reserved.
O LCD_DCLK — LCD panel clock.
P2[3] 144 E16 E13 100 [3] I;
PU
I/O P2[3] — General purpose digital input/output pin.
O PWM1[4] — Pulse Width Modulator 1, channel 4 output.
I U1_DCD — Data Carrier Detect input for UART1.
O T2_MAT2 — Match output for Timer 2, channel 2.
- R — Function reserved.
O TRACEDATA[2] — Trace data, bit 2.
- R — Function reserved.
O LCD_FP — Frame pulse (STN). Vertical synchronization pulse
(TFT).
P2[4] 142 D17 E14 99 [3] I;
PU
I/O P2[4] — General purpose digital input/output pin.
O PWM1[5] — Pulse Width Modulator 1, channel 5 output.
I U1_DSR — Data Set Ready input for UART1.
O T2_MAT1 — Match output for Timer 2, channel 1.
- R — Function reserved.
O TRACEDATA[1] — Trace data, bit 1.
- R — Function reserved.
O LCD_ENAB_M — STN AC bias drive or TFT data enable
output.
Table 3. Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 23 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
P2[5] 140 F16 F12 97 [3] I;
PU
I/O P2[5] — General purpose digital input/output pin.
O PWM1[6] — Pulse Width Modulator 1, channel 6 output.
O U1_DTR — Data Terminal Ready output for UART1. Can also
be configured to be an RS-485/EIA-485 output enable signal for
UART1.
O T2_MAT0 — Match output for Timer 2, channel 0.
- R — Function reserved.
O TRACEDATA[0] — Trace data, bit 0.
- R — Function reserved.
O LCD_LP — Line synchronization pulse (STN). Horizontal
synchronization pulse (TFT).
P2[6] 138 E17 F13 96 [3] I;
PU
I/O P2[6] — General purpose digital input/output pin.
I PWM1_CAP0 — Capture input for PWM1, channel 0.
I U1_RI — Ring Indicator input for UART1.
I T2_CAP0 — Capture input for Timer 2, channel 0.
O U2_OE — RS-485/EIA-485 output enable signal for UART2.
O TRACECLK — Trace clock.
O LCD_VD[0] — LCD data.
O LCD_VD[4] — LCD data.
P2[7] 136 G16 G11 95 [3] I;
PU
I/O P2[7] — General purpose digital input/output pin.
I CAN_RD2 — CAN2 receiver input.
O U1_RTS — Request to Send output for UART1. Can also be
configured to be an RS-485/EIA-485 output enable signal for
UART1.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
O LCD_VD[1] — LCD data.
O LCD_VD[5] — LCD data.
P2[8] 134 H15 G14 93 [3] I;
PU
I/O P2[8] — General purpose digital input/output pin.
O CAN_TD2 — CAN2 transmitter output.
O U2_TXD — Transmitter output for UART2.
I U1_CTS — Clear to Send input for UART1.
O ENET_MDC — Ethernet MIIM clock.
- R — Function reserved.
O LCD_VD[2] — LCD data.
O LCD_VD[6] — LCD data.
Table 3. Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 24 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
P2[9] 132 H16 H11 92 [3] I;
PU
I/O P2[9] — General purpose digital input/output pin.
O USB_CONNECT1 — USB1 SoftConnect control. Signal used to
switch an external 1.5 k resistor under the software control.
Used with the SoftConnect USB feature.
I U2_RXD — Receiver input for UART2.
I U4_RXD — Receiver input for USART4.
I/O ENET_MDIO — Ethernet MIIM data input and output.
- R — Function reserved.
I LCD_VD[3] — LCD data.
I LCD_VD[7] — LCD data.
P2[10] 110 N15 M13 76 [10] I;
PU
I/O P2[10] — General purpose digital input/output pin. This pin
includes a 10 ns input .
A LOW on this pin while RESET is LOW forces the on-chip boot
loader to take over control of the part after a reset and go into
ISP mode.
I EINT0 — External interrupt 0 input.
I NMI — Non-maskable interrupt input.
P2[11] 108 T17 M12 75 [10] I;
PU
I/O P2[11] — General purpose digital input/output pin. This pin
includes a 10 ns input glitch filter.
I EINT1 — External interrupt 1 input.
I/O SD_DAT[1] — Data line 1 for SD card interface.
I/O I2S_TX_SCK — Transmit Clock. It is driven by the master and
received by the slave. Corresponds to the signal SCK in the
I
2S-bus specification.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
O LCD_CLKIN — LCD clock.
P2[12] 106 N14 N14 73 [10] I;
PU
I/O P2[12] — General purpose digital input/output pin. This pin
includes a 10 ns input glitch filter.
I EINT2 — External interrupt 2 input.
I/O SD_DAT[2] — Data line 2 for SD card interface.
I/O I2S_TX_WS — Transmit Word Select. It is driven by the master
and received by the slave. Corresponds to the signal WS in the
I
2S-bus specification.
O LCD_VD[4] — LCD data.
O LCD_VD[3] — LCD data.
O LCD_VD[8] — LCD data.
O LCD_VD[18] — LCD data.
Table 3. Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 25 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
P2[13] 102 T16 M11 71 [10] I;
PU
I/O P2[13] — General purpose digital input/output pin. This pin
includes a 10 ns input glitch filter.
I EINT3 — External interrupt 3 input.
I/O SD_DAT[3] — Data line 3 for SD card interface.
I/O I2S_TX_SDA — Transmit data. It is driven by the transmitter
and read by the receiver. Corresponds to the signal SD in the
I
2S-bus specification.
- R — Function reserved.
O LCD_VD[5] — LCD data.
O LCD_VD[9] — LCD data.
O LCD_VD[19] — LCD data.
P2[14] 91 R12 - - [3] I;
PU
I/O P2[14] — General purpose digital input/output pin.
O EMC_CS2 — LOW active Chip Select 2 signal.
I/O I2C1_SDA — I
2C1 data input/output (this pin does not use a
specialized I2C pad).
I T2_CAP0 — Capture input for Timer 2, channel 0.
P2[15] 99 P13 - - [3] I;
PU
I/O P2[15] — General purpose digital input/output pin.
O EMC_CS3 — LOW active Chip Select 3 signal.
I/O I2C1_SCL — I
2C1 clock input/output (this pin does not use a
specialized I2C pad).
I T2_CAP1 — Capture input for Timer 2, channel 1.
P2[16] 87 R11 P9 - [3] I;
PU
I/O P2[16] — General purpose digital input/output pin.
O EMC_CAS — LOW active SDRAM Column Address Strobe.
P2[17] 95 R13 P11 - [3] I;
PU
I/O P2[17] — General purpose digital input/output pin.
O EMC_RAS — LOW active SDRAM Row Address Strobe.
P2[18] 59 U3 P3 - [6] I;
PU
I/O P2[18] — General purpose digital input/output pin.
O EMC_CLK[0] — SDRAM clock 0.
P2[19] 67 R7 N5 - [6] I;
PU
I/O P2[19] — General purpose digital input/output pin.
O EMC_CLK[1] — SDRAM clock 1.
P2[20] 73 T8 P6 - [3] I;
PU
I/O P2[20] — General purpose digital input/output pin.
O EMC_DYCS0 — SDRAM chip select 0.
P2[21] 81 U11 N8 - [3] I;
PU
I/O P2[21] — General purpose digital input/output pin.
O EMC_DYCS1 — SDRAM chip select 1.
P2[22] 85 U12 - - [3] I;
PU
I/O P2[22] — General purpose digital input/output pin.
O EMC_DYCS2 — SDRAM chip select 2.
I/O SSP0_SCK — Serial clock for SSP0.
I T3_CAP0 — Capture input for Timer 3, channel 0.
Table 3. Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 26 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
P2[23] 64 U5 - - [3] I;
PU
I/O P2[23] — General purpose digital input/output pin.
O EMC_DYCS3 — SDRAM chip select 3.
I/O SSP0_SSEL — Slave Select for SSP0.
I T3_CAP1 — Capture input for Timer 3, channel 1.
P2[24] 53 P5 P1 - [3] I;
PU
I/O P2[24] — General purpose digital input/output pin.
O EMC_CKE0 — SDRAM clock enable 0.
P2[25] 54 R4 P2 - [3] I;
PU
I/O P2[25] — General purpose digital input/output pin.
O EMC_CKE1 — SDRAM clock enable 1.
P2[26] 57 T4 - - [3] I;
PU
I/O P2[26] — General purpose digital input/output pin.
O EMC_CKE2 — SDRAM clock enable 2.
I/O SSP0_MISO — Master In Slave Out for SSP0.
O T3_MAT0 — Match output for Timer 3, channel 0.
P2[27] 47 P3 - - [3] I;
PU
I/O P2[27] — General purpose digital input/output pin.
O EMC_CKE3 — SDRAM clock enable 3.
I/O SSP0_MOSI — Master Out Slave In for SSP0.
O T3_MAT1 — Match output for Timer 3, channel 1.
P2[28] 49 P4 M2 - [3] I;
PU
I/O P2[28] — General purpose digital input/output pin.
O EMC_DQM0 — Data mask 0 used with SDRAM and static
devices.
P2[29] 43 N3 L1 - [3] I;
PU
I/O P2[29] — General purpose digital input/output pin.
O EMC_DQM1 — Data mask 1 used with SDRAM and static
devices.
P2[30] 31 L4 - - [3] I;
PU
I/O P2[30] — General purpose digital input/output pin.
O EMC_DQM2 — Data mask 2 used with SDRAM and static
devices.
I/O I2C2_SDA — I
2C2 data input/output (this pin does not use a
specialized I2C pad).
O T3_MAT2 — Match output for Timer 3, channel 2.
P2[31] 39 N2 - - [3] I;
PU
I/O P2[31] — General purpose digital input/output pin.
O EMC_DQM3 — Data mask 3 used with SDRAM and static
devices.
I/O I2C2_SCL — I
2C2 clock input/output (this pin does not use a
specialized I2C pad).
O T3_MAT3 — Match output for Timer 3, channel 3.
P3[0] to
P3[31]
I/O Port 3: Port 3 is a 32-bit I/O port with individual direction
controls for each bit. The operation of port 3 pins depends upon
the pin function selected via the pin connect block.
Table 3. Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 27 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
P3[0] 197 B4 D6 137 [3] I;
PU
I/O P3[0] — General purpose digital input/output pin.
I/O EMC_D[0] — External memory data line 0.
P3[1] 201 B3 E6 140 [3] I;
PU
I/O P3[1] — General purpose digital input/output pin.
I/O EMC_D[1] — External memory data line 1.
P3[2] 207 B1 A2 144 [3] I;
PU
I/O P3[2] — General purpose digital input/output pin.
I/O EMC_D[2] — External memory data line 2.
P3[3] 3 E4 G5 2 [3] I;
PU
I/O P3[3] — General purpose digital input/output pin.
I/O EMC_D[3] — External memory data line 3.
P3[4] 13 F2 D3 9 [3] I;
PU
I/O P3[4] — General purpose digital input/output pin.
I/O EMC_D[4] — External memory data line 4.
P3[5] 17 G1 E3 12 [3] I;
PU
I/O P3[5] — General purpose digital input/output pin.
I/O EMC_D[5] — External memory data line 5.
P3[6] 23 J1 F4 16 [3] I;
PU
I/O P3[6] — General purpose digital input/output pin.
I/O EMC_D[6] — External memory data line 6.
P3[7] 27 L1 G3 19 [3] I;
PU
I/O P3[7] — General purpose digital input/output pin.
I/O EMC_D[7] — External memory data line 7.
P3[8] 191 D8 A6 - [3] I;
PU
I/O P3[8] — General purpose digital input/output pin.
I/O EMC_D[8] — External memory data line 8.
P3[9] 199 C5 A4 - [3] I;
PU
I/O P3[9] — General purpose digital input/output pin.
I/O EMC_D[9] — External memory data line 9.
P3[10] 205 B2 B3 - [3] I;
PU
I/O P3[10] — General purpose digital input/output pin.
I/O EMC_D[10] — External memory data line 10.
P3[11] 208 D5 B2 - [3] I;
PU
I/O P3[11] — General purpose digital input/output pin.
I/O EMC_D[11] — External memory data line 11.
P3[12] 1 D4 A1 - [3] I;
PU
I/O P3[12] — General purpose digital input/output pin.
I/O EMC_D[12] — External memory data line 12.
P3[13] 7 C1 C1 - [3] I;
PU
I/O P3[13] — General purpose digital input/output pin.
I/O EMC_D[13] — External memory data line 13.
P3[14] 21 H2 F1 - [3] I;
PU
I/O P3[14] — General purpose digital input/output pin.
I/O EMC_D[14] — External memory data line 14.
P3[15] 28 M1 G4 - [3] I;
PU
I/O P3[15] — General purpose digital input/output pin.
I/O EMC_D[15] — External memory data line 15.
P3[16] 137 F17 - - [3] I;
PU
I/O P3[16] — General purpose digital input/output pin.
I/O EMC_D[16] — External memory data line 16.
O PWM0[1] — Pulse Width Modulator 0, output 1.
O U1_TXD — Transmitter output for UART1.
Table 3. Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 28 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
P3[17] 143 F15 - - [3] I;
PU
I/O P3[17] — General purpose digital input/output pin.
I/O EMC_D[17] — External memory data line 17.
O PWM0[2] — Pulse Width Modulator 0, output 2.
I U1_RXD — Receiver input for UART1.
P3[18] 151 C15 - - [3] I;
PU
I/O P3[18] — General purpose digital input/output pin.
I/O EMC_D[18] — External memory data line 18.
O PWM0[3] — Pulse Width Modulator 0, output 3.
I U1_CTS — Clear to Send input for UART1.
P3[19] 161 B14 - - [3] I;
PU
I/O P3[19] — General purpose digital input/output pin.
I/O EMC_D[19] — External memory data line 19.
O PWM0[4] — Pulse Width Modulator 0, output 4.
I U1_DCD — Data Carrier Detect input for UART1.
P3[20] 167 A13 - - [3] I;
PU
I/O P3[20] — General purpose digital input/output pin.
I/O EMC_D[20] — External memory data line 20.
O PWM0[5] — Pulse Width Modulator 0, output 5.
I U1_DSR — Data Set Ready input for UART1.
P3[21] 175 C10 - - [3] I;
PU
I/O P3[21] — General purpose digital input/output pin.
I/O EMC_D[21] — External memory data line 21.
O PWM0[6] — Pulse Width Modulator 0, output 6.
O U1_DTR — Data Terminal Ready output for UART1. Can also
be configured to be an RS-485/EIA-485 output enable signal for
UART1.
P3[22] 195 C6 - - [3] I;
PU
I/O P3[22] — General purpose digital input/output pin.
I/O EMC_D[22] — External memory data line 22.
I PWM0_CAP0 — Capture input for PWM0, channel 0.
I U1_RI — Ring Indicator input for UART1.
P3[23] 65 T6 M4 45 [3] I;
PU
I/O P3[23] — General purpose digital input/output pin.
I/O EMC_D[23] — External memory data line 23.
I PWM1_CAP0 — Capture input for PWM1, channel 0.
I T0_CAP0 — Capture input for Timer 0, channel 0.
P3[24] 58 R5 N3 40 [3] I;
PU
I/O P3[24] — General purpose digital input/output pin.
I/O EMC_D[24] — External memory data line 24.
O PWM1[1] — Pulse Width Modulator 1, output 1.
I T0_CAP1 — Capture input for Timer 0, channel 1.
Table 3. Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 29 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
P3[25] 56 U2 M3 39 [3] I;
PU
I/O P3[25] — General purpose digital input/output pin.
I/O EMC_D[25] — External memory data line 25.
O PWM1[2] — Pulse Width Modulator 1, output 2.
O T0_MAT0 — Match output for Timer 0, channel 0.
P3[26] 55 T3 K7 38 [3] I;
PU
I/O P3[26] — General purpose digital input/output pin.
I/O EMC_D[26] — External memory data line 26.
O PWM1[3] — Pulse Width Modulator 1, output 3.
O T0_MAT1 — Match output for Timer 0, channel 1.
I STCLK — System tick timer clock input. The maximum STCLK
frequency is 1/4 of the ARM processor clock frequency CCLK.
P3[27] 203 A1 - - [3] I;
PU
I/O P3[27] — General purpose digital input/output pin.
I/O EMC_D[27] — External memory data line 27.
O PWM1[4] — Pulse Width Modulator 1, output 4.
I T1_CAP0 — Capture input for Timer 1, channel 0.
P3[28] 5 D2 - - [3] I;
PU
I/O P3[28] — General purpose digital input/output pin.
I/O EMC_D[28] — External memory data line 28.
O PWM1[5] — Pulse Width Modulator 1, output 5.
I T1_CAP1 — Capture input for Timer 1, channel 1.
P3[29] 11 F3 - - [3] I;
PU
I/O P3[29] — General purpose digital input/output pin.
I/O EMC_D[29] — External memory data line 29.
O PWM1[6] — Pulse Width Modulator 1, output 6.
O T1_MAT0 — Match output for Timer 1, channel 0.
P3[30] 19 H3 - - [3] I;
PU
I/O P3[30] — General purpose digital input/output pin.
I/O EMC_D[30] — External memory data line 30.
O U1_RTS — Request to Send output for UART1. Can also be
configured to be an RS-485/EIA-485 output enable signal for
UART1.
O T1_MAT1 — Match output for Timer 1, channel 1.
P3[31] 25 J3 - - [3] I;
PU
I/O P3[31] — General purpose digital input/output pin.
I/O EMC_D[31] — External memory data line 31.
- R — Function reserved.
O T1_MAT2 — Match output for Timer 1, channel 2.
P4[0] to
P4[31]
I/O Port 4: Port 4 is a 32-bit I/O port with individual direction
controls for each bit. The operation of port 4 pins depends upon
the pin function selected via the pin connect block.
P4[0] 75 U9 L6 52 [3] I;
PU
I/O P4[0] — General purpose digital input/output pin.
I/O EMC_A[0] — External memory address line 0.
Table 3. Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 30 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
P4[1] 79 U10 M7 55 [3] I;
PU
I/O P4[1] — General purpose digital input/output pin.
I/O EMC_A[1] — External memory address line 1.
P4[2] 83 T11 M8 58 [3] I;
PU
I/O P4[2] — General purpose digital input/output pin.
I/O EMC_A[2] — External memory address line 2.
P4[3] 97 U16 K9 68 [3] I;
PU
I/O P4[3] — General purpose digital input/output pin.
I/O EMC_A[3] — External memory address line 3.
P4[4] 103 R15 P13 72 [3] I;
PU
I/O P4[4] — General purpose digital input/output pin.
I/O EMC_A[4] — External memory address line 4.
P4[5] 107 R16 H10 74 [3] I;
PU
I/O P4[5] — General purpose digital input/output pin.
I/O EMC_A[5] — External memory address line 5.
P4[6] 113 M14 K10 78 [3] I;
PU
I/O P4[6] — General purpose digital input/output pin.
I/O EMC_A[6] — External memory address line 6.
P4[7] 121 L16 K12 84 [3] I;
PU
I/O P4[7] — General purpose digital input/output pin.
I/O EMC_A[7] — External memory address line 7.
P4[8] 127 J17 J11 88 [3] I;
PU
I/O P4[8] — General purpose digital input/output pin.
I/O EMC_A[8] — External memory address line 8.
P4[9] 131 H17 H12 91 [3] I;
PU
I/O P4[9] — General purpose digital input/output pin.
I/O EMC_A[9] — External memory address line 9.
P4[10] 135 G17 G12 94 [3] I;
PU
I/O P4[10] — General purpose digital input/output pin.
I/O EMC_A[10] — External memory address line 10.
P4[11] 145 F14 F11 101 [3] I;
PU
I/O P4[11] — General purpose digital input/output pin.
I/O EMC_A[11] — External memory address line 11.
P4[12] 149 C16 F10 104 [3] I;
PU
I/O P4[12] — General purpose digital input/output pin.
I/O EMC_A[12] — External memory address line 12.
P4[13] 155 B16 B14 108 [3] I;
PU
I/O P4[13] — General purpose digital input/output pin.
I/O EMC_A[13] — External memory address line 13.
P4[14] 159 B15 E8 110 [3] I;
PU
I/O P4[14] — General purpose digital input/output pin.
I/O EMC_A[14] — External memory address line 14.
P4[15] 173 A11 C10 120 [3] I;
PU
I/O P4[15] — General purpose digital input/output pin.
I/O EMC_A[15] — External memory address line 15.
P4[16] 101 U17 N12 - [3] I;
PU
I/O P4[16] — General purpose digital input/output pin.
I/O EMC_A[16] — External memory address line 16.
P4[17] 104 P14 N13 - [3] I;
PU
I/O P4[17] — General purpose digital input/output pin.
I/O EMC_A[17] — External memory address line 17.
P4[18] 105 P15 P14 - [3] I;
PU
I/O P4[18] — General purpose digital input/output pin.
I/O EMC_A[18] — External memory address line 18.
Table 3. Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 31 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
P4[19] 111 P16 M14 - [3] I;
PU
I/O P4[19] — General purpose digital input/output pin.
I/O EMC_A[19] — External memory address line 19.
P4[20] 109 R17 - - [3] I;
PU
I/O P4[20] — General purpose digital input/output pin.
I/O EMC_A[20] — External memory address line 20.
I/O I2C2_SDA — I
2C2 data input/output (this pin does not use a
specialized I2C pad).
I/O SSP1_SCK — Serial Clock for SSP1.
P4[21] 115 M15 - - [3] I;
PU
I/O P4[21] — General purpose digital input/output pin.
I/O EMC_A[21] — External memory address line 21.
I/O I2C2_SCL — I
2C2 clock input/output (this pin does not use a
specialized I2C pad).
I/O SSP1_SSEL — Slave Select for SSP1.
P4[22] 123 K14 - - [3] I;
PU
I/O P4[22] — General purpose digital input/output pin.
I/O EMC_A[22] — External memory address line 22.
O U2_TXD — Transmitter output for UART2.
I/O SSP1_MISO — Master In Slave Out for SSP1.
P4[23] 129 J15 - - [3] I;
PU
I/O P4[23] — General purpose digital input/output pin.
I/O EMC_A[23] — External memory address line 23.
I U2_RXD — Receiver input for UART2.
I/O SSP1_MOSI — Master Out Slave In for SSP1.
P4[24] 183 B8 C8 127 [3] I;
PU
I/O P4[24] — General purpose digital input/output pin.
O EMC_OE — LOW active Output Enable signal.
P4[25] 179 B9 D9 124 [3] I;
PU
I/O P4[25] — General purpose digital input/output pin.
O EMC_WE — LOW active Write Enable signal.
P4[26] 119 L15 K13 - [3] I;
PU
I/O P4[26] — General purpose digital input/output pin.
O EMC_BLS0 — LOW active Byte Lane select signal 0.
P4[27] 139 G15 F14 - [3] I;
PU
I/O P4[27] — General purpose digital input/output pin.
O EMC_BLS1 — LOW active Byte Lane select signal 1.
P4[28] 170 C11 D10 118 [3] I;
PU
I/O P4[28] — General purpose digital input/output pin.
O EMC_BLS2 — LOW active Byte Lane select signal 2.
O U3_TXD — Transmitter output for UART3.
O T2_MAT0 — Match output for Timer 2, channel 0.
- R — Function reserved.
O LCD_VD[6] — LCD data.
O LCD_VD[10] — LCD data.
O LCD_VD[2] — LCD data.
Table 3. Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 32 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
P4[29] 176 B10 B9 122 [3] I;
PU
I/O P4[29] — General purpose digital input/output pin.
O EMC_BLS3 — LOW active Byte Lane select signal 3.
I U3_RXD — Receiver input for UART3.
O T2_MAT1 — Match output for Timer 2, channel 1.
I/O I2C2_SCL — I
2C2 clock input/output (this pin does not use a
specialized I2C pad).
O LCD_VD[7] — LCD data.
O LCD_VD[11] — LCD data.
O LCD_VD[3] — LCD data.
P4[30] 187 B7 C7 130 [3] I;
PU
I/O P4[30] — General purpose digital input/output pin.
O EMC_CS0 — LOW active Chip Select 0 signal.
P4[31] 193 A4 E7 134 [3] I;
PU
I/O P4[31] — General purpose digital input/output pin.
O EMC_CS1 — LOW active Chip Select 1 signal.
P5[0] to P5[4] I/O Port 5: Port 5 is a 5-bit I/O port with individual direction controls
for each bit. The operation of port 5 pins depends upon the pin
function selected via the pin connect block.
P5[0] 9 F4 E5 6 [3] I;
PU
I/O P5[0] — General purpose digital input/output pin.
I/O EMC_A[24] — External memory address line 24.
I/O SSP2_MOSI — Master Out Slave In for SSP2.
O T2_MAT2 — Match output for Timer 2, channel 2.
P5[1] 30 J4 H1 21 [3] I;
PU
I/O P5[1] — General purpose digital input/output pin.
I/O EMC_A[25] — External memory address line 25.
I/O SSP2_MISO — Master In Slave Out for SSP2.
O T2_MAT3 — Match output for Timer 2, channel 3.
P5[2] 117 L14 L12 81 [11] I I/O P5[2] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
O T3_MAT2 — Match output for Timer 3, channel 2.
- R — Function reserved.
I/O I2C0_SDA — I
2C0 data input/output (this pin uses a specialized
I
2C pad that supports I2C Fast Mode Plus).
Table 3. Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 33 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
P5[3] 141 G14 G10 98 [11] I I/O P5[3] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
I U4_RXD — Receiver input for USART4.
I/O I2C0_SCL — I
2C0 clock input/output (this pin uses a
specialized I2C pad that supports I2C Fast Mode Plus).
P5[4] 206 C3 C4 143 [3] I;
PU
I/O P5[4] — General purpose digital input/output pin.
O U0_OE — RS-485/EIA-485 output enable signal for UART0.
- R — Function reserved.
O T3_MAT3 — Match output for Timer 3, channel 3.
O U4_TXD — Transmitter output for USART4 (input/output in
smart card mode).
JTAG_TDO
(SWO)
2 D3 B1 1 [3] O O Test Data Out for JTAG interface. Also used as Serial wire trace
output.
JTAG_TDI 4 C2 C3 3 [3] I;
PU
I Test Data In for JTAG interface.
JTAG_TMS
(SWDIO)
6 E3 C2 4 [3] I;
PU
I Test Mode Select for JTAG interface. Also used as Serial wire
debug data input/output.
JTAG_TRST 8 D1 D4 5 [3] I;
PU
I Test Reset for JTAG interface.
JTAG_TCK
(SWDCLK)
10 E2 D2 7 [3] i I Test Clock for JTAG interface. This clock must be slower than
1/6 of the CPU clock (CCLK) for the JTAG interface to operate.
Also used as serial wire clock.
RESET 35 M2 J1 24 [12] I;
PU
I External reset input with 20 ns glitch filter. A LOW-going pulse
as short as 50 ns on this pin resets the device, causing I/O ports
and peripherals to take on their default states, and processor
execution to begin at address 0. This pin also serves as the
debug select input. LOW level selects the JTAG boundary scan.
HIGH level selects the ARM SWD debug mode.
RSTOUT 29 K3 H2 20 [3] OH O Reset status output. A LOW output on this pin indicates that the
device is in the reset state for any reason. This reflects the
RESET input pin and all internal reset sources.
RTC_ALARM 37 N1 H5 26 [13] OL O RTC controlled output. This pin has a low drive strength and is
powered by VBAT. It is driven HIGH when an RTC alarm is
generated.
RTCX1 34 K2 J2 23 [14]
[15]
- I Input to the RTC 32 kHz ultra-low power oscillator circuit.
RTCX2 36 L2 J3 25 [14]
[15]
- O Output from the RTC 32 kHz ultra-low power oscillator circuit.
USB_D2 52 U1 N2 37 [9] - I/O USB port 2 bidirectional D line.
Table 3. Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 34 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
VBAT 38 M3 K1 27 - I RTC power supply: 3.0 V on this pin supplies power to the RTC.
VDD(REG)(3V3) 26,
86,
174
H4,
P11,
D11
G1,
N9,
E9
18,
60,
121
- S 3.3 V regulator supply voltage: This is the power supply for the
on-chip voltage regulator that supplies internal logic.
VDDA 20 G4 F2 14 - S Analog 3.3 V pad supply voltage: This can be connected to the
same supply as VDD(3V3) but should be isolated to minimize
noise and error. This voltage is used to power the ADC and
DAC. Note: This pin should be tied to 3.3 V if the ADC and
DAC are not used.
VDD(3V3) 15,
60,
71,
89,
112,
125,
146,
165,
181,
198
G3,
P6,
P8,
U13,
P17,
K16,
C17,
B13,
C9,
D7
E2,
L4,
K8,
L11,
J14,
E12,
E10,
C5
41,
62,
77,
102,
114,
138
- S 3.3 V supply voltage: This is the power supply voltage for I/O
other than pins in the VBAT domain.
VREFP 24 K1 G2 17 - S ADC positive reference voltage: This should be the same
voltage as VDDA, but should be isolated to minimize noise and
error. The voltage level on this pin is used as a reference for
ADC and DAC. Note: This pin should be tied to 3.3 V if the
ADC and DAC are not used.
VSS 33,
63,
77,
93,
114,
133,
148,
169,
189,
200
L3,
T5,
R9,
P12,
N16,
H14,
E15,
A12,
B6,
A2
H4,
P4,
L9,
L13,
G13,
D13,
C11,
B4
44,
65,
79,
103,
117,
139
- G Ground: 0 V reference for digital IO pins.
VSSREG 32,
84,
172
D12,
K4,
P10
H3,
L8,
A10
22,
59,
119
- G Ground: 0 V reference for internal logic.
VSSA 22 J2 F3 15 - G Analog ground: 0 V power supply and reference for the ADC
and DAC. This should be the same voltage as VSS, but should
be isolated to minimize noise and error.
XTAL1 44 M4 L2 31 [14]
[16]
- I Input to the oscillator circuit and internal clock generator circuits.
XTAL2 46 N4 K4 33 [14]
[16]
- O Output from the oscillator amplifier.
Table 3. Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC
pins).
Symbol
Pin LQFP208
Ball TFBGA208
Ball TFBGA180
Pin LQFP144
Reset state[1]
Type[2]
DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 35 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
[1] PU = internal pull-up enabled (for VDD(REG)(3V3) = 3.3 V, pulled up to 3.3 V); IA = inactive, no pull-up/down enabled; F = floating; floating
pins, if not used, should be tied to ground or power to minimize power consumption.
[2] I = Input; O = Output; OL = Output driving LOW; G = Ground; S = Supply.
[3] 5 V tolerant pad (5 V tolerant if VDD(3V3) present; if VDD(3V3) not present, do not exceed 3.6 V) providing digital I/O functions with TTL
levels and hysteresis.
[4] 5 V tolerant standard pad (5 V tolerant if VDD(3V3) present; if VDD(3V3) not present, do not exceed 3.6 V) providing digital I/O functions with
TTL levels and hysteresis. This pad can be powered by VBAT.
[5] 5 V tolerant pad (5 V tolerant if VDD(3V3) present; if VDD(3V3) not present or configured for an analog function, do not exceed 3.6 V)
providing digital I/O functions with TTL levels and hysteresis and analog input. When configured as a ADC input, digital section of the
pad is disabled.
[6] 5 V tolerant fast pad (5 V tolerant if VDD(3V3) present; if VDD(3V3) not present, do not exceed 3.6 V) providing digital I/O functions with TTL
levels and hysteresis.
[7] 5 V tolerant pad (5 V tolerant if VDD(3V3) present; if VDD(3V3) not present or configured for an analog function, do not exceed 3.6 V)
providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output, digital section of the
pad is disabled.
[8] Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus 400 kHz specification. It requires an external pull-up to provide output
functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines. Open-drain
configuration applies to all functions on this pin.
[9] Not 5 V tolerant. Pad provides digital I/O and USB functions. It is designed in accordance with the USB specification, revision 2.0
(Full-speed and Low-speed mode only).
[10] 5 V tolerant pad (5 V tolerant if VDD(3V3) present; if VDD(3V3) not present, do not exceed 3.6 V) with 5 ns glitch filter providing digital I/O
functions with TTL levels and hysteresis.
[11] Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus 1 MHz specification. It requires an external pull-up to provide output
functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines. Open-drain
configuration applies to all functions on this pin.
[12] 5 V tolerant pad (5 V tolerant if VDD(3V3) present; if VDD(3V3) not present, do not exceed 3.6 V) with 20 ns glitch filter providing digital I/O
function with TTL levels and hysteresis.
[13] This pad can be powered from VBAT.
[14] Pad provides special analog functionality. A 32 kHz crystal oscillator must be used with the RTC. An external clock (32 kHz) can’t be
used to drive the RTCX1 pin.
[15] If the RTC is not used, these pins can be left floating.
[16] When the main oscillator is not used, connect XTAL1 and XTAL2 as follows: XTAL1 can be left floating or can be grounded (grounding
is preferred to reduce susceptibility to noise). XTAL2 should be left floating.
Table 4. Pin allocation table TFBGA208
Not all functions are available on all parts. See Table 2 and Table 7 (EMC pins).
Ball Symbol Ball Symbol Ball Symbol Ball Symbol
Row A
1 P3[27] 2 VSS 3 P1[0] 4 P4[31]
5 P1[4] 6 P1[9] 7 P1[14] 8 P1[15]
9 P1[17] 10 P1[3] 11 P4[15] 12 VSS
13 P3[20] 14 P1[11] 15 P0[8] 16 P1[12]
17 P1[5] - - -
Row B
1 P3[2] 2 P3[10] 3 P3[1] 4 P3[0]
5 P1[1] 6 VSS 7 P4[30] 8 P4[24]
9 P4[25] 10 P4[29] 11 P1[6] 12 P0[4]
13 VDD(3V3) 14 P3[19] 15 P4[14] 16 P4[13]
17 P2[0] - - -
Row CLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 36 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
1 P3[13] 2 JTAG_TDI 3 P5[4] 4 P0[2]
5 P3[9] 6 P3[22] 7 P1[8] 8 P1[10]
9 VDD(3V3) 10 P3[21] 11 P4[28] 12 P0[5]
13 P0[7] 14 P0[9] 15 P3[18] 16 P4[12]
17 VDD(3V3)- - -
Row D
1 JTAG_TRST 2 P3[28] 3 JTAG_TDO (SWO) 4 P3[12]
5 P3[11] 6 P0[3] 7 VDD(3V3) 8 P3[8]
9 P1[2] 10 P1[16] 11 VDD(REG)(3V3) 12 VSSREG
13 P0[6] 14 P1[7] 15 P2[2] 16 P1[13]
17 P2[4] - - -
Row E
1 P0[26] 2 JTAG_TCK
(SWDCLK)
3 JTAG_TMS (SWDIO) 4 P3[3]
5 - 6- 7 - 8 -
9 - 10 - 11 - 12 -
13 - 14 P2[1] 15 VSS 16 P2[3]
17 P2[6] - - -
Row F
1 P0[25] 2 P3[4] 3 P3[29] 4 P5[0]
5 - 6- 7 - 8 -
9 - 10 - 11 - 12 -
13 - 14 P4[11] 15 P3[17] 16 P2[5]
17 P3[16] - - -
Row G
1 P3[5] 2 P0[24] 3 VDD(3V3) 4 VDDA
5 - 6 - 7 - 8 -
9 - 10 - 11 - 12 -
13 - 14 P5[3] 15 P4[27] 16 P2[7]
17 P4[10] - - -
Row H
1 P0[23] 2 P3[14] 3 P3[30] 4 VDD(REG)(3V3)
5 - 6 - 7 - 8 -
9 - 10 - 11 - 12 -
13 - 14 VSS 15 P2[8] 16 P2[9]
17 P4[9] - - -
Row J
1 P3[6] 2 VSSA 3 P3[31] 4 P5[1]
5 - 6 - 7 - 8 -
9 - 10 - 11 - 12 -
Table 4. Pin allocation table TFBGA208
Not all functions are available on all parts. See Table 2 and Table 7 (EMC pins).
Ball Symbol Ball Symbol Ball Symbol Ball SymbolLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 37 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
13 14 P0[16] 15 P4[23] 16 P0[15]
17 P4[8] - - -
Row K
1 VREFP 2 RTCX1 3 RSTOUT 4 VSSREG
13 - 14 P4[22] 15 P0[18] 16 VDD(3V3)
17 P0[17] - - -
Row L
1 P3[7] 2 RTCX2 3 VSS 4 P2[30]
5 - 6- 7 - 8 -
9 - 10 - 11 - 12 -
13 - 14 P5[2] 15 P4[26] 16 P4[7]
17 P0[19] - - -
Row M
1 P3[15] 2 RESET 3 VBAT 4 XTAL1
5 - 6 - 7 - 8 -
9 - 10 - 11 - 12 -
13 - 14 P4[6] 15 P4[21] 16 P0[21]
17 P0[20] - - -
Row N
1 RTC_ALARM 2 P2[31] 3 P2[29] 4 XTAL2
5 - 6 - 7 - 8 -
9 - 10 - 11 - 12 -
13 - 14 P2[12 15 P2[10] 16 VSS
17 P0[22] - - -
Row P
1 P1[31] 2 P1[30] 3 P2[27] 4 P2[28]
5 P2[24] 6 VDD(3V3) 7 P1[18] 8 VDD(3V3)
9 P1[23] 10 VSSREG 11 VDD(REG)(3V3) 12 VSS
13 P2[15] 14 P4[17] 15 P4[18] 16 P4[19]
17 VDD(3V3) ---
Row R
1 P0[12] 2 P0[13] 3 P0[28] 4 P2[25]
5 P3[24] 6 P0[30] 7 P2[19] 8 P1[21]
9 VSS 10 P1[26] 11 P2[16] 12 P2[14]
13 P2[17] 14 P0[11] 15 P4[4] 16 P4[5]
17 P4[20] - - -
Row T
1 P0[27] 2 P0[31] 3 P3[26] 4 P2[26]
5 VSS 6 P3[23] 7 P0[14] 8 P2[20]
9 P1[24] 10 P1[25] 11 P4[2] 12 P1[27]
Table 4. Pin allocation table TFBGA208
Not all functions are available on all parts. See Table 2 and Table 7 (EMC pins).
Ball Symbol Ball Symbol Ball Symbol Ball SymbolLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 38 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
13 P1[28] 14 P0[1] 15 P0[10] 16 P2[13]
17 P2[11] - - -
Row U
1 USB_D-2 2 P3[25] 3 P2[18] 4 P0[29]
5 P2[23] 6 P1[19] 7 P1[20] 8 P1[22]
9 P4[0] 10 P4[1] 11 P2[21] 12 P2[22]
13 VDD(3V3) 14 P1[29] 15 P0[0] 16 P4[3]
17 P4[16] - - -
Table 4. Pin allocation table TFBGA208
Not all functions are available on all parts. See Table 2 and Table 7 (EMC pins).
Ball Symbol Ball Symbol Ball Symbol Ball Symbol
Table 5. Pin allocation table TFBGA180
Not all functions are available on all parts. See Table 2 and Table 7 (EMC pins).
Ball Symbol Ball Symbol Ball Symbol Ball Symbol
Row A
5 P1[1] 6 P3[8] 7 P1[10] 8 P1[15]
9 P1[3] 10 VSSREG 11 P0[4] 12 P1[11]
13 P0[9] 14 P1[12] - -
Row B
1 JTAG_TDO (SWO) 2 P3[11] 3 P3[10] 4 VSS
5 P1[0] 6 P1[8] 7 P1[2] 8 P1[16]
9 P4[29] 10 P1[6] 11 P0[5] 12 P0[7]
13 P1[5] 14 P4[13] - -
Row C
1 P3[13] 2 JTAG_TMS (SWDIO) 3 JTAG_TDI 4 P5[4]
5 VDD(3V3) 6 P1[4] 7 P4[30] 8 P4[24]
9 P1[17] 10 P4[15] 11 VSS 12 P0[8]
13 P1[7] 14 P2[1] - -
Row D
1 P0[26] 2 JTAG_TCK
(SWDCLK)
3 P3[4] 4 JTAG_TRST
5 P0[2] 6 P3[0] 7 P1[9] 8 P1[14]
9 P4[25] 10 P4[28] 11 P0[6] 12 P2[0]
13 VSS 14 P1[13] - -
Row E
1 P0[24] 2 VDD(3V3) 3 P3[5] 4 P0[25]
5 P5[0] 6 P3[1] 7 P4[31] 8 P4[14]
9 VDD(REG)(3V3) 10 VDD(3V3) 11 P2[2] 12 VDD(3V3)
13 P2[3] 14 P2[4] - -
Row F
1 P3[14] 2 VDDA 3 VSSA 4 P3[6]
5 P0[23] 6 - 7 - 8 -
9 - 10 P4[12] 11 P4[11] 12 P2[5]LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 39 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
13 P2[6] 14 P4[27] - -
Row G
1 VDD(REG)(3V3) 2 VREFP 3 P3[7] 4 P3[15]
5 P3[3] 6 - 7 - 8 -
9 - 10 P5[3] 11 P2[7] 12 P4[10]
13 VSS 14 P2[8] - -
Row H
1 P5[1] 2 RSTOUT 3 VSSREG 4 VSS
5 RTC_ALARM 6 - 7 - 8 -
9 - 10 P4[5] 11 P2[9] 12 P4[9]
13 P0[15] 14 P0[16] - -
Table 5. Pin allocation table TFBGA180
Not all functions are available on all parts. See Table 2 and Table 7 (EMC pins).
Ball Symbol Ball Symbol Ball Symbol Ball SymbolLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 40 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
7. Functional description
7.1 Architectural overview
The ARM Cortex-M3 includes three AHB-Lite buses: the system bus, the I-code bus, and
the D-code bus. The I-code and D-code core buses are faster than the system bus and
are used similarly to Tightly Coupled Memory (TCM) interfaces: one bus dedicated for
instruction fetch (I-code) and one bus for data access (D-code). The use of two core
buses allows for simultaneous operations if concurrent operations target different devices.
Row J
1 RESET 2 RTCX1 3 RTCX2 4 P0[12]
5 P0[13] 6 - 7 - 8 -
9 - 10 P0[19] 11 P4[8] 12 P0[17]
13 P0[18] 14 VDD(3V3) - -
Row K
1 VBAT 2 P1[31] 3 P1[30] 4 XTAL2
5 P0[29] 6 P1[20] 7 P3[26] 8 VDD(3V3)
9 P4[3] 10 P4[6] 11 P0[21] 12 P4[7]
13 P4[26] 14 P0[20] - -
Row L
1 P2[29] 2 XTAL1 3 P0[27] 4 VDD(3V3)
5 P1[18] 6 P4[0] 7 P1[25] 8 VSSREG
9 VSS 10 P0[10] 11 VDD(3V3) 12 P5[2]
13 VSS 14 P0[22] - -
Row M
1 P0[28] 2 P2[28] 3 P3[25] 4 P3[23]
5 P0[14] 6 P1[22] 7 P4[1] 8 P4[2]
9 P1[27] 10 P0[0] 11 P2[13] 12 P2[11]
13 P2[10] 14 P4[19] - -
Row N
1 P0[31] 2 USB_D-2 3 P3[24] 4 P0[30]
5 P2[19] 6 P1[21] 7 P1[23] 8 P2[21]
9 VDD(REG)(3V3) 10 P1[29] 11 P0[1] 12 P4[16]
13 P4[17] 14 P2[12] - -
Row P
1 P2[24] 2 P2[25] 3 P2[18] 4 VSS
5 P1[19] 6 P2[20] 7 P1[24] 8 P1[26]
9 P2[16] 10 P1[28] 11 P2[17] 12 P0[11]
13 P4[4] 14 P4[18] - -
Table 5. Pin allocation table TFBGA180
Not all functions are available on all parts. See Table 2 and Table 7 (EMC pins).
Ball Symbol Ball Symbol Ball Symbol Ball SymbolLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 41 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
The LPC178x/7x use a multi-layer AHB matrix to connect the ARM Cortex-M3 buses and
other bus masters to peripherals in a flexible manner that optimizes performance by
allowing peripherals that are on different slaves ports of the matrix to be accessed
simultaneously by different bus masters.
7.2 ARM Cortex-M3 processor
The ARM Cortex-M3 is a general purpose, 32-bit microprocessor, which offers high
performance and very low power consumption. The ARM Cortex-M3 offers many new
features, including a Thumb-2 instruction set, low interrupt latency, hardware division,
hardware single-cycle multiply, interruptable/continuable multiple load and store
instructions, automatic state save and restore for interrupts, tightly integrated interrupt
controller with wake-up interrupt controller, and multiple core buses capable of
simultaneous accesses.
Pipeline techniques are employed so that all parts of the processing and memory systems
can operate continuously. Typically, while one instruction is being executed, its successor
is being decoded, and a third instruction is being fetched from memory.
The ARM Cortex-M3 processor is described in detail in the Cortex-M3 Technical
Reference Manual that can be found on official ARM website.
7.3 On-chip flash program memory
The LPC178x/7x contain up to 512 kB of on-chip flash program memory. A new two-port
flash accelerator maximizes performance for use with the two fast AHB-Lite buses.
7.4 EEPROM
The LPC178x/7x contains up to 4032 byte of on-chip byte-erasable and
byte-programmable EEPROM data memory.
7.5 On-chip SRAM
The LPC178x/7x contain a total of up to 96 kB on-chip static RAM data memory. This
includes the main 64 kB SRAM, accessible by the CPU and DMA controller on a
higher-speed bus, and up to two additional 16 kB each SRAM blocks situated on a
separate slave port on the AHB multilayer matrix.
This architecture allows CPU and DMA accesses to be spread over three separate RAMs
that can be accessed simultaneously.
7.6 Memory Protection Unit (MPU)
The LPC178x/7x have a Memory Protection Unit (MPU) which can be used to improve the
reliability of an embedded system by protecting critical data within the user application.
The MPU allows separating processing tasks by disallowing access to each other's data,
disabling access to memory regions, allowing memory regions to be defined as read-only
and detecting unexpected memory accesses that could potentially break the system.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 42 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
The MPU separates the memory into distinct regions and implements protection by
preventing disallowed accesses. The MPU supports up to eight regions each of which can
be divided into eight subregions. Accesses to memory locations that are not defined in the
MPU regions, or not permitted by the region setting, will cause the Memory Management
Fault exception to take place.
7.7 Memory map
The LPC178x/7x incorporate several distinct memory regions, shown in the following
figures. Figure 6 shows the overall map of the entire address space from the user
program viewpoint following reset. The interrupt vector area supports address remapping.
The AHB peripheral area is 2 MB in size, and is divided to allow for up to 128 peripherals.
The APB peripheral area is 1 MB in size and is divided to allow for up to 64 peripherals.
Each peripheral of either type is allocated 16 kB of space. This allows simplifying the
address decoding for each peripheral.
Table 6. LPC178x/177x memory usage and details
Address range General Use Address range details and description
0x0000 0000 to
0x1FFF FFFF
On-chip non-volatile
memory
0x0000 0000 - 0x0007 FFFF For devices with 512 kB of flash memory.
0x0000 0000 - 0x0003 FFFF For devices with 256 kB of flash memory.
0x0000 0000 - 0x0001 FFFF For devices with 128 kB of flash memory.
0x0000 0000 - 0x0000 FFFF For devices with 64 kB of flash memory.
On-chip main SRAM 0x1000 0000 - 0x1000 FFFF For devices with 64 kB of main SRAM.
0x1000 0000 - 0x1000 7FFF For devices with 32 kB of main SRAM.
0x1000 0000 - 0x1000 3FFF For devices with 16 kB of main SRAM.
Boot ROM 0x1FFF 0000 - 0x1FFF 1FFF 8 kB Boot ROM with flash services.
0x2000 0000 to
0x3FFF FFFF
On-chip SRAM
(typically used for
peripheral data)
0x2000 0000 - 0x2000 1FFF Peripheral RAM - bank 0 (first 8 kB)
0x2000 2000 - 0x2000 3FFF Peripheral RAM - bank 0 (second 8 kB)
0x2000 4000 - 0x2000 7FFF Peripheral RAM - bank 1 (16 kB)
AHB peripherals 0x2008 0000 - 0x200B FFFF See Figure 6 for details
0x4000 0000 to
0x7FFF FFFF
APB Peripherals 0x4000 0000 - 0x4007 FFFF APB0 Peripherals, up to 32 peripheral blocks of
16 kB each.
0x4008 0000 - 0x400F FFFF APB1 Peripherals, up to 32 peripheral blocks of
16 kB each.
0x8000 0000 to
0xDFFF FFFF
Off-chip Memory via
the External Memory
Controller
Four static memory chip selects:
0x8000 0000 - 0x83FF FFFF Static memory chip select 0 (up to 64 MB)
0x9000 0000 - 0x93FF FFFF Static memory chip select 1 (up to 64 MB)
0x9800 0000 - 0x9BFF FFFF Static memory chip select 2 (up to 64 MB)
0x9C00 0000 - 0x9FFF FFFF Static memory chip select 3 (up to 64 MB)
Four dynamic memory chip selects:
0xA000 0000 - 0xAFFF FFFF Dynamic memory chip select 0 (up to 256MB)
0xB000 0000 - 0xBFFF FFFF Dynamic memory chip select 1 (up to 256MB)
0xC000 0000 - 0xCFFF FFFF Dynamic memory chip select 2 (up to 256MB)
0xD000 0000 - 0xDFFF FFFF Dynamic memory chip select 3 (up to 256MB)
0xE000 0000 to
0xE00F FFFF
Cortex-M3 Private
Peripheral Bus
0xE000 0000 - 0xE00F FFFF Cortex-M3 related functions, includes the NVIC
and System Tick Timer.xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 43 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller (1) Not available on all parts. See Table 2 and Table 6. Fig 6. LPC178x/7x memory map
0x4000 4000
0x4000 8000
0x4000 C000
0x4001 0000
0x4001 8000
0x4002 0000
0x4002 8000
0x4002 C000
0x4003 4000
0x4003 0000
0x4003 8000
0x4003 C000
0x4004 0000
0x4004 4000
0x4004 8000
0x4004 C000
0x4005 C000
0x4006 0000
0x4008 0000
0x4002 4000
0x4001 C000
0x4001 4000
0x4000 0000
APB1 peripherals
0x4008 0000
0x4008 8000
0x4008 C000
0x4009 0000
0x4009 4000
0x4009 8000
0x4009 C000
0x400A 0000
0x400A 4000
0x400A 8000
0x400A C000
0x400B 0000
0x400B 4000
0x400B 8000
0x400B C000
0x400C 0000
0x400F C000
0x4010 0000
SSP0
DAC
timer 2
timer 3
UART2
UART3
USART4(1)
I
2C2
1 - 0 reserved
2
3
4
5
6
7
8
9
10
SSP2
I
2S
11
12
reserved
motor control PWM
reserved
30 - 17 reserved
13
14
15
16
31 system control
reserved
reserved
64 kB main static RAM(1)
EMC 4 x static chip select(1)
EMC 4 x dynamic chip select(1)
reserved
private peripheral bus
0 GB 0x0000 0000
0.5 GB
4 GB
1 GB
0x1000 0000
0x1001 0000
0x1FFF 0000
0x2000 0000
0x2000 8000
0x2008 0000
0x2200 0000
0x200A 0000
0x2400 0000
0x2800 0000
0x4000 0000
0x4008 0000
0x4010 0000
0x4200 0000
0x4400 0000
0x8000 0000
0xA000 0000
0xE000 0000
0xE010 0000
0xFFFF FFFF
reserved
reserved
reserved
reserved
reserved
reserved
APB0 peripherals
0xE004 0000
AHB peripherals
APB1 peripherals
peripheral
SRAM bit-band alias addressing
peripheral bit-band alias addressing
16 kB peripheral SRAM1(1) 0x2000 4000
16 kB peripheral SRAM0(1)
LPC178x/7x
0x0008 0000
512 kB on-chip flash(1)
QEI(1)
SD/MMC(1)
APB0 peripherals
WWDT
timer 0
timer 1
UART0
UART1
reserved
reserved
CAN AF RAM
CAN common
CAN1
CAN2
CAN AF registers
PWM0
I
2C0
RTC/event recorder
+ backup registers
GPIO interrupts
pin connect
SSP1
ADC
22 - 19 reserved
I
2C1
31 - 24 reserved
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
23
PWM1
8 kB boot ROM
0x0000 0000
0x0000 0400
active interrupt vectors
+ 256 words
I-code/D-code
memory space
002aaf574
reserved 0x1FFF 2000
0x2900 0000 reserved
reserved
0x2008 0000
0x2008 4000
0x2008 8000
0x2008 C000
0x200A 0000
0x2009 C000
AHB peripherals
LCD(1)
USB(1)
Ethernet(1)
0 GPDMA controller
1
2
3
0x2009 0000 4 CRC engine
0x2009 4000 5
0x2009 8000 GPIO
EMC registers
6
7LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 44 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
7.8 Nested Vectored Interrupt Controller (NVIC)
The NVIC is an integral part of the Cortex-M3. The tight coupling to the CPU allows for low
interrupt latency and efficient processing of late arriving interrupts.
7.8.1 Features
• Controls system exceptions and peripheral interrupts.
• On the LPC178x/7x, the NVIC supports 40 vectored interrupts.
• 32 programmable interrupt priority levels, with hardware priority level masking.
• Relocatable vector table.
• Non-Maskable Interrupt (NMI).
• Software interrupt generation.
7.8.2 Interrupt sources
Each peripheral device has one interrupt line connected to the NVIC but may have several
interrupt flags. Individual interrupt flags may also represent more than one interrupt
source.
Any pin on port 0 and port 2 regardless of the selected function can be programmed to
generate an interrupt on a rising edge, a falling edge, or both.
7.9 Pin connect block
The pin connect block allows selected pins of the microcontroller to have more than one
function. Configuration registers control the multiplexers to allow connection between the
pin and the on-chip peripherals.
Peripherals should be connected to the appropriate pins prior to being activated and prior
to any related interrupt(s) being enabled. Activity of any enabled peripheral function that is
not mapped to a related pin should be considered undefined.
Most pins can also be configured as open-drain outputs or to have a pull-up, pull-down, or
no resistor enabled.
7.10 External memory controller
Remark: Supported memory size and type and EMC bus width vary for different parts
(see Table 2). The EMC pin configuration for each part is shown in Table 7.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 45 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
Table 7. External memory controller pin configuration
Part Data bus pins Address bus
pins
Control pins
SRAM SDRAM
LPC1788FBD208 EMC_D[31:0] EMC_A[25:0] EMC_BLS[3:0],
EMC_CS[3:0],
EMC_OE, EMC_WE
EMC_RAS, EMC_CAS, EMC_DYCS[3:0],
EMC_CLK[1:0], EMC_CKE[3:0],
EMC_DQM[3:0]
LPC1788FET208 EMC_D[31:0] EMC_A[25:0] EMC_BLS[3:0],
EMC_CS[3:0],
EMC_OE, EMC_WE
EMC_RAS, EMC_CAS, EMC_DYCS[3:0],
EMC_CLK[1:0], EMC_CKE[3:0],
EMC_DQM[3:0]
LPC1788FET180 EMC_D[15:0] EMC_A[19:0] EMC_BLS[1:0],
EMC_CS[1:0],
EMC_OE, EMC_WE
EMC_RAS, EMC_CAS, EMC_DYCS[1:0],
EMC_CLK[1:0], EMC_CKE[1:0],
EMC_DQM[1:0]
LPC1788FBD144 EMC_D[7:0] EMC_A[15:0] EMC_BLS[3:2],
EMC_CS[1:0],
EMC_OE, EMC_WE
not available
LPC1787FBD208 EMC_D[31:0] EMC_A[25:0] EMC_BLS[3:0],
EMC_CS_[3:0],
EMC_OE, EMC_WE
EMC_RAS, EMC_CAS, EMC_DYCS[3:0],
EMC_CLK[1:0], EMC_CKE[3:0],
EMC_DQM[3:0]
LPC1786FBD208 EMC_D[31:0] EMC_A[25:0] EMC_BLS[3:0],
EMC_CS[3:0],
EMC_OE, EMC_WE
EMC_RAS, EMC_CAS, EMC_DYCS[3:0],
EMC_CLK[1:0], EMC_CKE[3:0],
EMC_DQM[3:0]
LPC1785FBD208 EMC_D[31:0] EMC_A[25:0] EMC_BLS[3:0],
EMC_CS[3:0],
EMC_OE, EMC_WE
EMC_RAS, EMC_CAS, EMC_DYCS[3:0],
EMC_CLK[1:0], EMC_CKE[3:0],
EMC_DQM[3:0]
LPC1778FBD208 EMC_D[31:0] EMC_A[25:0] EMC_BLS[3:0],
EMC_CS[3:0],
EMC_OE, EMC_WE
EMC_RAS, EMC_CAS, EMC_DYCS[3:0],
EMC_CLK[1:0], EMC_CKE[3:0],
EMC_DQM[3:0]
LPC1778FET208 EMC_D[31:0] EMC_A[25:0] EMC_BLS[3:0],
EMC_CS[3:0],
EMC_OE, EMC_WE
EMC_RAS, EMC_CAS, EMC_DYCS[3:0],
EMC_CLK[1:0], EMC_CKE[3:0],
EMC_DQM[3:0]
LPC1778FET180 EMC_D[15:0] EMC_A[19:0] EMC_BLS[1:0],
EMC_CS[1:0],
EMC_OE, EMC_WE
EMC_RAS, EMC_CAS, EMC_DYCS[1:0],
EMC_CLK[1:0], EMC_CKE[1:0],
EMC_DQM[1:0]
LPC1778FBD144 EMC_D[7:0] EMC_A[15:0] EMC_CS[1:0],
EMC_OE, EMC_WE
not available
LPC1777FBD208 EMC_D[31:0] EMC_A[25:0] EMC_BLS[3:0],
EMC_CS[3:0],
EMC_OE, EMC_WE
EMC_RAS, EMC_CAS, EMC_DYCS[3:0],
EMC_CLK[1:0], EMC_CKE[3:0],
EMC_DQM[3:0]
LPC1776FBD208 EMC_D[31:0] EMC_A[25:0] EMC_BLS[3:0],
EMC_CS[3:0],
EMC_OE, EMC_WE
EMC_RAS, EMC_CAS, EMC_DYCS[3:0],
EMC_CLK[1:0], EMC_CKE[3:0],
EMC_DQM[3:0]
LPC1776FET180 EMC_D[15:0] EMC_A[19:0] EMC_BLS[3:0],
EMC_CS[3:0],
EMC_OE, EMC_WE
EMC_RAS, EMC_CAS, EMC_DYCS[1:0],
EMC_CLK[1:0], EMC_CKE[1:0],
EMC_DQM[1:0]
LPC1774FBD208 EMC_D[31:0] EMC_A[25:0] EMC_BLS[3:0],
EMC_CS[3:0],
EMC_OE, EMC_WE
EMC_RAS, EMC_CAS, EMC_DYCS[3:0],
EMC_CLK[1:0], EMC_CKE[3:0],
EMC_DQM[3:0]
LPC1774FBD144 EMC_D[7:0] EMC_A[15:0] EMC_CS[1:0],
EMC_OE, EMC_WE
not availableLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 46 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
The LPC178x/7x EMC is an ARM PrimeCell MultiPort Memory Controller peripheral
offering support for asynchronous static memory devices such as RAM, ROM, and flash.
In addition, it can be used as an interface with off-chip memory-mapped devices and
peripherals. The EMC is an Advanced Microcontroller Bus Architecture (AMBA) compliant
peripheral.
See Table 6 for EMC memory access.
7.10.1 Features
• Dynamic memory interface support including single data rate SDRAM.
• Asynchronous static memory device support including RAM, ROM, and flash, with or
without asynchronous page mode.
• Low transaction latency.
• Read and write buffers to reduce latency and to improve performance.
• 8/16/32 data and 16/20/26 address lines wide static memory support.
• 16 bit and 32 bit wide chip select SDRAM memory support.
• Static memory features include:
– Asynchronous page mode read.
– Programmable Wait States.
– Bus turnaround delay.
– Output enable and write enable delays.
– Extended wait.
• Four chip selects for synchronous memory and four chip selects for static memory
devices.
• Power-saving modes dynamically control EMC_CKE and EMC_CLK outputs to
SDRAMs.
• Dynamic memory self-refresh mode controlled by software.
• Controller supports 2048 (A0 to A10), 4096 (A0 to A11), and 8192 (A0 to A12) row
address synchronous memory parts. That is typical 512 MB, 256 MB, and 128 MB
parts, with 4, 8, 16, or 32 data bits per device.
• Separate reset domains allow the for auto-refresh through a chip reset if desired.
Note: Synchronous static memory devices (synchronous burst mode) are not supported.
7.11 General purpose DMA controller
The GPDMA is an AMBA AHB compliant peripheral allowing selected peripherals to have
DMA support.
The GPDMA enables peripheral-to-memory, memory-to-peripheral,
peripheral-to-peripheral, and memory-to-memory transactions. The source and
destination areas can each be either a memory region or a peripheral and can be
accessed through the AHB master. The GPDMA controller allows data transfers between
the various on-chip SRAM areas and supports the SD/MMC card interface, all SSPs, the
I
2S, all UARTs, the A/D Converter, and the D/A Converter peripherals. DMA can also be
triggered by selected timer match conditions. Memory-to-memory transfers and transfers
to or from GPIO are supported. LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 47 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
7.11.1 Features
• Eight DMA channels. Each channel can support an unidirectional transfer.
• 16 DMA request lines.
• Single DMA and burst DMA request signals. Each peripheral connected to the DMA
Controller can assert either a burst DMA request or a single DMA request. The DMA
burst size is set by programming the DMA Controller.
• Memory-to-memory, memory-to-peripheral, peripheral-to-memory, and
peripheral-to-peripheral transfers are supported.
• Scatter or gather DMA is supported through the use of linked lists. This means that
the source and destination areas do not have to occupy contiguous areas of memory.
• Hardware DMA channel priority.
• AHB slave DMA programming interface. The DMA Controller is programmed by
writing to the DMA control registers over the AHB slave interface.
• One AHB bus master for transferring data. The interface transfers data when a DMA
request goes active.
• 32-bit AHB master bus width.
• Incrementing or non-incrementing addressing for source and destination.
• Programmable DMA burst size. The DMA burst size can be programmed to more
efficiently transfer data.
• Internal four-word FIFO per channel.
• Supports 8, 16, and 32-bit wide transactions.
• Big-endian and little-endian support. The DMA Controller defaults to little-endian
mode on reset.
• An interrupt to the processor can be generated on a DMA completion or when a DMA
error has occurred.
• Raw interrupt status. The DMA error and DMA count raw interrupt status can be read
prior to masking.
7.12 CRC engine
The Cyclic Redundancy Check (CRC) generator with programmable polynomial settings
supports several CRC standards commonly used. To save system power and bus
bandwidth, the CRC engine supports DMA transfers.
7.12.1 Features
• Supports three common polynomials CRC-CCITT, CRC-16, and CRC-32.
– CRC-CCITT: x16 + x12 + x5 + 1
– CRC-16: x16 + x15 + x2 + 1
– CRC-32: x32 + x26 + x23 + x22 + x16 + x12 + x11 + x10 + x8 + x7 + x5 + x4 + x2 + x + 1
• Bit order reverse and 1’s complement programmable setting for input data and CRC
sum.
• Programmable seed number setting.
• Supports CPU PIO or DMA back-to-back transfer.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 48 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
• Accept any size of data width per write: 8, 16 or 32-bit.
– 8-bit write: 1-cycle operation.
– 16-bit write: 2-cycle operation (8-bit x 2-cycle).
– 32-bit write: 4-cycle operation (8-bit x 4-cycle).
7.13 LCD controller
Remark: The LCD controller is available on parts LPC1788/87/86/85.
The LCD controller provides all of the necessary control signals to interface directly to a
variety of color and monochrome LCD panels. Both STN (single and dual panel) and TFT
panels can be operated. The display resolution is selectable and can be up to 1024 768
pixels. Several color modes are provided, up to a 24-bit true-color non-palettized mode.
An on-chip 512-byte color palette allows reducing bus utilization (i.e. memory size of the
displayed data) while still supporting a large number of colors.
The LCD interface includes its own DMA controller to allow it to operate independently of
the CPU and other system functions. A built-in FIFO acts as a buffer for display data,
providing flexibility for system timing. Hardware cursor support can further reduce the
amount of CPU time needed to operate the display.
7.13.1 Features
• AHB master interface to access frame buffer.
• Setup and control via a separate AHB slave interface.
• Dual 16-deep programmable 64-bit wide FIFOs for buffering incoming display data.
• Supports single and dual-panel monochrome Super Twisted Nematic (STN) displays
with 4-bit or 8-bit interfaces.
• Supports single and dual-panel color STN displays.
• Supports Thin Film Transistor (TFT) color displays.
• Programmable display resolution including, but not limited to: 320 200, 320 240,
640 200, 640 240, 640 480, 800 600, and 1024 768.
• Hardware cursor support for single-panel displays.
• 15 gray-level monochrome, 3375 color STN, and 32 K color palettized TFT support.
• 1, 2, or 4 bits-per-pixel (bpp) palettized displays for monochrome STN.
• 1, 2, 4, or 8 bpp palettized color displays for color STN and TFT.
• 16 bpp true-color non-palettized, for color STN and TFT.
• 24 bpp true-color non-palettized, for color TFT.
• Programmable timing for different display panels.
• 256 entry, 16-bit palette RAM, arranged as a 128 32-bit RAM.
• Frame, line, and pixel clock signals.
• AC bias signal for STN, data enable signal for TFT panels.
• Supports little and big-endian, and Windows CE data formats.
• LCD panel clock may be generated from the peripheral clock, or from a clock input
pin.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 49 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
7.14 Ethernet
Remark: The Ethernet block is available on parts LPC1788/86 and LPC1778/76.
The Ethernet block contains a full featured 10 Mbit/s or 100 Mbit/s Ethernet MAC
designed to provide optimized performance through the use of DMA hardware
acceleration. Features include a generous suite of control registers, half or full duplex
operation, flow control, control frames, hardware acceleration for transmit retry, receive
packet filtering and wake-up on LAN activity. Automatic frame transmission and reception
with scatter-gather DMA off-loads many operations from the CPU.
The Ethernet block and the CPU share the ARM Cortex-M3 D-code and system bus
through the AHB-multilayer matrix to access the various on-chip SRAM blocks for
Ethernet data, control, and status information.
The Ethernet block interfaces between an off-chip Ethernet PHY using the Media
Independent Interface (MII) or Reduced MII (RMII) protocol and the on-chip Media
Independent Interface Management (MIIM) serial bus.
7.14.1 Features
• Ethernet standards support:
– Supports 10 Mbit/s or 100 Mbit/s PHY devices including 10 Base-T, 100 Base-TX,
100 Base-FX, and 100 Base-T4.
– Fully compliant with IEEE standard 802.3.
– Fully compliant with 802.3x Full Duplex Flow Control and Half Duplex back
pressure.
– Flexible transmit and receive frame options.
– Virtual Local Area Network (VLAN) frame support
– .
• Memory management:
– Independent transmit and receive buffers memory mapped to shared SRAM.
– DMA managers with scatter/gather DMA and arrays of frame descriptors.
– Memory traffic optimized by buffering and pre-fetching.
• Enhanced Ethernet features:
– Receive filtering.
– Multicast and broadcast frame support for both transmit and receive.
– Optional automatic Frame Check Sequence (FCS) insertion with Circular
Redundancy Check (CRC) for transmit.
– Selectable automatic transmit frame padding.
– Over-length frame support for both transmit and receive allows any length frames.
– Promiscuous receive mode.
– Automatic collision back-off and frame retransmission.
– Includes power management by clock switching.
– Wake-on-LAN power management support allows system wake-up: using the
receive filters or a magic frame detection filter.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 50 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
• Physical interface:
– Attachment of external PHY chip through standard MII or RMII interface.
– PHY register access is available via the MIIM interface.
7.15 USB interface
Remark: The USB Device/Host/OTG controller is available on parts LPC1788/87/86/85
and LPC1778/77/76. The USB Device-only controller is available on parts LPC1774.
The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a
host and one or more (up to 127) peripherals. The host controller allocates the USB
bandwidth to attached devices through a token-based protocol. The bus supports hot
plugging and dynamic configuration of the devices. All transactions are initiated by the
host controller.
Details on typical USB interfacing solutions can be found in Section 14.1.
7.15.1 USB device controller
The device controller enables 12 Mbit/s data exchange with a USB host controller. It
consists of a register interface, serial interface engine, endpoint buffer memory, and a
DMA controller. The serial interface engine decodes the USB data stream and writes data
to the appropriate endpoint buffer. The status of a completed USB transfer or error
condition is indicated via status registers. An interrupt is also generated if enabled. When
enabled, the DMA controller transfers data between the endpoint buffer and the USB
RAM.
7.15.1.1 Features
• Fully compliant with USB 2.0 Specification (full speed).
• Supports 32 physical (16 logical) endpoints with a 4 kB endpoint buffer RAM.
• Supports Control, Bulk, Interrupt and Isochronous endpoints.
• Scalable realization of endpoints at run time.
• Endpoint Maximum packet size selection (up to USB maximum specification) by
software at run time.
• Supports SoftConnect and GoodLink features.
• While USB is in the Suspend mode, the LPC178x/7x can enter one of the reduced
power modes and wake up on USB activity.
• Supports DMA transfers with all on-chip SRAM blocks on all non-control endpoints.
• Allows dynamic switching between CPU-controlled and DMA modes.
• Double buffer implementation for Bulk and Isochronous endpoints.
7.15.2 USB host controller
The host controller enables full- and low-speed data exchange with USB devices attached
to the bus. It consists of register interface, serial interface engine and DMA controller. The
register interface complies with the Open Host Controller Interface (OHCI) specification.
7.15.2.1 Features
• OHCI compliant.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 51 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
• Two downstream ports.
• Supports per-port power switching.
7.15.3 USB OTG controller
USB OTG is a supplement to the USB 2.0 Specification that augments the capability of
existing mobile devices and USB peripherals by adding host functionality for connection to
USB peripherals.
The OTG Controller integrates the host controller, device controller, and a master-only I2C
interface to implement OTG dual-role device functionality. The dedicated I2C interface
controls an external OTG transceiver.
7.15.3.1 Features
• Fully compliant with On-The-Go supplement to the USB 2.0 Specification, Revision
1.0a.
• Hardware support for Host Negotiation Protocol (HNP).
• Includes a programmable timer required for HNP and Session Request Protocol
(SRP).
• Supports any OTG transceiver compliant with the OTG Transceiver Specification
(CEA-2011), Rev. 1.0.
7.16 SD/MMC card interface
Remark: The SD/MMC card interface is available on parts LPC1788/87/86/85 and parts
LPC1778/77/76.
The Secure Digital and Multimedia Card Interface (MCI) allows access to external SD
memory cards. The SD card interface conforms to the SD Multimedia Card Specification
Version 2.11.
7.16.1 Features
• The MCI provides all functions specific to the SD/MMC memory card. These include
the clock generation unit, power management control, and command and data
transfer.
• Conforms to Multimedia Card Specification v2.11.
• Conforms to Secure Digital Memory Card Physical Layer Specification, v0.96.
• Can be used as a multimedia card bus or a secure digital memory card bus host. The
SD/MMC can be connected to several multimedia cards or a single secure digital
memory card.
• DMA supported through the GPDMA controller.
7.17 Fast general purpose parallel I/O
Device pins that are not connected to a specific peripheral function are controlled by the
GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate
registers allow setting or clearing any number of outputs simultaneously. The value of the
output register may be read back as well as the current state of the port pins.
LPC178x/7x use accelerated GPIO functions:LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 52 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
• GPIO registers are accessed through the AHB multilayer bus so that the fastest
possible I/O timing can be achieved.
• Mask registers allow treating sets of port bits as a group, leaving other bits
unchanged.
• All GPIO registers are byte and half-word addressable.
• Entire port value can be written in one instruction.
• Support for Cortex-M3 bit banding.
• Support for use with the GPDMA controller.
Additionally, any pin on Port 0 and Port 2 providing a digital function can be programmed
to generate an interrupt on a rising edge, a falling edge, or both. The edge detection is
asynchronous, so it may operate when clocks are not present such as during Power-down
mode. Each enabled interrupt can be used to wake up the chip from Power-down mode.
7.17.1 Features
• Bit level set and clear registers allow a single instruction to set or clear any number of
bits in one port.
• Direction control of individual bits.
• All I/O default to inputs after reset.
• Pull-up/pull-down resistor configuration and open-drain configuration can be
programmed through the pin connect block for each GPIO pin.
7.18 12-bit ADC
The LPC178x/7x contain one ADC. It is a single 12-bit successive approximation ADC
with eight channels and DMA support.
7.18.1 Features
• 12-bit successive approximation ADC.
• Input multiplexing among eight pins.
• Power-down mode.
• Measurement range VSS to VREFP.
• 12-bit conversion rate: up to 400 kHz.
• Individual channels can be selected for conversion.
• Burst conversion mode for single or multiple inputs.
• Optional conversion on transition of input pin or Timer Match signal.
• Individual result registers for each ADC channel to reduce interrupt overhead.
• DMA support.
7.19 10-bit DAC
The LPC178x/7x contain one DAC. The DAC allows to generate a variable analog output.
The maximum output value of the DAC is VREFP.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 53 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
7.19.1 Features
• 10-bit DAC.
• Resistor string architecture.
• Buffered output.
• Power-down mode.
• Selectable output drive.
• Dedicated conversion timer.
• DMA support.
7.20 UARTs
Remark: USART4 is not available on part LPC1774FBD144.
The LPC178x/7x contain five UARTs. In addition to standard transmit and receive data
lines, UART1 also provides a full modem control handshake interface and support for
RS-485/9-bit mode allowing both software address detection and automatic address
detection using 9-bit mode.
The UARTs include a fractional baud rate generator. Standard baud rates such as
115200 Bd can be achieved with any crystal frequency above 2 MHz.
7.20.1 Features
• Maximum UART data bit rate of 7.5 MBit/s.
• 16 B Receive and Transmit FIFOs.
• Register locations conform to 16C550 industry standard.
• Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B.
• Built-in fractional baud rate generator covering wide range of baud rates without a
need for external crystals of particular values.
• Auto-baud capability.
• Fractional divider for baud rate control, auto baud capabilities and FIFO control
mechanism that enables software flow control implementation.
• Support for RS-485/9-bit/EIA-485 mode and multiprocessor addressing.
• All UARTs have DMA support for both transmit and receive.
• UART1 equipped with standard modem interface signals. This module also provides
full support for hardware flow control (auto-CTS/RTS).
• USART4 includes an IrDA mode to support infrared communication.
• USART4 supports synchronous mode and a smart card mode conforming to
ISO7816-3.
7.21 SSP serial I/O controller
The LPC178x/7x contain three SSP controllers. The SSP controller is capable of
operation on a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and
slaves on the bus. Only a single master and a single slave can communicate on the bus LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 54 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
during a given data transfer. The SSP supports full duplex transfers, with frames of 4 bits
to 16 bits of data flowing from the master to the slave and from the slave to the master. In
practice, often only one of these data flows carries meaningful data.
7.21.1 Features
• Maximum SSP speed of 33 Mbit/s (master) or 10 Mbit/s (slave).
• Compatible with Motorola SPI, 4-wire Texas Instruments SSI, and National
Semiconductor Microwire buses.
• Synchronous serial communication.
• Master or slave operation.
• 8-frame FIFOs for both transmit and receive.
• 4-bit to 16-bit frame.
• DMA transfers supported by GPDMA.
7.22 I2C-bus serial I/O controllers
The LPC178x/7x contain three I2C-bus controllers.
The I2C-bus is bidirectional for inter-IC control using only two wires: a Serial Clock Line
(SCL) and a Serial Data Line (SDA). Each device is recognized by a unique address and
can operate as either a receiver-only device (e.g., an LCD driver) or a transmitter with the
capability to both receive and send information (such as memory). Transmitters and/or
receivers can operate in either master or slave mode, depending on whether the chip has
to initiate a data transfer or is only addressed. The I2C is a multi-master bus and can be
controlled by more than one bus master connected to it.
7.22.1 Features
• All I2C-bus controllers can use standard GPIO pins with bit rates of up to 400 kbit/s
(Fast I2C-bus). The I2C0-bus interface uses special open-drain pins with bit rates of
up to 400 kbit/s.
• The I2C-bus interface supports Fast-mode Plus with bit rates up to 1 Mbit/s for I2C0
using pins P5[2] and P5[3].
• Easy to configure as master, slave, or master/slave.
• Programmable clocks allow versatile rate control.
• Bidirectional data transfer between masters and slaves.
• Multi-master bus (no central master).
• Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus.
• Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus.
• Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer.
• The I2C-bus can be used for test and diagnostic purposes.
• Both I2C-bus controllers support multiple address recognition and a bus monitor
mode.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 55 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
7.23 I2S-bus serial I/O controllers
The LPC178x/7x contain one I2S-bus interface. The I2S-bus provides a standard
communication interface for digital audio applications.
The I2S-bus specification defines a 3-wire serial bus using one data line, one clock line,
and one word select signal. The basic I2S connection has one master, which is always the
master, and one slave. The I2S interface on the LPC178x/7x provides a separate transmit
and receive channel, each of which can operate as either a master or a slave.
7.23.1 Features
• The interface has separate input/output channels each of which can operate in master
or slave mode.
• Capable of handling 8-bit, 16-bit, and 32-bit word sizes.
• Mono and stereo audio data supported.
• The sampling frequency can range from 16 kHz to 48 kHz (16, 22.05, 32, 44.1,
48) kHz.
• Configurable word select period in master mode (separately for I2S input and output).
• Two 8 word FIFO data buffers are provided, one for transmit and one for receive.
• Generates interrupt requests when buffer levels cross a programmable boundary.
• Two DMA requests, controlled by programmable buffer levels. These are connected
to the GPDMA block.
• Controls include reset, stop and mute options separately for I2S input and I2S output.
7.24 CAN controller and acceptance filters
The LPC178x/7x contain one CAN controller with two channels.
The Controller Area Network (CAN) is a serial communications protocol which efficiently
supports distributed real-time control with a very high level of security. Its domain of
application ranges from high-speed networks to low cost multiplex wiring.
The CAN block is intended to support multiple CAN buses simultaneously, allowing the
device to be used as a gateway, switch, or router between two of CAN buses in industrial
or automotive applications.
Each CAN controller has a register structure similar to the NXP SJA1000 and the PeliCAN
Library block, but the 8-bit registers of those devices have been combined in 32-bit words
to allow simultaneous access in the ARM environment. The main operational difference is
that the recognition of received Identifiers, known in CAN terminology as Acceptance
Filtering, has been removed from the CAN controllers and centralized in a global
Acceptance Filter.
7.24.1 Features
• Two CAN controllers and buses.
• Data rates to 1 Mbit/s on each bus.
• 32-bit register and RAM access.
• Compatible with CAN specification 2.0B, ISO 11898-1.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 56 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
• Global Acceptance Filter recognizes 11-bit and 29-bit receive identifiers for all CAN
buses.
• Acceptance Filter can provide FullCAN-style automatic reception for selected
Standard Identifiers.
• FullCAN messages can generate interrupts.
7.25 General purpose 32-bit timers/external event counters
The LPC178x/7x include four 32-bit timer/counters.
The timer/counter is designed to count cycles of the system derived clock or an
externally-supplied clock. It can optionally generate interrupts, generate timed DMA
requests, or perform other actions at specified timer values, based on four match
registers. Each timer/counter also includes two capture inputs to trap the timer value when
an input signal transitions, optionally generating an interrupt.
7.25.1 Features
• A 32-bit timer/counter with a programmable 32-bit prescaler.
• Counter or timer operation.
• Two 32-bit capture channels per timer, that can take a snapshot of the timer value
when an input signal transitions. A capture event may also generate an interrupt.
• Four 32-bit match registers that allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Up to four external outputs corresponding to match registers, with the following
capabilities:
– Set LOW on match.
– Set HIGH on match.
– Toggle on match.
– Do nothing on match.
• Up to two match registers can be used to generate timed DMA requests.
7.26 Pulse Width Modulator (PWM)
The LPC178x/7x contain two standard PWMs.
The PWM is based on the standard Timer block and inherits all of its features, although
only the PWM function is pinned out on the LPC178x/7x. The Timer is designed to count
cycles of the system derived clock and optionally switch pins, generate interrupts or
perform other actions when specified timer values occur, based on seven match registers.
The PWM function is in addition to these features, and is based on match register events.
The ability to separately control rising and falling edge locations allows the PWM to be
used for more applications. For instance, multi-phase motor control typically requires
three non-overlapping PWM outputs with individual control of all three pulse widths and
positions.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 57 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
Two match registers can be used to provide a single edge controlled PWM output. One
match register (PWMMR0) controls the PWM cycle rate, by resetting the count upon
match. The other match register controls the PWM edge position. Additional single edge
controlled PWM outputs require only one match register each, since the repetition rate is
the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a
rising edge at the beginning of each PWM cycle, when an PWMMR0 match occurs.
Three match registers can be used to provide a PWM output with both edges controlled.
Again, the PWMMR0 match register controls the PWM cycle rate. The other match
registers control the two PWM edge positions. Additional double edge controlled PWM
outputs require only two match registers each, since the repetition rate is the same for all
PWM outputs.
With double edge controlled PWM outputs, specific match registers control the rising and
falling edge of the output. This allows both positive going PWM pulses (when the rising
edge occurs prior to the falling edge), and negative going PWM pulses (when the falling
edge occurs prior to the rising edge).
7.26.1 Features
• LPC178x/7x has two PWM blocks with Counter or Timer operation (may use the
peripheral clock or one of the capture inputs as the clock source).
• Seven match registers allow up to 6 single edge controlled or 3 double edge
controlled PWM outputs, or a mix of both types. The match registers also allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Supports single edge controlled and/or double edge controlled PWM outputs. Single
edge controlled PWM outputs all go high at the beginning of each cycle unless the
output is a constant low. Double edge controlled PWM outputs can have either edge
occur at any position within a cycle. This allows for both positive going and negative
going pulses.
• Pulse period and width can be any number of timer counts. This allows complete
flexibility in the trade-off between resolution and repetition rate. All PWM outputs will
occur at the same repetition rate.
• Double edge controlled PWM outputs can be programmed to be either positive going
or negative going pulses.
• Match register updates are synchronized with pulse outputs to prevent generation of
erroneous pulses. Software must ‘release’ new match values before they can become
effective.
• May be used as a standard 32-bit timer/counter with a programmable 32-bit prescaler
if the PWM mode is not enabled.
7.27 Motor control PWM
The LPC178x/7x contain one motor control PWM.
The motor control PWM is a specialized PWM supporting 3-phase motors and other
combinations. Feedback inputs are provided to automatically sense rotor position and use
that information to ramp speed up or down. An abort input is also provided that causes the LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 58 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
PWM to immediately release all motor drive outputs. At the same time, the motor control
PWM is highly configurable for other generalized timing, counting, capture, and compare
applications.
The maximum PWM speed is determined by the PWM resolution (n) and the operating
frequency f: PWM speed = f/2n (see Table 8).
7.28 Quadrature Encoder Interface (QEI)
Remark: The QEI is available on parts LPC1788/87/86 and LPC1778/77/76
A quadrature encoder, also known as a 2-channel incremental encoder, converts angular
displacement into two pulse signals. By monitoring both the number of pulses and the
relative phase of the two signals, the user can track the position, direction of rotation, and
velocity. In addition, a third channel, or index signal, can be used to reset the position
counter. The quadrature encoder interface decodes the digital pulses from a quadrature
encoder wheel to integrate position over time and determine direction of rotation. In
addition, the QEI can capture the velocity of the encoder wheel.
7.28.1 Features
• Tracks encoder position.
• Increments/decrements depending on direction.
• Programmable for 2 or 4 position counting.
• Velocity capture using built-in timer.
• Velocity compare function with “less than” interrupt.
• Uses 32-bit registers for position and velocity.
• Three position compare registers with interrupts.
• Index counter for revolution counting.
• Index compare register with interrupts.
• Can combine index and position interrupts to produce an interrupt for whole and
partial revolution displacement.
• Digital filter with programmable delays for encoder input signals.
• Can accept decoded signal inputs (clk and direction).
• Connected to APB.
7.29 ARM Cortex-M3 system tick timer
The ARM Cortex-M3 includes a system tick timer (SYSTICK) that is intended to generate
a dedicated SYSTICK exception at a 10 ms interval. In the LPC178x/7x, this timer can be
clocked from the internal AHB clock or from a device pin.
Table 8. PWM speed at operating frequency 120 MHz
PWM resolution PWM speed
6 bit 1.875 MHz
8 bit 0.468 MHz
10 bit 0.117 MHzLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 59 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
7.30 Windowed WatchDog Timer (WWDT)
The purpose of the watchdog is to reset the controller if software fails to periodically
service it within a programmable time window.
7.30.1 Features
• Internally resets chip if not periodically reloaded during the programmable time-out
period.
• Optional windowed operation requires reload to occur between a minimum and
maximum time period, both programmable.
• Optional warning interrupt can be generated at a programmable time prior to
watchdog time-out.
• Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be
disabled.
• Incorrect feed sequence causes reset or interrupt if enabled.
• Flag to indicate watchdog reset.
• Programmable 24-bit timer with internal prescaler.
• Selectable time period from (Tcy(WDCLK) 256 4) to (Tcy(WDCLK) 224 4) in
multiples of Tcy(WDCLK) 4.
• The Watchdog Clock (WDCLK) source is a dedicated watchdog oscillator, which is
always running if the watchdog timer is enabled.
7.31 RTC and backup registers
The RTC is a set of counters for measuring time when system power is on, and optionally
when it is off. The RTC on the LPC178x/7x is designed to have very low power
consumption. The RTC will typically run from the main chip power supply conserving
battery power while the rest of the device is powered up. When operating from a battery,
the RTC will continue working down to 2.1 V. Battery power can be provided from a
standard 3 V lithium button cell.
An ultra-low power 32 kHz oscillator provides a 1 Hz clock to the time counting portion of
the RTC, moving most of the power consumption out of the time counting function.
The RTC includes a calibration mechanism to allow fine-tuning the count rate in a way
that will provide less than 1 second per day error when operated at a constant voltage and
temperature.
The RTC contains a small set of backup registers (20 bytes) for holding data while the
main part of the LPC178x/7x is powered off.
The RTC includes an alarm function that can wake up the LPC178x/7x from all reduced
power modes with a time resolution of 1 s.
7.31.1 Features
• Measures the passage of time to maintain a calendar and clock.
• Ultra low power design to support battery powered systems.
• Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and
Day of Year.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 60 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
• Dedicated power supply pin can be connected to a battery or to the main 3.3 V.
• Periodic interrupts can be generated from increments of any field of the time registers.
• Backup registers (20 bytes) powered by VBAT.
• RTC power supply is isolated from the rest of the chip.
7.32 Event monitor/recorder
The event monitor/recorder allows recording of tampering events in sealed product
enclosures. Sensors report any attempt to open the enclosure, or to tamper with the
device in any other way. The event monitor/recorder stores records of such events when
the device is powered only by the backup battery.
7.32.1 Features
• Supports three digital event inputs in the VBAT power domain.
• An event is defined as a level change at the digital event inputs.
• For each event channel, two timestamps mark the first and the last occurrence of an
event. Each channel also has a dedicated counter tracking the total number of events.
Timestamp values are taken from the RTC.
• Runs in VBAT power domain, independent of system power supply. The
event/recorder/monitor can therefore operate in Deep power-down mode.
• Very low power consumption.
• Interrupt available if system is running.
• A qualified event can be used as a wake-up trigger.
• State of event interrupts accessible by software through GPIO.
7.33 Clocking and power control
7.33.1 Crystal oscillators
The LPC178x/7x include four independent oscillators. These are the main oscillator, the
IRC oscillator, the watchdog oscillator, and the RTC oscillator.
Following reset, the LPC178x/7x will operate from the Internal RC oscillator until switched
by software. This allows systems to operate without any external crystal and the boot
loader code to operate at a known frequency.
See Figure 7 for an overview of the LPC178x/7x clock generation.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 61 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
7.33.1.1 Internal RC oscillator
The IRC may be used as the clock that drives the PLL and subsequently the CPU. The
nominal IRC frequency is 12 MHz. The IRC is trimmed to 1 % accuracy over the entire
voltage and temperature range.
Upon power-up or any chip reset, the LPC178x/7x use the IRC as the clock source.
Software may later switch to one of the other available clock sources.
7.33.1.2 Main oscillator
The main oscillator can be used as the clock source for the CPU, with or without using the
PLL. The main oscillator also provides the clock source for the alternate PLL1.
The main oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can be
boosted to a higher frequency, up to the maximum CPU operating frequency, by the main
PLL. The clock selected as the PLL input is PLLCLKIN. The ARM processor clock
frequency is referred to as CCLK elsewhere in this document. The frequencies of
PLLCLKIN and CCLK are the same value unless the PLL is active and connected. The
clock frequency for each peripheral can be selected individually and is referred to as
PCLK. Refer to Section 7.33.2 for additional information.
Fig 7. LPC178x/7x clock generation block diagram
MAIN PLL0
IRC oscillator
main oscillator
(osc_clk)
CLKSRCSEL
(system clock select)
sysclk
pll_clk
CCLKSEL
(CPU clock select)
002aaf531
pll_clk
ALT PLL1
CPU CLOCK
DIVIDER
alt_pll_clk
cclk
PERIPHERAL
CLOCK DIVIDER pclk
EMC
CLOCK DIVIDER emc_clk
sysclk
alt_pll_clk
pll_clk
USBCLKSEL
(USB clock select)
USB
CLOCK DIVIDER usb_clk
sysclk
LPC178x/7xLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 62 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
7.33.1.3 RTC oscillator
The RTC oscillator provides a 1 Hz clock to the RTC and a 32 kHz clock output that can
be output on the CLKOUT pin in order to allow trimming the RTC oscillator without
interference from a probe.
7.33.1.4 Watchdog oscillator
The Watchdog Timer has a dedicated watchdog oscillator that provides a 500 kHz clock to
the Watchdog Timer. The watchdog oscillator is always running if the Watchdog Timer is
enabled. The Watchdog oscillator clock can be output on the CLKOUT pin in order to
allow observe its frequency.
In order to allow Watchdog Timer operation with minimum power consumption, which can
be important in reduced power modes, the Watchdog oscillator frequency is not tightly
controlled. The Watchdog oscillator frequency will vary over temperature and power
supply within a particular part, and may vary by processing across different parts. This
variation should be taken into account when determining Watchdog reload values.
Within a particular part, temperature and power supply variations can produce up to a
17 % frequency variation. Frequency variation between devices under the same
operating conditions can be up to 30 %.
7.33.2 Main PLL (PLL0) and Alternate PLL (PLL1)
PLL0 (also called the Main PLL) and PLL1 (also called the Alternate PLL) are functionally
identical but have somewhat different input possibilities and output connections. These
possibilities are shown in Figure 7. The Main PLL can receive its input from either the IRC
or the main oscillator and can potentially be used to provide the clocks to nearly
everything on the device. The Alternate PLL receives its input only from the main oscillator
and is intended to be used as an alternate source of clocking to the USB. The USB has
timing needs that may not always be filled by the Main PLL.
Both PLLs are disabled and powered off on reset. If the Alternate PLL is left disabled, the
USB clock can be supplied by PLL0 if everything is set up to provide 48 MHz to the USB
clock through that route. The source for each clock must be selected via the CLKSEL
registers and can be further reduced by clock dividers as needed.
PLL0 accepts an input clock frequency from either the IRC or the main oscillator. If only
the Main PLL is used, then its output frequency must be an integer multiple of all other
clocks needed in the system. PLL1 takes its input only from the main oscillator, requiring
an external crystal in the range of 10 to 25 MHz. In each PLL, the Current Controlled
Oscillator (CCO) operates in the range of 156 MHz to 320 MHz, so there are additional
dividers to bring the output down to the desired frequencies. The minimum output divider
value is 2, insuring that the output of the PLLs have a 50 % duty cycle.
If the USB is used, the possibilities for the CPU clock and other clocks will be limited by
the requirements that the frequency be precise and very low jitter, and that the PLL0
output must be a multiple of 48 MHz. Even multiples of 48 MHz that are within the
operating range of the PLL are 192 MHz and 288 MHz. Also, only the main oscillator in
conjunction with the PLL can meet the precision and jitter specifications for USB. It is due
to these limitations that the Alternate PLL is provided.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 63 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
The alternate PLL accepts an input clock frequency from the main oscillator in the range
of 10 MHz to 25 MHz only. When used as the USB clock, the input frequency is multiplied
up to a multiple of 48 MHz (192 MHz or 288 MHz as described above).
7.33.3 Wake-up timer
The LPC178x/7x begin operation at power-up and when awakened from Power-down
mode by using the 12 MHz IRC oscillator as the clock source. This allows chip operation
to resume quickly. If the main oscillator or the PLL is needed by the application, software
will need to enable these features and wait for them to stabilize before they are used as a
clock source.
When the main oscillator is initially activated, the wake-up timer allows software to ensure
that the main oscillator is fully functional before the processor uses it as a clock source
and starts to execute instructions. This is important at power on, all types of reset, and
whenever any of the aforementioned functions are turned off for any reason. Since the
oscillator and other functions are turned off during Power-down mode, any wake-up of the
processor from Power-down mode makes use of the wake-up Timer.
The wake-up timer monitors the crystal oscillator to check whether it is safe to begin code
execution. When power is applied to the chip, or when some event caused the chip to exit
Power-down mode, some time is required for the oscillator to produce a signal of sufficient
amplitude to drive the clock logic. The amount of time depends on many factors, including
the rate of VDD(3V3) ramp (in the case of power on), the type of crystal and its electrical
characteristics (if a quartz crystal is used), as well as any other external circuitry (e.g.,
capacitors), and the characteristics of the oscillator itself under the existing ambient
conditions.
7.33.4 Power control
The LPC178x/7x support a variety of power control features. There are four special
modes of processor power reduction: Sleep mode, Deep-sleep mode, Power-down mode,
and Deep power-down mode. The CPU clock rate may also be controlled as needed by
changing clock sources, reconfiguring PLL values, and/or altering the CPU clock divider
value. This allows a trade-off of power versus processing speed based on application
requirements. In addition, the peripheral power control allows shutting down the clocks to
individual on-chip peripherals, allowing fine tuning of power consumption by eliminating all
dynamic power use in any peripherals that are not required for the application. Each of the
peripherals has its own clock divider which provides even better power control.
The integrated PMU (Power Management Unit) automatically adjusts internal regulators
to minimize power consumption during Sleep, Deep-sleep, Power-down, and Deep
power-down modes.
The LPC178x/7x also implement a separate power domain to allow turning off power to
the bulk of the device while maintaining operation of the RTC and a small set of registers
for storing data during any of the power-down modes.
7.33.4.1 Sleep mode
When Sleep mode is entered, the clock to the core is stopped. Resumption from the Sleep
mode does not need any special sequence other than re-enabling the clock to the ARM
core.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 64 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
In Sleep mode, execution of instructions is suspended until either a Reset or interrupt
occurs. Peripheral functions continue operation during Sleep mode and may generate
interrupts to cause the processor to resume execution. Sleep mode eliminates dynamic
power used by the processor itself, memory systems and related controllers, and internal
buses.
The DMA controller can continue to work in Sleep mode and has access to the peripheral
RAMs and all peripheral registers. The flash memory and the main SRAM are not
available in Sleep mode, they are disabled in order to save power.
Wake-up from Sleep mode will occur whenever any enabled interrupt occurs.
7.33.4.2 Deep-sleep mode
In Deep-sleep mode, the oscillator is shut down and the chip receives no internal clocks.
The processor state and registers, peripheral registers, and internal SRAM values are
preserved throughout Deep-sleep mode and the logic levels of chip pins remain static.
The output of the IRC is disabled but the IRC is not powered down to allow fast wake-up.
The RTC oscillator is not stopped because the RTC interrupts may be used as the
wake-up source. The PLL is automatically turned off and disconnected. The clock divider
registers are automatically reset to zero.
The Deep-sleep mode can be terminated and normal operation resumed by either a
Reset or certain specific interrupts that are able to function without clocks. Since all
dynamic operation of the chip is suspended, Deep-sleep mode reduces chip power
consumption to a very low value. Power to the flash memory is left on in Deep-sleep
mode, allowing a very quick wake-up.
Wake-up from Deep-sleep mode can initiated by the NMI, External Interrupts EINT0
through EINT3, GPIO interrupts, the Ethernet Wake-on-LAN interrupt, Brownout Detect,
an RTC Alarm interrupt, a USB input pin transition (USB activity interrupt), a CAN input
pin transition, or a Watchdog Timer time-out, when the related interrupt is enabled.
Wake-up will occur whenever any enabled interrupt occurs.
On wake-up from Deep-sleep mode, the code execution and peripherals activities will
resume after four cycles expire if the IRC was used before entering Deep-sleep mode. If
the main external oscillator was used, the code execution will resume when 4096 cycles
expire. PLL and clock dividers need to be reconfigured accordingly.
7.33.4.3 Power-down mode
Power-down mode does everything that Deep-sleep mode does but also turns off the
power to the IRC oscillator and the flash memory. This saves more power but requires
waiting for resumption of flash operation before execution of code or data access in the
flash memory can be accomplished.
When the chip enters Power-down mode, the IRC, the main oscillator, and all clocks are
stopped. The RTC remains running if it has been enabled and RTC interrupts may be
used to wake up the CPU. The flash is forced into Power-down mode. The PLLs are
automatically turned off and the clock selection multiplexers are set to use the system
clock sysclk (the reset state). The clock divider control registers are automatically reset to
zero. If the Watchdog timer is running, it will continue running in Power-down mode.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 65 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
On the wake-up of Power-down mode, if the IRC was used before entering Power-down
mode, it will take IRC 60 s to start-up. After this, four IRC cycles will expire before the
code execution can then be resumed if the code was running from SRAM. In the
meantime, the flash wake-up timer then counts 12 MHz IRC clock cycles to make the
100 s flash start-up time. When it times out, access to the flash will be allowed. Users
need to reconfigure the PLL and clock dividers accordingly.
7.33.4.4 Deep power-down mode
In Deep power-down mode, power is shut off to the entire chip with the exception of the
RTC module and the RESET pin.
To optimize power conservation, the user has the additional option of turning off or
retaining power to the 32 kHz oscillator. It is also possible to use external circuitry to turn
off power to the on-chip regulator via the VDD(REG)(3V3) pins and/or the I/O power via the
VDD(3V3) pins after entering Deep Power-down mode. Power must be restored before
device operation can be restarted.
The LPC178x/7x can wake up from Deep power-down mode via the RESET pin or an
alarm match event of the RTC.
7.33.4.5 Wake-up Interrupt Controller (WIC)
The WIC allows the CPU to automatically wake up from any enabled priority interrupt that
can occur while the clocks are stopped in Deep-sleep, Power-down, and Deep
power-down modes.
The WIC works in connection with the Nested Vectored Interrupt Controller (NVIC). When
the CPU enters Deep-sleep, Power-down, or Deep power-down mode, the NVIC sends a
mask of the current interrupt situation to the WIC.This mask includes all of the interrupts
that are both enabled and of sufficient priority to be serviced immediately. With this
information, the WIC simply notices when one of the interrupts has occurred and then it
wakes up the CPU.
The WIC eliminates the need to periodically wake up the CPU and poll the interrupts
resulting in additional power savings.
7.33.5 Peripheral power control
A power control for peripherals feature allows individual peripherals to be turned off if they
are not needed in the application, resulting in additional power savings.
7.33.6 Power domains
The LPC178x/7x provide two independent power domains that allow the bulk of the
device to have power removed while maintaining operation of the RTC and the backup
registers.
On the LPC178x/7x, I/O pads are powered by VDD(3V3), while VDD(REG)(3V3) powers the
on-chip voltage regulator which in turn provides power to the CPU and most of the
peripherals.
Depending on the LPC178x/7x application, a design can use two power options to
manage power consumption.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 66 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
The first option assumes that power consumption is not a concern and the design ties the
VDD(3V3) and VDD(REG)(3V3) pins together. This approach requires only one 3.3 V power
supply for both pads, the CPU, and peripherals. While this solution is simple, it does not
support powering down the I/O pad ring “on the fly” while keeping the CPU and
peripherals alive.
The second option uses two power supplies; a 3.3 V supply for the I/O pads (VDD(3V3)) and
a dedicated 3.3 V supply for the CPU (VDD(REG)(3V3)). Having the on-chip voltage regulator
powered independently from the I/O pad ring enables shutting down of the I/O pad power
supply “on the fly” while the CPU and peripherals stay active.
The VBAT pin supplies power only to the RTC domain. The RTC operates at very low
power, which can be supplied by an external battery. The device core power
(VDD(REG)(3V3)) is used to operate the RTC whenever VDD(REG)(3V3) is present. There is no
power drain from the RTC battery when VDD(REG)(3V3) is at nominal levels and
VDD(REG)(3V3) > VBAT.
Fig 8. Power distribution
REAL-TIME CLOCK
BACKUP REGISTERS
REGULATOR
32 kHz
OSCILLATOR
POWER
SELECTOR
ULTRA-LOW
POWER
REGULATOR
RTC POWER DOMAIN
MAIN POWER DOMAIN
002aaf530
RTCX1
VBAT
(typical 3.0 V)
VDD(REG)(3V3)
(typical 3.3 V)
RTCX2
VDD(3V3)
VSS
to memories,
peripherals,
oscillators,
PLLs
to core
to I/O pads
ADC
DAC
ADC POWER DOMAIN
VDDA
VREFP
VSSA
LPC178x/7xLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 67 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
7.34 System control
7.34.1 Reset
Reset has four sources on the LPC178x/7x: the RESET pin, the Watchdog reset,
Power-On Reset (POR), and the BrownOut Detection (BOD) circuit. The RESET pin is a
Schmitt trigger input pin. Assertion of chip Reset by any source, once the operating
voltage attains a usable level, starts the Wake-up timer (see description in
Section 7.33.3), causing reset to remain asserted until the external Reset is de-asserted,
the oscillator is running, a fixed number of clocks have passed, and the flash controller
has completed its initialization.
When the internal Reset is removed, the processor begins executing at address 0, which
is initially the Reset vector mapped from the boot block. At that point, all of the processor
and peripheral registers have been initialized to predetermined values.
7.34.2 Brownout detection
The LPC178x/7x include 2-stage monitoring of the voltage on the VDD(REG)(3V3) pins. If this
voltage falls below 2.2 V (typical), the BOD asserts an interrupt signal to the Vectored
Interrupt Controller. This signal can be enabled for interrupt in the Interrupt Enable
Register in the NVIC in order to cause a CPU interrupt; if not, software can monitor the
signal by reading a dedicated status register.
The second stage of low-voltage detection asserts a reset to inactivate the LPC178x/7x
when the voltage on the VDD(REG)(3V3) pins falls below 1.85 V (typical). This reset prevents
alteration of the flash as operation of the various elements of the chip would otherwise
become unreliable due to low voltage. The BOD circuit maintains this reset down below
1 V, at which point the power-on reset circuitry maintains the overall reset.
Both the 2.2 V and 1.85 V thresholds include some hysteresis. In normal operation, this
hysteresis allows the 2.2 V detection to reliably interrupt, or a regularly executed event
loop to sense the condition.
7.34.3 Code security (Code Read Protection - CRP)
This feature of the LPC178x/7x allows user to enable different levels of security in the
system so that access to the on-chip flash and use of the JTAG and ISP can be restricted.
When needed, CRP is invoked by programming a specific pattern into a dedicated flash
location. IAP commands are not affected by the CRP.
There are three levels of the Code Read Protection.
CRP1 disables access to chip via the JTAG and allows partial flash update (excluding
flash sector 0) using a limited set of the ISP commands. This mode is useful when CRP is
required and flash field updates are needed but all sectors can not be erased.
CRP2 disables access to chip via the JTAG and only allows full flash erase and update
using a reduced set of the ISP commands.
Running an application with level CRP3 selected fully disables any access to chip via the
JTAG pins and the ISP. This mode effectively disables ISP override using P2[10] pin, too.
It is up to the user’s application to provide (if needed) flash update mechanism using IAP
calls or call reinvoke ISP command to enable flash update via UART0.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 68 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
7.34.4 APB interface
The APB peripherals are split into two separate APB buses in order to distribute the bus
bandwidth and thereby reducing stalls caused by contention between the CPU and the
GPDMA controller.
7.34.5 AHB multilayer matrix
The LPC178x/7x use an AHB multilayer matrix. This matrix connects the instruction
(I-code) and data (D-code) CPU buses of the ARM Cortex-M3 to the flash memory, the
main (64 kB) SRAM, and the Boot ROM. The GPDMA can also access all of these
memories. Additionally, the matrix connects the CPU system bus and all of the DMA
controllers to the various peripheral functions.
7.34.6 External interrupt inputs
The LPC178x/7x include up to 30 edge sensitive interrupt inputs combined with one level
sensitive external interrupt input as selectable pin function. The external interrupt input
can optionally be used to wake up the processor from Power-down mode.
7.34.7 Memory mapping control
The Cortex-M3 incorporates a mechanism that allows remapping the interrupt vector table
to alternate locations in the memory map. This is controlled via the Vector Table Offset
Register contained in the NVIC.
The vector table may be located anywhere within the bottom 1 GB of Cortex-M3 address
space. The vector table must be located on a 128 word (512 byte) boundary because the
NVIC on the LPC178x/7x is configured for 128 total interrupts.
7.35 Debug control
Debug and trace functions are integrated into the ARM Cortex-M3. Serial wire debug and
trace functions are supported in addition to a standard JTAG debug and parallel trace
functions. The ARM Cortex-M3 is configured to support up to eight breakpoints and four
watch points.
CAUTION
If level three Code Read Protection (CRP3) is selected, no future factory testing can be
performed on the device.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 69 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
8. Limiting values
[1] The following applies to the limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[2] Including voltage on outputs in 3-state mode.
[3] Not to exceed 4.6 V.
[4] The maximum non-operating storage temperature is different than the temperature for required shelf life which should be determined
based on the required shelf lifetime. Please refer to the JEDEC spec for further details.
[5] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
Table 9. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol Parameter Conditions Min Max Unit
VDD(3V3) supply voltage (3.3 V) external rail 2.4 3.6 V
VDD(REG)(3V3) regulator supply voltage (3.3 V) 2.4 3.6 V
VDDA analog 3.3 V pad supply voltage 0.5 +4.6 V
Vi(VBAT) input voltage on pin VBAT for the RTC 0.5 +4.6 V
Vi(VREFP) input voltage on pin VREFP 0.5 +4.6 V
VIA analog input voltage on ADC related
pins
0.5 +5.1 V
VI input voltage 5 V tolerant digital
I/O pins;
VDD(3V3) 2.4V
[2] 0.5 +5.5 V
VDD(3V3) 0 V 0.5 +3.6 V
other I/O pins [2][3] 0.5 VDD(3V3) +
0.5
V
IDD supply current per supply pin - 100 mA
ISS ground current per ground pin - 100 mA
Ilatch I/O latch-up current (0.5VDD(3V3)) < VI
< (1.5VDD(3V3));
Tj
< 125 C
- 100 mA
Tstg storage temperature non-operating [4] 65 +150 C
Ptot(pack) total power dissipation (per package) based on package
heat transfer, not
device power
consumption
- 1.5 W
VESD electrostatic discharge voltage human body
model; all pins
[5] - 4000 VLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 70 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
9. Thermal characteristics
The average chip junction temperature, Tj (C), can be calculated using the following
equation:
(1)
• Tamb = ambient temperature (C),
• Rth(j-a) = the package junction-to-ambient thermal resistance (C/W)
• PD = sum of internal and I/O power dissipation
Table 10. Thermal characteristics
VDD = 3.0 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified;
Symbol Parameter Min Typ Max Unit
Tj(max) maximum junction
temperature
- - 125 C
Table 11. Thermal resistance (LQFP packages)
Tamb = 40 C to +85 C unless otherwise specified.
Symbol Conditions Thermal resistance in C/W ±15 %
LQFP208 LQFP144
ja JEDEC (4.5 in 4 in)
0 m/s 27.4 31.5
1 m/s 25.7 28.1
2.5 m/s 24.4 26.2
Single-layer (4.5 in 3 in)
0 m/s 35.4 43.2
1 m/s 31.2 35.7
2.5 m/s 29.2 32.8
jc - 8.8 7.8
jb - 15.4 13.8
Table 12. Thermal resistance value (TFBGA packages)
Tamb = 40 C to +85 C unless otherwise specified.
Symbol Conditions Thermal resistance in C/W ±15 %
TFBGA208 TFBGA180
ja JEDEC (4.5 in 4 in)
0 m/s 41 45.5
1 m/s 35 38.3
2.5 m/s 31 33.8
8-layer (4.5 in 3 in)
0 m/s 34.9 38
1 m/s 30.9 33.5
2.5 m/s 28 29.8
jc - 8.3 8.9
jb - 13.6 12
Tj Tamb PD Rth j a – += LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 71 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
10. Static characteristics
Table 13. Static characteristics
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol Parameter Conditions Min Typ[1] Max Unit
Supply pins
VDD(3V3) supply voltage (3.3 V) external rail [2] 2.4 3.3 3.6 V
VDD(REG)(3V3) regulator supply voltage
(3.3 V)
2.4 3.3 3.6 V
VDDA analog 3.3 V pad supply
voltage
[3] 2.7 3.3 3.6 V
Vi(VBAT) input voltage on pin
VBAT
[4] 2.1 3.0 3.6 V
Vi(VREFP) input voltage on pin
VREFP
[3] 2.7 3.3 VDDA V
IDD(REG)(3V3) regulator supply current
(3.3 V)
active mode; code
while(1){}
executed from flash; all
peripherals disabled
PCLK = CCLK/4
CCLK = 12 MHz; PLL
disabled
[5][6] - 7- mA
CCLK = 120 MHz; PLL
enabled
[5][7] - 51- mA
active mode; code
while(1){}
executed from flash; all
peripherals enabled;
PCLK = CCLK/4
CCLK = 12 MHz; PLL
disabled
[5][6] 14
CCLK = 120 MHz; PLL
enabled
[5][7] 100 mA
Sleep mode [5][8] - 5- mA
Deep-sleep mode [5][9] - 550 - A
Power-down mode [5][9] - 280 - A
IBAT battery supply current RTC running;
part powered down;
VDD(REG)(3V3) =0 V;
Vi(VBAT) = 3.0 V;
VDD(3V3) = 0 V.
[10] -
1 - A
part powered;
VDD(REG)(3V3) = 3.3 V;
Vi(VBAT) = 3.0 V
[11] <10 nALPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 72 of 122
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
Standard port pins, RESET
IIL LOW-level input current VI = 0 V; on-chip pull-up
resistor disabled
- 0.5 10 nA
IIH HIGH-level input
current
VI = VDD(3V3); on-chip
pull-down resistor
disabled
- 0.5 10 nA
IOZ OFF-state output
current
VO = 0 V; VO = VDD(3V3);
on-chip pull-up/down
resistors disabled
- 0.5 10 nA
VI input voltage pin configured to provide
a digital function
[15][16]
[17]
0- 5.0 V
VO output voltage output active 0 - VDD(3V3) V
VIH HIGH-level input
voltage
0.7VDD(3V3) --V
VIL LOW-level input voltage - - 0.3VDD(3V3) V
Vhys hysteresis voltage 0.4 - - V
VOH HIGH-level output
voltage
IOH = 4 mA VDD(3V3)
0.4
--V
VOL LOW-level output
voltage
IOL = 4 mA --0.4 V
IOH HIGH-level output
current
VOH = VDD(3V3) 0.4 V 4 - - mA
IOL LOW-level output
current
VOL = 0.4 V 4- - mA
IOHS HIGH-level short-circuit
output current
VOH =0V [18] - - 45 mA
IOLS LOW-level short-circuit
output current
VOL = VDD(3V3) [18] --50 mA
Ipd pull-down current VI =5V 10 50 150 A
Ipu pull-up current VI =0V 15 50 85 A
VDD(3V3) < VI <5V 0 0 0 A
I
2C-bus pins (P0[27] and P0[28])
VIH HIGH-level input
voltage
0.7VDD(3V3) --V
VIL LOW-level input voltage - - 0.3VDD(3V3) V
Vhys hysteresis voltage - 0.05
VDD(3V3)
- V
VOL LOW-level output
voltage
IOLS = 3 mA --0.4 V
ILI input leakage current VI = VDD(3V3) [19] - 24 A
VI =5V - 10 22 A
USB pins
IOZ OFF-state output
current
0V>
NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
22. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 5
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 8
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 9
7 Functional description . . . . . . . . . . . . . . . . . . 40
7.1 Architectural overview . . . . . . . . . . . . . . . . . . 40
7.2 ARM Cortex-M3 processor . . . . . . . . . . . . . . . 41
7.3 On-chip flash program memory . . . . . . . . . . . 41
7.4 EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
7.5 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 41
7.6 Memory Protection Unit (MPU). . . . . . . . . . . . 41
7.7 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 42
7.8 Nested Vectored Interrupt Controller (NVIC) . 44
7.8.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
7.8.2 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 44
7.9 Pin connect block . . . . . . . . . . . . . . . . . . . . . . 44
7.10 External memory controller. . . . . . . . . . . . . . . 44
7.10.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
7.11 General purpose DMA controller . . . . . . . . . . 46
7.11.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
7.12 CRC engine . . . . . . . . . . . . . . . . . . . . . . . . . . 47
7.12.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
7.13 LCD controller. . . . . . . . . . . . . . . . . . . . . . . . . 48
7.13.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
7.14 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
7.14.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
7.15 USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 50
7.15.1 USB device controller . . . . . . . . . . . . . . . . . . . 50
7.15.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
7.15.2 USB host controller. . . . . . . . . . . . . . . . . . . . . 50
7.15.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
7.15.3 USB OTG controller . . . . . . . . . . . . . . . . . . . . 51
7.15.3.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
7.16 SD/MMC card interface . . . . . . . . . . . . . . . . . 51
7.16.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
7.17 Fast general purpose parallel I/O . . . . . . . . . . 51
7.17.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
7.18 12-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
7.18.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
7.19 10-bit DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
7.19.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
7.20 UARTs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
7.20.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
7.21 SSP serial I/O controller. . . . . . . . . . . . . . . . . 53
7.21.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
7.22 I2C-bus serial I/O controllers . . . . . . . . . . . . . 54
7.22.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
7.23 I2S-bus serial I/O controllers . . . . . . . . . . . . . 55
7.23.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
7.24 CAN controller and acceptance filters . . . . . . 55
7.24.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
7.25 General purpose 32-bit timers/external
event counters . . . . . . . . . . . . . . . . . . . . . . . . 56
7.25.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
7.26 Pulse Width Modulator (PWM). . . . . . . . . . . . 56
7.26.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
7.27 Motor control PWM . . . . . . . . . . . . . . . . . . . . 57
7.28 Quadrature Encoder Interface (QEI) . . . . . . . 58
7.28.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
7.29 ARM Cortex-M3 system tick timer . . . . . . . . . 58
7.30 Windowed WatchDog Timer (WWDT) . . . . . . 59
7.30.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
7.31 RTC and backup registers . . . . . . . . . . . . . . . 59
7.31.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
7.32 Event monitor/recorder . . . . . . . . . . . . . . . . . 60
7.32.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
7.33 Clocking and power control . . . . . . . . . . . . . . 60
7.33.1 Crystal oscillators. . . . . . . . . . . . . . . . . . . . . . 60
7.33.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . . 61
7.33.1.2 Main oscillator . . . . . . . . . . . . . . . . . . . . . . . . 61
7.33.1.3 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 62
7.33.1.4 Watchdog oscillator . . . . . . . . . . . . . . . . . . . . 62
7.33.2 Main PLL (PLL0) and Alternate PLL (PLL1) . 62
7.33.3 Wake-up timer . . . . . . . . . . . . . . . . . . . . . . . . 63
7.33.4 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 63
7.33.4.1 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 63
7.33.4.2 Deep-sleep mode. . . . . . . . . . . . . . . . . . . . . . 64
7.33.4.3 Power-down mode . . . . . . . . . . . . . . . . . . . . . 64
7.33.4.4 Deep power-down mode . . . . . . . . . . . . . . . . 65
7.33.4.5 Wake-up Interrupt Controller (WIC) . . . . . . . . 65
7.33.5 Peripheral power control . . . . . . . . . . . . . . . . 65
7.33.6 Power domains . . . . . . . . . . . . . . . . . . . . . . . 65
7.34 System control . . . . . . . . . . . . . . . . . . . . . . . . 67
7.34.1 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
7.34.2 Brownout detection . . . . . . . . . . . . . . . . . . . . 67
7.34.3 Code security (Code Read Protection - CRP) 67
7.34.4 APB interface . . . . . . . . . . . . . . . . . . . . . . . . . 68
7.34.5 AHB multilayer matrix . . . . . . . . . . . . . . . . . . 68
7.34.6 External interrupt inputs . . . . . . . . . . . . . . . . . 68
7.34.7 Memory mapping control . . . . . . . . . . . . . . . . 68
7.35 Debug control. . . . . . . . . . . . . . . . . . . . . . . . . 68NXP Semiconductors LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
© NXP Semiconductors N.V. 2014. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 9 September 2014
Document identifier: LPC178X_7X
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 69
9 Thermal characteristics . . . . . . . . . . . . . . . . . 70
10 Static characteristics. . . . . . . . . . . . . . . . . . . . 71
10.1 Power consumption . . . . . . . . . . . . . . . . . . . . 74
10.2 Peripheral power consumption . . . . . . . . . . . . 76
10.3 Electrical pin characteristics . . . . . . . . . . . . . . 78
11 Dynamic characteristics . . . . . . . . . . . . . . . . . 80
11.1 Flash memory. . . . . . . . . . . . . . . . . . . . . . . . . 80
11.2 External memory interface . . . . . . . . . . . . . . . 81
11.3 External clock . . . . . . . . . . . . . . . . . . . . . . . . . 87
11.4 Internal oscillators. . . . . . . . . . . . . . . . . . . . . . 87
11.5 I/O pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
11.6 SSP interface . . . . . . . . . . . . . . . . . . . . . . . . . 88
11.7 I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
11.8 I2S-bus interface. . . . . . . . . . . . . . . . . . . . . . . 91
11.9 LCD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
11.10 SD/MMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
12 ADC electrical characteristics . . . . . . . . . . . . 94
13 DAC electrical characteristics . . . . . . . . . . . . 97
14 Application information. . . . . . . . . . . . . . . . . . 98
14.1 Suggested USB interface solutions . . . . . . . . 98
14.2 Crystal oscillator XTAL input and component
selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
14.3 XTAL Printed-Circuit Board (PCB) layout
guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
14.4 Standard I/O pin configuration . . . . . . . . . . . 104
14.5 Reset pin configuration. . . . . . . . . . . . . . . . . 105
14.6 Reset pin configuration for RTC operation . . 105
15 Package outline . . . . . . . . . . . . . . . . . . . . . . . 107
16 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
17 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . 114
18 References . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
19 Revision history. . . . . . . . . . . . . . . . . . . . . . . 116
20 Legal information. . . . . . . . . . . . . . . . . . . . . . 119
20.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . 119
20.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . 119
20.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 119
20.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . 120
21 Contact information. . . . . . . . . . . . . . . . . . . . 120
22 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
1. General description
The LPC4350/30/20/10 are ARM Cortex-M4 based microcontrollers for embedded
applications which include an ARM Cortex-M0 coprocessor, up to 264 kB of SRAM,
advanced configurable peripherals such as the State Configurable Timer/PWM
(SCTimer/PWM) and the Serial General-Purpose I/O (SGPIO) interface, two High-speed
USB controllers, Ethernet, LCD, an external memory controller, and multiple digital and
analog peripherals. The LPC4350/30/20/10 operate at CPU frequencies of up to 204
MHz.
The ARM Cortex-M4 is a next generation 32-bit core that offers system enhancements
such as low power consumption, enhanced debug features, and a high level of support
block integration. The ARM Cortex-M4 CPU incorporates a 3-stage pipeline, uses a
Harvard architecture with separate local instruction and data buses as well as a third bus
for peripherals, and includes an internal prefetch unit that supports speculative branching.
The ARM Cortex-M4 supports single-cycle digital signal processing and SIMD
instructions. A hardware floating-point processor is integrated in the core.
The ARM Cortex-M0 coprocessor is an energy-efficient and easy-to-use 32-bit core which
is code- and tool-compatible with the Cortex-M4 core. The Cortex-M0 coprocessor offers
up to 204 MHz performance with a simple instruction set and reduced code size.
See Section 17 “References” for additional documentation.
2. Features and benefits
Cortex-M4 Processor core
ARM Cortex-M4 processor, running at frequencies of up to 204 MHz.
ARM Cortex-M4 built-in Memory Protection Unit (MPU) supporting eight regions.
ARM Cortex-M4 built-in Nested Vectored Interrupt Controller (NVIC).
Hardware floating-point unit.
Non-maskable Interrupt (NMI) input.
JTAG and Serial Wire Debug (SWD), serial trace, eight breakpoints, and four watch
points.
Enhanced Trace Module (ETM) and Enhanced Trace Buffer (ETB) support.
System tick timer.
Cortex-M0 Processor core
ARM Cortex-M0 co-processor capable of off-loading the main ARM Cortex-M4
application processor.
Running at frequencies of up to 204 MHz.
JTAG and built-in NVIC.
LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 flashless MCU; up to 264 kB SRAM;
Ethernet; two HS USBs; advanced configurable peripherals
Rev. 4.2 — 18 August 2014 Product data sheetLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 2 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
On-chip memory
Up to 264 kB SRAM for code and data use.
Multiple SRAM blocks with separate bus access. Two SRAM blocks can be
powered down individually.
64 kB ROM containing boot code and on-chip software drivers.
64 bit + 256 bit general-purpose One-Time Programmable (OTP) memory.
Clock generation unit
Crystal oscillator with an operating range of 1 MHz to 25 MHz.
12 MHz Internal RC (IRC) oscillator trimmed to 1.5 % accuracy over temperature
and voltage.
Ultra-low power Real-Time Clock (RTC) crystal oscillator.
Three PLLs allow CPU operation up to the maximum CPU rate without the need for
a high-frequency crystal. The second PLL is dedicated to the High-speed USB, the
third PLL can be used as audio PLL.
Clock output.
Configurable digital peripherals
Serial GPIO (SGPIO) interface.
State Configurable Timer (SCTimer/PWM) subsystem on AHB.
Global Input Multiplexer Array (GIMA) allows to cross-connect multiple inputs and
outputs to event driven peripherals like the timers, SCT, and ADC0/1.
Serial interfaces
Quad SPI Flash Interface (SPIFI) with 1-, 2-, or 4-bit data at rates of up to
52 MB per second.
10/100T Ethernet MAC with RMII and MII interfaces and DMA support for high
throughput at low CPU load. Support for IEEE 1588 time stamping/advanced time
stamping (IEEE 1588-2008 v2).
One High-speed USB 2.0 Host/Device/OTG interface with DMA support and
on-chip high-speed PHY (USB0).
One High-speed USB 2.0 Host/Device interface with DMA support, on-chip
full-speed PHY and ULPI interface to external high-speed PHY (USB1).
USB interface electrical test software included in ROM USB stack.
Four 550 UARTs with DMA support: one UART with full modem interface; one
UART with IrDA interface; three USARTs support UART synchronous mode and a
smart card interface conforming to ISO7816 specification.
Up to two C_CAN 2.0B controllers with one channel each. Use of C_CAN controller
excludes operation of all other peripherals connected to the same bus bridge. See
Figure 1 and Ref. 2.
Two SSP controllers with FIFO and multi-protocol support. Both SSPs with DMA
support.
One SPI controller.
One Fast-mode Plus I2C-bus interface with monitor mode and with open-drain I/O
pins conforming to the full I2C-bus specification. Supports data rates of up to
1 Mbit/s.
One standard I2C-bus interface with monitor mode and with standard I/O pins.
Two I2S interfaces, each with DMA support and with one input and one output.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 3 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
Digital peripherals
External Memory Controller (EMC) supporting external SRAM, ROM, NOR flash,
and SDRAM devices.
LCD controller with DMA support and a programmable display resolution of up to
1024 H 768 V. Supports monochrome and color STN panels and TFT color
panels; supports 1/2/4/8 bpp Color Look-Up Table (CLUT) and 16/24-bit direct pixel
mapping.
Secure Digital Input Output (SD/MMC) card interface.
Eight-channel General-Purpose DMA controller can access all memories on the
AHB and all DMA-capable AHB slaves.
Up to 164 General-Purpose Input/Output (GPIO) pins with configurable
pull-up/pull-down resistors.
GPIO registers are located on the AHB for fast access. GPIO ports have DMA
support.
Up to eight GPIO pins can be selected from all GPIO pins as edge and level
sensitive interrupt sources.
Two GPIO group interrupt modules enable an interrupt based on a programmable
pattern of input states of a group of GPIO pins.
Four general-purpose timer/counters with capture and match capabilities.
One motor control Pulse Width Modulator (PWM) for three-phase motor control.
One Quadrature Encoder Interface (QEI).
Repetitive Interrupt timer (RI timer).
Windowed watchdog timer (WWDT).
Ultra-low power Real-Time Clock (RTC) on separate power domain with 256 bytes
of battery powered backup registers.
Alarm timer; can be battery powered.
Analog peripherals
One 10-bit DAC with DMA support and a data conversion rate of 400 kSamples/s.
Two 10-bit ADCs with DMA support and a data conversion rate of 400 kSamples/s.
Up to eight input channels per ADC.
Unique ID for each device.
Power
Single 3.3 V (2.2 V to 3.6 V) power supply with on-chip internal voltage regulator for
the core supply and the RTC power domain.
RTC power domain can be powered separately by a 3 V battery supply.
Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep
power-down.
Processor wake-up from Sleep mode via wake-up interrupts from various
peripherals.
Wake-up from Deep-sleep, Power-down, and Deep power-down modes via
external interrupts and interrupts generated by battery powered blocks in the RTC
power domain.
Brownout detect with four separate thresholds for interrupt and forced reset.
Power-On Reset (POR).
Available as LBGA256, TFBGA180, and TFBGA100 packages and as LQFP144
package.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 4 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
3. Applications
Motor control Embedded audio applications
Power management Industrial automation
White goods e-metering
RFID readersLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 5 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
4. Ordering information
4.1 Ordering options
Table 1. Ordering information
Type number Package
Name Description Version
LPC4350FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17 17 1 mm SOT740-2
LPC4350FET180 TFBGA180 Thin fine-pitch ball grid array package; 180 balls SOT570-3
LPC4330FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17 17 1 mm SOT740-2
LPC4330FET180 TFBGA180 Thin fine-pitch ball grid array package; 180 balls SOT570-3
LPC4330FET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9 9 0.7 mm SOT926-1
LPC4330FBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm SOT486-1
LPC4320FET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9 9 0.7 mm SOT926-1
LPC4320FBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm SOT486-1
LPC4310FET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9 9 0.7 mm SOT926-1
LPC4310FBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm SOT486-1
Table 2. Ordering options
Type number Total
SRAM
LCD Ethernet USB0
(Host,
Device,
OTG)
USB1
(Host,
Device)/
ULPI
interface
ADC
channels
PWM QEI GPIO Package
LPC4350FET256 264 kB yes yes yes yes/yes 8 yes yes 164 LBGA256
LPC4350FET180 264 kB yes yes yes yes/yes 8 yes yes 118 TFBGA180
LPC4330FET256 264 kB no yes yes yes/yes 8 yes yes 164 LBGA256
LPC4330FET180 264 kB no yes yes yes/yes 8 yes yes 118 TFBGA180
LPC4330FET100 264 kB no yes yes yes/no 4 no no 49 TFBGA100
LPC4330FBD144 264 kB no yes yes yes/no 8 yes no 83 LQFP144
LPC4320FET100 200 kB no no yes no 4 no no 49 TFBGA100
LPC4320FBD144 200 kB no no yes no 8 yes no 83 LQFP144
LPC4310FET100 168 kB no no no no 4 no no 49 TFBGA100
LPC4310FBD144 168 kB no no no no 8 yes no 83 LQFP144LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 6 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
5. Block diagram
(1) Not available on all parts (see Table 2).
Fig 1. LPC4350/30/20/10 Block diagram
ARM
CORTEX-M4
TEST/DEBUG
INTERFACE I-code bus D-code bus
system bus
DMA LCD(1) SD/
MMC
ETHERNET(1)
10/100
MAC
IEEE 1588
HIGH-SPEED
USB0(1)
HOST/
DEVICE/OTG
HIGH-SPEED
USB1(1)
HOST/DEVICE
EMC
HIGH-SPEED PHY
32 kB AHB SRAM
16 +16 kB AHB SRAM
SPIFI
AES ENCRYPTION/
DECRYPTION(2)
HS GPIO
SPI
SGPIO
SCT
64 kB ROM
I
2C0
I
2S0
I
2S1
C_CAN1
MOTOR
CONTROL
PWM(1)
TIMER3
TIMER2
USART2
USART3
SSP1
RI TIMER
QEI(1)
GIMA
BRIDGE 0 BRIDGE 1 BRIDGE 2 BRIDGE 3 BRIDGE
BRIDGE
AHB MULTILAYER MATRIX
LPC4350/30/20/20/10
128 kB LOCAL SRAM
72 kB LOCAL SRAM
10-bit ADC0
10-bit ADC1
C_CAN0
I
2C1
10-bit DAC
BRIDGE
RGU
CCU2
CGU
CCU1
ALARM TIMER
CONFIGURATION
REGISTERS
OTP MEMORY
EVENT ROUTER
POWER MODE CONTROL
12 MHz IRC
RTC POWER DOMAIN
BACKUP REGISTERS
RTC RTC OSC
002aaf772
slaves
slaves
masters
ARM
CORTEX-M0
TEST/DEBUG
INTERFACE
= connected to GPDMA
GPIO
INTERRUPTS
GPIO GROUP0
INTERRUPT
GPIO GROUP1
INTERRUPT
WWDT
USART0
UART1
SSP0
TIMER0
TIMER1
SCULPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 7 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
6. Pinning information
6.1 Pinning
6.2 Pin description
On the LPC4350/30/20/10, digital pins are grouped into 16 ports, named P0 to P9 and PA
to PF, with up to 20 pins used per port. Each digital pin can support up to eight different
digital functions, including General-Purpose I/O (GPIO), selectable through the System
Configuration Unit (SCU) registers. The pin name is not indicative of the GPIO port
assigned to it.
Fig 2. Pin configuration LBGA256 package Fig 3. Pin configuration TFBGA180 package
002aaf813
LPC4350/30FET256
Transparent top view
T
R
P
N
M
L
J
G
K
H
F
E
D
C
B
A
2 4 6 8 10 12
13
14
15
16
1 3 5 7 9 11
ball A1
index area
002aag374
LPC4350/30FET180
Transparent top view
N
L
P
M
K
J
H
G
F
D
B
E
C
A
2 4 6 8 10 12
13
14
1 3 5 7 9 11
ball A1
index area
Fig 4. Pin configuration TFBGA100 package Fig 5. Pin configuration LQFP144 package
002aag375
LPC4330/20/10FET100
Transparent top view
J
G
K
H
F
E
D
C
B
A
13579 2 4 6 8 10
ball A1
index area
LPC4330/20/10FBD144
72
1
36
108
73
37
109
144
002aag377LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 8 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
Not all functions listed in Table 3 are available on all packages. See Table 2 for availability
of USB0, USB1, Ethernet, and LCD functions.
The parts contain two 10-bit ADCs (ADC0 and ADC1). The input channels of ADC0 and
ADC1 on dedicated pins and multiplexed pins are combined in such a way that all channel
0 inputs (named ADC0_0 and ADC1_0) are tied together and connected to both, channel
0 on ADC0 and channel 0 on ADC1, channel 1 inputs (named ADC0_1 and ADC1_1) are
tied together and connected to channel 1 on ADC0 and ADC1, and so forth. There are
eight ADC channels total for the two ADCs.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 9 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
Table 3. Pin description
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
Description
Multiplexed digital pins
P0_0 L3 K3 G2 32 [2] N;
PU
I/O GPIO0[0] — General purpose digital input/output pin.
I/O SSP1_MISO — Master In Slave Out for SSP1.
I ENET_RXD1 — Ethernet receive data 1 (RMII/MII interface).
I/O SGPIO0 — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
I/O I2S0_TX_WS — Transmit Word Select. It is driven by the
master and received by the slave. Corresponds to the signal
WS in the I
2S-bus specification.
I/O I2S1_TX_WS — Transmit Word Select. It is driven by the
master and received by the slave. Corresponds to the signal
WS in the I
2S-bus specification.
P0_1 M2 K2 G1 34 [2] N;
PU
I/O GPIO0[1] — General purpose digital input/output pin.
I/O SSP1_MOSI — Master Out Slave in for SSP1.
I ENET_COL — Ethernet Collision detect (MII interface).
I/O SGPIO1 — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
ENET_TX_EN — Ethernet transmit enable (RMII/MII
interface).
I/O I2S1_TX_SDA — I2S1 transmit data. It is driven by the
transmitter and read by the receiver. Corresponds to the signal
SD in the I
2S-bus specification.
P1_0 P2 L1 H1 38 [2] N;
PU
I/O GPIO0[4] — General purpose digital input/output pin.
I CTIN_3 — SCTimer/PWM input 3. Capture input 1 of timer 1.
I/O EMC_A5 — External memory address line 5.
- R — Function reserved.
- R — Function reserved.
I/O SSP0_SSEL — Slave Select for SSP0.
I/O SGPIO7 — General purpose digital input/output pin.
- R — Function reserved.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 10 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P1_1 R2 N1 K2 42 [2] N;
PU
I/O GPIO0[8] — General purpose digital input/output pin. Boot pin
(see Table 5).
O CTOUT_7 — SCTimer/PWM output 7. Match output 3 of timer
1.
I/O EMC_A6 — External memory address line 6.
I/O SGPIO8 — General purpose digital input/output pin.
- R — Function reserved.
I/O SSP0_MISO — Master In Slave Out for SSP0.
- R — Function reserved.
- R — Function reserved.
P1_2 R3 N2 K1 43 [2] N;
PU
I/O GPIO0[9] — General purpose digital input/output pin. Boot pin
(see Table 5).
O CTOUT_6 — SCTimer/PWM output 6. Match output 2 of timer
1.
I/O EMC_A7 — External memory address line 7.
I/O SGPIO9 — General purpose digital input/output pin.
- R — Function reserved.
I/O SSP0_MOSI — Master Out Slave in for SSP0.
- R — Function reserved.
- R — Function reserved.
P1_3 P5 M2 J1 44 [2] N;
PU
I/O GPIO0[10] — General purpose digital input/output pin.
O CTOUT_8 — SCTimer/PWM output 8. Match output 0 of timer
2.
I/O SGPIO10 — General purpose digital input/output pin.
O EMC_OE — LOW active Output Enable signal.
O USB0_IND1 — USB0 port indicator LED control
output 1.
I/O SSP1_MISO — Master In Slave Out for SSP1.
- R — Function reserved.
O SD_RST — SD/MMC reset signal for MMC4.4 card.
P1_4 T3 P2 J2 47 [2] N;
PU
I/O GPIO0[11] — General purpose digital input/output pin.
O CTOUT_9 — SCTimer/PWM output 9. Match output 3 of timer
3.
I/O SGPIO11 — General purpose digital input/output pin.
O EMC_BLS0 — LOW active Byte Lane select signal 0.
O USB0_IND0 — USB0 port indicator LED control output 0.
I/O SSP1_MOSI — Master Out Slave in for SSP1.
- R — Function reserved.
O SD_VOLT1 — SD/MMC bus voltage select output 1.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 11 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P1_5 R5 N3 J4 48 [2] N;
PU
I/O GPIO1[8] — General purpose digital input/output pin.
O CTOUT_10 — SCTimer/PWM output 10. Match output 3 of
timer 3.
- R — Function reserved.
O EMC_CS0 — LOW active Chip Select 0 signal.
I USB0_PWR_FAULT — Port power fault signal indicating
overcurrent condition; this signal monitors over-current on the
USB bus (external circuitry required to detect over-current
condition).
I/O SSP1_SSEL — Slave Select for SSP1.
I/O SGPIO15 — General purpose digital input/output pin.
O SD_POW — SD/MMC power monitor output.
P1_6 T4 P3 K4 49 [2] N;
PU
I/O GPIO1[9] — General purpose digital input/output pin.
I CTIN_5 — SCTimer/PWM input 5. Capture input 2 of timer 2.
- R — Function reserved.
O EMC_WE — LOW active Write Enable signal.
- R — Function reserved.
- R — Function reserved.
I/O SGPIO14 — General purpose digital input/output pin.
I/O SD_CMD — SD/MMC command signal.
P1_7 T5 N4 G4 50 [2] N;
PU
I/O GPIO1[0] — General purpose digital input/output pin.
I U1_DSR — Data Set Ready input for UART1.
O CTOUT_13 — SCTimer/PWM output 13. Match output 3 of
timer 3.
I/O EMC_D0 — External memory data line 0.
O USB0_PPWR — VBUS drive signal (towards external charge
pump or power management unit); indicates that VBUS must
be driven (active HIGH).
Add a pull-down resistor to disable the power switch at reset.
This signal has opposite polarity compared to the USB_PPWR
used on other NXP LPC parts.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 12 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P1_8 R7 M5 H5 51 [2] N;
PU
I/O GPIO1[1] — General purpose digital input/output pin.
O U1_DTR — Data Terminal Ready output for UART1.
O CTOUT_12 — SCTimer/PWM output 12. Match output 3 of
timer 3.
I/O EMC_D1 — External memory data line 1.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
O SD_VOLT0 — SD/MMC bus voltage select output 0.
P1_9 T7 N5 J5 52 [2] N;
PU
I/O GPIO1[2] — General purpose digital input/output pin.
O U1_RTS — Request to Send output for UART1.
O CTOUT_11 — SCTimer/PWM output 11. Match output 3 of
timer 2.
I/O EMC_D2 — External memory data line 2.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
I/O SD_DAT0 — SD/MMC data bus line 0.
P1_10 R8 N6 H6 53 [2] N;
PU
I/O GPIO1[3] — General purpose digital input/output pin.
I U1_RI — Ring Indicator input for UART1.
O CTOUT_14 — SCTimer/PWM output 14. Match output 2 of
timer 3.
I/O EMC_D3 — External memory data line 3.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
I/O SD_DAT1 — SD/MMC data bus line 1.
P1_11 T9 P8 J7 55 [2] N;
PU
I/O GPIO1[4] — General purpose digital input/output pin.
I U1_CTS — Clear to Send input for UART1.
O CTOUT_15 — SCTimer/PWM output 15. Match output 3 of
timer 3.
I/O EMC_D4 — External memory data line 4.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
I/O SD_DAT2 — SD/MMC data bus line 2.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 13 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P1_12 R9 P7 K7 56 [2] N;
PU
I/O GPIO1[5] — General purpose digital input/output pin.
I U1_DCD — Data Carrier Detect input for UART1.
- R — Function reserved.
I/O EMC_D5 — External memory data line 5.
I T0_CAP1 — Capture input 1 of timer 0.
- R — Function reserved.
I/O SGPIO8 — General purpose digital input/output pin.
I/O SD_DAT3 — SD/MMC data bus line 3.
P1_13 R10 L8 H8 60 [2] N;
PU
I/O GPIO1[6] — General purpose digital input/output pin.
O U1_TXD — Transmitter output for UART1.
- R — Function reserved.
I/O EMC_D6 — External memory data line 6.
I T0_CAP0 — Capture input 0 of timer 0.
- R — Function reserved.
I/O SGPIO9 — General purpose digital input/output pin.
I SD_CD — SD/MMC card detect input.
P1_14 R11 K7 J8 61 [2] N;
PU
I/O GPIO1[7] — General purpose digital input/output pin.
I U1_RXD — Receiver input for UART1.
- R — Function reserved.
I/O EMC_D7 — External memory data line 7.
O T0_MAT2 — Match output 2 of timer 0.
- R — Function reserved.
I/O SGPIO10 — General purpose digital input/output pin.
- R — Function reserved.
P1_15 T12 P11 K8 62 [2] N;
PU
I/O GPIO0[2] — General purpose digital input/output pin.
O U2_TXD — Transmitter output for USART2.
I/O SGPIO2 — General purpose digital input/output pin.
I ENET_RXD0 — Ethernet receive data 0 (RMII/MII interface).
O T0_MAT1 — Match output 1 of timer 0.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 14 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P1_16 M7 L5 H9 64 [2] N;
PU
I/O GPIO0[3] — General purpose digital input/output pin.
I U2_RXD — Receiver input for USART2.
I/O SGPIO3 — General purpose digital input/output pin.
I ENET_CRS — Ethernet Carrier Sense (MII interface).
O T0_MAT0 — Match output 0 of timer 0.
- R — Function reserved.
- R — Function reserved.
I ENET_RX_DV — Ethernet Receive Data Valid (RMII/MII
interface).
P1_17 M8 L6 H10 66 [3] N;
PU
I/O GPIO0[12] — General purpose digital input/output pin.
I/O U2_UCLK — Serial clock input/output for USART2 in
synchronous mode.
- R — Function reserved.
I/O ENET_MDIO — Ethernet MIIM data input and output.
I T0_CAP3 — Capture input 3 of timer 0.
O CAN1_TD — CAN1 transmitter output.
I/O SGPIO11 — General purpose digital input/output pin.
- R — Function reserved.
P1_18 N12 N10 J10 67 [2] N;
PU
I/O GPIO0[13] — General purpose digital input/output pin.
I/O U2_DIR — RS-485/EIA-485 output enable/direction control for
USART2.
- R — Function reserved.
O ENET_TXD0 — Ethernet transmit data 0 (RMII/MII interface).
O T0_MAT3 — Match output 3 of timer 0.
I CAN1_RD — CAN1 receiver input.
I/O SGPIO12 — General purpose digital input/output pin.
- R — Function reserved.
P1_19 M11 N9 K9 68 [2] N;
PU
I ENET_TX_CLK (ENET_REF_CLK) — Ethernet Transmit
Clock (MII interface) or Ethernet Reference Clock (RMII
interface).
I/O SSP1_SCK — Serial clock for SSP1.
- R — Function reserved.
- R — Function reserved.
O CLKOUT — Clock output pin.
- R — Function reserved.
O I2S0_RX_MCLK — I2S receive master clock.
I/O I2S1_TX_SCK — Transmit Clock. It is driven by the master
and received by the slave. Corresponds to the signal SCK in
the I2S-bus specification.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 15 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P1_20 M10 J10 K10 70 [2] N;
PU
I/O GPIO0[15] — General purpose digital input/output pin.
I/O SSP1_SSEL — Slave Select for SSP1.
- R — Function reserved.
O ENET_TXD1 — Ethernet transmit data 1 (RMII/MII interface).
I T0_CAP2 — Capture input 2 of timer 0.
- R — Function reserved.
I/O SGPIO13 — General purpose digital input/output pin.
- R — Function reserved.
P2_0 T16 N14 G10 75 [2] N;
PU
I/O SGPIO4 — General purpose digital input/output pin.
O U0_TXD — Transmitter output for USART0.
I/O EMC_A13 — External memory address line 13.
O USB0_PPWR — VBUS drive signal (towards external charge
pump or power management unit); indicates that VBUS must
be driven (active HIGH).
Add a pull-down resistor to disable the power switch at reset.
This signal has opposite polarity compared to the USB_PPWR
used on other NXP LPC parts.
I/O GPIO5[0] — General purpose digital input/output pin.
- R — Function reserved.
I T3_CAP0 — Capture input 0 of timer 3.
O ENET_MDC — Ethernet MIIM clock.
P2_1 N15 M13 G7 81 [2] N;
PU
I/O SGPIO5 — General purpose digital input/output pin.
I U0_RXD — Receiver input for USART0.
I/O EMC_A12 — External memory address line 12.
I USB0_PWR_FAULT — Port power fault signal indicating
overcurrent condition; this signal monitors over-current on the
USB bus (external circuitry required to detect over-current
condition).
I/O GPIO5[1] — General purpose digital input/output pin.
- R — Function reserved.
I T3_CAP1 — Capture input 1 of timer 3.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 16 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P2_2 M15 L13 F5 84 [2] N;
PU
I/O SGPIO6 — General purpose digital input/output pin.
I/O U0_UCLK — Serial clock input/output for USART0 in
synchronous mode.
I/O EMC_A11 — External memory address line 11.
O USB0_IND1 — USB0 port indicator LED control output 1.
I/O GPIO5[2] — General purpose digital input/output pin.
I CTIN_6 — SCTimer/PWM input 6. Capture input 1 of timer 3.
I T3_CAP2 — Capture input 2 of timer 3.
- R — Function reserved.
P2_3 J12 G11 D8 87 [3] N;
PU
I/O SGPIO12 — General purpose digital input/output pin.
I/O I2C1_SDA — I
2C1 data input/output (this pin does not use a
specialized I2C pad).
O U3_TXD — Transmitter output for USART3.
I CTIN_1 — SCTimer/PWM input 1. Capture input 1 of timer 0.
Capture input 1 of timer 2.
I/O GPIO5[3] — General purpose digital input/output pin.
- R — Function reserved.
O T3_MAT0 — Match output 0 of timer 3.
O USB0_PPWR — VBUS drive signal (towards external charge
pump or power management unit); indicates that VBUS must
be driven (active HIGH).
Add a pull-down resistor to disable the power switch at reset.
This signal has opposite polarity compared to the USB_PPWR
used on other NXP LPC parts.
P2_4 K11 L9 D9 88 [3] N;
PU
I/O SGPIO13 — General purpose digital input/output pin.
I/O I2C1_SCL — I
2C1 clock input/output (this pin does not use a
specialized I2C pad).
I U3_RXD — Receiver input for USART3.
I CTIN_0 — SCTimer/PWM input 0. Capture input 0 of timer 0,
1, 2, 3.
I/O GPIO5[4] — General purpose digital input/output pin.
- R — Function reserved.
O T3_MAT1 — Match output 1 of timer 3.
I USB0_PWR_FAULT — Port power fault signal indicating
overcurrent condition; this signal monitors over-current on the
USB bus (external circuitry required to detect over-current
condition).
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 17 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P2_5 K14 J12 D10 91 [3] N;
PU
I/O SGPIO14 — General purpose digital input/output pin.
I CTIN_2 — SCTimer/PWM input 2. Capture input 2 of timer 0.
I USB1_VBUS — Monitors the presence of USB1 bus power.
Note: This signal must be HIGH for USB reset to occur.
I ADCTRIG1 — ADC trigger input 1.
I/O GPIO5[5] — General purpose digital input/output pin.
- R — Function reserved.
O T3_MAT2 — Match output 2 of timer 3.
O USB0_IND0 — USB0 port indicator LED control output 0.
P2_6 K16 J14 G9 95 [2] N;
PU
I/O SGPIO7 — General purpose digital input/output pin.
I/O U0_DIR — RS-485/EIA-485 output enable/direction control for
USART0.
I/O EMC_A10 — External memory address line 10.
O USB0_IND0 — USB0 port indicator LED control
output 0.
I/O GPIO5[6] — General purpose digital input/output pin.
I CTIN_7 — SCTimer/PWM input 7.
I T3_CAP3 — Capture input 3 of timer 3.
- R — Function reserved.
P2_7 H14 G12 C10 96 [2] N;
PU
I/O GPIO0[7] — General purpose digital input/output pin. If this pin
is pulled LOW at reset, the part enters ISP mode using
USART0.
O CTOUT_1 — SCTimer/PWM output 1. Match output 3 of timer
3.
I/O U3_UCLK — Serial clock input/output for USART3 in
synchronous mode.
I/O EMC_A9 — External memory address line 9.
- R — Function reserved.
- R — Function reserved.
O T3_MAT3 — Match output 3 of timer 3.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 18 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P2_8 J16 H14 C6 98 [2] N;
PU
I/O SGPIO15 — General purpose digital input/output pin. Boot pin
(see Table 5).
O CTOUT_0 — SCTimer/PWM output 0. Match output 0 of timer
0.
I/O U3_DIR — RS-485/EIA-485 output enable/direction control for
USART3.
I/O EMC_A8 — External memory address line 8.
I/O GPIO5[7] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
P2_9 H16 G14 B10 102 [2] N;
PU
I/O GPIO1[10] — General purpose digital input/output pin. Boot
pin (see Table 5.
O CTOUT_3 — SCTimer/PWM output 3. Match output 3 of timer
0.
I/O U3_BAUD — Baud pin for USART3.
I/O EMC_A0 — External memory address line 0.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
P2_10 G16 F14 E8 104 [2] N;
PU
I/O GPIO0[14] — General purpose digital input/output pin.
O CTOUT_2 — SCTimer/PWM output 2. Match output 2 of timer
0.
O U2_TXD — Transmitter output for USART2.
I/O EMC_A1 — External memory address line 1.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
P2_11 F16 E13 A9 105 [2] N;
PU
I/O GPIO1[11] — General purpose digital input/output pin.
O CTOUT_5 — SCTimer/PWM output 5. Match output 3 of timer
3.
I U2_RXD — Receiver input for USART2.
I/O EMC_A2 — External memory address line 2.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 19 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P2_12 E15 D13 B9 106 [2] N;
PU
I/O GPIO1[12] — General purpose digital input/output pin.
O CTOUT_4 — SCTimer/PWM output 4. Match output 3 of timer
3.
- R — Function reserved.
I/O EMC_A3 — External memory address line 3.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
I/O U2_UCLK — Serial clock input/output for USART2 in
synchronous mode.
P2_13 C16 E14 A10 108 [2] N;
PU
I/O GPIO1[13] — General purpose digital input/output pin.
I CTIN_4 — SCTimer/PWM input 4. Capture input 2 of timer 1.
- R — Function reserved.
I/O EMC_A4 — External memory address line 4.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
I/O U2_DIR — RS-485/EIA-485 output enable/direction control for
USART2.
P3_0 F13 D12 A8 112 [2] N;
PU
I/O I2S0_RX_SCK — I2S receive clock. It is driven by the master
and received by the slave. Corresponds to the signal SCK in
the I
2S-bus specification.
O I2S0_RX_MCLK — I2S receive master clock.
I/O I2S0_TX_SCK — Transmit Clock. It is driven by the master
and received by the slave. Corresponds to the signal SCK in
the I2S-bus specification.
O I2S0_TX_MCLK — I2S transmit master clock.
I/O SSP0_SCK — Serial clock for SSP0.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 20 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P3_1 G11 D10 F7 114 [2] N;
PU
I/O I2S0_TX_WS — Transmit Word Select. It is driven by the
master and received by the slave. Corresponds to the signal
WS in the I
2S-bus specification.
I/O I2S0_RX_WS — Receive Word Select. It is driven by the
master and received by the slave. Corresponds to the signal
WS in the I
2S-bus specification.
I CAN0_RD — CAN receiver input.
O USB1_IND1 — USB1 Port indicator LED control output 1.
I/O GPIO5[8] — General purpose digital input/output pin.
- R — Function reserved.
O LCD_VD15 — LCD data.
- R — Function reserved.
P3_2 F11 D9 G6 116 [2] OL;
PU
I/O I2S0_TX_SDA — I2S transmit data. It is driven by the
transmitter and read by the receiver. Corresponds to the signal
SD in the I
2S-bus specification.
I/O I2S0_RX_SDA — I2S Receive data. It is driven by the
transmitter and read by the receiver. Corresponds to the signal
SD in the I
2S-bus specification.
O CAN0_TD — CAN transmitter output.
O USB1_IND0 — USB1 Port indicator LED control output 0.
I/O GPIO5[9] — General purpose digital input/output pin.
- R — Function reserved.
O LCD_VD14 — LCD data.
- R — Function reserved.
P3_3 B14 B13 A7 118 [4] N;
PU
- R — Function reserved.
I/O SPI_SCK — Serial clock for SPI.
I/O SSP0_SCK — Serial clock for SSP0.
O SPIFI_SCK — Serial clock for SPIFI.
O CGU_OUT1 — CGU spare clock output 1.
- R — Function reserved.
O I2S0_TX_MCLK — I2S transmit master clock.
I/O I2S1_TX_SCK — Transmit Clock. It is driven by the master
and received by the slave. Corresponds to the signal SCK in
the I2S-bus specification.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 21 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P3_4 A15 C14 B8 119 [2] N;
PU
I/O GPIO1[14] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
I/O SPIFI_SIO3 — I/O lane 3 for SPIFI.
O U1_TXD — Transmitter output for UART 1.
I/O I2S0_TX_WS — Transmit Word Select. It is driven by the
master and received by the slave. Corresponds to the signal
WS in the I
2S-bus specification.
I/O I2S1_RX_SDA — I2S1 Receive data. It is driven by the
transmitter and read by the receiver. Corresponds to the signal
SD in the I
2S-bus specification.
O LCD_VD13 — LCD data.
P3_5 C12 C11 B7 121 [2] N;
PU
I/O GPIO1[15] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
I/O SPIFI_SIO2 — I/O lane 2 for SPIFI.
I U1_RXD — Receiver input for UART 1.
I/O I2S0_TX_SDA — I2S transmit data. It is driven by the
transmitter and read by the receiver. Corresponds to the signal
SD in the I
2S-bus specification.
I/O I2S1_RX_WS — Receive Word Select. It is driven by the
master and received by the slave. Corresponds to the signal
WS in the I
2S-bus specification.
O LCD_VD12 — LCD data.
P3_6 B13 B12 C7 122 [2] N;
PU
I/O GPIO0[6] — General purpose digital input/output pin.
I/O SPI_MISO — Master In Slave Out for SPI.
I/O SSP0_SSEL — Slave Select for SSP0.
I/O SPIFI_MISO — Input 1 in SPIFI quad mode; SPIFI output IO1.
- R — Function reserved.
I/O SSP0_MISO — Master In Slave Out for SSP0.
- R — Function reserved.
- R — Function reserved.
P3_7 C11 C10 D7 123 [2] N;
PU
- R — Function reserved.
I/O SPI_MOSI — Master Out Slave In for SPI.
I/O SSP0_MISO — Master In Slave Out for SSP0.
I/O SPIFI_MOSI — Input I0 in SPIFI quad mode; SPIFI output IO0.
I/O GPIO5[10] — General purpose digital input/output pin.
I/O SSP0_MOSI — Master Out Slave in for SSP0.
- R — Function reserved.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 22 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P3_8 C10 C9 E7 124 [2] N;
PU
- R — Function reserved.
I SPI_SSEL — Slave Select for SPI. Note that this pin in an
input pin only. The SPI in master mode cannot drive the CS
input on the slave. Any GPIO pin can be used for SPI chip
select in master mode.
I/O SSP0_MOSI — Master Out Slave in for SSP0.
I/O SPIFI_CS — SPIFI serial flash chip select.
I/O GPIO5[11] — General purpose digital input/output pin.
I/O SSP0_SSEL — Slave Select for SSP0.
- R — Function reserved.
- R — Function reserved.
P4_0 D5 D4 - 1 [2] N;
PU
I/O GPIO2[0] — General purpose digital input/output pin.
O MCOA0 — Motor control PWM channel 0, output A.
I NMI — External interrupt input to NMI.
- R — Function reserved.
- R — Function reserved.
O LCD_VD13 — LCD data.
I/O U3_UCLK — Serial clock input/output for USART3 in
synchronous mode.
- R — Function reserved.
P4_1 A1 D3 - 3 [5] N;
PU
I/O GPIO2[1] — General purpose digital input/output pin.
O CTOUT_1 — SCTimer/PWM output 1. Match output 3 of timer
3.
O LCD_VD0 — LCD data.
- R — Function reserved.
- R — Function reserved.
O LCD_VD19 — LCD data.
O U3_TXD — Transmitter output for USART3.
I ENET_COL — Ethernet Collision detect (MII interface).
AI ADC0_1 — ADC0 and ADC1, input channel 1. Configure the
pin as GPIO input and use the ADC function select register in
the SCU to select the ADC.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 23 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P4_2 D3 A2 - 8 [2] N;
PU
I/O GPIO2[2] — General purpose digital input/output pin.
O CTOUT_0 — SCTimer/PWM output 0. Match output 0 of timer
0.
O LCD_VD3 — LCD data.
- R — Function reserved.
- R — Function reserved.
O LCD_VD12 — LCD data.
I U3_RXD — Receiver input for USART3.
I/O SGPIO8 — General purpose digital input/output pin.
P4_3 C2 B2 - 7 [5] N;
PU
I/O GPIO2[3] — General purpose digital input/output pin.
O CTOUT_3 — SCTimer/PWM output 3. Match output 3 of timer
0.
O LCD_VD2 — LCD data.
- R — Function reserved.
- R — Function reserved.
O LCD_VD21 — LCD data.
I/O U3_BAUD — Baud pin for USART3.
I/O SGPIO9 — General purpose digital input/output pin.
AI ADC0_0 — DAC output; ADC0 and ADC1, input channel 0.
Configure the pin as GPIO input and use the ADC function
select register in the SCU to select the ADC.
P4_4 B1 A1 - 9 [5] N;
PU
I/O GPIO2[4] — General purpose digital input/output pin.
O CTOUT_2 — SCTimer/PWM output 2. Match output 2 of timer
0.
O LCD_VD1 — LCD data.
- R — Function reserved.
- R — Function reserved.
O LCD_VD20 — LCD data.
I/O U3_DIR — RS-485/EIA-485 output enable/direction control for
USART3.
I/O SGPIO10 — General purpose digital input/output pin.
O DAC — DAC output. Shared between 10-bit ADC0/1 and
DAC.. Configure the pin as GPIO input and use the analog
function select register in the SCU to select the DAC.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 24 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P4_5 D2 C2 - 10 [2] N;
PU
I/O GPIO2[5] — General purpose digital input/output pin.
O CTOUT_5 — SCTimer/PWM output 5. Match output 3 of timer
3.
O LCD_FP — Frame pulse (STN). Vertical synchronization pulse
(TFT).
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
I/O SGPIO11 — General purpose digital input/output pin.
P4_6 C1 B1 - 11 [2] N;
PU
I/O GPIO2[6] — General purpose digital input/output pin.
O CTOUT_4 — SCTimer/PWM output 4. Match output 3 of timer
3.
O LCD_ENAB/LCDM — STN AC bias drive or TFT data enable
input.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
I/O SGPIO12 — General purpose digital input/output pin.
P4_7 H4 F4 - 14 [2] O;
PU
O LCD_DCLK — LCD panel clock.
I GP_CLKIN — General-purpose clock input to the CGU.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
I/O I2S1_TX_SCK — Transmit Clock. It is driven by the master
and received by the slave. Corresponds to the signal SCK in
the I2S-bus specification.
I/O I2S0_TX_SCK — Transmit Clock. It is driven by the master
and received by the slave. Corresponds to the signal SCK in
the I2S-bus specification.
P4_8 E2 D2 - 15 [2] N;
PU
- R — Function reserved.
I CTIN_5 — SCTimer/PWM input 5. Capture input 2 of timer 2.
O LCD_VD9 — LCD data.
- R — Function reserved.
I/O GPIO5[12] — General purpose digital input/output pin.
O LCD_VD22 — LCD data.
O CAN1_TD — CAN1 transmitter output.
I/O SGPIO13 — General purpose digital input/output pin.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 25 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P4_9 L2 J2 - 33 [2] N;
PU
- R — Function reserved.
I CTIN_6 — SCTimer/PWM input 6. Capture input 1 of timer 3.
O LCD_VD11 — LCD data.
- R — Function reserved.
I/O GPIO5[13] — General purpose digital input/output pin.
O LCD_VD15 — LCD data.
I CAN1_RD — CAN1 receiver input.
I/O SGPIO14 — General purpose digital input/output pin.
P4_10 M3 L3 - 35 [2] N;
PU
- R — Function reserved.
I CTIN_2 — SCTimer/PWM input 2. Capture input 2 of timer 0.
O LCD_VD10 — LCD data.
- R — Function reserved.
I/O GPIO5[14] — General purpose digital input/output pin.
O LCD_VD14 — LCD data.
- R — Function reserved.
I/O SGPIO15 — General purpose digital input/output pin.
P5_0 N3 L2 - 37 [2] N;
PU
I/O GPIO2[9] — General purpose digital input/output pin.
O MCOB2 — Motor control PWM channel 2, output B.
I/O EMC_D12 — External memory data line 12.
- R — Function reserved.
I U1_DSR — Data Set Ready input for UART 1.
I T1_CAP0 — Capture input 0 of timer 1.
- R — Function reserved.
- R — Function reserved.
P5_1 P3 M1 - 39 [2] N;
PU
I/O GPIO2[10] — General purpose digital input/output pin.
I MCI2 — Motor control PWM channel 2, input.
I/O EMC_D13 — External memory data line 13.
- R — Function reserved.
O U1_DTR — Data Terminal Ready output for UART 1. Can also
be configured to be an RS-485/EIA-485 output enable signal
for UART 1.
I T1_CAP1 — Capture input 1 of timer 1.
- R — Function reserved.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 26 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P5_2 R4 M3 - 46 [2] N;
PU
I/O GPIO2[11] — General purpose digital input/output pin.
I MCI1 — Motor control PWM channel 1, input.
I/O EMC_D14 — External memory data line 14.
- R — Function reserved.
O U1_RTS — Request to Send output for UART 1. Can also be
configured to be an RS-485/EIA-485 output enable signal for
UART 1.
I T1_CAP2 — Capture input 2 of timer 1.
- R — Function reserved.
- R — Function reserved.
P5_3 T8 P6 - 54 [2] N;
PU
I/O GPIO2[12] — General purpose digital input/output pin.
I MCI0 — Motor control PWM channel 0, input.
I/O EMC_D15 — External memory data line 15.
- R — Function reserved.
I U1_RI — Ring Indicator input for UART 1.
I T1_CAP3 — Capture input 3 of timer 1.
- R — Function reserved.
- R — Function reserved.
P5_4 P9 N7 - 57 [2] N;
PU
I/O GPIO2[13] — General purpose digital input/output pin.
O MCOB0 — Motor control PWM channel 0, output B.
I/O EMC_D8 — External memory data line 8.
- R — Function reserved.
I U1_CTS — Clear to Send input for UART 1.
O T1_MAT0 — Match output 0 of timer 1.
- R — Function reserved.
- R — Function reserved.
P5_5 P10 N8 - 58 [2] N;
PU
I/O GPIO2[14] — General purpose digital input/output pin.
O MCOA1 — Motor control PWM channel 1, output A.
I/O EMC_D9 — External memory data line 9.
- R — Function reserved.
I U1_DCD — Data Carrier Detect input for UART 1.
O T1_MAT1 — Match output 1 of timer 1.
- R — Function reserved.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 27 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P5_6 T13 M11 - 63 [2] N;
PU
I/O GPIO2[15] — General purpose digital input/output pin.
O MCOB1 — Motor control PWM channel 1, output B.
I/O EMC_D10 — External memory data line 10.
- R — Function reserved.
O U1_TXD — Transmitter output for UART 1.
O T1_MAT2 — Match output 2 of timer 1.
- R — Function reserved.
- R — Function reserved.
P5_7 R12 N11 - 65 [2] N;
PU
I/O GPIO2[7] — General purpose digital input/output pin.
O MCOA2 — Motor control PWM channel 2, output A.
I/O EMC_D11 — External memory data line 11.
- R — Function reserved.
I U1_RXD — Receiver input for UART 1.
O T1_MAT3 — Match output 3 of timer 1.
- R — Function reserved.
- R — Function reserved.
P6_0 M12 M10 H7 73 [2] N;
PU
- R — Function reserved.
O I2S0_RX_MCLK — I2S receive master clock.
- R — Function reserved.
- R — Function reserved.
I/O I2S0_RX_SCK — Receive Clock. It is driven by the master and
received by the slave. Corresponds to the signal SCK in the
I
2S-bus specification.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
P6_1 R15 P14 G5 74 [2] N;
PU
I/O GPIO3[0] — General purpose digital input/output pin.
O EMC_DYCS1 — SDRAM chip select 1.
I/O U0_UCLK — Serial clock input/output for USART0 in
synchronous mode.
I/O I2S0_RX_WS — Receive Word Select. It is driven by the
master and received by the slave. Corresponds to the signal
WS in the I
2S-bus specification.
- R — Function reserved.
I T2_CAP0 — Capture input 2 of timer 2.
- R — Function reserved.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 28 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P6_2 L13 K11 J9 78 [2] N;
PU
I/O GPIO3[1] — General purpose digital input/output pin.
O EMC_CKEOUT1 — SDRAM clock enable 1.
I/O U0_DIR — RS-485/EIA-485 output enable/direction control for
USART0.
I/O I2S0_RX_SDA — I2S Receive data. It is driven by the
transmitter and read by the receiver. Corresponds to the signal
SD in the I
2S-bus specification.
- R — Function reserved.
I T2_CAP1 — Capture input 1 of timer 2.
- R — Function reserved.
- R — Function reserved.
P6_3 P15 N13 - 79 [2] N;
PU
I/O GPIO3[2] — General purpose digital input/output pin.
O USB0_PPWR — VBUS drive signal (towards external charge
pump or power management unit); indicates that the VBUS
signal must be driven (active HIGH).
Add a pull-down resistor to disable the power switch at reset.
This signal has opposite polarity compared to the USB_PPWR
used on other NXP LPC parts.
I/O SGPIO4 — General purpose digital input/output pin.
O EMC_CS1 — LOW active Chip Select 1 signal.
- R — Function reserved.
I T2_CAP2 — Capture input 2 of timer 2.
- R — Function reserved.
- R — Function reserved.
P6_4 R16 M14 F6 80 [2] N;
PU
I/O GPIO3[3] — General purpose digital input/output pin.
I CTIN_6 — SCTimer/PWM input 6. Capture input 1 of timer 3.
O U0_TXD — Transmitter output for USART0.
O EMC_CAS — LOW active SDRAM Column Address Strobe.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 29 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P6_5 P16 L14 F9 82 [2] N;
PU
I/O GPIO3[4] — General purpose digital input/output pin.
O CTOUT_6 — SCTimer/PWM output 6. Match output 2 of timer
1.
I U0_RXD — Receiver input for USART0.
O EMC_RAS — LOW active SDRAM Row Address Strobe.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
P6_6 L14 K12 - 83 [2] N;
PU
I/O GPIO0[5] — General purpose digital input/output pin.
O EMC_BLS1 — LOW active Byte Lane select signal 1.
I/O SGPIO5 — General purpose digital input/output pin.
I USB0_PWR_FAULT — Port power fault signal indicating
overcurrent condition; this signal monitors over-current on the
USB bus (external circuitry required to detect over-current
condition).
- R — Function reserved.
I T2_CAP3 — Capture input 3 of timer 2.
- R — Function reserved.
- R — Function reserved.
P6_7 J13 H11 - 85 [2] N;
PU
- R — Function reserved.
I/O EMC_A15 — External memory address line 15.
I/O SGPIO6 — General purpose digital input/output pin.
O USB0_IND1 — USB0 port indicator LED control output 1.
I/O GPIO5[15] — General purpose digital input/output pin.
O T2_MAT0 — Match output 0 of timer 2.
- R — Function reserved.
- R — Function reserved.
P6_8 H13 F12 - 86 [2] N;
PU
- R — Function reserved.
I/O EMC_A14 — External memory address line 14.
I/O SGPIO7 — General purpose digital input/output pin.
O USB0_IND0 — USB0 port indicator LED control output 0.
I/O GPIO5[16] — General purpose digital input/output pin.
O T2_MAT1 — Match output 1 of timer 2.
- R — Function reserved.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 30 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P6_9 J15 H13 F8 97 [2] N;
PU
I/O GPIO3[5] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
O EMC_DYCS0 — SDRAM chip select 0.
- R — Function reserved.
O T2_MAT2 — Match output 2 of timer 2.
- R — Function reserved.
- R — Function reserved.
P6_10 H15 G13 - 100 [2] N;
PU
I/O GPIO3[6] — General purpose digital input/output pin.
O MCABORT — Motor control PWM, LOW-active fast abort.
- R — Function reserved.
O EMC_DQMOUT1 — Data mask 1 used with SDRAM and static
devices.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
P6_11 H12 F11 C9 101 [2] N;
PU
I/O GPIO3[7] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
O EMC_CKEOUT0 — SDRAM clock enable 0.
- R — Function reserved.
O T2_MAT3 — Match output 3 of timer 2.
- R — Function reserved.
- R — Function reserved.
P6_12 G15 F13 - 103 [2] N;
PU
I/O GPIO2[8] — General purpose digital input/output pin.
O CTOUT_7 — SCTimer/PWM output 7. Match output 3 of timer
1.
- R — Function reserved.
O EMC_DQMOUT0 — Data mask 0 used with SDRAM and static
devices.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 31 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P7_0 B16 B14 - 110 [2] N;
PU
I/O GPIO3[8] — General purpose digital input/output pin.
O CTOUT_14 — SCTimer/PWM output 14. Match output 2 of
timer 3.
- R — Function reserved.
O LCD_LE — Line end signal.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
I/O SGPIO4 — General purpose digital input/output pin.
P7_1 C14 C13 - 113 [2] N;
PU
I/O GPIO3[9] — General purpose digital input/output pin.
O CTOUT_15 — SCTimer/PWM output 15. Match output 3 of
timer 3.
I/O I2S0_TX_WS — Transmit Word Select. It is driven by the
master and received by the slave. Corresponds to the signal
WS in the I
2S-bus specification.
O LCD_VD19 — LCD data.
O LCD_VD7 — LCD data.
- R — Function reserved.
O U2_TXD — Transmitter output for USART2.
I/O SGPIO5 — General purpose digital input/output pin.
P7_2 A16 A14 - 115 [2] N;
PU
I/O GPIO3[10] — General purpose digital input/output pin.
I CTIN_4 — SCTimer/PWM input 4. Capture input 2 of timer 1.
I/O I2S0_TX_SDA — I2S transmit data. It is driven by the
transmitter and read by the receiver. Corresponds to the signal
SD in the I
2S-bus specification.
O LCD_VD18 — LCD data.
O LCD_VD6 — LCD data.
- R — Function reserved.
I U2_RXD — Receiver input for USART2.
I/O SGPIO6 — General purpose digital input/output pin.
P7_3 C13 C12 - 117 [2] N;
PU
I/O GPIO3[11] — General purpose digital input/output pin.
I CTIN_3 — SCTimer/PWM input 3. Capture input 1 of timer 1.
- R — Function reserved.
O LCD_VD17 — LCD data.
O LCD_VD5 — LCD data.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 32 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P7_4 C8 C6 - 132 [5] N;
PU
I/O GPIO3[12] — General purpose digital input/output pin.
O CTOUT_13 — SCTimer/PWM output 13. Match output 3 of
timer 3.
- R — Function reserved.
O LCD_VD16 — LCD data.
O LCD_VD4 — LCD data.
O TRACEDATA[0] — Trace data, bit 0.
- R — Function reserved.
- R — Function reserved.
AI ADC0_4 — ADC0 and ADC1, input channel 4. Configure the
pin as GPIO input and use the ADC function select register in
the SCU to select the ADC.
P7_5 A7 A7 - 133 [5] N;
PU
I/O GPIO3[13] — General purpose digital input/output pin.
O CTOUT_12 — SCTimer/PWM output 12. Match output 3 of
timer 3.
- R — Function reserved.
O LCD_VD8 — LCD data.
O LCD_VD23 — LCD data.
O TRACEDATA[1] — Trace data, bit 1.
- R — Function reserved.
- R — Function reserved.
AI ADC0_3 — ADC0 and ADC1, input channel 3. Configure the
pin as GPIO input and use the ADC function select register in
the SCU to select the ADC.
P7_6 C7 F5 - 134 [2] N;
PU
I/O GPIO3[14] — General purpose digital input/output pin.
O CTOUT_11 — SCTimer/PWM output 1. Match output 3 of
timer 2.
- R — Function reserved.
O LCD_LP — Line synchronization pulse (STN). Horizontal
synchronization pulse (TFT).
- R — Function reserved.
O TRACEDATA[2] — Trace data, bit 2.
- R — Function reserved.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 33 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P7_7 B6 D5 - 140 [5] N;
PU
I/O GPIO3[15] — General purpose digital input/output pin.
O CTOUT_8 — SCTimer/PWM output 8. Match output 0 of timer
2.
- R — Function reserved.
O LCD_PWR — LCD panel power enable.
- R — Function reserved.
O TRACEDATA[3] — Trace data, bit 3.
O ENET_MDC — Ethernet MIIM clock.
I/O SGPIO7 — General purpose digital input/output pin.
AI ADC1_6 — ADC1 and ADC0, input channel 6. Configure the
pin as GPIO input and use the ADC function select register in
the SCU to select the ADC.
P8_0 E5 E4 - - [3] N;
PU
I/O GPIO4[0] — General purpose digital input/output pin.
I USB0_PWR_FAULT — Port power fault signal indicating
overcurrent condition; this signal monitors over-current on the
USB bus (external circuitry required to detect over-current
condition).
- R — Function reserved.
I MCI2 — Motor control PWM channel 2, input.
I/O SGPIO8 — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
O T0_MAT0 — Match output 0 of timer 0.
P8_1 H5 G4 - - [3] N;
PU
I/O GPIO4[1] — General purpose digital input/output pin.
O USB0_IND1 — USB0 port indicator LED control output 1.
- R — Function reserved.
I MCI1 — Motor control PWM channel 1, input.
I/O SGPIO9 — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
O T0_MAT1 — Match output 1 of timer 0.
P8_2 K4 J4 - - [3] N;
PU
I/O GPIO4[2] — General purpose digital input/output pin.
O USB0_IND0 — USB0 port indicator LED control output 0.
- R — Function reserved.
I MCI0 — Motor control PWM channel 0, input.
I/O SGPIO10 — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
O T0_MAT2 — Match output 2 of timer 0.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 34 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P8_3 J3 H3 - - [2] N;
PU
I/O GPIO4[3] — General purpose digital input/output pin.
I/O USB1_ULPI_D2 — ULPI link bidirectional data line 2.
- R — Function reserved.
O LCD_VD12 — LCD data.
O LCD_VD19 — LCD data.
- R — Function reserved.
- R — Function reserved.
O T0_MAT3 — Match output 3 of timer 0.
P8_4 J2 H2 - - [2] N;
PU
I/O GPIO4[4] — General purpose digital input/output pin.
I/O USB1_ULPI_D1 — ULPI link bidirectional data line 1.
- R — Function reserved.
O LCD_VD7 — LCD data.
O LCD_VD16 — LCD data.
- R — Function reserved.
- R — Function reserved.
I T0_CAP0 — Capture input 0 of timer 0.
P8_5 J1 H1 - - [2] N;
PU
I/O GPIO4[5] — General purpose digital input/output pin.
I/O USB1_ULPI_D0 — ULPI link bidirectional data line 0.
- R — Function reserved.
O LCD_VD6 — LCD data.
O LCD_VD8 — LCD data.
- R — Function reserved.
- R — Function reserved.
I T0_CAP1 — Capture input 1 of timer 0.
P8_6 K3 J3 - - [2] N;
PU
I/O GPIO4[6] — General purpose digital input/output pin.
I USB1_ULPI_NXT — ULPI link NXT signal. Data flow control
signal from the PHY.
- R — Function reserved.
O LCD_VD5 — LCD data.
O LCD_LP — Line synchronization pulse (STN). Horizontal
synchronization pulse (TFT).
- R — Function reserved.
- R — Function reserved.
I T0_CAP2 — Capture input 2 of timer 0.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 35 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P8_7 K1 J1 - - [2] N;
PU
I/O GPIO4[7] — General purpose digital input/output pin.
O USB1_ULPI_STP — ULPI link STP signal. Asserted to end or
interrupt transfers to the PHY.
- R — Function reserved.
O LCD_VD4 — LCD data.
O LCD_PWR — LCD panel power enable.
- R — Function reserved.
- R — Function reserved.
I T0_CAP3 — Capture input 3 of timer 0.
P8_8 L1 K1 - - [2] N;
PU
- R — Function reserved.
I USB1_ULPI_CLK — ULPI link CLK signal. 60 MHz clock
generated by the PHY.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
O CGU_OUT0 — CGU spare clock output 0.
O I2S1_TX_MCLK — I2S1 transmit master clock.
P9_0 T1 P1 - - [2] N;
PU
I/O GPIO4[12] — General purpose digital input/output pin.
O MCABORT — Motor control PWM, LOW-active fast abort.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
I ENET_CRS — Ethernet Carrier Sense (MII interface).
I/O SGPIO0 — General purpose digital input/output pin.
I/O SSP0_SSEL — Slave Select for SSP0.
P9_1 N6 P4 - - [2] N;
PU
I/O GPIO4[13] — General purpose digital input/output pin.
O MCOA2 — Motor control PWM channel 2, output A.
- R — Function reserved.
- R — Function reserved.
I/O I2S0_TX_WS — Transmit Word Select. It is driven by the
master and received by the slave. Corresponds to the signal
WS in the I
2S-bus specification.
I ENET_RX_ER — Ethernet receive error (MII interface).
I/O SGPIO1 — General purpose digital input/output pin.
I/O SSP0_MISO — Master In Slave Out for SSP0.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 36 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P9_2 N8 M6 - - [2] N;
PU
I/O GPIO4[14] — General purpose digital input/output pin.
O MCOB2 — Motor control PWM channel 2, output B.
- R — Function reserved.
- R — Function reserved.
I/O I2S0_TX_SDA — I2S transmit data. It is driven by the
transmitter and read by the receiver. Corresponds to the signal
SD in the I
2S-bus specification.
I ENET_RXD3 — Ethernet receive data 3 (MII interface).
I/O SGPIO2 — General purpose digital input/output pin.
I/O SSP0_MOSI — Master Out Slave in for SSP0.
P9_3 M6 P5 - - [2] N;
PU
I/O GPIO4[15] — General purpose digital input/output pin.
O MCOA0 — Motor control PWM channel 0, output A.
O USB1_IND1 — USB1 Port indicator LED control output 1.
- R — Function reserved.
- R — Function reserved.
I ENET_RXD2 — Ethernet receive data 2 (MII interface).
I/O SGPIO9 — General purpose digital input/output pin.
O U3_TXD — Transmitter output for USART3.
P9_4 N10 M8 - - [2] N;
PU
- R — Function reserved.
O MCOB0 — Motor control PWM channel 0, output B.
O USB1_IND0 — USB1 Port indicator LED control output 0.
- R — Function reserved.
I/O GPIO5[17] — General purpose digital input/output pin.
O ENET_TXD2 — Ethernet transmit data 2 (MII interface).
I/O SGPIO4 — General purpose digital input/output pin.
I U3_RXD — Receiver input for USART3.
P9_5 M9 L7 - 69 [2] N;
PU
- R — Function reserved.
O MCOA1 — Motor control PWM channel 1, output A.
O USB1_PPWR — VBUS drive signal (towards external charge
pump or power management unit); indicates that VBUS must
be driven (active high).
Add a pull-down resistor to disable the power switch at reset.
This signal has opposite polarity compared to the USB_PPWR
used on other NXP LPC parts.
- R — Function reserved.
I/O GPIO5[18] — General purpose digital input/output pin.
O ENET_TXD3 — Ethernet transmit data 3 (MII interface).
I/O SGPIO3 — General purpose digital input/output pin.
O U0_TXD — Transmitter output for USART0.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 37 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
P9_6 L11 M9 - 72 [2] N;
PU
I/O GPIO4[11] — General purpose digital input/output pin.
O MCOB1 — Motor control PWM channel 1, output B.
I USB1_PWR_FAULT — USB1 Port power fault signal
indicating over-current condition; this signal monitors
over-current on the USB1 bus (external circuitry required to
detect over-current condition).
- R — Function reserved.
- R — Function reserved.
I ENET_COL — Ethernet Collision detect (MII interface).
I/O SGPIO8 — General purpose digital input/output pin.
I U0_RXD — Receiver input for USART0.
PA_0 L12 L10 - - [2] N;
PU
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
O I2S1_RX_MCLK — I2S1 receive master clock.
O CGU_OUT1 — CGU spare clock output 1.
- R — Function reserved.
PA_1 J14 H12 - - [3] N;
PU
I/O GPIO4[8] — General purpose digital input/output pin.
I QEI_IDX — Quadrature Encoder Interface INDEX input.
- R — Function reserved.
O U2_TXD — Transmitter output for USART2.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
PA_2 K15 J13 - - [3] N;
PU
I/O GPIO4[9] — General purpose digital input/output pin.
I QEI_PHB — Quadrature Encoder Interface PHB input.
- R — Function reserved.
I U2_RXD — Receiver input for USART2.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 38 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
PA_3 H11 E10 - - [3] N;
PU
I/O GPIO4[10] — General purpose digital input/output pin.
I QEI_PHA — Quadrature Encoder Interface PHA input.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
PA_4 G13 E12 - - [2] N;
PU
- R — Function reserved.
O CTOUT_9 — SCTimer/PWM output 9. Match output 3 of timer
3.
- R — Function reserved.
I/O EMC_A23 — External memory address line 23.
I/O GPIO5[19] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
PB_0 B15 D14 - - [2] N;
PU
- R — Function reserved.
O CTOUT_10 — SCTimer/PWM output 10. Match output 3 of
timer 3.
O LCD_VD23 — LCD data.
- R — Function reserved.
I/O GPIO5[20] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
PB_1 A14 A13 - - [2] N;
PU
- R — Function reserved.
I USB1_ULPI_DIR — ULPI link DIR signal. Controls the ULP
data line direction.
O LCD_VD22 — LCD data.
- R — Function reserved.
I/O GPIO5[21] — General purpose digital input/output pin.
O CTOUT_6 — SCTimer/PWM output 6. Match output 2 of timer
1.
- R — Function reserved.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 39 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
PB_2 B12 B11 - - [2] N;
PU
- R — Function reserved.
I/O USB1_ULPI_D7 — ULPI link bidirectional data line 7.
O LCD_VD21 — LCD data.
- R — Function reserved.
I/O GPIO5[22] — General purpose digital input/output pin.
O CTOUT_7 — SCTimer/PWM output 7. Match output 3 of timer
1.
- R — Function reserved.
- R — Function reserved.
PB_3 A13 A12 - - [2] N;
PU
- R — Function reserved.
I/O USB1_ULPI_D6 — ULPI link bidirectional data line 6.
O LCD_VD20 — LCD data.
- R — Function reserved.
I/O GPIO5[23] — General purpose digital input/output pin.
O CTOUT_8 — SCTimer/PWM output 8. Match output 0 of timer
2.
- R — Function reserved.
- R — Function reserved.
PB_4 B11 B10 - - [2] N;
PU
- R — Function reserved.
I/O USB1_ULPI_D5 — ULPI link bidirectional data line 5.
O LCD_VD15 — LCD data.
- R — Function reserved.
I/O GPIO5[24] — General purpose digital input/output pin.
I CTIN_5 — SCTimer/PWM input 5. Capture input 2 of timer 2.
- R — Function reserved.
- R — Function reserved.
PB_5 A12 A11 - - [2] N;
PU
- R — Function reserved.
I/O USB1_ULPI_D4 — ULPI link bidirectional data line 4.
O LCD_VD14 — LCD data.
- R — Function reserved.
I/O GPIO5[25] — General purpose digital input/output pin.
I CTIN_7 — SCTimer/PWM input 7.
O LCD_PWR — LCD panel power enable.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 40 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
PB_6 A6 C5 - - [5] N;
PU
- R — Function reserved.
I/O USB1_ULPI_D3 — ULPI link bidirectional data line 3.
O LCD_VD13 — LCD data.
- R — Function reserved.
I/O GPIO5[26] — General purpose digital input/output pin.
I CTIN_6 — SCTimer/PWM input 6. Capture input 1 of timer 3.
O LCD_VD19 — LCD data.
- R — Function reserved.
AI ADC0_6 — ADC0 and ADC1, input channel 6. Configure the
pin as GPIO input and use the ADC function select register in
the SCU to select the ADC.
PC_0 D4 - - - [5] N;
PU
- R — Function reserved.
I USB1_ULPI_CLK — ULPI link CLK signal. 60 MHz clock
generated by the PHY.
- R — Function reserved.
I/O ENET_RX_CLK — Ethernet Receive Clock (MII interface).
O LCD_DCLK — LCD panel clock.
- R — Function reserved.
- R — Function reserved.
I/O SD_CLK — SD/MMC card clock.
AI ADC1_1 — ADC1 and ADC0, input channel 1. Configure the
pin as input (USB_ULPI_CLK) and use the ADC function select
register in the SCU to select the ADC.
PC_1 E4 - - - [2] N;
PU
I/O USB1_ULPI_D7 — ULPI link bidirectional data line 7.
- R — Function reserved.
I U1_RI — Ring Indicator input for UART 1.
O ENET_MDC — Ethernet MIIM clock.
I/O GPIO6[0] — General purpose digital input/output pin.
- R — Function reserved.
I T3_CAP0 — Capture input 0 of timer 3.
O SD_VOLT0 — SD/MMC bus voltage select output 0.
PC_2 F6 - - - [2] N;
PU
I/O USB1_ULPI_D6 — ULPI link bidirectional data line 6.
- R — Function reserved.
I U1_CTS — Clear to Send input for UART 1.
O ENET_TXD2 — Ethernet transmit data 2 (MII interface).
I/O GPIO6[1] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
O SD_RST — SD/MMC reset signal for MMC4.4 card.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 41 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
PC_3 F5 - - - [5] N;
PU
I/O USB1_ULPI_D5 — ULPI link bidirectional data line 5.
- R — Function reserved.
O U1_RTS — Request to Send output for UART 1. Can also be
configured to be an RS-485/EIA-485 output enable signal for
UART 1.
O ENET_TXD3 — Ethernet transmit data 3 (MII interface).
I/O GPIO6[2] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
O SD_VOLT1 — SD/MMC bus voltage select output 1.
AI ADC1_0 — DAC output; ADC1 and ADC0, input channel 0.
Configure the pin as GPIO input and use the ADC function
select register in the SCU to select the ADC.
PC_4 F4 - - - [2] N;
PU
- R — Function reserved.
I/O USB1_ULPI_D4 — ULPI link bidirectional data line 4.
- R — Function reserved.
ENET_TX_EN — Ethernet transmit enable (RMII/MII
interface).
I/O GPIO6[3] — General purpose digital input/output pin.
- R — Function reserved.
I T3_CAP1 — Capture input 1 of timer 3.
I/O SD_DAT0 — SD/MMC data bus line 0.
PC_5 G4 - - - [2] N;
PU
- R — Function reserved.
I/O USB1_ULPI_D3 — ULPI link bidirectional data line 3.
- R — Function reserved.
O ENET_TX_ER — Ethernet Transmit Error (MII interface).
I/O GPIO6[4] — General purpose digital input/output pin.
- R — Function reserved.
I T3_CAP2 — Capture input 2 of timer 3.
I/O SD_DAT1 — SD/MMC data bus line 1.
PC_6 H6 - - - [2] N;
PU
- R — Function reserved.
I/O USB1_ULPI_D2 — ULPI link bidirectional data line 2.
- R — Function reserved.
I ENET_RXD2 — Ethernet receive data 2 (MII interface).
I/O GPIO6[5] — General purpose digital input/output pin.
- R — Function reserved.
I T3_CAP3 — Capture input 3 of timer 3.
I/O SD_DAT2 — SD/MMC data bus line 2.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 42 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
PC_7 G5 - - - [2] N;
PU
- R — Function reserved.
I/O USB1_ULPI_D1 — ULPI link bidirectional data line 1.
- R — Function reserved.
I ENET_RXD3 — Ethernet receive data 3 (MII interface).
I/O GPIO6[6] — General purpose digital input/output pin.
- R — Function reserved.
O T3_MAT0 — Match output 0 of timer 3.
I/O SD_DAT3 — SD/MMC data bus line 3.
PC_8 N4 - - - [2] N;
PU
- R — Function reserved.
I/O USB1_ULPI_D0 — ULPI link bidirectional data line 0.
- R — Function reserved.
I ENET_RX_DV — Ethernet Receive Data Valid (RMII/MII
interface).
I/O GPIO6[7] — General purpose digital input/output pin.
- R — Function reserved.
O T3_MAT1 — Match output 1 of timer 3.
I SD_CD — SD/MMC card detect input.
PC_9 K2 - - - [2] N;
PU
- R — Function reserved.
I USB1_ULPI_NXT — ULPI link NXT signal. Data flow control
signal from the PHY.
- R — Function reserved.
I ENET_RX_ER — Ethernet receive error (MII interface).
I/O GPIO6[8] — General purpose digital input/output pin.
- R — Function reserved.
O T3_MAT2 — Match output 2 of timer 3.
O SD_POW — SD/MMC power monitor output.
PC_10 M5 - - - [2] N;
PU
- R — Function reserved.
O USB1_ULPI_STP — ULPI link STP signal. Asserted to end or
interrupt transfers to the PHY.
I U1_DSR — Data Set Ready input for UART 1.
- R — Function reserved.
I/O GPIO6[9] — General purpose digital input/output pin.
- R — Function reserved.
O T3_MAT3 — Match output 3 of timer 3.
I/O SD_CMD — SD/MMC command signal.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 43 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
PC_11 L5 - - - [2] N;
PU
- R — Function reserved.
I USB1_ULPI_DIR — ULPI link DIR signal. Controls the ULPI
data line direction.
I U1_DCD — Data Carrier Detect input for UART 1.
- R — Function reserved.
I/O GPIO6[10] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
I/O SD_DAT4 — SD/MMC data bus line 4.
PC_12 L6 - - - [2] N;
PU
- R — Function reserved.
- R — Function reserved.
O U1_DTR — Data Terminal Ready output for UART 1. Can also
be configured to be an RS-485/EIA-485 output enable signal
for UART 1.
- R — Function reserved.
I/O GPIO6[11] — General purpose digital input/output pin.
I/O SGPIO11 — General purpose digital input/output pin.
I/O I2S0_TX_SDA — I2S transmit data. It is driven by the
transmitter and read by the receiver. Corresponds to the signal
SD in the I
2S-bus specification.
I/O SD_DAT5 — SD/MMC data bus line 5.
PC_13 M1 - - - [2] N;
PU
- R — Function reserved.
- R — Function reserved.
O U1_TXD — Transmitter output for UART 1.
- R — Function reserved.
I/O GPIO6[12] — General purpose digital input/output pin.
I/O SGPIO12 — General purpose digital input/output pin.
I/O I2S0_TX_WS — Transmit Word Select. It is driven by the
master and received by the slave. Corresponds to the signal
WS in the I
2S-bus specification.
I/O SD_DAT6 — SD/MMC data bus line 6.
PC_14 N1 - - - [2] N;
PU
- R — Function reserved.
- R — Function reserved.
I U1_RXD — Receiver input for UART 1.
- R — Function reserved.
I/O GPIO6[13] — General purpose digital input/output pin.
I/O SGPIO13 — General purpose digital input/output pin.
O ENET_TX_ER — Ethernet Transmit Error (MII interface).
I/O SD_DAT7 — SD/MMC data bus line 7.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 44 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
PD_0 N2 - - - [2] N;
PU
- R — Function reserved.
O CTOUT_15 — SCTimer/PWM output 15. Match output 3 of
timer 3.
O EMC_DQMOUT2 — Data mask 2 used with SDRAM and static
devices.
- R — Function reserved.
I/O GPIO6[14] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
I/O SGPIO4 — General purpose digital input/output pin.
PD_1 P1 - - - [2] N;
PU
- R — Function reserved.
- R — Function reserved.
O EMC_CKEOUT2 — SDRAM clock enable 2.
- R — Function reserved.
I/O GPIO6[15] — General purpose digital input/output pin.
O SD_POW — SD/MMC power monitor output.
- R — Function reserved.
I/O SGPIO5 — General purpose digital input/output pin.
PD_2 R1 - - - [2] N;
PU
- R — Function reserved.
O CTOUT_7 — SCTimer/PWM output 7. Match output 3 of timer
1.
I/O EMC_D16 — External memory data line 16.
- R — Function reserved.
I/O GPIO6[16] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
I/O SGPIO6 — General purpose digital input/output pin.
PD_3 P4 - - - [2] N;
PU
- R — Function reserved.
O CTOUT_6 — SCTimer/PWM output 7. Match output 2 of timer
1.
I/O EMC_D17 — External memory data line 17.
- R — Function reserved.
I/O GPIO6[17] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
I/O SGPIO7 — General purpose digital input/output pin.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 45 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
PD_4 T2 - - - [2] N;
PU
- R — Function reserved.
O CTOUT_8 — SCTimer/PWM output 8. Match output 0 of timer
2.
I/O EMC_D18 — External memory data line 18.
- R — Function reserved.
I/O GPIO6[18] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
I/O SGPIO8 — General purpose digital input/output pin.
PD_5 P6 - - - [2] N;
PU
- R — Function reserved.
O CTOUT_9 — SCTimer/PWM output 9. Match output 3 of timer
3.
I/O EMC_D19 — External memory data line 19.
- R — Function reserved.
I/O GPIO6[19] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
I/O SGPIO9 — General purpose digital input/output pin.
PD_6 R6 - - - [2] N;
PU
- R — Function reserved.
O CTOUT_10 — SCTimer/PWM output 10. Match output 3 of
timer 3.
I/O EMC_D20 — External memory data line 20.
- R — Function reserved.
I/O GPIO6[20] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
I/O SGPIO10 — General purpose digital input/output pin.
PD_7 T6 - - - [2] N;
PU
- R — Function reserved.
I CTIN_5 — SCTimer/PWM input 5. Capture input 2 of timer 2.
I/O EMC_D21 — External memory data line 21.
- R — Function reserved.
I/O GPIO6[21] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
I/O SGPIO11 — General purpose digital input/output pin.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 46 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
PD_8 P8 - - - [2] N;
PU
- R — Function reserved.
I CTIN_6 — SCTimer/PWM input 6. Capture input 1 of timer 3.
I/O EMC_D22 — External memory data line 22.
- R — Function reserved.
I/O GPIO6[22] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
I/O SGPIO12 — General purpose digital input/output pin.
PD_9 T11 - - - [2] N;
PU
- R — Function reserved.
O CTOUT_13 — SCTimer/PWM output 13. Match output 3 of
timer 3.
I/O EMC_D23 — External memory data line 23.
- R — Function reserved.
I/O GPIO6[23] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
I/O SGPIO13 — General purpose digital input/output pin.
PD_10 P11 - - - [2] N;
PU
- R — Function reserved.
I CTIN_1 — SCTimer/PWM input 1. Capture input 1 of timer 0.
Capture input 1 of timer 2.
O EMC_BLS3 — LOW active Byte Lane select signal 3.
- R — Function reserved.
I/O GPIO6[24] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
PD_11 N9 M7 - - [2] N;
PU
- R — Function reserved.
- R — Function reserved.
O EMC_CS3 — LOW active Chip Select 3 signal.
- R — Function reserved.
I/O GPIO6[25] — General purpose digital input/output pin.
I/O USB1_ULPI_D0 — ULPI link bidirectional data line 0.
O CTOUT_14 — SCTimer/PWM output 14. Match output 2 of
timer 3.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 47 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
PD_12 N11 P9 - - [2] N;
PU
- R — Function reserved.
- R — Function reserved.
O EMC_CS2 — LOW active Chip Select 2 signal.
- R — Function reserved.
I/O GPIO6[26] — General purpose digital input/output pin.
- R — Function reserved.
O CTOUT_10 — SCTimer/PWM output 10. Match output 3 of
timer 3.
- R — Function reserved.
PD_13 T14 - - - [2] N;
PU
- R — Function reserved.
I CTIN_0 — SCTimer/PWM input 0. Capture input 0 of timer 0,
1, 2, 3.
O EMC_BLS2 — LOW active Byte Lane select signal 2.
- R — Function reserved.
I/O GPIO6[27] — General purpose digital input/output pin.
- R — Function reserved.
O CTOUT_13 — SCTimer/PWM output 13. Match output 3 of
timer 3.
- R — Function reserved.
PD_14 R13 L11 - - [2] N;
PU
- R — Function reserved.
- R — Function reserved.
O EMC_DYCS2 — SDRAM chip select 2.
- R — Function reserved.
I/O GPIO6[28] — General purpose digital input/output pin.
- R — Function reserved.
O CTOUT_11 — SCTimer/PWM output 11. Match output 3 of
timer 2.
- R — Function reserved.
PD_15 T15 P13 - - [2] N;
PU
- R — Function reserved.
- R — Function reserved.
I/O EMC_A17 — External memory address line 17.
- R — Function reserved.
I/O GPIO6[29] — General purpose digital input/output pin.
I SD_WP — SD/MMC card write protect input.
O CTOUT_8 — SCTimer/PWM output 8. Match output 0 of timer
2.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 48 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
PD_16 R14 P12 - - [2] N;
PU
- R — Function reserved.
- R — Function reserved.
I/O EMC_A16 — External memory address line 16.
- R — Function reserved.
I/O GPIO6[30] — General purpose digital input/output pin.
O SD_VOLT2 — SD/MMC bus voltage select output 2.
O CTOUT_12 — SCTimer/PWM output 12. Match output 3 of
timer 3.
- R — Function reserved.
PE_0 P14 N12 - - [2] N;
PU
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
I/O EMC_A18 — External memory address line 18.
I/O GPIO7[0] — General purpose digital input/output pin.
O CAN1_TD — CAN1 transmitter output.
- R — Function reserved.
- R — Function reserved.
PE_1 N14 M12 - - [2] N;
PU
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
I/O EMC_A19 — External memory address line 19.
I/O GPIO7[1] — General purpose digital input/output pin.
I CAN1_RD — CAN1 receiver input.
- R — Function reserved.
- R — Function reserved.
PE_2 M14 L12 - - [2] N;
PU
I ADCTRIG0 — ADC trigger input 0.
I CAN0_RD — CAN receiver input.
- R — Function reserved.
I/O EMC_A20 — External memory address line 20.
I/O GPIO7[2] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 49 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
PE_3 K12 K10 - - [2] N;
PU
- R — Function reserved.
O CAN0_TD — CAN transmitter output.
I ADCTRIG1 — ADC trigger input 1.
I/O EMC_A21 — External memory address line 21.
I/O GPIO7[3] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
PE_4 K13 J11 - - [2] N;
PU
- R — Function reserved.
I NMI — External interrupt input to NMI.
- R — Function reserved.
I/O EMC_A22 — External memory address line 22.
I/O GPIO7[4] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
PE_5 N16 - - - [2] N;
PU
- R — Function reserved.
O CTOUT_3 — SCTimer/PWM output 3. Match output 3 of timer
0.
O U1_RTS — Request to Send output for UART 1. Can also be
configured to be an RS-485/EIA-485 output enable signal for
UART 1.
I/O EMC_D24 — External memory data line 24.
I/O GPIO7[5] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
PE_6 M16 - - - [2] N;
PU
- R — Function reserved.
O CTOUT_2 — SCTimer/PWM output 2. Match output 2 of timer
0.
I U1_RI — Ring Indicator input for UART 1.
I/O EMC_D25 — External memory data line 25.
I/O GPIO7[6] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 50 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
PE_7 F15 - - - [2] N;
PU
- R — Function reserved.
O CTOUT_5 — SCTimer/PWM output 5. Match output 3 of timer
3.
I U1_CTS — Clear to Send input for UART1.
I/O EMC_D26 — External memory data line 26.
I/O GPIO7[7] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
PE_8 F14 - - - [2] N;
PU
- R — Function reserved.
O CTOUT_4 — SCTimer/PWM output 4. Match output 3 of timer
3.
I U1_DSR — Data Set Ready input for UART 1.
I/O EMC_D27 — External memory data line 27.
I/O GPIO7[8] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
PE_9 E16 - - - [2] N;
PU
- R — Function reserved.
I CTIN_4 — SCTimer/PWM input 4. Capture input 2 of timer 1.
I U1_DCD — Data Carrier Detect input for UART 1.
I/O EMC_D28 — External memory data line 28.
I/O GPIO7[9] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
PE_10 E14 - - - [2] N;
PU
- R — Function reserved.
I CTIN_3 — SCTimer/PWM input 3. Capture input 1 of timer 1.
O U1_DTR — Data Terminal Ready output for UART 1. Can also
be configured to be an RS-485/EIA-485 output enable signal
for UART 1.
I/O EMC_D29 — External memory data line 29.
I/O GPIO7[10] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 51 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
PE_11 D16 - - - [2] N;
PU
- R — Function reserved.
O CTOUT_12 — SCTimer/PWM output 12. Match output 3 of
timer 3.
O U1_TXD — Transmitter output for UART 1.
I/O EMC_D30 — External memory data line 30.
I/O GPIO7[11] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
PE_12 D15 - - - [2] N;
PU
- R — Function reserved.
O CTOUT_11 — SCTimer/PWM output 11. Match output 3 of
timer 2.
I U1_RXD — Receiver input for UART 1.
I/O EMC_D31 — External memory data line 31.
I/O GPIO7[12] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
PE_13 G14 - - - [2] N;
PU
- R — Function reserved.
O CTOUT_14 — SCTimer/PWM output 14. Match output 2 of
timer 3.
I/O I2C1_SDA — I
2C1 data input/output (this pin does not use a
specialized I2C pad).
O EMC_DQMOUT3 — Data mask 3 used with SDRAM and static
devices.
I/O GPIO7[13] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
PE_14 C15 - - - [2] N;
PU
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
O EMC_DYCS3 — SDRAM chip select 3.
I/O GPIO7[14] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 52 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
PE_15 E13 - - - [2] N;
PU
- R — Function reserved.
O CTOUT_0 — SCTimer/PWM output 0. Match output 0 of timer
0.
I/O I2C1_SCL — I
2C1 clock input/output (this pin does not use a
specialized I2C pad).
O EMC_CKEOUT3 — SDRAM clock enable 3.
I/O GPIO7[15] — General purpose digital input/output pin.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
PF_0 D12 - - - [2] O;
PU
I/O SSP0_SCK — Serial clock for SSP0.
I GP_CLKIN — General-purpose clock input to the CGU.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
O I2S1_TX_MCLK — I2S1 transmit master clock.
PF_1 E11 - - - [2] N;
PU
- R — Function reserved.
- R — Function reserved.
I/O SSP0_SSEL — Slave Select for SSP0.
- R — Function reserved.
I/O GPIO7[16] — General purpose digital input/output pin.
- R — Function reserved.
I/O SGPIO0 — General purpose digital input/output pin.
- R — Function reserved.
PF_2 D11 - - - [2] N;
PU
- R — Function reserved.
O U3_TXD — Transmitter output for USART3.
I/O SSP0_MISO — Master In Slave Out for SSP0.
- R — Function reserved.
I/O GPIO7[17] — General purpose digital input/output pin.
- R — Function reserved.
I/O SGPIO1 — General purpose digital input/output pin.
- R — Function reserved.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 53 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
PF_3 E10 - - - [2] N;
PU
- R — Function reserved.
I U3_RXD — Receiver input for USART3.
I/O SSP0_MOSI — Master Out Slave in for SSP0.
- R — Function reserved.
I/O GPIO7[18] — General purpose digital input/output pin.
- R — Function reserved.
I/O SGPIO2 — General purpose digital input/output pin.
- R — Function reserved.
PF_4 D10 D6 H4 120 [2] O;
PU
I/O SSP1_SCK — Serial clock for SSP1.
I GP_CLKIN — General-purpose clock input to the CGU.
O TRACECLK — Trace clock.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
O I2S0_TX_MCLK — I2S transmit master clock.
I/O I2S0_RX_SCK — I2S receive clock. It is driven by the master
and received by the slave. Corresponds to the signal SCK in
the I
2S-bus specification.
PF_5 E9 - - - [5] N;
PU
- R — Function reserved.
I/O U3_UCLK — Serial clock input/output for USART3 in
synchronous mode.
I/O SSP1_SSEL — Slave Select for SSP1.
O TRACEDATA[0] — Trace data, bit 0.
I/O GPIO7[19] — General purpose digital input/output pin.
- R — Function reserved.
I/O SGPIO4 — General purpose digital input/output pin.
- R — Function reserved.
AI ADC1_4 — ADC1 and ADC0, input channel 4. Configure the
pin as GPIO input and use the ADC function select register in
the SCU to select the ADC.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 54 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
PF_6 E7 - - - [5] N;
PU
- R — Function reserved.
I/O U3_DIR — RS-485/EIA-485 output enable/direction control for
USART3.
I/O SSP1_MISO — Master In Slave Out for SSP1.
O TRACEDATA[1] — Trace data, bit 1.
I/O GPIO7[20] — General purpose digital input/output pin.
- R — Function reserved.
I/O SGPIO5 — General purpose digital input/output pin.
I/O I2S1_TX_SDA — I2S1 transmit data. It is driven by the
transmitter and read by the receiver. Corresponds to the signal
SD in the I
2S-bus specification.
AI ADC1_3 — ADC1 and ADC0, input channel 3. Configure the
pin as GPIO input and use the ADC function select register in
the SCU to select the ADC.
PF_7 B7 - - - [5] N;
PU
- R — Function reserved.
I/O U3_BAUD — Baud pin for USART3.
I/O SSP1_MOSI — Master Out Slave in for SSP1.
O TRACEDATA[2] — Trace data, bit 2.
I/O GPIO7[21] — General purpose digital input/output pin.
- R — Function reserved.
I/O SGPIO6 — General purpose digital input/output pin.
I/O I2S1_TX_WS — Transmit Word Select. It is driven by the
master and received by the slave. Corresponds to the signal
WS in the I
2S-bus specification.
AI/
O
ADC1_7 — ADC1 and ADC0, input channel 7 or band gap
output. Configure the pin as GPIO input and use the ADC
function select register in the SCU to select the ADC.
PF_8 E6 - - - [5] N;
PU
- R — Function reserved.
I/O U0_UCLK — Serial clock input/output for USART0 in
synchronous mode.
I CTIN_2 — SCTimer/PWM input 2. Capture input 2 of timer 0.
O TRACEDATA[3] — Trace data, bit 3.
I/O GPIO7[22] — General purpose digital input/output pin.
- R — Function reserved.
I/O SGPIO7 — General purpose digital input/output pin.
- R — Function reserved.
AI ADC0_2 — ADC0 and ADC1, input channel 2. Configure the
pin as GPIO input and use the ADC function select register in
the SCU to select the ADC.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 55 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
PF_9 D6 - - - [5] N;
PU
- R — Function reserved.
I/O U0_DIR — RS-485/EIA-485 output enable/direction control for
USART0.
O CTOUT_1 — SCTimer/PWM output 1. Match output 3 of timer
3.
- R — Function reserved.
I/O GPIO7[23] — General purpose digital input/output pin.
- R — Function reserved.
I/O SGPIO3 — General purpose digital input/output pin.
- R — Function reserved.
AI ADC1_2 — ADC1 and ADC0, input channel 2. Configure the
pin as GPIO input and use the ADC function select register in
the SCU to select the ADC.
PF_10 A3 - - - [5] N;
PU
- R — Function reserved.
O U0_TXD — Transmitter output for USART0.
- R — Function reserved.
- R — Function reserved.
I/O GPIO7[24] — General purpose digital input/output pin.
- R — Function reserved.
I SD_WP — SD/MMC card write protect input.
- R — Function reserved.
AI ADC0_5 — ADC0 and ADC1, input channel 5. Configure the
pin as GPIO input and use the ADC function select register in
the SCU to select the ADC.
PF_11 A2 - - - [5] N;
PU
- R — Function reserved.
I U0_RXD — Receiver input for USART0.
- R — Function reserved.
- R — Function reserved.
I/O GPIO7[25] — General purpose digital input/output pin.
- R — Function reserved.
O SD_VOLT2 — SD/MMC bus voltage select output 2.
- R — Function reserved.
AI ADC1_5 — ADC1 and ADC0, input channel 5. Configure the
pin as GPIO input and use the ADC function select register in
the SCU to select the ADC.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 56 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
Clock pins
CLK0 N5 M4 K3 45 [4] O;
PU
O EMC_CLK0 — SDRAM clock 0.
O CLKOUT — Clock output pin.
- R — Function reserved.
- R — Function reserved.
I/O SD_CLK — SD/MMC card clock.
O EMC_CLK01 — SDRAM clock 0 and clock 1 combined.
I/O SSP1_SCK — Serial clock for SSP1.
I ENET_TX_CLK (ENET_REF_CLK) — Ethernet Transmit
Clock (MII interface) or Ethernet Reference Clock (RMII
interface).
CLK1 T10 - - - [4] O;
PU
O EMC_CLK1 — SDRAM clock 1.
O CLKOUT — Clock output pin.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
O CGU_OUT0 — CGU spare clock output 0.
- R — Function reserved.
O I2S1_TX_MCLK — I2S1 transmit master clock.
CLK2 D14 P10 K6 99 [4] O;
PU
O EMC_CLK3 — SDRAM clock 3.
O CLKOUT — Clock output pin.
- R — Function reserved.
- R — Function reserved.
I/O SD_CLK — SD/MMC card clock.
O EMC_CLK23 — SDRAM clock 2 and clock 3 combined.
O I2S0_TX_MCLK — I2S transmit master clock.
I/O I2S1_RX_SCK — Receive Clock. It is driven by the master and
received by the slave. Corresponds to the signal SCK in the
I
2S-bus specification.
CLK3 P12 - - - [4] O;
PU
O EMC_CLK2 — SDRAM clock 2.
O CLKOUT — Clock output pin.
- R — Function reserved.
- R — Function reserved.
- R — Function reserved.
O CGU_OUT1 — CGU spare clock output 1.
- R — Function reserved.
I/O I2S1_RX_SCK — Receive Clock. It is driven by the master and
received by the slave. Corresponds to the signal SCK in the
I
2S-bus specification.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 57 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
Debug pins
DBGEN L4 K4 A6 28 [2] I; PU I JTAG interface control signal. Also used for boundary scan. To
use the part in functional mode, connect this pin in one of the
following ways:
• Leave DBGEN open. The DBGEN pin is pulled up
internally by a 50 kΩ resistor.
• Tie DBGEN to VDDIO.
• Pull DBGEN up to VDDIO with an external pull-up resistor.
TCK/SWDCLK J5 G5 H2 27 [2] I; F I Test Clock for JTAG interface (default) or Serial Wire (SW)
clock.
TRST M4 L4 B4 29 [2] I; PU I Test Reset for JTAG interface.
TMS/SWDIO K6 K5 C4 30 [2] I; PU I Test Mode Select for JTAG interface (default) or SW debug
data input/output.
TDO/SWO K5 J5 H3 31 [2] O O Test Data Out for JTAG interface (default) or SW trace output.
TDI J4 H4 G3 26 [2] I; PU I Test Data In for JTAG interface.
USB0 pins
USB0_DP F2 E2 E1 18 [6] - I/O USB0 bidirectional D+ line.
USB0_DM G2 F2 E2 20 [6] - I/O USB0 bidirectional D line.
USB0_VBUS F1 E1 E3 21 [6]
[7]
- I/O VBUS pin (power on USB cable). This pin includes an internal
pull-down resistor of 64 kΩ (typical) 16 kΩ.
USB0_ID H2 G2 F1 22 [8] - I Indicates to the transceiver whether connected as an A-device
(USB0_ID LOW) or B-device (USB0_ID HIGH). For OTG this
pin has an internal pull-up resistor.
USB0_RREF H1 G1 F3 24 [8] - 12.0 kΩ (accuracy 1 %) on-board resistor to ground for current
reference.
USB1 pins
USB1_DP F12 D11 E9 89 [9] - I/O USB1 bidirectional D+ line.
USB1_DM G12 E11 E10 90 [9] - I/O USB1 bidirectional D line.
I
2C-bus pins
I2C0_SCL L15 K13 D6 92 [10] I; F I/O I2C clock input/output. Open-drain output (for I2C-bus
compliance).
I2C0_SDA L16 K14 E6 93 [10] I; F I/O I2C data input/output. Open-drain output (for I2C-bus
compliance).
Reset and wake-up pins
RESET D9 C7 B6 128 [11] I; IA I External reset input: A LOW-going pulse as short as 50 ns on
this pin resets the device, causing I/O ports and peripherals to
take on their default states, and processor execution to begin
at address 0. This pin does not have an internal pull-up.
WAKEUP0 A9 A9 A4 130 [11] I; IA I External wake-up input; can raise an interrupt and can cause
wake-up from any of the low-power modes. A pulse with a
duration > 45 ns wakes up the part. This pin does not have an
internal pull-up.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 58 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
WAKEUP1 A10 C8 - - [11] I; IA I External wake-up input; can raise an interrupt and can cause
wake-up from any of the low-power modes. A pulse with a
duration > 45 ns wakes up the part. This pin does not have an
internal pull-up.
WAKEUP2 C9 E5 - - [11] I; IA I External wake-up input; can raise an interrupt and can cause
wake-up from any of the low-power modes. A pulse with a
duration > 45 ns wakes up the part. This pin does not have an
internal pull-up.
WAKEUP3 D8 - - - [11] I; IA I External wake-up input; can raise an interrupt and can cause
wake-up from any of the low-power modes. A pulse with a
duration > 45 ns wakes up the part. This pin does not have an
internal pull-up.
ADC pins
ADC0_0/
ADC1_0/DAC
E3 B6 A2 6 [8] I; IA I ADC input channel 0. Shared between 10-bit ADC0/1 and
DAC.
ADC0_1/
ADC1_1
C3 C4 A1 2 [8] I; IA I ADC input channel 1. Shared between 10-bit ADC0/1.
ADC0_2/
ADC1_2
A4 B3 B3 143 [8] I; IA I ADC input channel 2. Shared between 10-bit ADC0/1.
ADC0_3/
ADC1_3
B5 B4 A3 139 [8] I; IA I ADC input channel 3. Shared between 10-bit ADC0/1.
ADC0_4/
ADC1_4
C6 A5 - 138 [8] I; IA I ADC input channel 4. Shared between 10-bit ADC0/1.
ADC0_5/
ADC1_5
B3 C3 - 144 [8] I; IA I ADC input channel 5. Shared between 10-bit ADC0/1.
ADC0_6/
ADC1_6
A5 A4 - 142 [8] I; IA I ADC input channel 6. Shared between 10-bit ADC0/1.
ADC0_7/
ADC1_7
C5 B5 - 136 [8] I; IA I ADC input channel 7. Shared between 10-bit ADC0/1.
RTC
RTC_ALARM A11 A10 C3 129 [11] O O RTC controlled output. This pin has an internal pull-up. The
reset state of this pin is LOW after POR. For all other types of
reset, the reset state depends on the state of the RTC alarm
interrupt.
RTCX1 A8 A8 A5 125 [8] - I Input to the RTC 32 kHz ultra-low power oscillator circuit.
RTCX2 B8 B7 B5 126 [8] - O Output from the RTC 32 kHz ultra-low power oscillator circuit.
Crystal oscillator pins
XTAL1 D1 C1 B1 12 [8] - I Input to the oscillator circuit and internal clock generator
circuits.
XTAL2 E1 D1 C1 13 [8] - O Output from the oscillator amplifier.
Power and ground pins
USB0_VDDA
3V3_DRIVER
F3 E3 D1 16 - - Separate analog 3.3 V power supply for driver.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 59 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
USB0
_VDDA3V3
G3 F3 D2 17 - - USB 3.3 V separate power supply voltage.
USB0_VSSA
_TERM
H3 G3 D3 19 - - Dedicated analog ground for clean reference for termination
resistors.
USB0_VSSA
_REF
G1 F1 F2 23 - - Dedicated clean analog ground for generation of reference
currents and voltages.
VDDA B4 A6 B2 137 - - Analog power supply and ADC reference voltage.
VBAT B10 B9 C5 127 - - RTC power supply: 3.3 V on this pin supplies power to the
RTC.
VDDREG F10,
F9,
L8,
L7
D8,
E8
E4,
E5,
F4
94,
131,
59,
25
- Main regulator power supply. Tie the VDDREG and VDDIO
pins to a common power supply to ensure the same ramp-up
time for both supply voltages.
VPP E8 - - - [12] - - OTP programming voltage.
VDDIO D7,
E12,
F7,
F8,
G10,
H10,
J6,
J7,
K7,
L9,
L10,
N7,
N13
H5,
H10,
K8,
G10
F10,
K5
5,
36,
41,
71,
77,
107,
111,
141
[12] - - I/O power supply. Tie the VDDREG and VDDIO pins to a
common power supply to ensure the same ramp-up time for
both supply voltages.
VDD - - - - Power supply for main regulator, I/O, and OTP.
VSS G9,
H7,
J10,
J11,
K8
F10,
D7,
E6,
E7,
E9,
K6,
K9
- - [13]
[14]
- - Ground.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 60 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
[1] N = neutral, input buffer disabled; no extra VDDIO current consumption if the input is driven midway between supplies; set the EZI bit in
the SFS register to enable the input buffer; I = input; OL = output driving LOW; OH = output driving HIGH; AI/O = analog input/output; IA
= inactive; PU = pull-up enabled (weak pull-up resistor pulls up pin to VDDIO; F = floating. Reset state reflects the pin state at reset
without boot code operation.
[2] 5 V tolerant pad with 15 ns glitch filter (5 V tolerant if VDDIO present; if VDDIO not present, do not exceed 3.6 V); provides digital I/O
functions with TTL levels and hysteresis; normal drive strength.
[3] 5 V tolerant pad with 15 ns glitch filter (5 V tolerant if VDDIO present; if VDDIO not present, do not exceed 3.6 V); provides digital I/O
functions with TTL levels, and hysteresis; high drive strength.
[4] 5 V tolerant pad with 15 ns glitch filter (5 V tolerant if VDDIO present; if VDDIO not present, do not exceed 3.6 V); provides high-speed
digital I/O functions with TTL levels and hysteresis.
[5] 5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input or output (5 V tolerant if VDDIO present;
if VDDIO not present, do not exceed 3.6 V). When configured as an ADC input or DAC output, the pin is not 5 V tolerant and the digital
section of the pad must be disabled by setting the pin to an input function and disabling the pull-up resistor through the pin’s SFSP
register.
[6] 5 V tolerant transparent analog pad.
[7] For maximum load CL = 6.5 μF and maximum pull-down resistance Rpd = 80 kΩ, the VBUS signal takes about 2 s to fall from VBUS =
5 V to VBUS = 0.2 V when it is no longer driven.
[8] Transparent analog pad. Not 5 V tolerant.
[9] Pad provides USB functions 5 V tolerant if VDDIO present; if VDDIO not present, do not exceed 3.6 V. It is designed in accordance with
the USB specification, revision 2.0 (Full-speed and Low-speed mode only).
[10] Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus Fast Mode Plus specification. This pad requires an external pull-up to
provide output functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines.
[11] 5 V tolerant pad with 20 ns glitch filter; provides digital I/O functions with open-drain output and hysteresis.
[12] On the TFBGA100 package, VPP is internally connected to VDDIO.
[13] On the LQFP144 package, VSSIO and VSS are connected to a common ground plane.
[14] On the TFBGA100 package, VSS is internally connected to VSSIO.
VSSIO C4,
D13,
G6,
G7,
G8,
H8,
H9,
J8,
J9,
K9,
K10,
M13,
P7,
P13
- C8,
D4,
D5,
G8,
J3,
J6
4,
40,
76,
109
[13]
[14]
- - Ground.
VSSA B2 A3 C2 135 - - Analog ground.
Not connected
- B9 B8 - - - - n.c.
Table 3. Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
LBGA256
TFBGA180
TFBGA100
LQFP144
Reset state
[1]
Type
DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 61 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
7. Functional description
7.1 Architectural overview
The ARM Cortex-M4 includes three AHB-Lite buses: the system bus, the I-CODE bus,
and the D-code bus. The I-CODE and D-code core buses allow for concurrent code and
data accesses from different slave ports.
The LPC4350/30/20/10 use a multi-layer AHB matrix to connect the ARM Cortex-M4
buses and other bus masters to peripherals in a flexible manner that optimizes
performance by allowing peripherals that are on different slaves ports of the matrix to be
accessed simultaneously by different bus masters.
An ARM Cortex-M0 co-processor is included in the LPC4350/30/20/10, capable of
off-loading the main ARM Cortex-M4 application processor. Most peripheral interrupts are
connected to both processors. The processors communicate with each other via an
interprocessor communication protocol.
7.2 ARM Cortex-M4 processor
The ARM Cortex-M4 CPU incorporates a 3-stage pipeline, uses a Harvard architecture
with separate local instruction and data buses as well as a third bus for peripherals, and
includes an internal prefetch unit that supports speculative branching. The ARM
Cortex-M4 supports single-cycle digital signal processing and SIMD instructions. A
hardware floating-point processor is integrated in the core. The processor includes an
NVIC with up to 53 interrupts.
7.3 ARM Cortex-M0 co-processor
The ARM Cortex-M0 is a general purpose, 32-bit microprocessor, which offers high
performance and very low-power consumption. The ARM Cortex-M0 co-processor uses a
3-stage pipeline von-Neumann architecture and a small but powerful instruction set
providing high-end processing hardware. The co-processor incorporates an NVIC with 32
interrupts.
7.4 Interprocessor communication
The ARM Cortex-M4 and ARM Cortex-M0 interprocessor communication is based on
using shared SRAM as mailbox and one processor raising an interrupt on the other
processor's NVIC, for example after it has delivered a new message in the mailbox. The
receiving processor can reply by raising an interrupt on the sending processor's NVIC to
acknowledge the message.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 62 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
7.5 AHB multilayer matrix
7.6 Nested Vectored Interrupt Controller (NVIC)
The NVIC is an integral part of the Cortex-M4. The tight coupling to the CPU allows for low
interrupt latency and efficient processing of late arriving interrupts.
The ARM Cortex-M0 co-processor has its own NVIC with 32 vectored interrupts. Most
peripheral interrupts are shared between the Cortex-M0 and Cortex-M4 NVICs.
Fig 6. AHB multilayer matrix master and slave connections
ARM
CORTEX-M4
TEST/DEBUG
INTERFACE
ARM
CORTEX-M0
TEST/DEBUG
INTERFACE
DMA ETHERNET USB0 USB1 LCD SD/
MMC
EXTERNAL
MEMORY
CONTROLLER
APB, RTC
DOMAIN
PERIPHERALS
16 kB + 16 kB
AHB SRAM
64 kB ROM
128 kB LOCAL SRAM
72 kB LOCAL SRAM
System
bus
I-
code
bus
D-
code
bus
masters
slaves
0 1
AHB MULTILAYER MATRIX
= master-slave connection
32 kB AHB SRAM
SPIFI
SGPIO
AHB PERIPHERALS
REGISTER
INTERFACES
002aaf873
HIGH-SPEED PHYLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 63 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
7.6.1 Features
• Controls system exceptions and peripheral interrupts.
• The Cortex-M4 NVIC supports up to 53 vectored interrupts.
• Eight programmable interrupt priority levels with hardware priority level masking.
• Relocatable vector table.
• Non-Maskable Interrupt (NMI).
• Software interrupt generation.
7.6.2 Interrupt sources
Each peripheral device has one interrupt line connected to the NVIC but may have several
interrupt flags. Individual interrupt flags can represent more than one interrupt source.
7.7 System Tick timer (SysTick)
The ARM Cortex-M4 includes a system tick timer (SysTick) that is intended to generate a
dedicated SYSTICK exception at a 10 ms interval.
Remark: The SysTick is not included in the ARM Cortex-M0 core.
7.8 Event router
The event router combines various internal signals, interrupts, and the external interrupt
pins (WAKEUP[3:0]) to create an interrupt in the NVIC, if enabled. In addition, the event
router creates a wake-up signal to the ARM core and the CCU for waking up from Sleep,
Deep-sleep, Power-down, and Deep power-down modes. Individual events can be
configured as edge or level sensitive and can be enabled or disabled in the event router.
The event router can be battery powered.
The following events if enabled in the event router can create a wake-up signal from
sleep, deep-sleep, power-down, and deep power-down modes and/or create an interrupt:
• External pins WAKEUP0/1/2/3 and RESET
• Alarm timer, RTC (32 kHz oscillator running)
The following events if enabled in the event router can create a wake-up signal from sleep
mode only and/or create an interrupt:
• WWDT, BOD interrupts
• C_CAN0/1 and QEI interrupts
• Ethernet, USB0, USB1 signals
• Selected outputs of combined timers (SCTimer/PWM and timer0/1/3)
Remark: Any interrupt can wake up the ARM Cortex-M4 from sleep mode if enabled in
the NVIC.
7.9 Global Input Multiplexer Array (GIMA)
The GIMA routes signals to event-driven peripheral targets like the SCTimer/PWM,
timers, event router, or the ADCs.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 64 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
7.9.1 Features
• Single selection of a source.
• Signal inversion.
• Can capture a pulse if the input event source is faster than the target clock.
• Synchronization of input event and target clock.
• Single-cycle pulse generation for target.
7.10 On-chip static RAM
The LPC4350/30/20/10 support up to 200 kB local SRAM and an additional 64 kB AHB
SRAM with separate bus master access for higher throughput and individual power
control for low-power operation.
7.11 In-System Programming (ISP)
In-System Programming (ISP) means programming or reprogramming the on-chip SRAM
memory, using the boot loader software and the USART0 serial port. ISP can be
performed when the part resides in the end-user board. ISP loads data into on-chip SRAM
and execute code from on-chip SRAM.
7.12 Boot ROM
The internal ROM memory is used to store the boot code of the LPC4350/30/20/10. After
a reset, the ARM processor will start its code execution from this memory.
The boot ROM memory includes the following features:
• The ROM memory size is 64 kB.
• Supports booting from UART interfaces and external static memory such as NOR
flash, quad SPI flash, and USB0 and USB1.
• Includes API for OTP programming.
• Includes a flexible USB device stack that supports Human Interface Device (HID),
Mass Storage Class (MSC), and Device Firmware Upgrade (DFU) drivers.
Several boot modes are available depending on the values of the OTP bits BOOT_SRC. If
the OTP memory is not programmed or the BOOT_SRC bits are all zero, the boot mode is
determined by the states of the boot pins P2_9, P2_8, P1_2, and P1_1.
Table 4. Boot mode when OTP BOOT_SRC bits are programmed
Boot mode BOOT_SRC
bit 3
BOOT_SRC
bit 2
BOOT_SRC
bit 1
BOOT_SRC
bit 0
Description
Pin state 0 0 0 0 Boot source is defined by the reset state of P1_1,
P1_2, P2_8, and P2_9 pins. See Table 5.
USART0 0 0 0 1 Boot from device connected to USART0 using pins
P2_0 and P2_1.
SPIFI 0 0 1 0 Boot from Quad SPI flash connected to the SPIFI
interface using pins P3_3 to P3_8.
EMC 8-bit 0 0 1 1 Boot from external static memory (such as NOR
flash) using CS0 and an 8-bit data bus.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 65 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
[1] The boot loader programs the appropriate pin function at reset to boot using either SSP0 or SPIFI.
Remark: Pin functions for SPIFI and SSP0 boot are different.
[1] The boot loader programs the appropriate pin function at reset to boot using either SSP0 or SPIFI.
Remark: Pin functions for SPIFI and SSP0 boot are different.
7.13 Memory mapping
The memory map shown in Figure 7 and Figure 8 is global to both the Cortex-M4 and the
Cortex-M0 processors and all SRAM is shared between both processors. Each processor
uses its own ARM private bus memory map for the NVIC and other system functions.
EMC 16-bit 0 1 0 0 Boot from external static memory (such as NOR
flash) using CS0 and a 16-bit data bus.
EMC 32-bit 0 1 0 1 Boot from external static memory (such as NOR
flash) using CS0 and a 32-bit data bus.
USB00 1 1 0 Boot from USB0.
USB10 1 1 1 Boot from USB1.
SPI (SSP) 1 0 0 0 Boot from SPI flash connected to the SSP0
interface on P3_3 (function SSP0_SCK), P3_6
(function SSP0_SSEL), P3_7 (function
SSP0_MISO), and P3_8 (function SSP0_MOSI)[1].
USART3 1 0 0 1 Boot from device connected to USART3 using pins
P2_3 and P2_4.
Table 4. Boot mode when OTP BOOT_SRC bits are programmed …continued
Boot mode BOOT_SRC
bit 3
BOOT_SRC
bit 2
BOOT_SRC
bit 1
BOOT_SRC
bit 0
Description
Table 5. Boot mode when OPT BOOT_SRC bits are zero
Boot mode Pins Description
P2_9 P2_8 P1_2 P1_1
USART0 LOW LOW LOW LOW Boot from device connected to USART0 using pins
P2_0 and P2_1.
SPIFI LOW LOW LOW HIGH Boot from Quad SPI flash connected to the SPIFI
interface on P3_3 to P3_8[1].
EMC 8-bit LOW LOW HIGH LOW Boot from external static memory (such as NOR
flash) using CS0 and an 8-bit data bus.
EMC 16-bit LOW LOW HIGH HIGH Boot from external static memory (such as NOR
flash) using CS0 and a 16-bit data bus.
EMC 32-bit LOW HIGH LOW LOW Boot from external static memory (such as NOR
flash) using CS0 and a 32-bit data bus.
USB0 LOW HIGH LOW HIGH Boot from USB0
USB1 LOW HIGH HIGH LOW Boot from USB1.
SPI (SSP) LOW HIGH HIGH HIGH Boot from SPI flash connected to the SSP0
interface on P3_3 (function SSP0_SCK), P3_6
(function SSP0_SSEL), P3_7 (function
SSP0_MISO), and P3_8 (function SSP0_MOSI)[1].
USART3 HIGH LOW LOW LOW Boot from device connected to USART3 using pins
P2_3 and P2_4.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 66 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
Fig 7. LPC4350/30/20/10 Memory mapping (overview)
reserved
peripheral bit band alias region
reserved
reserved
high-speed GPIO
reserved
0 GB 0x0000 0000
1 GB
4 GB
0x2001 0000
0x2200 0000
0x2400 0000
0x2800 0000
0x1000 0000
0x3000 0000
0x4000 0000
0x4001 2000
0x4004 0000
0x4005 0000
0x4010 0000
0x4400 0000
0x6000 0000
AHB peripherals
APB peripherals #0
APB peripherals #1
reserved
reserved
reserved
RTC domain peripherals
0x4006 0000
0x4008 0000
0x4009 0000
0x400A 0000
0x400B 0000
0x400C 0000
0x400D 0000
0x400E 0000
0x400F 0000
0x400F 1000
0x400F 2000
0x400F 4000
0x400F 8000
clocking/reset peripherals
APB peripherals #2
APB peripherals #3
0x2000 8000
16 kB AHB SRAM (LPC4350/30)
16 kB AHB SRAM (LPC4350/30/20/10)
0x2000 C000
16 kB AHB SRAM (LPC4350/30)
16 kB AHB SRAM (LPC4350/30/20/10)
SGPIO
SPI
0x4010 1000
0x4010 2000
0x4200 0000
reserved
local SRAM/
external static memory banks
0x2000 0000
0x2000 4000
128 MB dynamic external memory DYCS0
256 MB dynamic external memory DYCS1
256 MB dynamic external memory DYCS2
256 MB dynamic external memory DYCS3 0x7000 0000
0x8000 0000
0x8800 0000
0xE000 0000
256 MB shadow area
LPC4350/30/20/10
0x1000 0000
0x1002 0000
0x1008 0000
0x1008 A000
0x1009 2000
0x1040 0000
0x1041 0000
0x1C00 0000
0x1D00 0000
reserved
reserved
32 MB AHB SRAM bit banding
reserved
reserved
reserved
0xE010 0000
0xFFFF FFFF
reserved
SPIFI data
ARM private bus
reserved
0x1001 8000 32 kB local SRAM (LPC4350/30/20)
96 kB local SRAM
(LPC4350/30/20/10)
32 kB + 8 kB local SRAM
(LPC4320/10)
64 kB + 8 kB local SRAM
(LPC4350/30)
reserved
reserved
reserved
reserved
64 kB ROM
0x1400 0000
0x1800 0000
SPIFI data
0x1E00 0000
0x1F00 0000
0x2000 0000
16 MB static external memory CS3
16 MB static external memory CS2
16 MB static external memory CS1
16 MB static external memory CS0
002aaf774xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 67 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller Fig 8. LPC4350/30/20/10 Memory mapping (peripherals)
reserved
peripheral bit band alias region
high-speed GPIO
reserved
reserved
reserved
reserved
0x4000 0000
0x0000 0000
0x4001 2000
0x4004 0000
0x4005 0000
0x4010 0000
0x4400 0000
0x6000 0000
0xFFFF FFFF
AHB peripherals
SRAM memories
external memory banks
APB0 peripherals
APB1 peripherals
reserved
reserved
reserved
RTC domain peripherals
0x4006 0000
0x4008 0000
0x4009 0000
0x400A 0000
0x400B 0000
0x400C 0000
0x400D 0000
0x400E 0000
0x400F 0000
0x400F 1000
0x400F 2000
0x400F 4000
0x400F 8000
clocking/reset peripherals
APB2 peripherals
APB3 peripherals
SGPIO
SPI
0x4010 1000
0x4010 2000
0x4200 0000
reserved
external memories and
ARM private bus
APB2
peripherals
0x400C 1000
0x400C 2000
0x400C 3000
0x400C 4000
0x400C 6000
0x400C 8000
0x400C 7000
0x400C 5000
0x400C 0000 RI timer
USART2
USART3
timer2
timer3
SSP1
QEI
APB1
peripherals
0x400A 1000
0x400A 2000
0x400A 3000
0x400A 4000
0x400A 5000
0x400B 0000
0x400A 0000 motor control PWM
I2C0
I2S0
I2S1
C_CAN1
reserved
AHB
peripherals
0x4000 1000
0x4000 0000 SCT
0x4000 2000
0x4000 3000
0x4000 4000
0x4000 6000
0x4000 8000
0x4001 0000
0x4001 2000
0x4000 9000
0x4000 7000
0x4000 5000
DMA
SD/MMC
EMC
USB1
LCD
USB0
reserved
SPIFI
ethernet
reserved
0x4008 1000
0x4008 0000 WWDT
0x4008 2000
0x4008 3000
0x4008 4000
0x4008 6000
0x4008 A000
0x4008 7000
0x4008 8000
0x4008 9000
0x4008 5000
UART1 w/ modem
SSP0
timer0
timer1
SCU
GPIO interrupts
GPIO GROUP0 interrupt
GPIO GROUP1 interrupt
USART0
RTC domain
peripherals
0x4004 1000
alarm timer 0x4004 0000
0x4004 2000
0x4004 3000
0x4004 4000
0x4004 6000
0x4004 7000
0x4004 5000
power mode control
CREG
event router
OTP controller
reserved
reserved
RTC
backup registers
clocking
reset control
peripherals
0x4005 1000
0x4005 0000 CGU
0x4005 2000
0x4005 3000
0x4005 4000
0x4006 0000
CCU2
RGU
CCU1
LPC4350/30/20/10
002aaf775
reserved
reserved
APB3
peripherals
0x400E 1000
0x400E 2000
0x400E 3000
0x400E 4000
0x400F 0000
0x400E 5000
0x400E 0000 I2C1
DAC
C_CAN0
ADC0
ADC1
reserved
GIMA
APB0
peripheralsLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 68 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
7.14 One-Time Programmable (OTP) memory
The OTP provides 64 bit + 256 bit One-Time Programmable (OTP) memory for
general-purpose use.
7.15 General-Purpose I/O (GPIO)
The LPC4350/30/20/10 provide eight GPIO ports with up to 31 GPIO pins each.
Device pins that are not connected to a specific peripheral function are controlled by the
GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate
registers allow setting or clearing any number of outputs simultaneously. The value of the
output register may be read back as well as the current state of the port pins.
All GPIO pins default to inputs with pull-up resistors enabled and input buffer disabled on
reset. The input buffer must be turned on in the system control block SFS register before
the GPIO input can be read.
7.15.1 Features
• Accelerated GPIO functions:
– GPIO registers are located on the AHB so that the fastest possible I/O timing can
be achieved.
– Mask registers allow treating sets of port bits as a group, leaving other bits
unchanged.
– All GPIO registers are byte and half-word addressable.
– Entire port value can be written in one instruction.
• Bit-level set and clear registers allow a single instruction set or clear of any number of
bits in one port.
• Direction control of individual bits.
• Up to eight GPIO pins can be selected from all GPIO pins to create an edge- or
level-sensitive GPIO interrupt request (GPIO interrupts).
• Two GPIO group interrupts can be triggered by any pin or pins in each port (GPIO
group0 and group1 interrupts).
7.16 Configurable digital peripherals
7.16.1 State Configurable Timer (SCTimer/PWM) subsystem
The SCTimer/PWM allows a wide variety of timing, counting, output modulation, and input
capture operations. The inputs and outputs of the SCTimer/PWM are shared with the
capture and match inputs/outputs of the 32-bit general-purpose counter/timers.
The SCTimer/PWM can be configured as two 16-bit counters or a unified 32-bit counter. In
the two-counter case, in addition to the counter value the following operational elements
are independent for each half:
• State variable
• Limit, halt, stop, and start conditions
• Values of Match/Capture registers, plus reload or capture control valuesLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 69 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
In the two-counter case, the following operational elements are global to the
SCTimer/PWM, but the last three can use match conditions from either counter:
• Clock selection
• Inputs
• Events
• Outputs
• Interrupts
7.16.1.1 Features
• Two 16-bit counters or one 32-bit counter.
• Counters clocked by bus clock or selected input.
• Counters can be configured as up-counters or up-down counters.
• State variable allows sequencing across multiple counter cycles.
• Event combines input or output condition and/or counter match in a specified state.
• Events control outputs and interrupts.
• Selected events can limit, halt, start, or stop a counter.
• Supports:
– up to 8 inputs
– 16 outputs
– 16 match/capture registers
– 16 events
– 32 states
7.16.2 Serial GPIO (SGPIO)
The Serial GPIOs offer standard GPIO functionality enhanced with features to accelerate
serial stream processing.
7.16.2.1 Features
• Each SGPIO input/output slice can be used to perform a serial to parallel or parallel to
serial data conversion.
• 16 SGPIO input/output slices each with a 32-bit FIFO that can shift the input value
from a pin or an output value to a pin with every cycle of a shift clock.
• Each slice is double-buffered.
• Interrupt is generated on a full FIFO, shift clock, or pattern match.
• Slices can be concatenated to increase buffer size.
• Each slice has a 32-bit pattern match filter.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 70 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
7.17 AHB peripherals
7.17.1 General-Purpose DMA (GPDMA)
The DMA controller allows peripheral-to memory, memory-to-peripheral,
peripheral-to-peripheral, and memory-to-memory transactions. Each DMA stream
provides unidirectional serial DMA transfers for a single source and destination. For
example, a bidirectional port requires one stream for transmit and one for receives. The
source and destination areas can each be either a memory region or a peripheral for
master 1, but only memory for master 0.
7.17.1.1 Features
• Eight DMA channels. Each channel can support a unidirectional transfer.
• 16 DMA request lines.
• Single DMA and burst DMA request signals. Each peripheral connected to the DMA
Controller can assert either a burst DMA request or a single DMA request. The DMA
burst size is set by programming the DMA Controller.
• Memory-to-memory, memory-to-peripheral, peripheral-to-memory, and
peripheral-to-peripheral transfers are supported.
• Scatter or gather DMA is supported through the use of linked lists. This means that
the source and destination areas do not have to occupy contiguous areas of memory.
• Hardware DMA channel priority.
• AHB slave DMA programming interface. The DMA Controller is programmed by
writing to the DMA control registers over the AHB slave interface.
• Two AHB bus masters for transferring data. These interfaces transfer data when a
DMA request goes active. Master 1 can access memories and peripherals, master 0
can access memories only.
• 32-bit AHB master bus width.
• Incrementing or non-incrementing addressing for source and destination.
• Programmable DMA burst size. The DMA burst size can be programmed to more
efficiently transfer data.
• Internal four-word FIFO per channel.
• Supports 8, 16, and 32-bit wide transactions.
• Big-endian and little-endian support. The DMA Controller defaults to little-endian
mode on reset.
• An interrupt to the processor can be generated on a DMA completion or when a DMA
error has occurred.
• Raw interrupt status. The DMA error and DMA count raw interrupt status can be read
prior to masking.
7.17.2 SPI Flash Interface (SPIFI)
The SPI Flash Interface allows low-cost serial flash memories to be connected to the ARM
Cortex-M4 processor with little performance penalty compared to parallel flash devices
with higher pin count. LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 71 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
After a few commands configure the interface at startup, the entire flash content is
accessible as normal memory using byte, halfword, and word accesses by the processor
and/or DMA channels. Simple sequences of commands handle erasing and
programming.
Many serial flash devices use a half-duplex command-driven SPI protocol for device setup
and initialization and then move to a half-duplex, command-driven 4-bit protocol for
normal operation. Different serial flash vendors and devices accept or require different
commands and command formats. SPIFI provides sufficient flexibility to be compatible
with common flash devices and includes extensions to help insure compatibility with future
devices.
7.17.2.1 Features
• Interfaces to serial flash memory in the main memory map.
• Supports classic and 4-bit bidirectional serial protocols.
• Half-duplex protocol compatible with various vendors and devices.
• Quad SPI Flash Interface (SPIFI) with 1-, 2-, or 4-bit data at rates of up to
52 MB per second.
• Supports DMA access.
7.17.3 SD/MMC card interface
The SD/MMC card interface supports the following modes to control:
• Secure Digital memory (SD version 3.0)
• Secure Digital I/O (SDIO version 2.0)
• Consumer Electronics Advanced Transport Architecture (CE-ATA version 1.1)
• MultiMedia Cards (MMC version 4.4)
7.17.4 External Memory Controller (EMC)
The LPC4350/30/20/10 EMC is a Memory Controller peripheral offering support for
asynchronous static memory devices such as RAM, ROM, and NOR flash. In addition, it
can be used as an interface with off-chip memory-mapped devices and peripherals.
7.17.4.1 Features
• Dynamic memory interface support including single data rate SDRAM.
• Asynchronous static memory device support including RAM, ROM, and NOR flash,
with or without asynchronous page mode.
• Low transaction latency.
• Read and write buffers to reduce latency and to improve performance.
• 8/16/32 data and 24 address lines-wide static memory support.
• 16 bit and 32 bit wide chip select SDRAM memory support.
• Static memory features include:
– Asynchronous page mode read
– Programmable Wait States
– Bus turnaround delayLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 72 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
– Output enable and write enable delays
– Extended wait
• Four chip selects for synchronous memory and four chip selects for static memory
devices.
• Power-saving modes dynamically control EMC_CKEOUT and EMC_CLK signals to
SDRAMs.
• Dynamic memory self-refresh mode controlled by software.
• Controller supports 2048 (A0 to A10), 4096 (A0 to A11), and 8192 (A0 to A12) row
address synchronous memory parts. Those are typically 512 MB, 256 MB, and
128 MB parts, with 4, 8, 16, or 32 data bits per device.
• Separate reset domains allow auto-refresh through a chip reset if desired.
• SDRAM clock can run at full or half the Cortex-M4 core frequency.
Note: Synchronous static memory devices (synchronous burst mode) are not supported.
7.17.5 High-speed USB Host/Device/OTG interface (USB0)
Remark: The USB0 controller is available on parts LPC4350/30/20. See Table 2.
The USB OTG module allows the LPC4350/30/20/10 to connect directly to a USB Host
such as a PC (in device mode) or to a USB Device in host mode.
7.17.5.1 Features
• On-chip UTMI+ compliant high-speed transceiver (PHY).
• Complies with Universal Serial Bus specification 2.0.
• Complies with USB On-The-Go supplement.
• Complies with Enhanced Host Controller Interface Specification.
• Supports auto USB 2.0 mode discovery.
• Supports all high-speed USB-compliant peripherals.
• Supports all full-speed USB-compliant peripherals.
• Supports software Host Negotiation Protocol (HNP) and Session Request Protocol
(SRP) for OTG peripherals.
• Supports interrupts.
• This module has its own, integrated DMA engine.
• USB interface electrical test software included in ROM USB stack.
7.17.6 High-speed USB Host/Device interface with ULPI (USB1)
Remark: The USB1 controller is available on parts LPC4350/30. See Table 2.
The USB1 interface can operate as a full-speed USB Host/Device interface or can
connect to an external ULPI PHY for High-speed operation.
7.17.6.1 Features
• Complies with Universal Serial Bus specification 2.0.
• Complies with Enhanced Host Controller Interface Specification.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 73 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
• Supports auto USB 2.0 mode discovery.
• Supports all high-speed USB-compliant peripherals if connected to external ULPI
PHY.
• Supports all full-speed USB-compliant peripherals.
• Supports interrupts.
• This module has its own, integrated DMA engine.
• USB interface electrical test software included in ROM USB stack.
7.17.7 LCD controller
Remark: The LCD controller is available on LPC4350 only. See Table 2.
The LCD controller provides all of the necessary control signals to interface directly to
various color and monochrome LCD panels. Both STN (single and dual panel) and TFT
panels can be operated. The display resolution is selectable and can be up to 1024 768
pixels. Several color modes are provided, up to a 24-bit true-color non-palettized mode.
An on-chip 512 byte color palette allows reducing bus utilization (that is, memory size of
the displayed data) while still supporting many colors.
The LCD interface includes its own DMA controller to allow it to operate independently of
the CPU and other system functions. A built-in FIFO acts as a buffer for display data,
providing flexibility for system timing. Hardware cursor support can further reduce the
amount of CPU time required to operate the display.
7.17.7.1 Features
• AHB master interface to access frame buffer.
• Setup and control via a separate AHB slave interface.
• Dual 16-deep programmable 64-bit wide FIFOs for buffering incoming display data.
• Supports single and dual-panel monochrome Super Twisted Nematic (STN) displays
with 4-bit or 8-bit interfaces.
• Supports single and dual-panel color STN displays.
• Supports Thin Film Transistor (TFT) color displays.
• Programmable display resolution including, but not limited to: 320 200, 320 240,
640 200, 640 240, 640 480, 800 600, and 1024 768.
• Hardware cursor support for single-panel displays.
• 15 gray-level monochrome, 3375 color STN, and 32 K color palettized TFT support.
• 1, 2, or 4 bits-per-pixel (bpp) palettized displays for monochrome STN.
• 1, 2, 4, or 8 bpp palettized color displays for color STN and TFT.
• 16 bpp true-color non-palettized for color STN and TFT.
• 24 bpp true-color non-palettized for color TFT.
• Programmable timing for different display panels.
• 256 entry, 16-bit palette RAM, arranged as a 128 32-bit RAM.
• Frame, line, and pixel clock signals.
• AC bias signal for STN, data enable signal for TFT panels.
• Supports little and big-endian, and Windows CE data formats.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 74 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
• LCD panel clock may be generated from the peripheral clock, or from a clock input
pin.
7.17.8 Ethernet
Remark: The Ethernet peripheral is available on parts LPC4350/30. See Table 2.
7.17.8.1 Features
• 10/100 Mbit/s
• DMA support
• Power management remote wake-up frame and magic packet detection
• Supports both full-duplex and half-duplex operation
– Supports CSMA/CD Protocol for half-duplex operation.
– Supports IEEE 802.3x flow control for full-duplex operation.
– Optional forwarding of received pause control frames to the user application in
full-duplex operation.
– Back-pressure support for half-duplex operation.
– Automatic transmission of zero-quanta pause frame on deassertion of flow control
input in full-duplex operation.
• Supports IEEE1588 time stamping and IEEE 1588 advanced time stamping (IEEE
1588-2008 v2).
7.18 Digital serial peripherals
7.18.1 UART1
The LPC4350/30/20/10 contain one UART with standard transmit and receive data lines.
UART1 also provides a full modem control handshake interface and support for
RS-485/9-bit mode allowing both software address detection and automatic address
detection using 9-bit mode.
UART1 includes a fractional baud rate generator. Standard baud rates such as 115200 Bd
can be achieved with any crystal frequency above 2 MHz.
7.18.1.1 Features
• Maximum UART data bit rate of 8 MBit/s.
• 16 B Receive and Transmit FIFOs.
• Register locations conform to 16C550 industry standard.
• Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B.
• Built-in fractional baud rate generator covering wide range of baud rates without a
need for external crystals of particular values.
• Auto baud capabilities and FIFO control mechanism that enables software flow
control implementation.
• Equipped with standard modem interface signals. This module also provides full
support for hardware flow control.
• Support for RS-485/9-bit/EIA-485 mode (UART1).LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 75 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
• DMA support.
7.18.2 USART0/2/3
The LPC4350/30/20/10 contain three USARTs. In addition to standard transmit and
receive data lines, the USARTs support a synchronous mode.
The USARTs include a fractional baud rate generator. Standard baud rates such as
115200 Bd can be achieved with any crystal frequency above 2 MHz.
7.18.2.1 Features
• Maximum UART data bit rate of 8 MBit/s.
• 16 B Receive and Transmit FIFOs.
• Register locations conform to 16C550 industry standard.
• Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B.
• Built-in fractional baud rate generator covering wide range of baud rates without a
need for external crystals of particular values.
• Auto baud capabilities and FIFO control mechanism that enables software flow
control implementation.
• Support for RS-485/9-bit/EIA-485 mode.
• USART3 includes an IrDA mode to support infrared communication.
• All USARTs have DMA support.
• Support for synchronous mode at a data bit rate of up to 8 Mbit/s.
• Smart card mode conforming to ISO7816 specification
7.18.3 SPI serial I/O controller
The LPC4350/30/20/10 contain one SPI controller. SPI is a full-duplex serial interface
designed to handle multiple masters and slaves connected to a given bus. Only a single
master and a single slave can communicate on the interface during a given data transfer.
During a data transfer the master always sends 8 bits to 16 bits of data to the slave, and
the slave always sends 8 bits to 16 bits of data to the master.
7.18.3.1 Features
• Maximum SPI data bit rate 25 Mbit/s.
• Compliant with SPI specification
• Synchronous, serial, full-duplex communication
• Combined SPI master and slave
• Maximum data bit rate of one eighth of the input clock rate
• 8 bits to 16 bits per transfer
7.18.4 SSP serial I/O controller
Remark: The LPC4350/30/20/10 contain two SSP controllers.
The SSP controller can operate on a SPI, 4-wire SSI, or Microwire bus. It can interact with
multiple masters and slaves on the bus. Only a single master and a single slave can
communicate on the bus during a given data transfer. The SSP supports full-duplex LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 76 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
transfers, with frames of 4 bit to 16 bit of data flowing from the master to the slave and
from the slave to the master. In practice, often only one of these data flows carries
meaningful data.
7.18.4.1 Features
• Maximum SSP speed in full-duplex mode of 25 Mbit/s; for transmit only 50 Mbit/s
(master) and 17 Mbit/s (slave).
• Compatible with Motorola SPI, 4-wire Texas Instruments SSI, and National
Semiconductor Microwire buses
• Synchronous serial communication
• Master or slave operation
• 8-frame FIFOs for both transmit and receive
• 4-bit to 16-bit frame
• DMA transfers supported by GPDMA
7.18.5 I2C-bus interface
Remark: The LPC4350/30/20/10 contain two I2C-bus interfaces.
The I2C-bus is bidirectional for inter-IC control using only two wires: a Serial Clock line
(SCL) and a Serial Data line (SDA). Each device is recognized by a unique address and
can operate as either a receiver-only device (for example an LCD driver) or a transmitter
with the capability to both receive and send information (such as memory). Transmitters
and/or receivers can operate in either master or slave mode, depending on whether the
chip has to initiate a data transfer or is only addressed. The I2C is a multi-master bus and
can be controlled by more than one bus master connected to it.
7.18.5.1 Features
• I
2C0 is a standard I2C-compliant bus interface with open-drain pins. I2C0 also
supports Fast mode plus with bit rates up to 1 Mbit/s.
• I
2C1 uses standard I/O pins with bit rates of up to 400 kbit/s (Fast I2C-bus).
• Easy to configure as master, slave, or master/slave.
• Programmable clocks allow versatile rate control.
• Bidirectional data transfer between masters and slaves.
• Multi-master bus (no central master).
• Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus.
• Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus.
• Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer.
• The I2C-bus can be used for test and diagnostic purposes.
• All I2C-bus controllers support multiple address recognition and a bus monitor mode.
7.18.6 I2S interface
Remark: The LPC4350/30/20/10 contain two I2S-bus interfaces.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 77 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
The I2S-bus provides a standard communication interface for digital audio applications.
The I
2S-bus specification defines a 3-wire serial bus using one data line, one clock line,
and one word select signal. The basic I2S-bus connection has one master, which is
always the master, and one slave. The I2S-bus interface provides a separate transmit and
receive channel, each of which can operate as either a master or a slave.
7.18.6.1 Features
• The I2S interface has separate input/output channels, each of which can operate in
master or slave mode.
• Capable of handling 8-bit, 16-bit, and 32-bit word sizes.
• Mono and stereo audio data supported.
• The sampling frequency can range from 16 kHz to 192 kHz (16, 22.05, 32, 44.1, 48,
96, 192) kHz.
• Support for an audio master clock.
• Configurable word select period in master mode (separately for I2S-bus input and
output).
• Two 8-word FIFO data buffers are provided, one for transmit and one for receive.
• Generates interrupt requests when buffer levels cross a programmable boundary.
• Two DMA requests controlled by programmable buffer levels. The DMA requests are
connected to the GPDMA block.
• Controls include reset, stop and mute options separately for I2S-bus input and I2S-bus
output.
7.18.7 C_CAN
Remark: The LPC4350/30/20/10 contain two C_CAN controllers.
Controller Area Network (CAN) is the definition of a high performance communication
protocol for serial data communication. The C_CAN controller is designed to provide a full
implementation of the CAN protocol according to the CAN Specification Version 2.0B. The
C_CAN controller can create powerful local networks with low-cost multiplex wiring by
supporting distributed real-time control with a high level of reliability.
7.18.7.1 Features
• Conforms to protocol version 2.0 parts A and B.
• Supports bit rate of up to 1 Mbit/s.
• Supports 32 Message Objects.
• Each Message Object has its own identifier mask.
• Provides programmable FIFO mode (concatenation of Message Objects).
• Provides maskable interrupts.
• Supports Disabled Automatic Retransmission (DAR) mode for time-triggered CAN
applications.
• Provides programmable loop-back mode for self-test operation.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 78 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
7.19 Counter/timers and motor control
7.19.1 General purpose 32-bit timers/external event counters
The LPC4350/30/20/10 include four 32-bit timer/counters. The timer/counter is designed
to count cycles of the system derived clock or an externally-supplied clock. It can
optionally generate interrupts, generate timed DMA requests, or perform other actions at
specified timer values, based on four match registers. Each timer/counter also includes
two capture inputs to trap the timer value when an input signal transitions, optionally
generating an interrupt.
7.19.1.1 Features
• A 32-bit timer/counter with a programmable 32-bit prescaler.
• Counter or timer operation.
• Two 32-bit capture channels per timer, that can take a snapshot of the timer value
when an input signal transitions. A capture event can also generate an interrupt.
• Four 32-bit match registers that allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Up to four external outputs corresponding to match registers, with the following
capabilities:
– Set LOW on match.
– Set HIGH on match.
– Toggle on match.
– Do nothing on match.
• Up to two match registers can be used to generate timed DMA requests.
7.19.2 Motor control PWM
The motor control PWM is a specialized PWM supporting 3-phase motors and other
combinations. Feedback inputs are provided to automatically sense rotor position and use
that information to ramp speed up or down. An abort input causes the PWM to release all
motor drive outputs immediately . At the same time, the motor control PWM is highly
configurable for other generalized timing, counting, capture, and compare applications.
7.19.3 Quadrature Encoder Interface (QEI)
A quadrature encoder, also known as a 2-channel incremental encoder, converts angular
displacement into two pulse signals. By monitoring both the number of pulses and the
relative phase of the two signals, the user code can track the position, direction of rotation,
and velocity. In addition, a third channel, or index signal, can be used to reset the position
counter. The quadrature encoder interface decodes the digital pulses from a quadrature
encoder wheel to integrate position over time and determine direction of rotation. In
addition, the QEI can capture the velocity of the encoder wheel.
7.19.3.1 Features
• Tracks encoder position.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 79 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
• Increments/decrements depending on direction.
• Programmable for 2 or 4 position counting.
• Velocity capture using built-in timer.
• Velocity compare function with “less than” interrupt.
• Uses 32-bit registers for position and velocity.
• Three position-compare registers with interrupts.
• Index counter for revolution counting.
• Index compare register with interrupts.
• Can combine index and position interrupts to produce an interrupt for whole and
partial revolution displacement.
• Digital filter with programmable delays for encoder input signals.
• Can accept decoded signal inputs (clk and direction).
7.19.4 Repetitive Interrupt (RI) timer
The repetitive interrupt timer provides a free-running 32-bit counter which is compared to
a selectable value, generating an interrupt when a match occurs. Any bits of the
timer/compare function can be masked such that they do not contribute to the match
detection. The repetitive interrupt timer can be used to create an interrupt that repeats at
predetermined intervals.
7.19.4.1 Features
• 32-bit counter. Counter can be free-running or be reset by a generated interrupt.
• 32-bit compare value.
• 32-bit compare mask. An interrupt is generated when the counter value equals the
compare value, after masking. This mechanism allows for combinations not possible
with a simple compare.
7.19.5 Windowed WatchDog Timer (WWDT)
The purpose of the watchdog is to reset the controller if software fails to periodically
service it within a programmable time window.
7.19.5.1 Features
• Internally resets chip if not periodically reloaded during the programmable time-out
period.
• Optional windowed operation requires reload to occur between a minimum and
maximum time period, both programmable.
• Optional warning interrupt can be generated at a programmable time prior to
watchdog time-out.
• Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be
disabled.
• Incorrect feed sequence causes reset or interrupt if enabled.
• Flag to indicate watchdog reset.
• Programmable 24-bit timer with internal prescaler.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 80 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
• Selectable time period from (Tcy(WDCLK) 256 4) to (Tcy(WDCLK) 224 4) in
multiples of Tcy(WDCLK) 4.
• The Watchdog Clock (WDCLK) uses the IRC as the clock source.
7.20 Analog peripherals
7.20.1 Analog-to-Digital Converter (ADC0/1)
7.20.1.1 Features
• 10-bit successive approximation analog to digital converter.
• Input multiplexing among 8 pins.
• Power-down mode.
• Measurement range 0 to VDDA.
• Sampling frequency up to 400 kSamples/s.
• Burst conversion mode for single or multiple inputs.
• Optional conversion on transition on ADCTRIG0 or ADCTRIG1 pins, combined timer
outputs 8 or 15, or the PWM output MCOA2.
• Individual result registers for each A/D channel to reduce interrupt overhead.
• DMA support.
7.20.2 Digital-to-Analog Converter (DAC)
7.20.2.1 Features
• 10-bit resolution
• Monotonic by design (resistor string architecture)
• Controllable conversion speed
• Low-power consumption
7.21 Peripherals in the RTC power domain
7.21.1 RTC
The Real-Time Clock (RTC) is a set of counters for measuring time when system power is
on, and optionally when it is off. It uses little power when the CPU does not access its
registers, especially in the reduced power modes. A separate 32 kHz oscillator clocks the
RTC. The oscillator produces a 1 Hz internal time reference and is powered by its own
power supply pin, VBAT.
7.21.1.1 Features
• Measures the passage of time to maintain a calendar and clock. Provides seconds,
minutes, hours, day of month, month, year, day of week, and day of year.
• Ultra-low power design to support battery powered systems. Uses power from the
CPU power supply when it is present.
• Dedicated battery power supply pin.
• RTC power supply is isolated from the rest of the chip.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 81 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
• Calibration counter allows adjustment to better than 1 sec/day with 1 sec resolution.
• Periodic interrupts can be generated from increments of any field of the time registers.
• Alarm interrupt can be generated for a specific date/time.
7.21.2 Alarm timer
The alarm timer is a 16-bit timer and counts down at 1 kHz from a preset value generating
alarms in intervals of up to 1 min. The counter triggers a status bit when it reaches 0x00
and asserts an interrupt if enabled.
The alarm timer is part of the RTC power domain and can be battery powered.
7.22 System control
7.22.1 Configuration registers (CREG)
The following settings are controlled in the configuration register block:
• BOD trip settings
• Oscillator output
• DMA-to-peripheral muxing
• Ethernet mode
• Memory mapping
• Timer/USART inputs
• Enabling the USB controllers
In addition, the CREG block contains the part identification and part configuration
information.
7.22.2 System Control Unit (SCU)
The system control unit determines the function and electrical mode of the digital pins. By
default function 0 is selected for all pins with pull-up enabled. For pins that support a
digital and analog function, the ADC function select registers in the SCU enable the
analog function.
A separate set of analog I/Os for the ADCs and the DAC as well as most USB pins are
located on separate pads and are not controlled through the SCU.
In addition, the clock delay register for the SDRAM EMC_CLK pins and the registers that
select the pin interrupts are located in the SCU.
7.22.3 Clock Generation Unit (CGU)
The Clock Generator Unit (CGU) generates several base clocks. The base clocks can be
unrelated in frequency and phase and can have different clock sources within the CGU.
One CGU base clock is routed to the CLKOUT pins. The base clock that generates the
CPU clock is referred to as CCLK.
Multiple branch clocks are derived from each base clock. The branch clocks offer flexible
control for power-management purposes. All branch clocks are outputs of one of two
Clock Control Units (CCUs) and can be controlled independently. Branch clocks derived
from the same base clock are synchronous in frequency and phase. LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 82 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
7.22.4 Internal RC oscillator (IRC)
The IRC is used as the clock source for the WWDT and/or as the clock that drives the
PLLs and the CPU. The nominal IRC frequency is 12 MHz. The IRC is trimmed to 1.5 %
accuracy over the entire voltage and temperature range.
Upon power-up or any chip reset, the LPC4350/30/20/10 use the IRC as the clock source.
The boot loader then configures the PLL1 to provide a 96 MHz clock for the core and the
PLL0USB or PLL0AUDIO as needed if an external boot source is selected.
7.22.5 PLL0USB (for USB0)
PLL0 is a dedicated PLL for the USB0 High-speed controller.
PLL0 accepts an input clock frequency from an external oscillator in the range of 14 kHz
to 25 MHz. The input frequency is multiplied up to a high frequency with a Current
Controlled Oscillator (CCO). The CCO operates in the range of 4.3 MHz to 550 MHz.
7.22.6 PLL0AUDIO (for audio)
The audio PLL PLL0AUDIO is a general-purpose PLL with a small step size. This PLL
accepts an input clock frequency derived from an external oscillator or internal IRC. The
input frequency is multiplied up to a high frequency with a Current Controlled Oscillator
(CCO). A sigma-delta converter modulates the PLL divider ratios to obtain the desired
output frequency. The output frequency can be set as a multiple of the sampling frequency
fs to 32fs, 64fs, 128 fs, 256 fs, 384 fs, 512 fs and the sampling frequency fs can
range from 16 kHz to 192 kHz (16, 22.05, 32, 44.1, 48, 96,192) kHz. Many other
frequencies are possible as well using the integrated fractional divider.
7.22.7 System PLL1
The PLL1 accepts an input clock frequency from an external oscillator in the range of
1 MHz to 25 MHz. The input frequency is multiplied up to a high frequency with a Current
Controlled Oscillator (CCO). The multiplier can be an integer value from 1 to 32. The CCO
operates in the range of 156 MHz to 320 MHz. This range is possible through an
additional divider in the loop to keep the CCO within its frequency range while the PLL is
providing the desired output frequency. The output divider can be set to divide by 2, 4, 8,
or 16 to produce the output clock. Since the minimum output divider value is 2, it is
insured that the PLL output has a 50 % duty cycle. The PLL is turned off and bypassed
following a chip reset. After reset, software can enable the PLL. The program must
configure and activate the PLL, wait for the PLL to lock, and then connect to the PLL as a
clock source. The PLL settling time is 100 s.
7.22.8 Reset Generation Unit (RGU)
The RGU allows generation of independent reset signals for individual blocks and
peripherals on the LPC4350/30/20/10.
7.22.9 Power control
The LPC4350/30/20/10 feature several independent power domains to control power to
the core and the peripherals (see Figure 9). The RTC and its associated peripherals (the
alarm timer, the CREG block, the OTP controller, the back-up registers, and the event
router) are located in the RTC power-domain. The main regulator or a battery supply can
power the RTC. A power selector switch ensures that the RTC block is always powered
on.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 83 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
7.22.10 Power Management Controller (PMC)
The PMC controls the power to the cores, peripherals, and memories.
The LPC4350/30/20/10 support the following power modes in order from highest to lowest
power consumption:
1. Active mode
2. Sleep mode
3. Power-down modes:
a. Deep-sleep mode
b. Power-down mode
c. Deep power-down mode
Fig 9. Power domains
REAL-TIME CLOCK
BACKUP REGISTERS
RESET/WAKE-UP
CONTROL
REGULATOR
32 kHz
OSCILLATOR
ALWAYS-ON/RTC POWER DOMAIN
MAIN POWER DOMAIN
RTCX1
VBAT
VDDREG
RTCX2
VDDIO
VSS
to memories,
peripherals,
oscillators,
PLLs
to cores
to I/O pads
ADC
DAC
OTP
ADC POWER DOMAIN
OTP POWER DOMAIN
USB0 POWER DOMAIN
VDDA
VSSA
VPP
USB0 USB0_VDDA3V_DRIVER
USB0_VDDA3V3
LPC43xx
ULTRA LOW-POWER
REGULATOR
ALARM
RESET
WAKEUP0/1/2/3
to RTC
domain
peripherals
002aag378
to RTC I/O
pads (Vps)LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 84 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
Active mode and sleep mode apply to the state of the core. In a dual-core system, either
core can be in active or sleep mode independently of the other core.
If the core is in Active mode, it is fully operational and can access peripherals and
memories as configured by software. If the core is in Sleep mode, it receives no clocks,
but peripherals and memories remain running.
Either core can enter sleep mode from active mode independently of the other core and
while the other core remains in active mode or is in sleep mode.
Power-down modes apply to the entire system. In the Power-down modes, both cores and
all peripherals except for peripherals in the always-on power domain are shut down.
Memories can remain powered for retaining memory contents as defined by the individual
power-down mode.
Either core in active mode can put the part into one of the three power down modes if the
core is enabled to do so. If both cores are enabled for putting the system into power-down,
then the system enters power-down only once both cores have received a WFI or WFE
instruction.
Wake-up from sleep mode is caused by an interrupt or event in the core’s NVIC. The
interrupt is captured in the NVIC and an event is captured in the Event router. Both cores
can wake up from sleep mode independently of each other.
Wake-up from the Power-down modes, Deep-sleep, Power-down, and Deep power-down,
is caused by an event on the WAKEUP pins or an event from the RTC or alarm timer.
When waking up from Deep power-down mode, the part resets and attempts to boot.
7.23 Serial Wire Debug/JTAG
Debug and trace functions are integrated into the ARM Cortex-M4. Serial wire debug and
trace functions are supported in addition to a standard JTAG debug and parallel trace
functions. The ARM Cortex-M4 is configured to support up to eight breakpoints and four
watch points.
Remark: Serial Wire Debug is supported for the ARM Cortex-M4 only,
The ARM Cortex-M0 coprocessor supports JTAG debug. A standard ARM
Cortex-compliant debugger can debug the ARM Cortex-M4 and the ARM Cortex-M0
cores separately or both cores simultaneously.
Remark: In order to debug the ARM Cortex-M0, release the M0 reset by software in the
RGU block.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 85 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
Fig 10. Dual-core debug configuration
002aah448
TCK ARM Cortex-M0 ARM Cortex-M4
DBGEN = HIGH
TMS
TRST
TDI TDO TDO
TDO
DBGEN
RESET RESET = HIGH
TCK
TMS
TRST
TDI
TCK
TMS
TRST
TDI
JTAG ID = 0x0BA0 1477 JTAG ID = 0x4BA0 0477
LPC43xxLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 86 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
8. Limiting values
[1] The following applies to the limiting values:
a) This product includes circuitry designed for the protection of its internal devices from the damaging effects of excessive static
charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[2] Including voltage on outputs in 3-state mode.
[3] The peak current is limited to 25 times the corresponding maximum current.
[4] Dependent on package type.
[5] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol Parameter Conditions Min Max Unit
VDD(REG)(3V3) regulator supply voltage
(3.3 V)
on pin VDDREG 0.5 3.6 V
VDD(IO) input/output supply
voltage
on pin VDDIO 0.5 3.6 V
VDDA(3V3) analog supply voltage
(3.3 V)
on pin VDDA 0.5 3.6 V
VBAT battery supply voltage on pin VBAT 0.5 3.6 V
Vprog(pf) polyfuse programming
voltage
on pin VPP 0.5 3.6 V
VI input voltage only valid when VDD(IO) 2.2 V
5 V tolerant I/O pins
[2]
0.5 5.5 V
ADC/DAC pins and digital I/O
pins configured for an analog
function
0.5 VDDA(3V3) V
USB0 pins USB0_DP;
USB0_DM;USB0_VBUS
0.3 5.25 V
USB0 pins USB0_ID;
USB0_RREF
0.3 3.6 V
USB1 pins USB1_DP and
USB1_DM
0.3 5.25 V
IDD supply current per supply pin [3] - 100 mA
ISS ground current per ground pin [3] - 100 mA
Ilatch I/O latch-up current (0.5VDD(IO)) < VI < (1.5VDD(IO));
Tj
< 125 C
- 100 mA
Tstg storage temperature [4] 65 +150 C
Ptot(pack) total power dissipation
(per package)
based on package heat transfer,
not device power consumption
- 1.5 W
VESD electrostatic discharge
voltage
human body model; all pins [5] 2000 +2000 VLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 87 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
9. Thermal characteristics
The average chip junction temperature, Tj (C), can be calculated using the following
equation:
(1)
• Tamb = ambient temperature (C),
• Rth(j-a) = the package junction-to-ambient thermal resistance (C/W)
• PD = sum of internal and I/O power dissipation
The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
Tj Tamb PD Rth j a – +=
Table 7. Thermal characteristics
VDD = 2.2 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified;
Symbol Parameter Conditions Min Typ Max Unit
Tj(max) maximum junction
temperature
- - 125 C
Table 8. Thermal resistance (LQFP packages)
Symbol Parameter Conditions Thermal resistance
in C/W ±15 %
LQFP144
Rth(j-a) thermal resistance from
junction to ambient
JEDEC (4.5 in 4 in); still air 38
Single-layer (4.5 in 3 in);
still air
50
Rth(j-c) thermal resistance from
junction to case
11
Table 9. Thermal resistance value (BGA packages)
Symbol Parameter Conditions Thermal resistance in C/W ±15 %
LBGA256 TFBGA180 TFBGA100
Rth(j-a) thermal resistance from
junction to ambient
JEDEC (4.5 in 4 in); still air 29 38 46
8-layer (4.5 in 3 in); still air 24 30 37
Rth(j-c) thermal resistance from
junction to case
14 11 11LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 88 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
10. Static characteristics
Table 10. Static characteristics
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol Parameter Conditions Min Typ[1] Max Unit
Supply pins
VDD(IO) input/output supply
voltage
2.2 - 3.6 V
VDD(REG)(3V3) regulator supply voltage
(3.3 V)
[2] 2.2 - 3.6 V
VDDA(3V3) analog supply voltage
(3.3 V)
on pin VDDA 2.2 - 3.6 V
on pins
USB0_VDDA3V3_
DRIVER and
USB0_VDDA3V3
3.0 3.3 3.6 V
VBAT battery supply voltage [2] 2.2 - 3.6 V
Vprog(pf) polyfuse programming
voltage
on pin VPP (for OTP) [3] 2.7 - 3.6 V
Iprog(pf) polyfuse programming
current
on pin VPP; OTP
programming time
1.6 ms
- - 30 mA
IDD(REG)(3V3) regulator supply current
(3.3 V)
Active mode; M0-core in
reset; code
while(1){}
executed from RAM; all
peripherals disabled;
PLL1 enabled
CCLK = 12 MHz [4] - 6.6- mA
CCLK = 60 MHz [4] 25.3 - mA
CCLK = 120 MHz [4] - 48.4- mA
CCLK = 180 MHz [4] - 72.0- mA
CCLK = 204 MHz [4] - 81.5- mA
IDD(REG)(3V3) regulator supply current
(3.3 V)
after WFE/WFI instruction
executed from RAM; all
peripherals disabled; M0
core in reset
sleep mode [4][5] - 5.0- mA
deep-sleep mode [4] - 30 - A
power-down mode [4] - 15 - A
deep power-down
mode
[4][6] - 0.03 - A
deep power-down
mode; VBAT floating
[4]-- 2 - A
IBAT battery supply current active mode; VBAT = 3.2 V;
VDD(REG)(3V3) = 3.6 V.
[7] - 0 -nALPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 89 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
IBAT battery supply current VDD(REG)(3V3) = 3.3 V;
VBAT = 3.6 V
deep-sleep mode
[8]
- 2- A
power-down mode [8] - 2- A
deep power-down
mode
[8]
- 2- A
IDD(IO) I/O supply current deep sleep mode - - 1 - A
power-down mode - - 1 - A
deep power-down mode [9] - 0.05 - A
IDDA Analog supply current on pin VDDA;
deep sleep mode
[11] - 0.4 -
A
power-down mode [11] - 0.4 - A
deep power-down
mode
[11] - 0.007 -
A
RESET,RTC_ALARM, WAKEUPn pins
VIH HIGH-level input
voltage
[10] 0.8 (Vps
0.35)
- 5.5 V
VIL LOW-level input voltage [10] 0 - 0.3 (Vps
0.1)
V
Vhys hysteresis voltage [10] 0.05 (Vps
0.35)
--V
Vo output voltage [10] - Vps - 0.2 - V
Standard I/O pins - normal drive strength
CI input capacitance - - 2 pF
ILL LOW-level leakage
current
VI = 0 V; on-chip pull-up
resistor disabled
- 3 - nA
ILH HIGH-level leakage
current
VI = VDD(IO); on-chip
pull-down resistor
disabled
- 3 - nA
VI = 5 V --20 nA
IOZ OFF-state output
current
VO = 0 V to VDD(IO);
on-chip pull-up/down
resistors disabled;
absolute value
- 3- nA
VI input voltage pin configured to provide
a digital function;
VDD(IO) 2.2 V
0 - 5.5 V
VDD(IO) = 0 V 0 - 3.6 V
VO output voltage output active 0 - VDD(IO) V
VIH HIGH-level input
voltage
0.7
VDD(IO)
- 5.5 V
VIL LOW-level input voltage 0 - 0.3
VDD(IO)
V
Vhys hysteresis voltage 0.1
VDD(IO)
--V
Table 10. Static characteristics …continued
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol Parameter Conditions Min Typ[1] Max UnitLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 90 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
VOH HIGH-level output
voltage
IOH = 6 mA VDD(IO)
0.4
--V
VOL LOW-level output
voltage
IOL = 6 mA --0.4 V
IOH HIGH-level output
current
VOH = VDD(IO) 0.4 V 6 - - mA
IOL LOW-level output
current
VOL = 0.4 V 6- - mA
IOHS HIGH-level short-circuit
output current
drive HIGH; connected to
ground
[12] --86.5 mA
IOLS LOW-level short-circuit
output current
drive LOW; connected to
VDD(IO)
[12] --76.5 mA
Ipd pull-down current VI = 5 V [14][15]
[16]
- 93 - A
Ipu pull-up current VI =0V [14][15]
[16]
- 62 - A
VDD(IO) < VI 5 V - 10 - A
Rs series resistance on I/O pins with analog
function; analog function
enabled
200
I/O pins - high drive strength
CI input capacitance - - 5.2 pF
ILL LOW-level leakage
current
VI = 0 V; on-chip pull-up
resistor disabled
- 3 - nA
ILH HIGH-level leakage
current
VI = VDD(IO); on-chip
pull-down resistor
disabled
- 3 - nA
VI = 5 V --20 nA
IOZ OFF-state output
current
VO = 0 V to VDD(IO);
on-chip pull-up/down
resistors disabled;
absolute value
- 3 - nA
VI input voltage pin configured to provide
a digital function;
VDD(IO) 2.2 V 0 - 5.5 V
VDD(IO) = 0 V 0 - 3.6 V
VO output voltage output active 0 - VDD(IO) V
VIH HIGH-level input
voltage
0.7
VDD(IO)
- 5.5 V
VIL LOW-level input voltage 0 - 0.3
VDD(IO)
V
Vhys hysteresis voltage 0.1
VDD(IO)
--V
Ipd pull-down current VI = VDD(IO) [14][15]
[16]
- 62 - A
Table 10. Static characteristics …continued
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol Parameter Conditions Min Typ[1] Max UnitLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 91 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
Ipu pull-up current VI =0V [14][15]
[16]
- 62 - A
VDD(IO) < VI 5 V - 10 - A
I/O pins - high drive strength: standard drive mode
IOH HIGH-level output
current
VOH = VDD(IO) 0.4 V 4 - - mA
IOL LOW-level output
current
VOL = 0.4 V 4- - mA
IOHS HIGH-level short-circuit
output current
drive HIGH; connected to
ground
[12] --32 mA
IOLS LOW-level short-circuit
output current
drive LOW; connected to
VDD(IO)
[12] --32 mA
I/O pins - high drive strength: medium drive mode
IOH HIGH-level output
current
VOH = VDD(IO) 0.4 V 8 - - mA
IOL LOW-level output
current
VOL = 0.4 V 8- - mA
IOHS HIGH-level short-circuit
output current
drive HIGH; connected to
ground
[12] --65 mA
IOLS LOW-level short-circuit
output current
drive LOW; connected to
VDD(IO)
[12] --63 mA
I/O pins - high drive strength: high drive mode
IOH HIGH-level output
current
VOH = VDD(IO) 0.4 V 14 - - mA
IOL LOW-level output
current
VOL = 0.4 V 14- - mA
IOHS HIGH-level short-circuit
output current
drive HIGH; connected to
ground
[12] --113 mA
IOLS LOW-level short-circuit
output current
drive LOW; connected to
VDD(IO)
[12] --110 mA
I/O pins - high drive strength: ultra-high drive mode
IOH HIGH-level output
current
VOH = VDD(IO) 0.4 V 20 - - mA
IOL LOW-level output
current
VOL = 0.4 V 20- - mA
IOHS HIGH-level short-circuit
output current
drive HIGH; connected to
ground
[12] --165 mA
IOLS LOW-level short-circuit
output current
drive LOW; connected to
VDD(IO)
[12] --156 mA
I/O pins - high-speed
CI input capacitance - - 2 pF
ILL LOW-level leakage
current
VI = 0 V; on-chip pull-up
resistor disabled
- 3 - nA
Table 10. Static characteristics …continued
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol Parameter Conditions Min Typ[1] Max UnitLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 92 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
ILH HIGH-level leakage
current
VI = VDD(IO); on-chip
pull-down resistor
disabled
- 3 - nA
VI = 5 V --20 nA
IOZ OFF-state output
current
VO = 0 V to VDD(IO);
on-chip pull-up/down
resistors disabled;
absolute value
- 3 - nA
VI input voltage pin configured to provide
a digital function;
VDD(IO) 2.2 V 0 - 5.5 V
VDD(IO) = 0 V 0 - 3.6 V
VO output voltage output active 0 - VDD(IO) V
VIH HIGH-level input
voltage
0.7
VDD(IO)
- 5.5 V
VIL LOW-level input voltage 0 - 0.3
VDD(IO)
V
Vhys hysteresis voltage 0.1
VDD(IO)
--V
VOH HIGH-level output
voltage
IOH = 8 mA VDD(IO)
0.4
--V
VOL LOW-level output
voltage
IOL = 8 mA --0.4 V
IOH HIGH-level output
current
VOH = VDD(IO) 0.4 V 8 - - mA
IOL LOW-level output
current
VOL = 0.4 V 8- - mA
IOHS HIGH-level short-circuit
output current
drive HIGH; connected to
ground
[12] --86 mA
IOLS LOW-level short-circuit
output current
drive LOW; connected to
VDD(IO)
[12] --76 mA
Ipd pull-down current VI = VDD(IO) [14][15]
[16]
- 62 - A
Ipu pull-up current VI =0V [14][15]
[16]
- 62 - A
VDD(IO) < VI 5V - 0 - A
Open-drain I2C0-bus pins
VIH HIGH-level input
voltage
0.7
VDD(IO)
--V
VIL LOW-level input voltage 0 0.14 0.3
VDD(IO)
V
Vhys hysteresis voltage 0.1
VDD(IO)
--V
VOL LOW-level output
voltage
IOLS = 3 mA --0.4 V
Table 10. Static characteristics …continued
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol Parameter Conditions Min Typ[1] Max UnitLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 93 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
[1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
[2] Dynamic characteristics for peripherals are provided for VDD(REG)(3V) 2.7 V.
ILI input leakage current VI = VDD(IO) [13] - 4.5 - A
VI = 5 V --10 A
Oscillator pins
Vi(XTAL1) input voltage on pin
XTAL1
0.5 - 1.2 V
Vo(XTAL2) output voltage on pin
XTAL2
0.5 - 1.2 V
Cio input/output
capacitance
[17] --0.8 pF
USB0 pins[18]
VI input voltage on pins USB0_DP;
USB0_DM; USB0_VBUS
VDD(IO) 2.2 V 0 - 5.25 V
VDD(IO) = 0 V 0 - 3.6 V
Rpd pull-down resistance on pin USB0_VBUS 48 64 80 k
VIC common-mode input
voltage
high-speed mode 50 200 500 mV
full-speed/low-speed
mode
800 - 2500 mV
chirp mode 50 - 600 mV
Vi(dif) differential input voltage 100 400 1100 mV
USB1 pins (USB1_DP/USB1_DM)[18]
IOZ OFF-state output
current
0V 0
EMC_DYCSn,
EMC_RAS,
EMC_CAS,
EMC_WE,
EMC_CKEOUTn,
EMC_A[22:0],
EMC_DQMOUTn
th(Q)
th(Q) - td
th(D) tsu(D)
th(D) tsu(D)
EMC_D[31:0]
write
EMC_D[31:0]
read; delay = 0
EMC_D[31:0]
read; delay > 0
th(x) - td td(xV) - td
td(QV) - td
td(QV)
th(x) td(xV)
EMC_CLKn delay td; programmable CLKn_DELAYLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 123 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
11.15 USB interface
[1] Characterized but not implemented as production test. Guaranteed by design.
Table 28. Dynamic characteristics: USB0 and USB1 pins (full-speed)
CL = 50 pF; Rpu = 1.5 k on D+ to VDD(IO); 3.0 V VDD(IO) 3.6 V.
Symbol Parameter Conditions Min Typ Max Unit
tr rise time 10 % to 90 % 8.5 - 13.8 ns
tf fall time 10 % to 90 % 7.7 - 13.7 ns
tFRFM differential rise and fall time
matching
tr / tf - -109 %
VCRS output signal crossover voltage 1.3 - 2.0 V
tFEOPT source SE0 interval of EOP see Figure 36 160 - 175 ns
tFDEOP source jitter for differential transition
to SE0 transition
see Figure 36 2 - +5 ns
tJR1 receiver jitter to next transition 18.5 - +18.5 ns
tJR2 receiver jitter for paired transitions 10 % to 90 % 9 - +9 ns
tEOPR1 EOP width at receiver must reject as
EOP; see
Figure 36
[1] 40 - - ns
tEOPR2 EOP width at receiver must accept as
EOP; see
Figure 36
[1] 82 - - ns
Fig 36. Differential data-to-EOP transition skew and EOP width
002aab561
TPERIOD
differential
data lines
crossover point
source EOP width: tFEOPT
receiver EOP width: tEOPR1, tEOPR2
crossover point
extended
differential data to
SE0/EOP skew
n × TPERIOD + tFDEOPLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 124 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
[1] Characterized but not implemented as production test.
[2] Total average power consumption.
[3] The driver is active only 20 % of the time.
11.16 Ethernet
Remark: The timing characteristics of the ENET_MDC and ENET_MDIO signals comply
with the IEEE standard 802.3.
Table 29. Static characteristics: USB0 PHY pins[1]
Symbol Parameter Conditions Min Typ Max Unit
High-speed mode
Pcons power consumption [2] - 68 - mW
IDDA(3V3) analog supply current (3.3 V) on pin USB0_VDDA3V3_DRIVER;
total supply current
[3]
- 18 - mA
during transmit - 31 - mA
during receive - 14 - mA
with driver tri-stated - 14 - mA
IDDD digital supply current - 7 - mA
Full-speed/low-speed mode
Pcons power consumption [2] - 15 - mW
IDDA(3V3) analog supply current (3.3 V) on pin USB0_VDDA3V3_DRIVER;
total supply current - 3.5 - mA
during transmit - 5 - mA
during receive - 3 - mA
with driver tri-stated - 3 - mA
IDDD digital supply current - 3 - mA
Suspend mode
IDDA(3V3) analog supply current (3.3 V) - 24 - A
with driver tri-stated - 24 - A
with OTG functionality enabled - 3 - mA
IDDD digital supply current - 30 - A
VBUS detector outputs
Vth threshold voltage for VBUS valid 4.4 - - V
for session end 0.2 - 0.8 V
for A valid 0.8 - 2 V
for B valid 2 - 4 V
Vhys hysteresis voltage for session end - 150 10 mV
A valid - 200 10 mV
B valid - 200 10 mVLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 125 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
[1] Output drivers can drive a load 25 pF accommodating over 12 inch of PCB trace and the input
capacitance of the receiving device.
[2] Timing values are given from the point at which the clock signal waveform crosses 1.4 V to the valid input or
output level.
Table 30. Dynamic characteristics: Ethernet
Tamb = 40 C to 85 C; 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V VDD(IO) 3.6 V. Values guaranteed by
design.
Symbol Parameter Conditions Min Max Unit
RMII mode
fclk clock frequency for ENET_RX_CLK [1] - 50 MHz
clk clock duty cycle [1] 50 50 %
tsu set-up time for ENET_TXDn, ENET_TX_EN,
ENET_RXDn, ENET_RX_ER,
ENET_RX_DV
[1][2] 4 - ns
th hold time for ENET_TXDn, ENET_TX_EN,
ENET_RXDn, ENET_RX_ER,
ENET_RX_DV
[1][2] 2 - ns
MII mode
fclk clock frequency for ENET_TX_CLK [1] - 25 MHz
clk clock duty cycle [1] 50 50 %
tsu set-up time for ENET_TXDn, ENET_TX_EN,
ENET_TX_ER
[1][2] 4 - ns
th hold time for ENET_TXDn, ENET_TX_EN,
ENET_TX_ER
[1][2] 2 - ns
fclk clock frequency for ENET_RX_CLK [1] - 25 MHz
clk clock duty cycle [1] 50 50 %
tsu set-up time for ENET_RXDn, ENET_RX_ER,
ENET_RX_DV
[1][2] 4 - ns
th hold time for ENET_RXDn, ENET_RX_ER,
ENET_RX_DV
[1][2] 2 - ns
Fig 37. Ethernet timing
002aag210
th tsu
ENET_RX_CLK
ENET_TX_CLK
ENET_RXD[n]
ENET_RX_DV
ENET_RX_ER
ENET_TXD[n]
ENET_TX_EN
ENET_TX_ERLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 126 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
11.17 SD/MMC
11.18 LCD
Table 31. Dynamic characteristics: SD/MMC
Tamb = 40 C to 85 C, 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V VDD(IO) 3.6 V, CL = 20 pF. Simulated
values. SAMPLE_DELAY = 0x8, DRV_DELAY = 0xF in the SDDELAY register (see the LPC43xx
user manual UM10430).
Symbol Parameter Conditions Min Max Unit
fclk clock frequency on pin SD_CLK; data transfer mode 52 MHz
tr rise time 0.5 2 ns
tf fall time 0.5 2 ns
tsu(D) data input set-up time on pins SD_DATn as inputs 6 - ns
on pins SD_CMD as inputs 7 - ns
th(D) data input hold time on pins SD_DATn as inputs -1 - ns
on pins SD_CMD as inputs 1 ns
td(QV) data output valid delay
time
on pins SD_DATn as outputs - 17 ns
on pins SD_CMD as outputs - 18 ns
th(Q) data output hold time on pins SD_DATn as outputs 4 - ns
on pins SD_CMD as outputs 4 - ns
Fig 38. SD/MMC timing
002aag204
SD_CLK
SD_DATn (O)
SD_DATn (I)
td(QV)
th(D) tsu(D)
Tcy(clk)
th(Q)
SD_CMD (O)
SD_CMD (I)
Table 32. Dynamic characteristics: LCD
Tamb = 40 C to +85 C; 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V VDD(IO) 3.6 V; CL = 20 pF.
Simulated values.
Symbol Parameter Conditions Min Typ Max Unit
fclk clock frequency on pin LCD_DCLK - 50 - MHz
td(QV) data output valid
delay time
- 17 ns
th(Q) data output hold time 8.5 - nsLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 127 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
11.19 SPIFI
Table 33. Dynamic characteristics: SPIFI
Tamb = 40 C to 85 C; 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V VDD(IO) 3.6 V. CL = 10 pF. Simulated
values.
Symbol Parameter Min Max Unit
Tcy(clk) clock cycle time 9.6 - ns
tDS data set-up time 3.4 - ns
tDH data hold time 0 - ns
tv(Q) data output valid time - 3.2 ns
th(Q) data output hold time 0.2 - ns
Fig 39. SPIFI timing (Mode 0)
SPIFI_SCK
SPIFI data out
SPIFI data in
Tcy(clk)
tDS tDH
tv(Q)
DATA VALID DATA VALID
th(Q)
DATA VALID DATA VALID
002aah409LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 128 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
12. ADC/DAC electrical characteristics
[1] The ADC is monotonic, there are no missing codes.
[2] The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 40.
[3] The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after
appropriate adjustment of gain and offset errors. See Figure 40.
[4] The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the
ideal curve. See Figure 40.
[5] The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset
error, and the straight line which fits the ideal transfer curve. See Figure 40.
[6] The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated
ADC and the ideal transfer curve. See Figure 40.
[7] Tamb = 25 C.
[8] Input resistance Ri
depends on the sampling frequency fs: Ri
= 2 k + 1 / (fs Cia).
Table 34. ADC characteristics
VDDA(3V3) over specified ranges; Tamb = 40 C to +85 C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VIA analog input voltage 0 - VDDA(3V3) V
Cia analog input
capacitance
- - 2 pF
ED differential linearity error 2.7 V VDDA(3V3) 3.6 V [1][2] - 0.8 - LSB
2.2 V VDDA(3V3) < 2.7 V - 1.0 - LSB
EL(adj) integral non-linearity 2.7 V VDDA(3V3) 3.6 V [3] - 0.8 - LSB
2.2 V VDDA(3V3) < 2.7 V - 1.5 - LSB
EO offset error 2.7 V VDDA(3V3) 3.6 V [4] - 0.15 - LSB
2.2 V VDDA(3V3) < 2.7 V - 0.15 - LSB
EG gain error 2.7 V VDDA(3V3) 3.6 V [5] - 0.3 - %
2.2 V VDDA(3V3) < 2.7 V - 0.35 - %
ET absolute error 2.7 V VDDA(3V3) 3.6 V [6] - 3 - LSB
2.2 V VDDA(3V3) < 2.7 V - 4 - LSB
Rvsi voltage source interface
resistance
see Figure 41 - - 1/(7 fclk(ADC)
Cia)
k
Ri input resistance [7][8] - - 1.2 M
fclk(ADC) ADC clock frequency - - 4.5 MHz
fs sampling frequency 10-bit resolution; 11 clock
cycles
- - 400 kSamples/s
2-bit resolution; 3 clock
cycles
1.5 MSamples/sLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 129 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
(1) Example of an actual transfer curve.
(2) The ideal transfer curve.
(3) Differential linearity error (ED).
(4) Integral non-linearity (EL(adj)).
(5) Center of a step of the actual transfer curve.
Fig 40. 10-bit ADC characteristics
002aaf959
1023
1022
1021
1020
1019
(2)
(1)
123456 7 1018 1019 1020 1021 1022 1023 1024
7
6
5
4
3
2
1
0
1018
(5)
(4)
(3)
1 LSB
(ideal)
code
out
VDDA(3V3) − VSSA
1024
offset
error
EO
gain
error
EG
offset error
EO
VIA (LSBideal)
1 LSB =LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 130 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
[1] In the DAC CR register, bit BIAS = 0 (see the LPC43xx user manual).
[2] Settling time is calculated within 1/2 LSB of the final value.
Rs 1/((7 fclk(ADC) Cia) 2 k
Fig 41. ADC interface to pins
LPC43xx
ADC0_n/ADC1_n
Cia = 2 pF
Rvsi
Rs
VSS
VEXT
002aag704
ADC
COMPARATOR
2 kΩ (analog pin)
2.2 kΩ (multiplexed pin)
Table 35. DAC characteristics
VDDA(3V3) over specified ranges; Tamb = 40 C to +85 C; unless otherwise specified
Symbol Parameter Conditions Min Typ Max Unit
ED differential linearity error 2.7 V VDDA(3V3) 3.6 V [1] - 0.8 - LSB
2.2 V VDDA(3V3) < 2.7 V - 1.0 - LSB
EL(adj) integral non-linearity code = 0 to 975
2.7 V VDDA(3V3) 3.6 V
[1] - 1.0 - LSB
2.2 V VDDA(3V3) < 2.7 V - 1.5 - LSB
EO offset error 2.7 V VDDA(3V3) 3.6 V [1] - 0.8 - LSB
2.2 V VDDA(3V3) < 2.7 V - 1.0 - LSB
EG gain error 2.7 V VDDA(3V3) 3.6 V [1] - 0.3 - %
2.2 V VDDA(3V3) < 2.7 V - 1.0 - %
CL load capacitance - - 200 pF
RL load resistance 1 - - k
ts settling time [2] 0.4 LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 131 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
13. Application information
13.1 LCD panel signal usage
Table 36. LCD panel connections for STN single panel mode
External pin 4-bit mono STN single panel 8-bit mono STN single panel Color STN single panel
LPC43xx pin
used
LCD function LPC43xx pin
used
LCD function LPC43xx pin
used
LCD function
LCD_VD[23:8] - - - - - -
LCD_VD7 - - P8_4 UD[7] P8_4 UD[7]
LCD_VD6 - - P8_5 UD[6] P8_5 UD[6]
LCD_VD5 - - P8_6 UD[5] P8_6 UD[5]
LCD_VD4 - - P8_7 UD[4] P8_7 UD[4]
LCD_VD3 P4_2 UD[3] P4_2 UD[3] P4_2 UD[3]
LCD_VD2 P4_3 UD[2] P4_3 UD[2] P4_3 UD[2]
LCD_VD1 P4_4 UD[1] P4_4 UD[1] P4_4 UD[1]
LCD_VD0 P4_1 UD[0] P4_1 UD[0] P4_1 UD[0]
LCD_LP P7_6 LCDLP P7_6 LCDLP P7_6 LCDLP
LCD_ENAB/
LCDM
P4_6 LCDENAB/
LCDM
P4_6 LCDENAB/
LCDM
P4_6 LCDENAB/
LCDM
LCD_FP P4_5 LCDFP P4_5 LCDFP P4_5 LCDFP
LCD_DCLK P4_7 LCDDCLK P4_7 LCDDCLK P4_7 LCDDCLK
LCD_LE P7_0 LCDLE P7_0 LCDLE P7_0 LCDLE
LCD_PWR P7_7 CDPWR P7_7 LCDPWR P7_7 LCDPWR
GP_CLKIN PF_4 LCDCLKIN PF_4 LCDCLKIN PF_4 LCDCLKIN
Table 37. LCD panel connections for STN dual panel mode
External pin 4-bit mono STN dual panel 8-bit mono STN dual panel Color STN dual panel
LPC43xx pin
used
LCD function LPC43xx pin
used
LCD function LPC43xx pin
used
LCD function
LCD_VD[23:16] - - - - - -
LCD_VD15 - - PB_4 LD[7] PB_4 LD[7]
LCD_VD14 - - PB_5 LD[6] PB_5 LD[6]
LCD_VD13 - - PB_6 LD[5] PB_6 LD[5]
LCD_VD12 - - P8_3 LD[4] P8_3 LD[4]
LCD_VD11 P4_9 LD[3] P4_9 LD[3] P4_9 LD[3]
LCD_VD10 P4_10 LD[2] P4_10 LD[2] P4_10 LD[2]
LCD_VD9 P4_8 LD[1] P4_8 LD[1] P4_8 LD[1]
LCD_VD8 P7_5 LD[0] P7_5 LD[0] P7_5 LD[0]
LCD_VD7 - - UD[7] P8_4 UD[7]
LCD_VD6 - - P8_5 UD[6] P8_5 UD[6]
LCD_VD5 - - P8_6 UD[5] P8_6 UD[5]
LCD_VD4 - - P8_7 UD[4] P8_7 UD[4]
LCD_VD3 P4_2 UD[3] P4_2 UD[3] P4_2 UD[3]LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 132 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
LCD_VD2 P4_3 UD[2] P4_3 UD[2] P4_3 UD[2]
LCD_VD1 P4_4 UD[1] P4_4 UD[1] P4_4 UD[1]
LCD_VD0 P4_1 UD[0] P4_1 UD[0] P4_1 UD[0]
LCD_LP P7_6 LCDLP P7_6 LCDLP P7_6 LCDLP
LCD_ENAB/
LCDM
P4_6 LCDENAB/
LCDM
P4_6 LCDENAB/
LCDM
P4_6 LCDENAB/
LCDM
LCD_FP P4_5 LCDFP P4_5 LCDFP P4_5 LCDFP
LCD_DCLK P4_7 LCDDCLK P4_7 LCDDCLK P4_7 LCDDCLK
LCD_LE P7_0 LCDLE P7_0 LCDLE P7_0 LCDLE
LCD_PWR P7_7 LCDPWR P7_7 LCDPWR P7_7 LCDPWR
GP_CLKIN PF_4 LCDCLKIN PF_4 LCDCLKIN PF_4 LCDCLKIN
Table 37. LCD panel connections for STN dual panel mode …continued
External pin 4-bit mono STN dual panel 8-bit mono STN dual panel Color STN dual panel
LPC43xx pin
used
LCD function LPC43xx pin
used
LCD function LPC43xx pin
used
LCD function
Table 38. LCD panel connections for TFT panels
External
pin
TFT 12 bit (4:4:4
mode)
TFT 16 bit (5:6:5 mode) TFT 16 bit (1:5:5:5 mode) TFT 24 bit
LPC43xx
pin used
LCD
function
LPC43xx
pin used
LCD
function
LPC43xx pin
used
LCD
function
LPC43xx
pin used
LCD
function
LCD_VD23 PB_0 BLUE3 PB_0 BLUE4 PB_0 BLUE4 PB_0 BLUE7
LCD_VD22 PB_1 BLUE2 PB_1 BLUE3 PB_1 BLUE3 PB_1 BLUE6
LCD_VD21 PB_2 BLUE1 PB_2 BLUE2 PB_2 BLUE2 PB_2 BLUE5
LCD_VD20 PB_3 BLUE0 PB_3 BLUE1 PB_3 BLUE1 PB_3 BLUE4
LCD_VD19 - - P7_1 BLUE0 P7_1 BLUE0 P7_1 BLUE3
LCD_VD18 - - - - P7_2 intensity P7_2 BLUE2
LCD_VD17 - - - - - - P7_3 BLUE1
LCD_VD16 - - - - - - P7_4 BLUE0
LCD_VD15 PB_4 GREEN3 PB_4 GREEN5 PB_4 GREEN4 PB_4 GREEN7
LCD_VD14 PB_5 GREEN2 PB_5 GREEN4 PB_5 GREEN3 PB_5 GREEN6
LCD_VD13 PB_6 GREEN1 PB_6 GREEN3 PB_6 GREEN2 PB_6 GREEN5
LCD_VD12 P8_3 GREEN0 P8_3 GREEN2 P8_3 GREEN1 P8_3 GREEN4
LCD_VD11 - - P4_9 GREEN1 P4_9 GREEN0 P4_9 GREEN3
LCD_VD10 - - P4_10 GREEN0 P4_10 intensity P4_10 GREEN2
LCD_VD9 - - - - - - P4_8 GREEN1
LCD_VD8 - - - - - - P7_5 GREEN0
LCD_VD7 P8_4 RED3 P8_4 RED4 P8_4 RED4 P8_4 RED7
LCD_VD6 P8_5 RED2 P8_5 RED3 P8_5 RED3 P8_5 RED6
LCD_VD5 P8_6 RED1 P8_6 RED2 P8_6 RED2 P8_6 RED5
LCD_VD4 P8_7 RED0 P8_7 RED1 P8_7 RED1 P8_7 RED4
LCD_VD3 - - P4_2 RED0 P4_2 RED0 P4_2 RED3
LCD_VD2 - - - - P4_3 intensity P4_3 RED2
LCD_VD1 - - - - - - P4_4 RED1LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 133 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
13.2 Crystal oscillator
The crystal oscillator is controlled by the XTAL_OSC_CTRL register in the CGU (see
LPC43xx user manual).
The crystal oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can be
boosted to a higher frequency, up to the maximum CPU operating frequency, by the PLL.
The oscillator can operate in one of two modes: slave mode and oscillation mode.
• In slave mode, couple the input clock signal with a capacitor of 100 pF (CC in
Figure 42), with an amplitude of at least 200 mV (RMS). The XTAL2 pin in this
configuration can be left unconnected.
• External components and models used in oscillation mode are shown in Figure 43,
and in Table 39 and Table 40. Since the feedback resistance is integrated on chip,
only a crystal and the capacitances CX1 and CX2 need to be connected externally in
case of fundamental mode oscillation L, CL and RS represent the fundamental
frequency). The capacitance CP in Figure 43 represents the parallel package
capacitance and must not be larger than 7 pF. Parameters FC, CL, RS and CP are
supplied by the crystal manufacturer.
LCD_VD0 - - - - - - P4_1 RED0
LCD_LP P7_6 LCDLP P7_6 LCDLP P7_6 LCDLP P7_6 LCDLP
LCD_ENAB
/LCDM
P4_6 LCDENAB/
LCDM
P4_6 LCDENAB/
LCDM
P4_6 LCDENAB/
LCDM
P4_6 LCDENAB/
LCDM
LCD_FP P4_5 LCDFP P4_5 LCDFP P4_5 LCDFP P4_5 LCDFP
LCD_DCLK P4_7 LCDDCLK P4_7 LCDDCLK P4_7 LCDDCLK P4_7 LCDDCLK
LCD_LE P7_0 LCDLE P7_0 LCDLE P7_0 LCDLE P7_0 LCDLE
LCD_PWR P7_7 LCDPWR P7_7 LCDPWR P7_7 LCDPWR P7_7 LCDPWR
GP_CLKIN PF_4 LCDCLKIN PF_4 LCDCLKIN PF_4 LCDCLKIN PF_4 LCDCLKIN
Table 38. LCD panel connections for TFT panels …continued
External
pin
TFT 12 bit (4:4:4
mode)
TFT 16 bit (5:6:5 mode) TFT 16 bit (1:5:5:5 mode) TFT 24 bit
LPC43xx
pin used
LCD
function
LPC43xx
pin used
LCD
function
LPC43xx pin
used
LCD
function
LPC43xx
pin used
LCD
function
Table 39. Recommended values for CX1/X2 in oscillation mode (crystal and external
components parameters) low frequency mode
Fundamental oscillation
frequency
Maximum crystal series
resistance RS
External load capacitors
CX1, CX2
2 MHz < 200 33 pF, 33 pF
< 200 39 pF, 39 pF
< 200 56 pF, 56 pF
4 MHz < 200 18 pF, 18 pF
< 200 39 pF, 39 pF
< 200 56 pF, 56 pF
8 MHz < 200 18 pF, 18 pF
< 200 39 pF, 39 pFLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 134 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
12 MHz < 160 18 pF, 18 pF
< 160 39 pF, 39 pF
16 MHz < 120 18 pF, 18 pF
< 80 33 pF, 33 pF
20 MHz <100 18 pF, 18 pF
< 80 33 pF, 33 pF
Table 40. Recommended values for CX1/X2 in oscillation mode (crystal and external
components parameters) high frequency mode
Fundamental oscillation
frequency
Maximum crystal series
resistance RS
External load capacitors CX1,
Cx2
15 MHz < 80 18 pF, 18 pF
20 MHz < 80 39 pF, 39 pF
< 100 47 pF, 47 pF
Fig 42. Slave mode operation of the on-chip oscillator
Fig 43. Oscillator modes with external crystal model used for CX1/CX2 evaluation
Table 39. Recommended values for CX1/X2 in oscillation mode (crystal and external
components parameters) low frequency mode …continued
Fundamental oscillation
frequency
Maximum crystal series
resistance RS
External load capacitors
CX1, CX2
LPC43xx
XTAL1
Ci
100 pF
Cg
002aag379
002aag380
LPC43xx
XTAL1 XTAL2
CX1 CX2
XTAL
= CL CP
RS
LLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 135 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
13.3 RTC oscillator
In the RTC oscillator circuit, only the crystal (XTAL) and the capacitances CRTCX1 and
CRTCX2 need to be connected externally. Typical capacitance values for CRTCX1 and
CRTCX2 are CRTCX1/2 = 20 (typical) 4 pF.
An external clock can be connected to RTCX1 if RTCX2 is left open. The recommended
amplitude of the clock signal is Vi(RMS) = 100 mV to 200 mV with a coupling capacitance of
5 pF to 10 pF. Vi(RMS) must be lower than 450 mV. See Figure 42 for a similar slave-mode
set-up that uses the crystal oscillator.
13.4 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines
Connect the crystal on the PCB as close as possible to the oscillator input and output pins
of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of third overtone
crystal usage have a common ground plane. Also connect the external components to the
ground plain. To keep the noise coupled in via the PCB as small as possible, make loops
and parasitics as small as possible. Choose smaller values of Cx1 and Cx2 if parasitics
increase in the PCB layout.
Ensure that no high-speed or high-drive signals are near the RTCX1/2 signals.
13.5 Standard I/O pin configuration
Figure 45 shows the possible pin modes for standard I/O pins with analog input function:
• Digital output driver enabled/disabled
• Digital input: Pull-up enabled/disabled
• Digital input: Pull-down enabled/disabled
• Digital input: Repeater mode enabled/disabled
• Digital input: Input buffer enabled/disabled
• Analog input
The default configuration for standard I/O pins is input buffer disabled and pull-up
enabled. The weak MOS devices provide a drive capability equivalent to pull-up and
pull-down resistors.
Fig 44. RTC 32 kHz oscillator circuit
002aah148
LPC43xx
RTCX1 RTCX2
CRTCX1 CRTCX2
XTALLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 136 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
13.6 Reset pin configuration
13.7 Suggested USB interface solutions
The USB device can be connected to the USB as self-powered device (see Figure 47) or
bus-powered device (see Figure 48).
The glitch filter rejects pulses of typical 12 ns width.
Fig 45. Standard I/O pin configuration with analog input
slew rate bit EHS
pull-up enable bit EPUN
pull-down enable bit EPD
glitch
filter
analog I/O
ESD
ESD
PIN
VDDIO
VSSIO
input buffer enable bit EZI
filter select bit ZIF
data input to core
data output from core
enable output driver
002aah028
Fig 46. Reset pin configuration
VSS
reset
002aag702
Vps
Vps
Vps
Rpu ESD
ESD
20 ns RC
GLITCH FILTER PINLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 137 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
On the LPC4350/30/20/10, USBn_VBUS pins are 5 V tolerant only when VDDIO is
applied and at operating voltage level. Therefore, if the USBn_VBUS function is
connected to the USB connector and the device is self-powered, the USBn_VBUS pins
must be protected for situations when VDDIO = 0 V.
If VDDIO is always at operating level while VBUS = 5 V, the USBn_VBUS pin can be
connected directly to the VBUS pin on the USB connector.
For systems where VDDIO can be 0 V and VBUS is directly applied to the USBn_VBUS
pins, precautions must be taken to reduce the voltage to below 3.6 V, which is the
maximum allowable voltage on the USBn_VBUS pins in this case.
One method is to use a voltage divider to connect the USBn_VBUS pins to VBUS on the
USB connector. The voltage divider ratio should be such that the USB_VBUS pin will be
greater than 0.7VDDIO to indicate a logic HIGH while below the 3.6 V allowable maximum
voltage.
For the following operating conditions
VBUSmax = 5.25 V
VDDIO = 3.6 V,
the voltage divider should provide a reduction of 3.6 V/5.25 V or ~0.686 V.
For bus-powered devices, a regulator powered by USB can provide 3.3 V to VDDIO
whenever bus power is present and ensure that power to the USBn_VBUS pins is always
present when the 5 V VBUS signal is applied. See Figure 48.
Remark: Applying 5 V to the USBn_VBUS pins for a short time while the regulator ramps
up might compromise the long-term reliability of the part but does not affect its function.
Fig 47. USB interface on a self-powered device where USBn_VBUS = 5 V
LPC43xx
VDDIO
USB-B
connector
USBn_VBUS VBUS
USB
R2
R3
aaa-013458LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 138 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
Remark: If the VBUS function of the USB1 interface is not connected, configure the pin
function for GPIO using the function control bits in the SYSCON block.
Remark: In OTG mode, it is important to be able to detect the VBUS level and to charge
and discharge VBUS. This requires adding active devices that disconnect the link when
VDDIO is not present.
Fig 48. USB interface on a bus-powered device
Fig 49. USB interface for USB operating in OTG mode
REGULATOR
USBn_VBUS VBUS
LPC43xx
VDDIO
USB-B
connector USB
aaa-013459
USBn_VBUS VBUS
LPC43xx
VDDIO
USB-B
connector USB
aaa-013460
R1
R2
R3
T2
T1LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 139 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
14. Package outline
Fig 50. Package outline LBGA256 package
OUTLINE REFERENCES
VERSION
EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC
MO-192
JEITA
SOT740-2 - - - - - -
SOT740-2
05-06-16
05-08-04
UNIT A
max
mm 1.55 0.45
0.35
1.1
0.9
0.55
0.45
17.2
16.8
17.2
16.8
A1
DIMENSIONS (mm are the original dimensions)
LBGA256: plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1 mm
X
A2 b D E e
1
e1
15
e2
15
v
0.25
w
0.1
y
0.12
y1
0.35
1/2 e
1/2 e
A
A2
A1
detail X
D
E
B A
ball A1
index area
y1 C y
C
A B
A
B
C
D
E
F
H
K
G
J
L
M
N
P
R
T
2 4 6 8 10 12 14 16 1 3 5 7 9 11 13 15 ball A1
index area
e
e
e1
b
e2
C
C
∅ v M
∅ w M
0 5 10 mm
scaleLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 140 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
Fig 51. Package outline of the TFBGA180 package
OUTLINE REFERENCES
VERSION
EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOT570-3
SOT570-3
08-07-09
10-04-15
UNIT
mm
max
nom
min
1.20
1.06
0.95
0.40
0.35
0.30
0.50
0.45
0.40
12.1
12.0
11.9
12.1
12.0
11.9
0.8 10.4 0.15 0.12
A
DIMENSIONS (mm are the original dimensions)
TFBGA180: thin fine-pitch ball grid array package; 180 balls
0 5 10 mm
scale
A1 A2
0.80
0.71
0.65
b D E e e1
10.4
e2 v w
0.05
y y1
0.1
ball A1
index area
D B A
E
C
y1 C y
X
A
B
C
D
E
F
H
K
G
L
J
M
N
P
2 4 6 8 10 12 14 1 3 5 7 9 11 13
b
e2
e1
e
e
1/2 e
1/2 e ∅ v M AC B
∅ w M C
ball A1
index area
detail X
A
A2
A1LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 141 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
Fig 52. Package outline of the TFBGA100 package
OUTLINE REFERENCES
VERSION
EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOT926-1 - - - - - - - - -
SOT926-1
05-12-09
05-12-22
UNIT A
max
mm 1.2 0.4
0.3
0.8
0.65
0.5
0.4
9.1
8.9
9.1
8.9
A1
DIMENSIONS (mm are the original dimensions)
TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
A2 b D E e2
7.2
e
0.8
e1
7.2
v
0.15
w
0.05
y
0.08
y1
0.1
0 2.5 5 mm
scale
b
e2
e1
e
e
1/2 e
1/2 e
∅ v M AC B
∅ w M C
ball A1
index area
A
B
C
D
E
F
H
K
G
J
13579 2 4 6 8 10
ball A1
index area
B A
E
D
C
y1 C y
X
detail X
A
A1
A2LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 142 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
Fig 53. Package outline for the LQFP144 package
UNIT A1 A2 A3 bp c E(1) e HE L Lp ywv Z θ
OUTLINE REFERENCES
VERSION
EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.15
0.05
1.45
1.35 0.25 0.27
0.17
0.20
0.09
20.1
19.9 0.5 22.15
21.85
1.4
1.1
7
0
o
1 0.080.2 0.08 o
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT486-1 136E23 MS-026 00-03-14
03-02-20
D(1) (1)(1)
20.1
19.9
HD
22.15
21.85
Z E
1.4
1.1
D
0 5 10 mm
scale
e bp
θ
E
A1
A
Lp
detail X
L
(A ) 3
B
c
bp
EH A2
DH v M B
D
ZD
A
ZE
e
v M A
X
y
w M
w M
A
max.
1.6
LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm SOT486-1
108
109
pin 1 index
73
72
37
1
144
36LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 143 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
15. Soldering
Fig 54. Reflow soldering of the LBGA256 package
DIMENSIONS in mm
P SL SP SR Hx Hy
Hx
Hy
SOT740-2
solder land plus solder paste
occupied area
Footprint information for reflow soldering of LBGA256 package
solder land
solder paste deposit
solder resist
P
P
SL
SP
SR
Generic footprint pattern
Refer to the package outline drawing for actual layout
detail X
see detail X
sot740-2_fr 1.00 0.450 0.450 0.600 17.500 17.500LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 144 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
Fig 55. Reflow soldering of the TFBGA180 package
DIMENSIONS in mm
P SL SP SR Hx Hy
Hx
Hy
SOT570-3
solder land plus solder paste
occupied area
Footprint information for reflow soldering of TFBGA180 package
solder land
solder paste deposit
solder resist
P
P
SL
SP
SR
Generic footprint pattern
Refer to the package outline drawing for actual layout
detail X
see detail X
sot570-3_fr 0.80 0.400 0.400 0.550 12.575 12.575LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 145 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
Fig 56. Reflow soldering of the LQFP144 package
SOT486-1
DIMENSIONS in mm
occupied area
Footprint information for reflow soldering of LQFP144 package
Ax
Bx
Gx
Hy Gy
Hx
AyBy
P2 P1
D2 (8×) D1
(0.125)
P1 P2 Ax Ay Bx By C D1 D2 Gx Gy Hx Hy
sot486-1_fr
solder land
C
Generic footprint pattern
Refer to the package outline drawing for actual layout
0.500 0.560 0.280 23.300 23.300 20.300 20.300 1.500 0.400 20.500 20.500 23.550 23.550LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 146 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
Fig 57. Reflow soldering of the TFBGA100 package
DIMENSIONS in mm
P SL SP SR Hx Hy
Hx
Hy
SOT926-1
solder land plus solder paste
occupied area
Footprint information for reflow soldering of TFBGA100 package
solder land
solder paste deposit
solder resist
P
P
SL
SP
SR
Generic footprint pattern
Refer to the package outline drawing for actual layout
detail X
see detail X
sot926-1_fr 0.80 0.330 0.400 0.480 9.400 9.400LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 147 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
16. Abbreviations
Table 41. Abbreviations
Acronym Description
ADC Analog-to-Digital Converter
AHB Advanced High-performance Bus
APB Advanced Peripheral Bus
API Application Programming Interface
BOD BrownOut Detection
CAN Controller Area Network
CMAC Cipher-based Message Authentication Code
CSMA/CD Carrier Sense Multiple Access with Collision Detection
DAC Digital-to-Analog Converter
DC-DC Direct Current-to-Direct Current
DMA Direct Memory Access
GPIO General-Purpose Input/Output
IRC Internal RC
IrDA Infrared Data Association
JTAG Joint Test Action Group
LCD Liquid Crystal Display
LSB Least Significant Bit
MAC Media Access Control
MCU MicroController Unit
MIIM Media Independent Interface Management
n.c. not connected
OHCI Open Host Controller Interface
OTG On-The-Go
PHY Physical Layer
PLL Phase-Locked Loop
PMC Power Mode Control
PWM Pulse Width Modulator
RIT Repetitive Interrupt Timer
RMII Reduced Media Independent Interface
SDRAM Synchronous Dynamic Random Access Memory
SIMD Single Instruction Multiple Data
SPI Serial Peripheral Interface
SSI Serial Synchronous Interface
SSP Synchronous Serial Port
UART Universal Asynchronous Receiver/Transmitter
ULPI UTMI+ Low Pin Interface
USART Universal Synchronous Asynchronous Receiver/Transmitter
USB Universal Serial Bus
UTMI USB2.0 Transceiver Macrocell InterfaceLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 148 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
17. References
[1] LPC43xx User manual UM10503:
http://www.nxp.com/documents/user_manual/UM10503.pdf
[2] LPC43X0 Errata sheet:
http://www.nxp.com/documents/errata_sheet/ES_LPC43XX.pdfLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 149 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
18. Revision history
Table 42. Revision history
Document ID Release date Data sheet status Change notice Supersedes
LPC4350_30_20_10 v.4.2 20140818 Product data sheet LPC4350_30_20_10 v.4.1
Modifications: • Parameter CI corrected for high-drive pins (changed from 2 pF to 5.2 pF). See
Table 10.
• Table 18 “Dynamic characteristic: I/O pins[1]” added.
• IRC accuracy changed from 1 % to 1.5 % over the full temperature range. See Table
16 “Dynamic characteristic: IRC oscillator”.
• Description of internal pull-up resistor configuration added for RESET, WAKEUPn,
and ALARM pins.See Table 3.
• Description of DEBUG pin updated.
• Input range for PLL1 corrected: 1 MHz to 25 MHz. See Section 7.22.7 “System PLL1”.
• Section 13.7 “Suggested USB interface solutions” added.
• SSP master mode timing diagram updated with SSEL timing parameters. See Figure
30 “SSP master mode timing (SPI mode)”.
• Parameters tlead, tlag, and td added in Table 22 “Dynamic characteristics: SSP pins in
SPI mode”.
• Reset state of the RTC alarm pin RTC_ALARM added. See Table 3.
• SRAM location for parts LPC4320 corrected in Figure 7.
• IEEE standard 802.3 compliance added to Section 11.16. Covers Ethernet dynamic
characteristics of ENET_MDIO and ENET_MDC signals.\
• Signal polarity of EMC_CKEOUT and EMC_DQMOUT corrected. Both signals are
active HIGH.
• SPIFI output timing parameters in Table 33 corrected to apply to Mode 0:
– tv(Q) changed to 3.2 ns.
– th(Q) changed to 0.2 ns,
• Parameter tCSLWEL with condition PB = 1 corrected: (WAITWEN + 1) Tcy(clk) added.
See Table 25 “Dynamic characteristics: Static asynchronous external memory
interface”.
• Parameter tCSLBLSL with condition PB = 0 corrected: (WAITWEN + 1) Tcy(clk) added.
See Table 25 “Dynamic characteristics: Static asynchronous external memory
interface”.
LPC4350_30_20_10 v.4.1 20131211 Product data sheet - LPC4350_30_20_10 v.4
Modifications: • Description of RESET pin updated in Table 3.
• Layout of local SRAM at address 0x1008 0000 clarified in Figure 7
“LPC4350/30/20/10 Memory mapping (overview)”.
• Maximum value for Vi(RMS) added in Section 13.3 “RTC oscillator”.
• VO for RTC_ALARM pin added in Table 10.
• RTC_ALARM and WAKEUPn pins added to Table 10.
• Table note 9 added in Table 10.
• Timing parameters in Table 31 “Dynamic characteristics: SD/MMC” corrected.
• Band gap characteristics removed.
• OTP memory size available for general purpose use corrected.
• Part LPC4350FBD208 removed.
LPC4350_30_20_10 v.4 20130326 Product data sheet - LPC4350_30_20_10 v.3.7LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 150 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
• Parameter ILH (High-level leakage current) for condition VI = 5 V changed to 20 nA
(max). See Table 10.
• Parameter VDDA(3V3) added for pins USB0_VDDA3V3_DRIVER and
USB0_VDDA3V3 in Table 10.
• SPI timing data added. See Table 22.
• SGPIO timing data added. See Table 23.
• SPI and SGPIO peripheral power consumption added in Table 11.
• Data sheet status changed to Product data sheet.
• Corrected max voltage on pins USB0_DP, USB0_DM, USB0_VBUS, USB1_DP, and
USB1_DM in Table 6 and Table 10 to be consistent with USB specifications.
LPC4350_30_20_10 v.3.7 20130131 Preliminary data sheet - LPC4350_30_20_10 v.3.6
Modifications: • SGPIO and SPI location corrected in Figure 1.
• SGPIO-to-DMA connection corrected in Figure 7.
• Power consumption in active mode corrected. See parameter IDD(REG)(3V3) in Table 10
and graphs Figure 12, Figure 13, and Figure 14.
• Parameter name IDD(ADC) changed to IDDA in Table 10.
• Figure 21 “Band gap voltage for different temperatures and process conditions” and
Table 13 “Band gap characteristics” corrected.
• Added note to limit data in Table 24 “Dynamic characteristics: Static asynchronous
external memory interface” to single memory accesses.
• Value of parameter IDD(REG)(3V3) in deep power-down increased to 0.03 μA in
Table 10.
• Value of parameter IDD(IO) in deep power-down increased to 0.05 μA in Table 10.
LPC4350_30_20_10 v.3.6 20121119 Preliminary data sheet - LPC4350_30_20_10 v.3.5
Modifications: • Table 13 “Band gap characteristics” added.
• Power consumption for M0 core added in Table 11 “Peripheral power consumption”.
• Section 7.22.10 “Power Management Controller (PMC)” added.
• Table 10, added Table note 2: “Dynamic characteristics for peripherals are provided
for VDD(REG)(3V3) 2.7 V.”
• Description of ADC pins on digital/analog input pins changed. Each input to the ADC
is connected to ADC0 and ADC1. See Table 3.
• Use of C_CAN peripheral restricted in Section 2.
• ADC channels limited to a total of 8 channels shared between ADC0 and ADC1.
• Minimum value for parameter VIL changed to 0 V in Table 10 “Static characteristics”.
LPC4350_30_20_10 v.3.5 20121011 Preliminary data sheet - LPC4350_30_20_10 v.3.4
Table 42. Revision history …continued
Document ID Release date Data sheet status Change notice SupersedesLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 151 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
Modifications: • Temperature range for simulated timing characteristics corrected to Tamb = 40 C to
+85 C in Section 11 “Dynamic characteristics”.
• SPIFI timing added. See Section 11.15.
• SPIFI maximum data rate changed to 52 MB per second.
• Editorial updates.
• Figure 25 and Figure 26 updated for full temperature range.
• Section 7.23 “Serial Wire Debug/JTAG” updated.
• The following changes were made on the TFBGA180 pinout in Table 3:
– P1_13 moved from ball D6 to L8.
– P7_5 moved from ball C7 to A7.
– PF_4 moved from ball L8 to D6.
– RESET moved from ball B7 to C7.
– RTCX2 moved from ball A7 to B7.
– Ball G10 changed from VSS to VDDIO.
LPC4350_30_20_10 v.3.4 20120904 Preliminary data sheet - LPC4350_30_20_10 v.3.3
Modifications: • SSP0 boot pin functions corrected in Table 5 and Table 4. Pin P3_3 = SSP0_SCK, pin
P3_6 = SSP0_SSEL, pin P3_7 = SSP0_MISO, pin P3_8 = SSP0_MOSI.
• Minimum value for all supply voltages changed to -0.5 V in Table 6.
LPC4350_30_20_10 v.3.3 20120821 Preliminary data sheet - LPC4350_30_20_10 v.3.2
Modifications: • Parameter twake updated in Table 13 for wake-up from deep power-down mode and
reset.
• Dynamic characteristics of the SD/MMC controller updated in Table 28.
• Dynamic characteristics of the LCD controller updated in Table 29.
• Dynamic characteristics of the SSP controller updated in Table 21.
• Minimum value of VI for conditions “USB0 pins USB0_DP; USB0_DM;
USB0_VBUS”,“USB0 pins USB0_ID; USB0_RREF”, and “USB1 pins USB1_DP and
USB1_DM” changed to 0.3 V in Table 6.
• Parameters IIL and IIH renamed to ILL and ILH in Table 10.
• AES removed. AES is available on parts LPC43Sxx only.
• Pin configuration diagrams corrected for LQFP packages (Figure 5 and Figure 6).
• Figure 10 updated.
• All power consumption data updated in Table 10 and Section 10.1 “Power
consumption”.
• BOD levels updated in Table 12.
• SWD debug option removed for Cortex-M0 core.
LPC4350_30_20_10 v.3.2 20120604 Preliminary data sheet - LPC4350_30_20_10 v.3.1
LPC4350_30_20_10 v.3.1 20120105 Objective data sheet - LPC4350_30_20_10 v.3
LPC4350_30_20_10 v.3 20111205 Objective data sheet - LPC4350_30_20_10 v.2.1
LPC4350_30_20_10 v.2.1 20110923 Objective data sheet - LPC4350_30_20_10 v.2
LPC4350_30_20_10 v.2 20110714 Objective data sheet - LPC4350_30_20_10 v.1
LPC4350_30_20_10 v.1 20101029 Objective data sheet - -
Table 42. Revision history …continued
Document ID Release date Data sheet status Change notice SupersedesLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 152 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
19. Legal information
19.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
19.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification. LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 153 of 155
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I
2C-bus — logo is a trademark of NXP Semiconductors N.V.
20. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.comLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 154 of 155
continued >>
NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
21. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 5
4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 5
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 6
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 7
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7
7 Functional description . . . . . . . . . . . . . . . . . . 61
7.1 Architectural overview . . . . . . . . . . . . . . . . . . 61
7.2 ARM Cortex-M4 processor . . . . . . . . . . . . . . . 61
7.3 ARM Cortex-M0 co-processor . . . . . . . . . . . . 61
7.4 Interprocessor communication . . . . . . . . . . . . 61
7.5 AHB multilayer matrix . . . . . . . . . . . . . . . . . . . 62
7.6 Nested Vectored Interrupt Controller (NVIC) . 62
7.6.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
7.6.2 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 63
7.7 System Tick timer (SysTick) . . . . . . . . . . . . . . 63
7.8 Event router . . . . . . . . . . . . . . . . . . . . . . . . . . 63
7.9 Global Input Multiplexer Array (GIMA) . . . . . . 63
7.9.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
7.10 On-chip static RAM. . . . . . . . . . . . . . . . . . . . . 64
7.11 In-System Programming (ISP) . . . . . . . . . . . . 64
7.12 Boot ROM. . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
7.13 Memory mapping . . . . . . . . . . . . . . . . . . . . . . 65
7.14 One-Time Programmable (OTP) memory . . . 68
7.15 General-Purpose I/O (GPIO) . . . . . . . . . . . . . 68
7.15.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
7.16 Configurable digital peripherals . . . . . . . . . . . 68
7.16.1 State Configurable Timer (SCTimer/PWM)
subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
7.16.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
7.16.2 Serial GPIO (SGPIO) . . . . . . . . . . . . . . . . . . . 69
7.16.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
7.17 AHB peripherals . . . . . . . . . . . . . . . . . . . . . . . 70
7.17.1 General-Purpose DMA (GPDMA). . . . . . . . . . 70
7.17.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
7.17.2 SPI Flash Interface (SPIFI). . . . . . . . . . . . . . . 70
7.17.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
7.17.3 SD/MMC card interface . . . . . . . . . . . . . . . . . 71
7.17.4 External Memory Controller (EMC). . . . . . . . . 71
7.17.4.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
7.17.5 High-speed USB Host/Device/OTG interface
(USB0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
7.17.5.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
7.17.6 High-speed USB Host/Device interface with
ULPI (USB1) . . . . . . . . . . . . . . . . . . . . . . . . . 72
7.17.6.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
7.17.7 LCD controller . . . . . . . . . . . . . . . . . . . . . . . . 73
7.17.7.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
7.17.8 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
7.17.8.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
7.18 Digital serial peripherals. . . . . . . . . . . . . . . . . 74
7.18.1 UART1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
7.18.1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
7.18.2 USART0/2/3. . . . . . . . . . . . . . . . . . . . . . . . . . 75
7.18.2.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
7.18.3 SPI serial I/O controller . . . . . . . . . . . . . . . . . 75
7.18.3.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
7.18.4 SSP serial I/O controller. . . . . . . . . . . . . . . . . 75
7.18.4.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
7.18.5 I2C-bus interface . . . . . . . . . . . . . . . . . . . . . . 76
7.18.5.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
7.18.6 I2S interface . . . . . . . . . . . . . . . . . . . . . . . . . . 76
7.18.6.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
7.18.7 C_CAN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
7.18.7.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
7.19 Counter/timers and motor control . . . . . . . . . 78
7.19.1 General purpose 32-bit timers/external event
counters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
7.19.1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
7.19.2 Motor control PWM . . . . . . . . . . . . . . . . . . . . 78
7.19.3 Quadrature Encoder Interface (QEI) . . . . . . . 78
7.19.3.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
7.19.4 Repetitive Interrupt (RI) timer. . . . . . . . . . . . . 79
7.19.4.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
7.19.5 Windowed WatchDog Timer (WWDT) . . . . . . 79
7.19.5.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
7.20 Analog peripherals . . . . . . . . . . . . . . . . . . . . . 80
7.20.1 Analog-to-Digital Converter (ADC0/1) . . . . . . 80
7.20.1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
7.20.2 Digital-to-Analog Converter (DAC). . . . . . . . . 80
7.20.2.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
7.21 Peripherals in the RTC power domain . . . . . . 80
7.21.1 RTC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
7.21.1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
7.21.2 Alarm timer. . . . . . . . . . . . . . . . . . . . . . . . . . . 81
7.22 System control . . . . . . . . . . . . . . . . . . . . . . . . 81
7.22.1 Configuration registers (CREG) . . . . . . . . . . . 81
7.22.2 System Control Unit (SCU) . . . . . . . . . . . . . . 81
7.22.3 Clock Generation Unit (CGU) . . . . . . . . . . . . 81
7.22.4 Internal RC oscillator (IRC) . . . . . . . . . . . . . . 82
7.22.5 PLL0USB (for USB0) . . . . . . . . . . . . . . . . . . . 82NXP Semiconductors LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
© NXP Semiconductors N.V. 2014. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 18 August 2014
Document identifier: LPC4350_30_20_10
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
7.22.6 PLL0AUDIO (for audio) . . . . . . . . . . . . . . . . . 82
7.22.7 System PLL1 . . . . . . . . . . . . . . . . . . . . . . . . . 82
7.22.8 Reset Generation Unit (RGU). . . . . . . . . . . . . 82
7.22.9 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 82
7.22.10 Power Management Controller (PMC) . . . . . . 83
7.23 Serial Wire Debug/JTAG. . . . . . . . . . . . . . . . . 84
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 86
9 Thermal characteristics . . . . . . . . . . . . . . . . . 87
10 Static characteristics. . . . . . . . . . . . . . . . . . . . 88
10.1 Power consumption . . . . . . . . . . . . . . . . . . . . 95
10.2 Peripheral power consumption . . . . . . . . . . . . 99
10.3 BOD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
10.4 Electrical pin characteristics . . . . . . . . . . . . . 102
11 Dynamic characteristics . . . . . . . . . . . . . . . . 106
11.1 Wake-up times . . . . . . . . . . . . . . . . . . . . . . . 106
11.2 External clock for oscillator in slave mode . . 106
11.3 Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . 107
11.4 IRC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 107
11.5 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 107
11.6 I/O pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
11.7 I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
11.8 I2S-bus interface. . . . . . . . . . . . . . . . . . . . . . 110
11.9 USART interface. . . . . . . . . . . . . . . . . . . . . . 111
11.10 SSP interface . . . . . . . . . . . . . . . . . . . . . . . . 112
11.11 SPI interface . . . . . . . . . . . . . . . . . . . . . . . . . 114
11.12 SSP/SPI timing diagrams . . . . . . . . . . . . . . . 115
11.13 SGPIO timing . . . . . . . . . . . . . . . . . . . . . . . . 116
11.14 External memory interface . . . . . . . . . . . . . . 118
11.15 USB interface . . . . . . . . . . . . . . . . . . . . . . . 123
11.16 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
11.17 SD/MMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
11.18 LCD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
11.19 SPIFI. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
12 ADC/DAC electrical characteristics . . . . . . . 128
13 Application information. . . . . . . . . . . . . . . . . 131
13.1 LCD panel signal usage . . . . . . . . . . . . . . . . 131
13.2 Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . 133
13.3 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 135
13.4 XTAL and RTCX Printed Circuit Board (PCB)
layout guidelines. . . . . . . . . . . . . . . . . . . . . . 135
13.5 Standard I/O pin configuration . . . . . . . . . . . 135
13.6 Reset pin configuration. . . . . . . . . . . . . . . . . 136
13.7 Suggested USB interface solutions . . . . . . . 136
14 Package outline . . . . . . . . . . . . . . . . . . . . . . . 139
15 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
16 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . 147
17 References . . . . . . . . . . . . . . . . . . . . . . . . . . . 148
18 Revision history. . . . . . . . . . . . . . . . . . . . . . . 149
19 Legal information . . . . . . . . . . . . . . . . . . . . . 152
19.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . 152
19.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . 152
19.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . 152
19.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . 153
20 Contact information . . . . . . . . . . . . . . . . . . . 153
21 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
Your Electronic Engineering Resource
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7491181012: Off-line Transformer WE-UNIT
Product Description:
Würth Electronics, Inc. has a broad selection of power transformers
for the latest reference designs from some of the leading IC
manufacturers in the industry. The overall product offering contains
more than 50 transformers built for chipsets from NXP
Semiconductors, Linear Technology, ON Semiconductor, Power
Integrations, STMicroelectronics, and National Semiconductor.
Examples of these devices are a series of offline power transformers
designed for NXP's dimmable LED drivers and a full series of flyback
transformers for Linear Technology's isolated flyback converters.
They are Designed for Tiny Switch ICs from Power Integration and NCP101x or 105x of ON Semiconductor
Key Features:
Nominal input voltage: 125V DC to 375V DC Output power 3W and 9W
Operating temperature: -40°C to +125°C Clearance and creepage distance 6mm min.
Switching frequency: 132kHz Isolation voltage 4kVAC
Applications:
Designed for Tiny Switch ICs from Power
Integration and NCP101x or 105x of ON
Semiconductor
For SMPS with universal input from 85 VAC up to 265
VAC
Ordering Information:
Mfr Part # Farnell# Newark# Description
7491181012 Click Here Click Here Off-line transformer WE-UNIT
1. Introduction
This data sheet describes the functionality of the CLRC632 Integrated Circuit (IC). It
includes the functional and electrical specifications and from a system and hardware
viewpoint gives detailed information on how to design-in the device.
Remark: The CLRC632 supports all variants of the MIFARE Mini, MIFARE 1K,
MIFARE 4K and MIFARE Ultralight RF identification protocols. To aid readability
throughout this data sheet, the MIFARE Mini, MIFARE 1K, MIFARE 4K and
MIFARE Ultralight products and protocols have the generic name MIFARE.
2. General description
The CLRC632 is a highly integrated reader IC for contactless communication at
13.56 MHz. The CLRC632 reader IC provides:
• outstanding modulation and demodulation for passive contactless communication
• a wide range of methods and protocols
• a small, fully integrated package
• pin compatibility with the MFRC500, MFRC530, MFRC531 and SLRC400
All protocol layers of the ISO/IEC 14443 A and ISO/IEC 14443 B communication
standards are supported provided:
• additional components, such as the oscillator, power supply, coil etc. are correctly
applied.
• standardized protocols, such as ISO/IEC 14443-4 and/or ISO/IEC 14443 B
anticollision are correctly implemented
The CLRC632 supports contactless communication using MIFARE higher baud rates (see
Section 9.12 on page 40). The receiver module provides a robust and efficient
demodulation/decoding circuitry implementation for compatible transponder signals (see
Section 9.10 on page 34).
The digital module, manages the complete ISO/IEC 14443 standard framing and error
detection (parity and CRC). In addition, it supports the fast MIFARE security algorithm for
authenticating the MIFARE products (see Section 9.14 on page 42).
All layers of the I-CODE1 and ISO/IEC 15693 protocols are supported by the CLRC632.
The receiver module provides a robust and efficient demodulation/decoding circuitry
implementation for I-CODE1 and ISO/IEC 15693 compatible transponder signals. The
digital module handles I-CODE1 and ISO/IEC 15693 framing and error detection (CRC).
CLRC632
Standard multi-protocol reader solution
Rev. 3.7 — 27 February 2014
073937
Product data sheet
COMPANY PUBLICCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.7 — 27 February 2014
073937 2 of 127
NXP Semiconductors CLRC632
Standard multi-protocol reader solution
The internal transmitter module (Section 9.9 on page 31) can directly drive an antenna
designed for a proximity operating distance up to 100 mm without any additional active
circuitry.
A parallel interface can be directly connected to any 8-bit microprocessor to ensure
reader/terminal design flexibility. In addition, Serial Peripheral Interface (SPI) compatibility
is supported (see Section 9.1.4 on page 9).
3. Features and benefits
3.1 General
Highly integrated analog circuitry for demodulating and decoding card/label response
Buffered output drivers enable antenna connection using the minimum of external
components
Proximity operating distance up to 100 mm
Supports both ISO/IEC 14443 A and ISO/IEC 14443 B standards
Supports MIFARE dual-interface card ICs and the MIFARE Mini, MIFARE 1K,
MIFARE 4K protocols
Contactless communication at MIFARE higher baud rates (up to 424 kBd)
Supports both I-CODE1 and ISO/IEC 15693 protocols
Crypto1 and secure non-volatile internal key memory
Pin-compatible with the MFRC500, MFRC530, MFRC531 and the SLRC400
Parallel microprocessor interface with internal address latch and IRQ line
SPI compatibility
Flexible interrupt handling
Automatic detection of parallel microprocessor interface type
64-byte send and receive FIFO buffer
Hard reset with low power function
Software controlled Power-down mode
Programmable timer
Unique serial number
User programmable start-up configuration
Bit-oriented and byte oriented framing
Independent power supply pins for analog, digital and transmitter modules
Internal oscillator buffer optimized for low phase jitter enables 13.56 MHz quartz
connection
Clock frequency filtering
3.3 V to 5 V operation for transmitter in short range and proximity applications
3.3 V or 5 V operation for the digital module
4. Applications
Electronic payment systems
Identification systems
Access control systemsCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.7 — 27 February 2014
073937 3 of 127
NXP Semiconductors CLRC632
Standard multi-protocol reader solution
Subscriber services
Banking systems
Digital content systems
5. Quick reference data
6. Ordering information
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
Tamb ambient temperature 40 - +150 C
Tstg storage temperature 40 - +150 C
VDDD digital supply voltage 0.5 5 6 V
VDDA analog supply voltage 0.5 5 6 V
VDD(TVDD) TVDD supply voltage 0.5 5 6 V
Vi
input voltage (absolute
value)
on any digital pin to DVSS 0.5 - VDDD + 0.5 V
on pin RX to AVSS 0.5 - VDDA + 0.5 V
ILI input leakage current 1.0 - 1.0 mA
IDD(TVDD) TVDD supply current continuous wave - - 150 mA
Table 2. Ordering information
Type number Package
Name Description Version
CLRC63201T/0FE SO32 plastic small outline package; 32 leads; body width 7.5 mm SOT287-1CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.7 — 27 February 2014
073937 4 of 127
NXP Semiconductors CLRC632
Standard multi-protocol reader solution
7. Block diagram
Fig 1. CLRC632 block diagram
001aaj629
FIFO CONTROL
64-BYTE FIFO
MASTER KEY BUFFER
CRYPTO1 UNIT
CONTROL REGISTER
BANK
NWR NRD NCS ALE A0 A1 A2
10 11 9 21 22 23 24 13 14 15 16 17 18 19 20
AD0 to AD7/D0 to D7
STATE MACHINE
COMMAND REGISTER
PROGRAMMABLE TIMER
INTERRUPT CONTROL
CRC16/CRC8
GENERATION AND CHECK
PARALLEL/SERIAL CONVERTER
BIT COUNTER
PARITY GENERATION AND CHECK
FRAME GENERATION AND CHECK
SERIAL DATA SWITCH
BIT DECODING BIT ENCODING
32 × 16-BYTE
EEPROM
EEPROM
ACCESS
CONTROL
32-BIT PSEUDO
RANDOM GENERATOR
AMPLITUDE
RATING
CLOCK
GENERATION,
FILTERING AND
DISTRIBUTION
OSCILLATOR
LEVEL SHIFTERS
CORRELATION
AND
REFERENCE BIT DECODING
VOLTAGE
Q-CHANNEL
AMPLIFIER
Q-CHANNEL
DEMODULATOR
I-CHANNEL
ANALOG AMPLIFIER
TEST
MULTIPLEXER I-CHANNEL
DEMODULATOR
PARALLEL INTERFACE CONTROL
(INCLUDING AUTOMATIC INTERFACE DETECTION AND SYNCHRONISATION)
VOLTAGE
MONITOR
AND
POWER ON
DETECT
DVDD
RSTPD
Q-CLOCK
GENERATION
TRANSMITTER CONTROL
GND
GND
VMID AUX RX TVSS TX1 TX2 TVDD
30 27 29 8 5 7 6
V
V
POWER ON
DETECT
OSCIN
AVDD
AVSS
OSCOUT
IRQ
MFIN
MFOUT
DVSS
25
31
1
26
28
32
2
3
4
12
RESET
CONTROL
POWER DOWN
CONTROLCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.7 — 27 February 2014
073937 5 of 127
NXP Semiconductors CLRC632
Standard multi-protocol reader solution
8. Pinning information
8.1 Pin description
Fig 2. CLRC632 pin configuration
CLRC632
OSCIN OSCOUT
IRQ RSTPD
MFIN VMID
MFOUT RX
TX1 AVSS
TVDD AUX
TX2 AVDD
TVSS DVDD
NCS A2/SCK
NWR/R/NW/nWrite A1
NRD/NDS/nDStrb A0/nWait/MOSI
DVSS ALE/AS/nAStrb/NSS
AD0/D0 D7/AD7
AD1/D1 D6/AD6
AD2/D2 D5/AD5
AD3/D3 D4/AD4
001aaj630
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
18
17
20
19
22
21
24
23
26
25
32
31
30
29
28
27
Table 3. Pin description
Pin Symbol Type[1] Description
1 OSCIN I oscillator/clock inputs:
crystal oscillator input to the oscillator’s inverting amplifier
externally generated clock input; fosc = 13.56 MHz
2 IRQ O interrupt request generates an output signaling an interrupt event
3 MFIN I ISO/IEC 14443 A MIFARE serial data interface input
4[2] MFOUT O interface outputs used as follows:
MIFARE: generates serial data ISO/IEC 14443 A
I-CODE: generates serial data based on I-CODE1 and ISO/IEC 15693
5 TX1 O transmitter 1 modulated carrier output; 13.56 MHz
6 TVDD P transmitter power supply for the TX1 and TX2 output stages
7 TX2 O transmitter 2 modulated carrier output; 13.56 MHz
8 TVSS G transmitter ground for the TX1 and TX2 output stages
9 NCS I not chip select input is used to select and activate the CLRC632’s microprocessor
interface
10[3] NWR I not write input generates the strobe signal for writing data to the CLRC632
registers when applied to pins D0 to D7
R/NW I read not write input is used to switch between read or write cycles
nWrite I not write input selects the read or write cycle to be performedCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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[1] Pin types: I = Input, O = Output, I/O = Input/Output, P = Power and G = Ground.
[2] The SLRC400 uses pin name SIGOUT for pin MFOUT. The CLRC632 functionality includes test functions for the SLRC400 using pin
MFOUT.
[3] These pins provide different functionality depending on the selected microprocessor interface type (see Section 9.1 on page 7 for
detailed information).
11[3] NRD I not read input generates the strobe signal for reading data from the CLRC632
registers when applied to pins D0 to D7
NDS I not data strobe input generates the strobe signal for the read and write cycles
nDStrb I not data strobe input generates the strobe signal for the read and write cycles
12 DVSS G digital ground
13 D0 O SPI master in, slave out output
13 to 20[3] D0 to D7 I/O 8-bit bidirectional data bus input/output on pins D0 to D7
AD0 to AD7 I/O 8-bit bidirectional address and data bus input/output on pins AD0 to AD7
21[3] ALE I address latch enable input for pins AD0 to AD5; HIGH latches the internal address
AS I address strobe input for pins AD0 to AD5; HIGH latches the internal address
nAStrb I not address strobe input for pins AD0 to AD5; LOW latches the internal address
NSS I not slave select strobe input for SPI communication
22[3] A0 I address line 0 is the address register bit 0 input
nWait O not wait output:
LOW starts an access cycle
HIGH ends an access cycle
MOSI I SPI master out, slave in
23 A1 I address line 1 is the address register bit 1 input
24[3] A2 I address line 2 is the address register bit 2 input
SCK I SPI serial clock input
25 DVDD P digital power supply
26 AVDD P analog power supply for pins OSCIN, OSCOUT, RX, VMID and AUX
27 AUX O auxiliary output is used to generate analog test signals. The output signal is
selected using the TestAnaSelect register’s TestAnaOutSel[4:0] bits
28 AVSS G analog ground
29 RX I receiver input is used as the card response input. The carrier is load modulated at
13.56 MHz, drawn from the antenna circuit
30 VMID P internal reference voltage pin provides the internal reference voltage as a supply
Remark: It must be connected to a 100 nF block capacitor connected between pin
VMID and ground
31 RSTPD I reset and power-down input:
HIGH: the internal current sinks are switched off, the oscillator is inhibited and
the input pads are disconnected
LOW (negative edge): start internal reset phase
32 OSCOUT O crystal oscillator output for the oscillator’s inverting amplifier
Table 3. Pin description …continued
Pin Symbol Type[1] DescriptionCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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9. Functional description
9.1 Digital interface
9.1.1 Overview of supported microprocessor interfaces
The CLRC632 supports direct interfacing to various 8-bit microprocessors. Alternatively,
the CLRC632 can be connected to a PC’s Enhanced Parallel Port (EPP). Table 4 shows
the parallel interface signals supported by the CLRC632.
9.1.2 Automatic microprocessor interface detection
After a Power-On or Hard reset, the CLRC632 resets parallel microprocessor interface
mode and detects the microprocessor interface type.
The CLRC632 identifies the microprocessor interface using the logic levels on the control
pins. This is performed using a combination of fixed pin connections and the dedicated
Initialization routine (see Section 9.7.4 on page 30).
Table 4. Supported microprocessor and EPP interface signals
Bus control signals Bus Separated address
and data bus
Multiplexed address and data bus
Separated read and
write strobes
control NRD, NWR, NCS NRD, NWR, NCS, ALE
address A0, A1, A2 AD0, AD1, AD2, AD3, AD4, AD5
data D0 to D7 AD0 to AD7
Common read and write
strobe
control R/NW, NDS, NCS R/NW, NDS, NCS, AS
address A0, A1, A2 AD0, AD1, AD2, AD3, AD4, AD5
data D0 to D7 AD0 to AD7
Common read and write
strobe with handshake
(EPP)
control - nWrite, nDStrb, nAStrb, nWait
address - AD0, AD1, AD2, AD3, AD4, AD5
data - AD0 to AD7CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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9.1.3 Connection to different microprocessor types
The connection to various microprocessor types is shown in Table 5.
9.1.3.1 Separate read and write strobe
Refer to Section 13.4.1 on page 102 for timing specification.
Table 5. Connection scheme for detecting the parallel interface type
CLRC632
pins
Parallel interface type and signals
Separated read/write strobe Common read/write strobe
Dedicated
address bus
Multiplexed
address
bus
Dedicated
address bus
Multiplexed
address bus
Multiplexed
address bus with
handshake
ALE HIGH ALE HIGH AS nAStrb
A2 A2 LOW A2 LOW HIGH
A1 A1 HIGH A1 HIGH HIGH
A0 A0 HIGH A0 LOW nWait
NRD NRD NRD NDS NDS nDStrb
NWR NWR NWR R/NW R/NW nWrite
NCS NCS NCS NCS NCS LOW
D7 to D0 D7 to D0 AD7 to AD0 D7 to D0 AD7 to AD0 AD7 to AD0
Fig 3. Connection to microprocessor: separate read and write strobes
001aak607
address bus (A3 to An)
NCS
A0 to A2
address bus (A0 to A2)
D0 to D7
ALE
data bus (D0 to D7)
HIGH
NRD Read strobe (NRD)
NWR Write strobe (NWR)
DEVICE
ADDRESS
DECODER
non-multiplexed address
NCS
AD0 to AD7
ALE
multiplexed address/data (AD0 to AD7)
address latch enable (ALE)
NRD Read strobe (NRD)
NWR Write strobe (NWR)
A2 LOW
A1 HIGH
A0 HIGH
DEVICE
ADDRESS
DECODERCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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9.1.3.2 Common read and write strobe
Refer to Section 13.4.2 on page 103 for timing specification.
9.1.3.3 Common read and write strobe: EPP with handshake
Refer to Section 13.4.3 on page 104 for timing specification.
Remark: In the EPP standard a chip select signal is not defined. To cover this situation,
the status of the NCS pin can be used to inhibit the nDStrb signal. If this inhibitor is not
used, it is mandatory that pin NCS is connected to pin DVSS.
Remark: After each Power-On or Hard reset, the nWait signal on pin A0 is
high-impedance. nWait is defined as the first negative edge applied to the nAStrb pin after
the reset phase. The CLRC632 does not support Read Address Cycle.
9.1.4 Serial Peripheral Interface
The CLRC632 provides compatibility with the 5-wire Serial Peripheral Interface (SPI)
standard and acts as a slave during the SPI communication. The SPI clock signal SCK
must be generated by the master. Data communication from the master to the slave uses
the MOSI line. The MISO line sends data from the CLRC632 to the master.
Fig 4. Connection to microprocessor: common read and write strobes
001aak608
address bus (A3 to An)
NCS
A0 to A2
address bus (A0 to A2)
D0 to D7
ALE
data bus (D0 to D7)
HIGH
NRD Data strobe (NDS)
NWR Read/Write (R/NW)
DEVICE
ADDRESS
DECODER
non-multiplexed address
NCS
AD0 to AD7
ALE
multiplexed address/data (AD0 to AD7)
Address strobe (AS)
NRD Data strobe (NDS)
NWR Read/Write (R/NW)
A2 LOW
A1 HIGH
A0 LOW
DEVICE
ADDRESS
DECODER
Fig 5. Connection to microprocessor: EPP common read/write strobes and handshake
001aak609
LOW NCS
AD0 to AD7
ALE
multiplexed address/data (AD0 to AD7)
Address strobe (nAStrb)
NRD Data strobe (nDStrb)
NWR Read/Write (nWrite)
A2 HIGH
A1 HIGH
A0 nWait
DEVICECLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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Figure 6 shows the microprocessor connection to the CLRC632 using SPI.
Remark: The SPI implementation for CLRC632 conforms to the SPI standard and
ensures that the CLRC632 can only be addressed as a slave.
9.1.4.1 SPI read data
The structure shown in Table 7 must be used to read data using SPI. It is possible to read
up to n-data bytes. The first byte sent defines both, the mode and the address.
The address byte must meet the following criteria:
• the Most Significant Bit (MSB) of the first byte sets the mode. To read data from the
CLRC632 the MSB is set to logic 1
• bits [6:1] define the address
• the Least Significant Bit (LSB) should be set to logic 0.
As shown in Table 8, all the bits of the last byte sent are set to logic 0.
Table 6. SPI compatibility
CLRC632 pins SPI pins
ALE NSS
A2 SCK
A1 LOW
A0 MOSI
NRD HIGH
NWR HIGH
NCS LOW
D7 to D1 do not connect
D0 MISO
Fig 6. Connection to microprocessor: SPI
001aak610
LOW NCS
D0
ALE
A2 SCK
A1 LOW
MOSI
NSS
A0
MISO
DEVICE
Table 7. SPI read data
Pin Byte 0 Byte 1 Byte 2 ... Byte n Byte n + 1
MOSI address 0 address 1 address 2 ... address n 00
MISO XX data 0 data 1 ... data n 1 data nCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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[1] All reserved bits must be set to logic 0.
9.1.4.2 SPI write data
The structure shown in Table 9 must be used to write data using SPI. It is possible to write
up to n-data bytes. The first byte sent defines both the mode and the address.
The address byte must meet the following criteria:
• the MSB of the first byte sets the mode. To write data to the CLRC632, the MSB is set
to logic 0
• bits [6:1] define the address
• the LSB should be set to logic 0.
SPI write mode writes all data to the address defined in byte 0 enabling effective write
cycles to the FIFO buffer.
[1] All reserved bits must be set to logic 0.
Remark: The data bus pins D7 to D0 must be disconnected.
Refer to Section 13.4.4 on page 106 for the timing specification.
Table 8. SPI read address
Address
(MOSI)
Bit 7
(MSB)
Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
(LSB)
byte 0 1 address address address address address address reserved
byte 1 to byte n reserved address address address address address address reserved
byte n + 1 0 0 0 0 0 0 0 0
Table 9. SPI write data
Byte 0 Byte 1 Byte 2 ... Byte n Byte n + 1
MOSI address data 0 data 1 ... data n 1 data n
MISO XX XX XX ... XX XX
Table 10. SPI write address
Address line
(MOSI)
Bit 7
(MSB)
Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
(LSB)
byte 0 0 address address address address address address reserved
byte 1 to byte
n+1
data data data data data data data dataCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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9.2 Memory organization of the EEPROM
Table 11. EEPROM memory organization diagram
Block Byte
address
Access Memory content Refer to
Position Address
0 0 00h to 0Fh R product
information field
Section 9.2.1 on page 13
1 1 10h to 1Fh R/W StartUp register
initialization file
Section 9.2.2.1 on page 14
2 2 20h to 2Fh R/W
3 3 30h to 3Fh R/W register
initialization file
user data or
second
initialization
Section 9.2.2.3 “Register
initialization file (read/write)”
on page 16
4 4 40h to 4Fh R/W
5 5 50h to 5Fh R/W
6 6 60h to 6Fh R/W
7 7 70h to 7Fh R/W
8 8 80h to 8Fh W keys for Crypto1 Section 9.2.3 on page 18
9 9 90h to 9Fh W
10 A A0h to AFh W
11 B B0h to BFh W
12 C C0h to CFh W
13 D D0h to DFh W
14 E E0h to EFh W
15 F F0h to FFh W
16 10 100h to 10Fh W
17 11 110h to 11Fh W
18 12 120h to 12Fh W
19 13 130h to 13Fh W
20 14 140h to 14Fh W
21 15 150h to 15Fh W
22 16 160h to 16Fh W
23 17 170h to 17Fh W
24 18 180h to 18Fh W
25 19 190h to 19Fh W
26 1A 1A0h to
1AFh
W
27 1B 1B0h to
1BFh
W
28 1C 1C0h to
1CFh
W
29 1D 1D0h to
1DFh
W
30 1E 1E0h to
1EFh
W
31 1F 1F0h to
1FFh
WCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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9.2.1 Product information field (read only)
[1] Byte 4 contains the current version number.
9.2.2 Register initialization files (read/write)
Register initialization from address 10h to address 2Fh is performed automatically during
the initializing phase (see Section 9.7.3 on page 30) using the StartUp register
initialization file.
In addition, the CLRC632 registers can be initialized using values from the register
initialization file when the LoadConfig command is executed (see Section 11.5.1 on
page 95).
Table 12. Product information field
Byte Symbol Access Value Description
15 CRC R - the content of the product information field
is secured using a CRC byte which is
checked during start-up
14 RsMaxP R - maximum source resistance for the
p-channel driver transistor on pins TX1 and
TX2
The source resistance of the p-channel
driver transistors of pin TX1 and TX2 can be
adjusted using the value GsCfgCW[5:0] in
the CwConductance register (see
Section 9.9.3 on page 32). The mean value
of the maximum adjustable source
resistance for pins TX1 and TX2 is stored
as an integer value in in this byte. Typical
values for RsMaxP are between 60 to
140 . This value is denoted as maximum
adjustable source resistance RS(ref)maxP and
is measured by setting the CwConductance
register’s GsCfgCW[5:0] bits to 01h.
13 to 12 Internal R - two bytes for internal trimming parameters
11 to 8 Product Serial Number R - a unique four byte serial number for the
device
7 to 5 reserved R -
4 to 0 Product Type
Identification
R - the CLRC632 is a member of a new family
of highly integrated reader ICs. Each
member of the product family has a unique
product type identification. The value of the
product type identification is shown in
Table 13.
Table 13. Product type identification definition
Definition Product type identification bytes
Byte 0 1 2 3 4[1]
Value 30h FFh FFh 0Fh XXhCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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Remark: The following points apply to initialization:
• the Page register (addressed using 10h, 18h, 20h, 28h) is skipped and not initialized.
• make sure that all PreSetxx registers are not changed.
• make sure that all register bits that are reserved are set to logic 0.
9.2.2.1 StartUp register initialization file (read/write)
The EEPROM memory block address 1 and 2 contents are used to automatically set the
register subaddresses 10h to 2Fh during the initialization phase. The default values stored
in the EEPROM during production are shown in Section 9.2.2.2 “Factory default StartUp
register initialization file”.
The byte assignment is shown in Table 14.
9.2.2.2 Factory default StartUp register initialization file
During the production tests, the StartUp register initialization file is initialized using the
default values shown in Table 15. During each power-up and initialization phase, these
values are written to the CLRC632’s registers.
Table 14. Byte assignment for register initialization at start-up
EEPROM byte address Register address Remark
10h (block 1, byte 0) 10h skipped
11h 11h copied
… ……
2Fh (block 2, byte 15) 2Fh copiedCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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Remark: The CLRC632 default configuration supports the MIFARE and ISO/IEC 14443 A
communication scheme. Memory addresses 3 to 7 may be used for user-specific
initialization files such as I-CODE1, ISO/IEC 15693 or ISO/IEC 14443 B.
Table 15. Shipment content of StartUp configuration file
EEPROM
byte
address
Register
address
Value Symbol Description
10h 10h 00h Page free for user
11h 11h 58h TxControl transmitter pins TX1 and TX2 are switched off, bridge driver
configuration, modulator driven from internal digital circuitry
12h 12h 3Fh CwConductance source resistance of TX1 and TX2 is set to minimum
13h 13h 3Fh ModConductance defines the output conductance
14h 14h 19h CoderControl ISO/IEC 14443 A coding is set
15h 15h 13h ModWidth pulse width for Miller pulse coding is set to standard configuration
16h 16h 3Fh ModWidthSOF pulse width of Start Of Frame (SOF)
17h 17h 3Bh TypeFraming ISO/IEC 14443 A framing is set
18h 18h 00h Page free for user
19h 19h 73h RxControl1 ISO/IEC 14443 A is set and internal amplifier gain is maximum
1Ah 1Ah 08h DecoderControl bit-collisions always evaluate to HIGH in the data bit stream
1Bh 1Bh ADh BitPhase BitPhase[7:0] is set to standard configuration
1Ch 1Ch FFh RxThreshold MinLevel[3:0] and CollLevel[3:0] are set to maximum
1Dh 1Dh 1Eh BPSKDemControl ISO/IEC 14443 A is set
1Eh 1Eh 41h RxControl2 use Q-clock for the receiver, automatic receiver off is switched on,
decoder is driven from internal analog circuitry
1Fh 1Fh 00h ClockQControl automatic Q-clock calibration is switched on
20h 20h 00h Page free for user
21h 21h 06h RxWait frame guard time is set to six bit-clocks
22h 22h 03h ChannelRedundancy channel redundancy is set using ISO/IEC 14443 A
23h 23h 63h CRCPresetLSB CRC preset value is set using ISO/IEC 14443 A
24h 24h 63h CRCPresetMSB CRC preset value is set using ISO/IEC 14443 A
25h 25h 00h TimeSlotPeriod defines the time for the I-CODE1 time slots
26h 26h 00h MFOUTSelect pin MFOUT is set LOW
27h 27h 00h PreSet27 -
28h 28h 00h Page free for user
29h 29h 08h FIFOLevel WaterLevel[5:0] FIFO buffer warning level is set to standard
configuration
2Ah 2Ah 07h TimerClock TPreScaler[4:0] is set to standard configuration, timer unit restart
function is switched off
2Bh 2Bh 06h TimerControl Timer is started at the end of transmission, stopped at the beginning
of reception
2Ch 2Ch 0Ah TimerReload TReloadValue[7:0]: the timer unit preset value is set to standard
configuration
2Dh 2Dh 02h IRQPinConfig pin IRQ is set to high-impedance
2Eh 2Eh 00h PreSet2E -
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9.2.2.3 Register initialization file (read/write)
The EEPROM memory content from block address 3 to 7 can initialize register sub
addresses 10h to 2Fh when the LoadConfig command is executed (see Section 11.5.1 on
page 95). This command requires the EEPROM starting byte address as a two byte
argument for the initialization procedure.
The byte assignment is shown in Table 16.
The register initialization file is large enough to hold values for two initialization sets and
up to one block (16-byte) of user data. The startup configuration could be adapted to the
I-CODE1 StartUp configuration and stored in register block address 3 and 4, providing
additional flexibility.
Remark: The register initialization file can be read/written by users and these bytes can
be used to store other user data.
After each power-up, the default configuration enables the MIFARE and ISO/IEC 14443 A
protocol.
9.2.2.4 Content of I-CODE1 and ISO/IEC 15693 StartUp register values
Table 17 gives an overview of the StartUp values for I-CODE1 and ISO/IEC 15693
communication.
Table 16. Byte assignment for register initialization at startup
EEPROM byte address Register address Remark
EEPROM starting byte address 10h skipped
EEPROM + 1 starting byte address 11h copied
… …
EEPROM + 31 starting byte address 2Fh copiedCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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Table 17. Content of I-CODE1 startup configuration
EEPROM
byte
address
Register
address
Value Symbol Description
30h 10h 00h Page free for user
31h 11h 58h TxControl transmitter pins TX1 and TX2 switched off, bridge driver
configuration, modulator driven from internal digital circuitry
32h 12h 3Fh CwConductance source resistance (RS) of TX1 and TX2 to minimum
33h 13h 05h ModGsCfgh source resistance (RS) of TX1 and TX2 at the time of
modulation, to determine the modulation index
34h 14h 2Ch CoderControl selects the bit coding mode and the framing during
transmission
35h 15h 3Fh ModWidth pulse width for code used (1 out of 256, NRZ or 1 out of 4)
pulse coding is set to standard configuration
36h 16h 3Fh ModWidthSOF pulse width of SOF
37h 17h 00h TypeBFraming -
38h 18h 00h Page free for user
39h 19h 8Bh RxControl1 amplifier gain is maximum
3Ah 1Ah 00h DecoderControl bit-collisions always evaluate to HIGH in the data bit stream
3Bh 1Bh 54h BitPhase BitPhase[7:0] is set to standard configuration
3Ch 1Ch 68h RxThreshold: MinLevel[3:0] and CollLevel[3:0] are set to maximum
3Dh 1Dh 00h BPSKDemControl -
3Eh 1Eh 41h RxControl2 use Q-clock for the receiver, automatic receiver off is
switched on, decoder is driven from internal analog circuitry
3Fh 1Fh 00h ClockQControl automatic Q-clock calibration is switched on
40h 20h 00h Page free for user
41h 21h 08h RxWait frame guard time is set to eight bit-clocks
42h 22h 0Ch ChannelRedundancy channel redundancy is set using I-CODE1
43h 23h FEh CRCPresetLSB CRC preset value is set using I-CODE1
44h 24h FFh CRCPresetMSB CRC preset value is set using I-CODE1
45h 25h 00h TimeSlot Period defines the time for the I-CODE1 time slots
46h 26h 00h MFOUTSelect pin MFOUT is set LOW
47h 27h 00h PreSet27 -
48h 28h 00h Page free for user
49h 29h 3Eh FIFOLevel WaterLevel[5:0] FIFO buffer warning level is set to standard
configuration
4Ah 2Ah 0Bh TimerClock TPreScaler[4:0] is set to standard configuration, timer unit
restart function is switched off
4Bh 2Bh 02h TimerControl Timer is started at the end of transmission, stopped at the
beginning of reception
4Ch 2Ch 00h TimerReload the timer unit preset value is set to standard configuration
4Dh 2Dh 02h IRQPinConfig pin IRQ is set to high-impedance
4Eh 2Eh 00h PreSet2E -
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9.2.3 Crypto1 keys (write only)
MIFARE security requires specific cryptographic keys to encrypt data stream
communication on the contactless interface. These keys are called Crypto1 keys.
9.2.3.1 Key format
Keys stored in the EEPROM are written in a specific format. Each key byte must be split
into lower four bits k0 to k3 (lower nibble) and the higher four bits k4 to k7 (higher nibble).
Each nibble is stored twice in one byte and one of the two nibbles is bit-wise inverted. This
format is a precondition for successful execution of the LoadKeyE2 (see Section 11.7.1 on
page 97) and LoadKey commands (see Section 11.7.2 on page 97).
Using this format, 12 bytes of EEPROM memory are needed to store a 6-byte key. This is
shown in Figure 7.
Example: The value for the key must be written to the EEPROM.
• If the key was: A0h A1h A2h A3h A4h A5h then
• 5Ah F0h 5Ah E1h 5Ah D2h 5Ah C3h 5Ah B4h 5Ah A5h would be written.
Remark: It is possible to load data for other key formats into the EEPROM key storage
location. However, it is not possible to validate card authentication with data which will
cause the LoadKeyE2 command (see Section 11.7.1 on page 97) to fail.
9.2.3.2 Storage of keys in the EEPROM
The CLRC632 reserves 384 bytes of memory in the EEPROM for the Crypto1 keys. No
memory segmentation is used to mirror the 12-byte structure of key storage. Thus, every
byte of the dedicated memory area can be the start of a key.
Example: If the key loading cycle starts at the last byte address of an EEPROM block, (for
example, key byte 0 is stored at 12Fh), the next bytes are stored in the next EEPROM
block, for example, key byte 1 is stored at 130h, byte 2 at 131h up to byte 11 at 13Ah.
Based on the 384 bytes of memory and a single key needing 12 bytes, then up to 32
different keys can be stored in the EEPROM.
Remark: It is not possible to load a key exceeding the EEPROM byte location 1FFh.
Fig 7. Key storage format
001aak640
Master key byte 0 (LSB)
Master key bits
EEPROM byte
address
Example
k7 k6 k5 k4 k7 k6 k5 k4
n
5Ah
k3 k2 k1 k0 k3 k2 k1 k0
n + 1
F0h
1
k7 k6 k5 k4 k7 k6 k5 k4
n + 2
5Ah
k3 k2 k1 k0 k3 k2 k1 k0
n + 3
E1h
5 (MSB)
k7 k6 k5 k4 k7 k6 k5 k4
n + 10
5Ah
k3 k2 k1 k0 k3 k2 k1 k0
n + 11
A5hCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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9.3 FIFO buffer
An 8 64 bit FIFO buffer is used in the CLRC632 to act as a parallel-to-parallel converter.
It buffers both the input and output data streams between the microprocessor and the
internal circuitry of the CLRC632. This makes it possible to manage data streams up to 64
bytes long without needing to take timing constraints into account.
9.3.1 Accessing the FIFO buffer
9.3.1.1 Access rules
The FIFO buffer input and output data bus is connected to the FIFOData register. Writing
to this register stores one byte in the FIFO buffer and increments the FIFO buffer write
pointer. Reading from this register shows the FIFO buffer contents stored at the FIFO
buffer read pointer and increments the FIFO buffer read pointer. The distance between the
write and read pointer can be obtained by reading the FIFOLength register.
When the microprocessor starts a command, the CLRC632 can still access the FIFO
buffer while the command is running. Only one FIFO buffer has been implemented which
is used for input and output. Therefore, the microprocessor must ensure that there are no
inadvertent FIFO buffer accesses. Table 18 gives an overview of FIFO buffer access
during command processing.
9.3.2 Controlling the FIFO buffer
In addition to writing to and reading from the FIFO buffer, the FIFO buffer pointers can be
reset using the FlushFIFO bit. This changes the FIFOLength[6:0] value to zero, bit
FIFOOvfl is cleared and the stored bytes are no longer accessible. This enables the FIFO
buffer to be written with another 64 bytes of data.
Table 18. FIFO buffer access
Active
command
FIFO buffer Remark
p Write p Read
StartUp - -
Idle - -
Transmit yes -
Receive - yes
Transceive yes yes the microprocessor has to know the state of the
command (transmitting or receiving)
WriteE2 yes -
ReadE2 yes yes the microprocessor has to prepare the arguments,
afterwards only reading is allowed
LoadKeyE2 yes -
LoadKey yes -
Authent1 yes -
Authent2 - -
LoadConfig yes -
CalcCRC yes -CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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9.3.3 FIFO buffer status information
The microprocessor can get the following FIFO buffer status data:
• the number of bytes stored in the FIFO buffer: bits FIFOLength[6:0]
• the FIFO buffer full warning: bit HiAlert
• the FIFO buffer empty warning: bit LoAlert
• the FIFO buffer overflow warning: bit FIFOOvfl.
Remark: Setting the FlushFIFO bit clears the FIFOOvfl bit.
The CLRC632 can generate an interrupt signal when:
• bit LoAlertIRq is set to logic 1 and bit LoAlert = logic 1, pin IRQ is activated.
• bit HiAlertIRq is set to logic 1 and bit HiAlert = logic 1, pin IRQ activated.
The HiAlert flag bit is set to logic 1 only when the WaterLevel[5:0] bits or less can be
stored in the FIFO buffer. The trigger is generated by Equation 1:
(1)
The LoAlert flag bit is set to logic 1 when the FIFOLevel register’s WaterLevel[5:0] bits or
less are stored in the FIFO buffer. The trigger is generated by Equation 2:
(2)
9.3.4 FIFO buffer registers and flags
Table 18 shows the related FIFO buffer flags in alphabetic order.
9.4 Interrupt request system
The CLRC632 indicates interrupt events by setting the PrimaryStatus register bit IRq (see
Section 10.5.1.4 “PrimaryStatus register” on page 51) and activating pin IRQ. The signal
on pin IRQ can be used to interrupt the microprocessor using its interrupt handling
capabilities ensuring efficient microprocessor software.
HiAlert 64 FIFOLength = – WaterLevel
LoAlert FIFOLength WaterLevel =
Table 19. Associated FIFO buffer registers and flags
Flags Register name Bit Register address
FIFOLength[6:0] FIFOLength 6 to 0 04h
FIFOOvfl ErrorFlag 4 0Ah
FlushFIFO Control 0 09h
HiAlert PrimaryStatus 1 03h
HiAlertIEn InterruptEn 1 06h
HiAlertIRq InterruptRq 1 07h
LoAlert PrimaryStatus 0 03h
LoAlertIEn InterruptEn 0 06h
LoAlertIRq InterruptRq 0 07h
WaterLevel[5:0] FIFOLevel 5 to 0 29hCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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9.4.1 Interrupt sources overview
Table 20 shows the integrated interrupt flags, related source and setting condition. The
interrupt TimerIRq flag bit indicates an interrupt set by the timer unit. Bit TimerIRq is set
when the timer decrements from one down to zero (bit TAutoRestart disabled) or from one
to the TReLoadValue[7:0] with bit TAutoRestart enabled.
Bit TxIRq indicates interrupts from different sources and is set as follows:
• the transmitter automatically sets the bit TxIRq interrupt when it is active and its state
changes from sending data to transmitting the end of frame pattern
• the CRC coprocessor sets the bit TxIRq after all data from the FIFO buffer has been
processed indicated by bit CRCReady = logic 1
• when EEPROM programming is finished, the bit TxIRq is set and is indicated by bit
E2Ready = logic 1
The RxIRq flag bit indicates an interrupt when the end of the received data is detected.
The IdleIRq flag bit is set when a command finishes and the content of the Command
register changes to Idle.
When the FIFO buffer reaches the HIGH-level indicated by the WaterLevel[5:0] value (see
Section 9.3.3 on page 20) and bit HiAlert = logic 1, then the HiAlertIRq flag bit is set to
logic 1.
When the FIFO buffer reaches the LOW-level indicated by the WaterLevel[5:0] value (see
Section 9.3.3 on page 20) and bit LoAlert = logic 1, then LoAlertIRq flag bit is set to
logic 1.
9.4.2 Interrupt request handling
9.4.2.1 Controlling interrupts and getting their status
The CLRC632 informs the microprocessor about the interrupt request source by setting
the relevant bit in the InterruptRq register. The relevance of each interrupt request bit as
source for an interrupt can be masked by the InterruptEn register interrupt enable bits.
Table 20. Interrupt sources
Interrupt flag Interrupt source Trigger action
TimerIRq timer unit timer counts from 1 to 0
TxIRq transmitter a data stream, transmitted to the card, ends
CRC coprocessor all data from the FIFO buffer has been processed
EEPROM all data from the FIFO buffer has been
programmed
RxIRq receiver a data stream, received from the card, ends
IdleIRq Command register command execution finishes
HiAlertIRq FIFO buffer FIFO buffer is full
LoAlertIRq FIFO buffer FIFO buffer is empty
Table 21. Interrupt control registers
Register Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
InterruptEn SetIEn reserved TimerIEn TxIEn RxIEn IdleIEn HiAlertIEn LoAlertIEn
InterruptRq SetIRq reserved TimerIRq TxIRq RxIRq IdleIRq HiAlertIRq LoAlertIRqCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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If any interrupt request flag is set to logic 1 (showing that an interrupt request is pending)
and the corresponding interrupt enable flag is set, the PrimaryStatus register IRq flag bit is
set to logic 1. Different interrupt sources can activate simultaneously because all interrupt
request bits are OR’ed, coupled to the IRq flag and then forwarded to pin IRQ.
9.4.2.2 Accessing the interrupt registers
The interrupt request bits are automatically set by the CLRC632’s internal state machines.
In addition, the microprocessor can also set or clear the interrupt request bits as required.
A special implementation of the InterruptRq and InterruptEn registers enables changing
an individual bit status without influencing any other bits. If an interrupt register is set to
logic 1, bit SetIxx and the specific bit must both be set to logic 1 at the same time. Vice
versa, if a specific interrupt flag is cleared, zero must be written to the SetIxx and the
interrupt register address must be set to logic 1 at the same time.
If a content bit is not changed during the setting or clearing phase, zero must be written to
the specific bit location.
Example: Writing 3Fh to the InterruptRq register clears all bits. SetIRq is set to logic 0
while all other bits are set to logic 1. Writing 81h to the InterruptRq register sets LoAlertIRq
to logic 1 and leaves all other bits unchanged.
9.4.3 Configuration of pin IRQ
The logic level of the IRq flag bit is visible on pin IRQ. The signal on pin IRQ can also be
controlled using the following IRQPinConfig register bits.
• bit IRQInv: the signal on pin IRQ is equal to the logic level of bit IRq when this bit is set
to logic 0. When set to logic 1, the signal on pin IRQ is inverted with respect to bit IRq.
• bit IRQPushPull: when set to logic 1, pin IRQ has CMOS output characteristics. When
it is set to logic 0, it is an open-drain output which requires an external resistor to
achieve a HIGH-level at pin IRQ.
Remark: During the reset phase (see Section 9.7.2 on page 29) bit IRQInv is set to
logic 1 and bit IRQPushPull is set to logic 0. This results in a high-impedance on pin IRQ.CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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9.4.4 Register overview interrupt request system
Table 22 shows the related interrupt request system flags in alphabetic order.
9.5 Timer unit
The timer derives its clock from the 13.56 MHz on-board chip clock. The microprocessor
can use this timer to manage timing-relevant tasks.
The timer unit may be used in one of the following configurations:
• Timeout counter
• WatchDog counter
• Stopwatch
• Programmable one shot
• Periodical trigger
The timer unit can be used to measure the time interval between two events or to indicate
that a specific timed event occurred. The timer is triggered by events but does not
influence any event (e.g. a time-out during data receiving does not automatically influence
the receiving process). Several timer related flags can be set and these flags can be used
to generate an interrupt.
Table 22. Associated Interrupt request system registers and flags
Flags Register name Bit Register address
HiAlertIEn InterruptEn 1 06h
HiAlertIRq InterruptRq 1 07h
IdleIEn InterruptEn 2 06h
IdleIRq InterruptRq 2 07h
IRq PrimaryStatus 3 03h
IRQInv IRQPinConfig 1 07h
IRQPushPull IRQPinConfig 0 07h
LoAlertIEn InterruptEn 0 06h
LoAlertIRq InterruptRq 0 07h
RxIEn InterruptEn 3 06h
RxIRq InterruptRq 3 07h
SetIEn InterruptEn 7 06h
SetIRq InterruptRq 7 07h
TimerIEn InterruptEn 5 06h
TimerIRq InterruptRq 5 07h
TxIEn InterruptEn 4 06h
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9.5.1 Timer unit implementation
9.5.1.1 Timer unit block diagram
Figure 8 shows the block diagram of the timer module.
The timer unit is designed, so that events when combined with enabling flags start or stop
the counter. For example, setting bit TStartTxBegin = logic 1 enables control of received
data with the timer unit. In addition, the first received bit is indicated by the TxBegin event.
This combination starts the counter at the defined TReloadValue[7:0].
The timer stops automatically when the counter value is equal to zero or if a defined stop
event happens.
9.5.1.2 Controlling the timer unit
The main part of the timer unit is a down-counter. As long as the down-counter value is
not zero, it decrements its value with each timer clock cycle.
If the TAutoRestart flag is enabled, the timer does not decrement down to zero. On
reaching value 1, the timer reloads the next clock function with the TReloadValue[7:0].
Fig 8. Timer module block diagram
001aak611
TxEnd Event
TAutoRestart
TRunning
TStartTxEnd
TStartNow
S
RQ
START COUNTER/
PARALLEL LOAD
STOP COUNTER
TPreScaler[4:0]
TimerValue[7:0]
Counter = 0 ?
to interrupt logic: TimerIRq
PARALLEL OUT
PARALLEL IN
TReloadValue[7:0]
CLOCK
DIVIDER
COUNTER MODULE
(x ≤ x − 1)
TStopNow
TxBegin Event
TStartTxBegin
TStopRxEnd
RxEnd Event
TStopRxBegin
13.56 MHz
to parallel interface
RxBegin Event
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The timer is started immediately by loading a value from the TimerReload register into the
counter module.
This is activated by one of the following events:
• transmission of the first bit to the card (TxBegin event) with bit TStartTxBegin = logic 1
• transmission of the last bit to the card (TxEnd event) with bit TStartTxEnd = logic 1
• bit TStartNow is set to logic 1 by the microprocessor
Remark: Every start event reloads the timer from the TimerReload register. Thus, the
timer unit is re-triggered.
The timer can be configured to stop on one of the following events:
• receipt of the first valid bit from the card (RxBegin event) with bit
TStopRxBegin = logic 1
• receipt of the last bit from the card (RxEnd event) with bit TStopRxEnd = logic 1
• the counter module has decremented down to zero and bit TAutoRestart = logic 0
• bit TStopNow is set to logic 1 by the microprocessor.
Loading a new value, e.g. zero, into the TimerReload register or changing the timer unit
while it is counting will not immediately influence the counter. In both cases, this is
because this register only affects the counter content after a start event.
If the counter is stopped when bit TStopNow is set, no TimerIRq is flagged.
9.5.1.3 Timer unit clock and period
The timer unit clock is derived from the 13.56 MHz on-board chip clock using the
programmable divider. Clock selection is made using the TimerClock register
TPreScaler[4:0] bits based on Equation 3:
(3)
The values for the TPreScaler[4:0] bits are between 0 and 21 which results in a minimum
periodic time (TTimerClock) of between 74 ns and 150 ms.
The time period elapsed since the last start event is calculated using Equation 4:
(4)
This results in a minimum time period (tTimer) of between 74 ns and 40 s.
9.5.1.4 Timer unit status
The SecondaryStatus register’s TRunning bit shows the timer’s status. Configured start
events start the timer at the TReloadValue[7:0] and changes the status flag TRunning to
logic 1. Conversely, configured stop events stop the timer and sets the TRunning status
flag to logic 0. As long as status flag TRunning is set to logic 1, the TimerValue register
changes on the next timer unit clock cycle.
The TimerValue[7:0] bits can be read directly from the TimerValue register.
fTimerClock
1
TTimerClock
--------------------------- 2
TPreScaler
13.56 = = -------------------------- MHz
tTimer
TReLoadValue TimerValue –
fTimerClock
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9.5.1.5 TimeSlotPeriod
When sending I-CODE1 Quit frames, it is necessary to generate the exact chronological
relationship to the start of the command frame.
If at the end of command execution TimeSlotPeriod > 0, the TimeSlotPeriod starts. If the
FIFO buffer contains data when the end of TimeSlotPeriod is reached, the data is sent. If
the FIFO buffer is empty nothing happens. As long as the TimeSlotPeriod is > 0, the
TimeSlotPeriod counter automatically starts on reaching the end.
This forms the exact time relationship between the start and finish of the command frame
used to generate and send I-CODE1 Quit frames.
When the TimeSlotPeriod > 0, the next Frame starts with exactly the same interval
TimeSlotPeriod/CoderRate delayed after each previous send frame. CoderRate defines
the clock frequency of the encoder. If TimeSlotPeriod[7:0] = 0, the send function is not
automatically triggered.
The content of the TimeSlotPeriod register can be changed while it is running but the
change is only effective after the next TimeSlotPeriod restart.
Example:
• CoderRate = 0 0.5 (~52.97 kHz)
• The interval should be 8.458 ms for I-CODE1 standard mode
Remark: The TimeSlotPeriodMSB bit is contained in the MFOUTSelect register.
Remark: Set bit TxCRCEn to logic 0 before the Quit frame is sent. If TxCRCEn is not set
to logic 0, the Quit frame is sent with a calculated CRC value. Use the CRC8 algorithm to
calculate the Quit value.
Fig 9. TimeSlotPeriod
Table 23. TimeSlotPeriod
I-CODE1 mode TimeSlotPeriod for TSP1 TimeSlotPeriod for TSP2
standard mode BFh 1BFh
fast mode 5Fh 67h
TimeSlotPeriod CoderRate Interval = = 52.97 kHz 8.458 ms – 1 447 1BFh = =
001aak612
COMMAND
RESPONSE1 RESPONSE2
TSP1 TSP2
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9.5.2 Using the timer unit functions
9.5.2.1 Time-out and WatchDog counters
After starting the timer using TReloadValue[7:0], the timer unit decrements the TimerValue
register beginning with a given start event. If a given stop event occurs, such as a bit
being received from the card, the timer unit stops without generating an interrupt.
If a stop event does not occur, such as the card not answering within the expected time,
the timer unit decrements down to zero and generates a timer interrupt request. This
signals to the microprocessor the expected event has not occurred within the given time
(tTimer).
9.5.2.2 Stopwatch
The time (tTimer) between a start and stop event is measured by the microprocessor using
the timer unit. Setting the TReloadValue register triggers the timer which in turn, starts to
decrement. If the defined stop event occurs, the timer stops. The time between start and
stop is calculated by the microprocessor using Equation 5, when the timer does not
decrement down to zero.
(5)
9.5.2.3 Programmable one shot timer and periodic trigger
Programmable one shot timer: The microprocessor starts the timer unit and waits for
the timer interrupt. The interrupt occurs after the time specified by tTimer.
Periodic trigger: If the microprocessor sets the TAutoRestart bit, it generates an interrupt
request after every tTimer cycle.
9.5.3 Timer unit registers
Table 24 shows the related flags of the timer unit in alphabetical order.
t TReLoadvalue – TimerValue tTimer =
Table 24. Associated timer unit registers and flags
Flags Register name Bit Register address
TAutoRestart TimerClock 5 2Ah
TimerValue[7:0] TimerValue 7 to 0 0Ch
TReloadValue[7:0] TimerReload 7 to 0 2Ch
TPreScaler[4:0] TimerClock 4 to 0 2Ah
TRunning SecondaryStatus 7 05h
TStartNow Control 1 09h
TStartTxBegin TimerControl 0 2Bh
TStartTxEnd TimerControl 1 2Bh
TStopNow Control 2 09h
TStopRxBegin TimerControl 2 2Bh
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9.6 Power reduction modes
9.6.1 Hard power-down
Hard power-down is enabled when pin RSTPD is HIGH. This turns off all internal current
sinks including the oscillator. All digital input buffers are separated from the input pads and
defined internally (except pin RSTPD itself). The output pins are frozen at a given value.
The status of all pins during a hard power-down is shown in Table 25.
9.6.2 Soft power-down mode
Soft power-down mode is entered immediately using the Control register bit PowerDown.
All internal current sinks, including the oscillator buffer, are switched off. The digital input
buffers are not separated from the input pads and keep their functionality. In addition, the
digital output pins do not change their state.
After resetting the Control register bit PowerDown, the bit indicating Soft power-down
mode is only cleared after 512 clock cycles. Resetting it does not immediately clear it. The
PowerDown bit is automatically cleared when the Soft power-down mode is exited.
Remark: When the internal oscillator is used, time (tosc) is required for the oscillator to
become stable. This is because the internal oscillator is supplied by VDDA and any clock
cycles will not be detected by the internal logic until VDDA is stable.
Table 25. Signal on pins during Hard power-down
Symbol Pin Type Description
OSCIN 1 I not separated from input, pulled to AVSS
IRQ 2 O high-impedance
MFIN 3 I separated from input
MFOUT 4 O LOW
TX1 5 O HIGH, if bit TX1RFEn = logic 1
LOW, if bit TX1RFEn = logic 0
TX2 7 O HIGH, only if bit TX2RFEn = logic 1 and bit
TX2Inv = logic 0
otherwise LOW
NCS 9 I separated from input
NWR 10 I separated from input
NRD 11 I separated from input
D0 to D7 13 to 20 I/O separated from input
ALE 21 I separated from input
A0 22 I/O separated from input
A1 23 I separated from input
A2 24 I separated from input
AUX 27 O high-impedance
RX 29 I not changed
VMID 30 A pulled to VDDA
RSTPD 31 I not changed
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9.6.3 Standby mode
The Standby mode is immediately entered when the Control register StandBy bit is set. All
internal current sinks, including the internal digital clock buffer are switched off. However,
the oscillator buffer is not switched off.
The digital input buffers are not separated by the input pads, keeping their functionality
and the digital output pins do not change their state. In addition, the oscillator does not
need time to wake-up.
After resetting the Control register StandBy bit, it takes four clock cycles on pin OSCIN for
Standby mode to exit. Resetting bit StandBy does not immediately clear it. It is
automatically cleared when the Standby mode is exited.
9.6.4 Automatic receiver power-down
It is a power saving feature to switch off the receiver circuit when it is not needed. Setting
bit RxAutoPD = logic 1, automatically powers down the receiver when it is not in use.
Setting bit RxAutoPD = logic 0, keeps the receiver continuously powered up.
9.7 StartUp phase
The events executed during the StartUp phase are shown in Figure 10.
9.7.1 Hard power-down phase
The hard power-down phase is active during the following cases:
• a Power-On Reset (POR) caused by power-up on pins DVDD or AVDD activated
when VDDD or VDDA is below the digital reset threshold.
• a HIGH-level on pin RSTPD which is active while pin RSTPD is HIGH. The HIGH level
period on pin RSTPD must be at least 100 s (tPD 100 s). Shorter phases will not
necessarily result in the reset phase (treset). The rising or falling edge slew rate on pin
RSTPD is not critical because pin RSTPD is a Schmitt trigger input.
9.7.2 Reset phase
The reset phase automatically follows the Hard power-down. Once the oscillator is
running stably, the reset phase takes 512 clock cycles. During the reset phase, some
register bits are preset by hardware. The respective reset values are given in the
description of each register (see Section 10.5 on page 50).
Remark: When the internal oscillator is used, time (tosc) is required for the oscillator to
become stable. This is because the internal oscillator is supplied by VDDA and any clock
cycles will not be detected by the internal logic until VDDA is stable.
Fig 10. The StartUp procedure
001aak613
StartUp phase
states
tRSTPD treset tinit
Hard powerdown
phase Reset phase Initialising
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9.7.3 Initialization phase
The initialization phase automatically follows the reset phase and takes 128 clock cycles.
During the initializing phase the content of the EEPROM blocks 1 and 2 is copied into the
register subaddresses 10h to 2Fh (see Section 9.2.2 on page 13).
Remark: During the production test, the CLRC632 is initialized with default configuration
values. This reduces the microprocessor’s configuration time to a minimum.
9.7.4 Initializing the parallel interface type
A different initialization sequence is used for each microprocessor. This enables detection
of the correct microprocessor interface type and synchronization of the microprocessor’s
and the CLRC632’s start-up. See Section 9.1.3 on page 8 for detailed information on the
different connections for each microprocessor interface type.
During StartUp phase, the command value is set to 3Fh once the oscillator attains clock
frequency stability at an amplitude of > 90 % of the nominal 13.56 MHz clock frequency. At
the end of the initialization phase, the CLRC632 automatically switches to idle and the
command value changes to 00h.
To ensure correct detection of the microprocessor interface, the following sequence is
executed:
• the Command register is read until the 6-bit register value is 00h. On reading the 00h
value, the internal initialization phase is complete and the CLRC632 is ready to be
controlled
• write 80h to the Page register to initialize the microprocessor interface
• read the Command register. If it returns a value of 00h, the microprocessor interface
was successfully initialized
• write 00h to the Page registers to activate linear addressing mode.
9.8 Oscillator circuit
The clock applied to the CLRC632 acts as a time basis for the synchronous system
encoder and decoder. The stability of the clock frequency is an important factor for correct
operation. To obtain highest performance, clock jitter must be as small as possible. This is
best achieved by using the internal oscillator buffer with the recommended circuitry.
Fig 11. Quartz clock connection
001aak614
13.56 MHz
15 pF 15 pF
OSCOUT OSCIN
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If an external clock source is used, the clock signal must be applied to pin OSCIN. In this
case, be very careful in optimizing clock duty cycle and clock jitter. Ensure the clock
quality has been verified. It must meet the specifications described in Section 13.4.5 on
page 106.
Remark: We do not recommend using an external clock source.
9.9 Transmitter pins TX1 and TX2
The signal on pins TX1 and TX2 is the 13.56 MHz energy carrier modulated by an
envelope signal. It can be used to drive an antenna directly, using minimal passive
components for matching and filtering (see Section 15.1 on page 107). To enable this, the
output circuitry is designed with a very low-impedance source resistance. The TxControl
register is used to control the TX1 and TX2 signals.
9.9.1 Configuring pins TX1 and TX2
TX1 pin configurations are described in Table 26.
TX2 pin configurations are described in Table 27.
Table 26. Pin TX1 configurations
TxControl register configuration Envelope TX1 signal
TX1RFEn FORCE100ASK
0 X X LOW (GND)
1 0 0 13.56 MHz carrier frequency modulated
1 0 1 13.56 MHz carrier frequency
1 1 0 LOW
1 1 1 13.56 MHz energy carrierCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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9.9.2 Antenna operating distance versus power consumption
Using different antenna matching circuits (by varying the supply voltage on the antenna
driver supply pin TVDD), it is possible to find the trade-off between maximum effective
operating distance and power consumption. Different antenna matching circuits are
described in the Application note “MIFARE Design of MFRC500 Matching Circuit and
Antennas”.
9.9.3 Antenna driver output source resistance
The output source conductance of pins TX1 and TX2 can be adjusted between 1 and
100 using the CwConductance register GsCfgCW[5:0] bits.
The output source conductance of pins TX1 and TX2 during the modulation phase can be
adjusted between 1 and 100 using the ModConductance register GsCfgMod[5:0] bits.
The values are relative to the reference resistance (RS(ref)) which is measured during the
production test and stored in the CLRC632 EEPROM. It can be read from the product
information field (see Section 9.2.1 on page 13). The electrical specification can be found
in Section 13.3.3 on page 101.
Table 27. Pin TX2 configurations
TxControl register configuration Envelope TX2 signal
TX2RFEn FORCE100ASK TX2CW TX2Inv
0 X X X X LOW
1 0 0 0 0 13.56 MHz carrier frequency
modulated
1 0 0 0 1 13.56 MHz carrier frequency
1 0 0 1 0 13.56 MHz carrier frequency
modulated, 180 phase-shift
relative to TX1
1 0 0 1 1 13.56 MHz carrier frequency,
180 phase-shift relative to TX1
1 0 1 0 X 13.56 MHz carrier frequency
1 0 1 1 X 13.56 MHz carrier frequency,
180 phase-shift relative to TX1
1 1 0 0 0 LOW
1 1 0 0 1 13.56 MHz carrier frequency
1 1 0 1 0 HIGH
1 1 0 1 1 13.56 MHz carrier frequency,
180 phase-shift relative to TX1
1 1 1 0 X 13.56 MHz carrier frequency
1 1 1 1 X 13.56 MHz carrier frequency,
180 phase-shift relative to TX1CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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9.9.3.1 Source resistance table
Table 28. TX1 and TX2 source resistance of n-channel driver transistor against GsCfgCW or GsCfgMod
MANT = Mantissa; EXP= Exponent.
GsCfgCW,
GsCfgMod
(decimal)
EXPGsCfgCW,
EXPGsCfgMod
(decimal)
MANTGsCfgCW,
MANTGsCfgMod
(decimal)
RS(ref)
()
GsCfgCW,
GsCfgMod
(decimal)
EXPGsCfgCW,
EXPGsCfgMod
(decimal)
MANTGsCfgCW,
MANTGsCfgMod
(decimal)
RS(ref)
()
0 0 0 - 24 1 8 0.0652
16 1 0 - 25 1 9 0.0580
32 2 0 - 37 2 5 0.0541
48 3 0 - 26 1 10 0.0522
1 0 1 1.0000 27 1 11 0.0474
17 1 1 0.5217 51 3 3 0.0467
2 0 2 0.5000 38 2 6 0.0450
3 0 3 0.3333 28 1 12 0.0435
33 2 1 0.2703 29 1 13 0.0401
18 1 2 0.2609 39 2 7 0.0386
4 0 4 0.2500 30 1 14 0.0373
5 0 5 0.2000 52 3 4 0.0350
19 1 3 0.1739 31 1 15 0.0348
6 0 6 0.1667 40 2 8 0.0338
7 0 7 0.1429 41 2 9 0.0300
49 3 1 0.1402 53 3 5 0.0280
34 2 2 0.1351 42 2 10 0.0270
20 1 4 0.1304 43 2 11 0.0246
8 0 8 0.1250 54 3 6 0.0234
9 0 9 0.1111 44 2 12 0.0225
21 1 5 0.1043 45 2 13 0.0208
10 0 10 0.1000 55 3 7 0.0200
11 0 11 0.0909 46 2 14 0.0193
35 2 3 0.0901 47 2 15 0.0180
22 1 6 0.0870 56 3 8 0.0175
12 0 12 0.0833 57 3 9 0.0156
13 0 13 0.0769 58 3 10 0.0140
23 1 7 0.0745 59 3 11 0.0127
14 0 14 0.0714 60 3 12 0.0117
50 3 2 0.0701 61 3 13 0.0108
36 2 4 0.0676 62 3 14 0.0100
15 0 15 0.0667 63 3 15 0.0093CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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9.9.3.2 Calculating the relative source resistance
The reference source resistance RS(ref) can be calculated using Equation 6.
(6)
The reference source resistance (RS(ref)) during the modulation phase can be calculated
using ModConductance register’s GsCfgMod[5:0].
9.9.3.3 Calculating the effective source resistance
Wiring resistance (RS(wire)): Wiring and bonding add a constant offset to the driver
resistance that is relevant when pins TX1 and TX2 are switched to low-impedance. The
additional resistance for pin TX1 (RS(wire)TX1) can be set approximately as shown in
Equation 7.
(7)
Effective resistance (RSx): The source resistances of the driver transistors (RsMaxP
byte) read from the Product Information Field (see Section 9.2.1 on page 13) are
measured during the production test with CwConductance register’s
GsCfgCW[5:0] = 01h.
To calculate the driver resistance for a specific value set in GsCfgMod[5:0], use
Equation 8.
(8)
9.9.4 Pulse width
The envelope carries the data signal information that is transmitted to the card. It is an
encoded data signal based on the Miller code. In addition, each pause of the Miller
encoded signal is again encoded as a pulse of a fixed width. The width of the pulse is
adjusted using the ModWidth register. The pulse width (tw) is calculated using Equation 9
where the frequency constant (fclk) = 13.56 MHz.
(9)
9.10 Receiver circuitry
The CLRC632 uses an integrated quadrature demodulation circuit enabling it to detect an
ISO/IEC 14443 A or ISO/IEC 14443 B compliant subcarrier signal on pin RX.
• ISO/IEC 14443 A subcarrier signal: defined as a Manchester coded ASK modulated
signal
• ISO/IEC 14443 B subcarrier signal: defined as an NRZ-L coded BPSK modulated
ISO/IEC 14443 B subcarrier signal
RS ref
1
MANTGsCfgCW
77
40
----- EXPGsCfgCW
= --------------------------------------------------------------------------------
RS wire TX1 500 m
RSx RS ref maxP RS wire TX1 – RS rel RS wire TX1 = +
tw 2ModWidth 1 +
fc
= -------------------------------------CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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The quadrature demodulator uses two different clocks (Q-clock and I-clock) with a
phase-shift of 90 between them. Both resulting subcarrier signals are amplified, filtered
and forwarded to the correlation circuitry. The correlation results are evaluated, digitized
and then passed to the digital circuitry. Various adjustments can be made to obtain
optimum performance for all processing units.
9.10.1 Receiver circuit block diagram
Figure 12 shows the block diagram of the receiver circuit. The receiving process can be
broken down in to several steps. Quadrature demodulation of the 13.56 MHz carrier signal
is performed. To achieve the optimum performance, automatic Q-clock calibration is
recommended (see Section 9.10.2.1 on page 35).
The demodulated signal is amplified by an adjustable amplifier. A correlation circuit
calculates the degree of similarity between the expected and the received signal. The
BitPhase register enables correlation interval position alignment with the received signal’s
bit grid. In the evaluation and digitizer circuitry, the valid bits are detected and the digital
results are sent to the FIFO buffer. Several tuning steps are possible for this circuit.
The signal can be observed on its way through the receiver as shown in Figure 12. One
signal at a time can be routed to pin AUX using the TestAnaSelect register as described in
Section 15.2.2 on page 112.
9.10.2 Receiver operation
In general, the default settings programmed in the StartUp initialization file are suitable for
use with the CLRC632 to MIFARE card data communication. However, in some
environments specific user settings will achieve better performance.
9.10.2.1 Automatic Q-clock calibration
The quadrature demodulation concept of the receiver generates a phase signal (I-clock)
and a 90 phase-shifted quadrature signal (Q-clock). To achieve the optimum
demodulator performance, the Q-clock and the I-clock must be phase-shifted by 90. After
the reset phase, a calibration procedure is automatically performed.
Fig 12. Receiver circuit block diagram
001aak615
ClkQDelay[4:0]
ClkQCalib
ClkQ180Deg
BitPhase[7:0]
CORRELATION
CIRCUITRY
EVALUATION
AND
DIGITIZER
CIRCUITRY
MinLevel[3:0]
CollLevel[3:0]
RxWait[7:0]
RcvClkSell
s_valid
s_data
s_coll
s_clock
Gain[1:0]
to
TestAnaOutSel
clock
I TO Q
CONVERSION
I-clock Q-clock
13.56 MHz
DEMODULATOR RX
VCorrDI
VCorrNI
VCorrDQ
VCorrNQ
VEvalR
VEvalL
VRxFollQ
VRxFollI VRxAmpI
VRxAmpQCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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Automatic calibration can be set-up to execute at the end of each Transceive command if
bit ClkQCalib = logic 0. Setting bit ClkQCalib = logic 1 disables all automatic calibrations
except after the reset sequence. Automatic calibration can also be triggered by the
software when bit ClkQCalib has a logic 0 to logic 1 transition.
Remark: The duration of the automatic Q-clock calibration is 65 oscillator periods or
approximately 4.8 s.
The ClockQControl register’s ClkQDelay[4:0] value is proportional to the phase-shift
between the Q-clock and the I-clock. The ClkQ180Deg status flag bit is set when the
phase-shift between the Q-clock and the I-clock is greater than 180.
Remark:
• The StartUp configuration file enables automatic Q-clock calibration after a reset
• If bit ClkQCalib = logic 1, automatic calibration is not performed. Leaving this bit set to
logic 1 can be used to permanently disable automatic calibration.
• It is possible to write data to the ClkQDelay[4:0] bits using the microprocessor. The
aim could be to disable automatic calibration and set the delay using the software.
Configuring the delay value using the software requires bit ClkQCalib to have been
previously set to logic 1 and a time interval of at least 4.8 s has elapsed. Each delay
value must be written with bit ClkQCalib set to logic 1. If bit ClkQCalib is logic 0, the
configured delay value is overwritten by the next automatic calibration interval.
9.10.2.2 Amplifier
The demodulated signal must be amplified by the variable amplifier to achieve the best
performance. The gain of the amplifiers can be adjusted using the RxControl1 register
Gain[1:0] bits; see Table 29.
Fig 13. Automatic Q-clock calibration
001aak616
calibration impulse
from reset sequence a rising edge initiates
Q-clock calibration
ClkQCalib bit
calibration impulse
from end of
Transceive command
Table 29. Gain factors for the internal amplifier
See Table 86 “RxControl1 register bit descriptions” on page 64 for additional information.
Register setting Gain factor [dB]
(simulation results)
00 20
01 24
10 31
11 35CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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9.10.2.3 Correlation circuitry
The correlation circuitry calculates the degree of matching between the received and an
expected signal. The output is a measure of the amplitude of the expected signal in the
received signal. This is done for both, the Q and I-channels. The correlator provides two
outputs for each of the two input channels, resulting in a total of four output signals.
The correlation circuitry needs the phase information for the incoming card signal for
optimum performance. This information is defined for the microprocessor using the
BitPhase register. This value defines the phase relationship between the transmitter and
receiver clock in multiples of the BitPhase time (tBitPhase) = 1 / 13.56 MHz.
9.10.2.4 Evaluation and digitizer circuitry
The correlation results are evaluated for each bit-half of the Manchester coded signal. The
evaluation and digitizer circuit decides from the signal strengths of both bit-halves, if the
current bit is valid
• If the bit is valid, its value is identified
• If the bit is not valid, it is checked to identify if it contains a bit-collision
Select the following levels for optimal using RxThreshold register bits:
• MinLevel[3:0]: defines the minimum signal strength of the stronger bit-halve’s signal
which is considered valid.
• CollLevel[3:0]: defines the minimum signal strength relative to the amplitude of the
stronger half-bit that has to be exceeded by the weaker half-bit of the Manchester
coded signal to generate a bit-collision. If the signal’s strength is below this value,
logic 1 and logic 0 can be determined unequivocally.
After data transmission, the card is not allowed to send its response before a preset time
period which is called the frame guard time in the ISO/IEC 14443 standard. The length of
this time period is set using the RxWait register’s RxWait[7:0] bits. The RxWait register
defines when the receiver is switched on after data transmission to the card in multiples of
one bit duration.
If bit RcvClkSelI is set to logic 1, the I-clock is used to clock the correlator and evaluation
circuits. If bit RcvClkSelI is set to logic 0, the Q-clock is used.
Remark: It is recommended to use the Q-clock.
9.11 Serial signal switch
The CLRC632 comprises two main blocks:
• digital circuitry: comprising the state machines, encoder and decoder logic etc.
• analog circuitry: comprising the modulator, antenna drivers, receiver and
amplification circuitry
The interface between these two blocks can be configured so that the interface signals
are routed to pins MFIN and MFOUT. This makes it possible to connect the analog part of
one CLRC632 to the digital part of another device.
The serial signal switch can be used to measure MIFARE and ISO/IEC 14443 A as well as
related I-CODE1 and ISO/IEC 15693 signals.CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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Remark: Pin MFIN can only be accessed at 106 kBd based on ISO/IEC 14443 A. The
Manchester signal and the Manchester signal with subcarrier can only be accessed on pin
MFOUT at 106 kBd based on ISO/IEC 14443 A.
9.11.1 Serial signal switch block diagram
Figure 14 shows the serial signal switches. Three different switches are implemented in
the serial signal switch enabling the CLRC632 to be used in different configurations.
The serial signal switch can also be used to check the transmitted and received data
during the design-in phase or for test purposes. Section 15.2.1 on page 110 describes the
analog test signals and measurements at the serial signal switch.
Remark: The SLR400 uses pin name SIGOUT for pin MFOUT. The CLRC632
functionality includes the test modes for the SLRC400 using pin MFOUT.
Section 9.11.2, Section 9.11.2.1 and Section 9.11.2.2 describe the relevant registers and
settings used to configure and control the serial signal switch.
9.11.2 Serial signal switch registers
The RxControl2 register DecoderSource[1:0] bits define the input signal for the internal
Manchester decoder and are described in Table 30.
Fig 14. Serial signal switch block diagram
3
MFIN MFOUT 001aak617
MODULATOR DRIVER
(part of)
analog circuitry
SUBCARRIER
DEMODULATOR
TX1
TX2
RX CARRIER
DEMODULATOR
2
MILLER CODER
1 OUT OF 256
NRZ OR
1 OUT OF 4
MANCHESTER
DECODER
SERIAL SIGNAL SWITCH
(part of)
serial data processing
Decoder
Source[1:0]
2
Modulator
Source[1:0]
SUBCARRIER
DEMODULATOR
serial data out
0 0
1 internal
2 Manchester with subcarrier
3
0
1
2
3
4
5
6
0
1
envelope
MFIN
0
1
2
3
Manchester
Manchester out
serial data in
7
0
0 1
1
envelope
transmit NRZ
Manchester with subcarrier
Manchester
reserved
reserved
MFOUTSelect[2:0]
digital test signal
signal to MFOUTCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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The TxControl register ModulatorSource[1:0] bits define the signal used to modulate the
transmitted 13.56 MHz energy carrier. The modulated signal drives pins TX1 and TX2.
The MFOUTSelect register MFOUTSelect[2:0] bits select the output signal which is to be
routed to pin MFOUT.
To use the MFOUTSelect[2:0] bits, the TestDigiSelect register SignalToMFOUT bit must
be logic 0.
9.11.2.1 Active antenna concept
The CLRC632 analog and digital circuitry is accessed using pins MFIN and MFOUT.
Table 33 lists the required settings.
Table 30. DecoderSource[1:0] values
See Table 96 on page 67 for additional information.
Number DecoderSource
[1:0]
Input signal to decoder
0 00 constant 0
1 01 output of the analog part. This is the default configuration
2 10 direct connection to pin MFIN; expects an 847.5 kHz subcarrier
signal modulated by a Manchester encoded signal
3 11 direct connection to pin MFIN; expects a Manchester encoded
signal
Table 31. ModulatorSource[1:0] values
See Table 96 on page 67 for additional information.
Number ModulatorSource
[1:0]
Input signal to modulator
0 00 constant 0 (energy carrier off on pins TX1 and TX2)
1 01 constant 1 (continuous energy carrier on pins TX1 and TX2)
2 10 modulation signal (envelope) from the internal encoder. This is the
default configuration.
3 11 direct connection to MFIN; expects a Miller pulse coded signal
Table 32. MFOUTSelect[2:0] values
See Table 110 on page 70 for additional information.
Number MFOUTSelect
[2:0]
Signal routed to pin MFOUT
0 000 constant LOW
1 001 constant HIGH
2 010 modulation signal (envelope) from the internal encoder
3 011 serial data stream to be transmitted; the same as for
MFOUTSelect[2:0] = 001 but not encoded by the selected pulse
encoder
4 100 output signal of the receiver circuit; card modulation signal
regenerated and delayed
5 101 output signal of the subcarrier demodulator; Manchester coded card
signal
6 110 reserved
7 111 reservedCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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[1] The number column refers to the value in the number column of Table 30, Table 31 and Table 32.
Two CLRC632 devices configured as described in Table 33 can be connected to each
other using pins MFOUT and MFIN.
Remark: The active antenna concept can only be used at 106 kBd based on
ISO/IEC 14443 A.
9.11.2.2 Driving both RF parts
It is possible to connect both passive and active antennas to a single IC. The passive
antenna pins TX1, TX2 and RX are connected using the appropriate filter and matching
circuit. At the same time an active antenna is connected to pins MFOUT and MFIN. In this
configuration, two RF parts can be driven, one after another, by one microprocessor.
9.12 MIFARE higher baud rates
The MIFARE system is specified with a fixed baud rate of 106 kBd for communication on
the RF interface. The current version of ISO/IEC 14443 A also defines 106 kBd for the
initial phase of a communication between Proximity Integrated Circuit Cards (PICC) and
Proximity Coupling Devices (PCD).
To cover requirements of large data transmissions and to speed up terminal to card
communication, the CLRC632 supports communication at MIFARE higher baud rates in
combination with a microcontroller IC such as the MIFARE ProX.
The MIFARE higher baud rates concept is described in the application note: MIFARE
Implementation of Higher Baud rates Ref. 5. This application covers the integration of the
MIFARE higher baud rates communication concept in current applications.
Table 33. Register settings to enable use of the analog circuitry
Register Number[1] Signal CLRC632 pin
Analog circuitry settings
ModulatorSource 3 Miller pulse encoded MFIN
MFOUTSelect 4 Manchester encoded with subcarrier MFOUT
DecoderSource X - -
Digital circuitry settings
ModulatorSource X - -
MFOUTSelect 2 Miller pulse encoded MFOUT
DecoderSource 2 Manchester encoded with subcarrier MFIN
Table 34. MIFARE higher baud rates
Communication direction Baud rates (kBd)
CLRC632 based PCD microcontroller PICC supporting higher baud rates 106, 212, 424
Microcontroller PICC supporting higher baud rates CLRC632 based PCD 106, 212, 424CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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9.13 ISO/IEC 14443 B communication scheme
The international standard ISO/IEC 14443 covers two communication schemes; ISO/IEC
14443 A and ISO/IEC 14443 B. The CLRC632 reader IC fully supports both ISO/IEC
14443 variants.
Table 35 describes the registers and flags covered by the ISO/IEC 14443 B
communication protocol.
As reference documentation, the international standard ISO/IEC 14443 Identification
cards - Contactless integrated circuit(s) cards - Proximity cards, part 1-4 (Ref. 4) can be
used.
Remark: NXP Semiconductors does not offer a basic function library to design-in the
ISO/IEC 14443 B protocol.
Table 35. ISO/IEC 14443 B registers and flags
Flag Register Bit Register address
CharSpacing[2:0] TypeBFraming 4 to 2 17h
CoderRate[2:0] CoderControl 5 to 3 14h
EOFWidth TypeBFraming 5 17h
FilterAmpDet BPSKDemControl 4 1Dh
Force100ASK TxControl 4 11h
GsCfgCW[5:0] CwConductance 5 to 0 12h
GsCfgMod[5:0] ModConductance 5 to 0 13h
MinLevel[3:0] RxThreshold 7 to 4 1Ch
NoTxEOF TypeBFraming 6 17h
NoTxSOF TypeBFraming 7 17h
NoRxEGT BPSKDemControl 6 1Dh
NoRxEOF BPSKDemControl 5 1Dh
NoRxSOF BPSKDemControl 7 1Dh
RxCoding DecoderControl 0 1Ah
RxFraming[1:0] DecoderControl 4 to 3 1Ah
SOFWidth[1:0] TypeBFraming 1 to 0 17h
SubCPulses[2:0] RxControl1 7 to 5 19h
TauB[1:0] BPSKDemControl 1 to 0 1Dh
TauD[1:0] BPSKDemControl 3 to 2 1Dh
TxCoding[2:0] CoderControl 2 to 0 14hCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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9.14 MIFARE authentication and Crypto1
The security algorithm used in the MIFARE products is called Crypto1. It is based on a
proprietary stream cipher with a 48-bit key length. To access data on MIFARE cards,
knowledge of the key format is needed. The correct key must be available in the
CLRC632 to enable successful card authentication and access to the card’s data stored in
the EEPROM.
After a card is selected as defined in ISO/IEC 14443 A standard, the user can continue
with the MIFARE protocol. It is mandatory that card authentication is performed.
Crypto1 authentication is a 3-pass authentication which is automatically performed when
the Authent1 and Authent2 commands are executed (see Section 11.7.3 on page 98 and
Section 11.7.4 on page 98).
During the card authentication procedure, the security algorithm is initialized. After a
successful authentication, communication with the MIFARE card is encrypted.
9.14.1 Crypto1 key handling
On execution of the authentication command, the CLRC632 reads the key from the key
buffer. The key is always read from the key buffer and ensures Crypto1 authentication
commands do not require addressing of a key. The user must ensure the correct key is
prepared in the key buffer before triggering card authentication.
The key buffer can be loaded from:
• the EEPROM using the LoadKeyE2 command (see Section 11.7.1 on page 97)
• the microprocessor’s FIFO buffer using the LoadKey command (see Section 11.7.2
on page 97). This is shown in Figure 15.
Fig 15. Crypto1 key handling block diagram
001aak624
FIFO BUFFER
from the microcontroller
WriteE2
LoadKey
EEPROM
KEYS
KEY BUFFER
LoadKeyE2
during
Authent1
CRYPTO1
MODULE
serial data stream in serial data stream out
(plain) (encrypted)CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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9.14.2 Authentication procedure
The Crypto1 security algorithm enables authentication of MIFARE cards. To obtain valid
authentication, the correct key has to be available in the key buffer of the CLRC632. This
can be ensured as follows:
1. Load the internal key buffer by using the LoadKeyE2 (see Section 11.7.1 on page 97)
or the LoadKey (see Section 11.7.2 on page 97) commands.
2. Start the Authent1 command (see Section 11.7.3 on page 98). When finished, check
the error flags to obtain the command execution status.
3. Start the Authent2 command (see Section 11.7.4 on page 98). When finished, check
the error flags and bit Crypto1On to obtain the command execution status.
10. CLRC632 registers
10.1 Register addressing modes
Three methods can be used to operate the CLRC632:
• initiating functions and controlling data by executing commands
• configuring the functional operation using a set of configuration bits
• monitoring the state of the CLRC632 by reading status flags
The commands, configuration bits and flags are accessed using the microprocessor
interface. The CLRC632 can internally address 64 registers using six address lines.
10.1.1 Page registers
The CLRC632 register set is segmented into eight pages contain eight registers each. A
Page register can always be addressed, irrespective of which page is currently selected.
10.1.2 Dedicated address bus
When using the CLRC632 with the dedicated address bus, the microprocessor defines
three address lines using address pins A0, A1 and A2. This enables addressing within a
page. To switch between registers in different pages a paging mechanism needs to be
used.
Table 36 shows how the register address is assembled.
10.1.3 Multiplexed address bus
The microprocessor may define all six address lines at once using the CLRC632 with a
multiplexed address bus. In this case either the paging mechanism or linear addressing
can be used.
Table 37 shows how the register address is assembled.
Table 36. Dedicated address bus: assembling the register address
Register bit: UsePageSelect Register address
1 PageSelect2 PageSelect1 PageSelect0 A2 A1 A0CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
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10.2 Register bit behavior
Bits and flags for different registers behave differently, depending on their functions. In
principle, bits with same behavior are grouped in common registers. Table 38 describes
the function of the Access column in the register tables.
Table 37. Multiplexed address bus: assembling the register address
Multiplexed
address bus
type
UsePage
Select
Register address
Paging mode 1 PageSelect2 PageSelect1 PageSelect0 AD2 AD1 AD0
Linear
addressing
0 AD5 AD4 AD3 AD2 AD1 AD0
Table 38. Behavior and designation of register bits
Abbreviation Behavior Description
R/W read and write These bits can be read and written by the microprocessor.
Since they are only used for control, their content is not
influenced by internal state machines.
Example: TimerReload register may be read and written by
the microprocessor. It will also be read by internal state
machines but never changed by them.
D dynamic These bits can be read and written by the microprocessor.
Nevertheless, they may also be written automatically by
internal state machines.
Example: the Command register changes its value
automatically after the execution of the command.
R read only These registers hold flags which have a value determined by
internal states only.
Example: the ErrorFlag register cannot be written externally
but shows internal states.
W write only These registers are used for control only. They may be written
by the microprocessor but cannot be read. Reading these
registers returns an undefined value.
Example: The TestAnaSelect register is used to determine the
signal on pin AUX however, it is not possible to read its
content.CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.7 — 27 February 2014
073937 45 of 127
NXP Semiconductors CLRC632
Standard multi-protocol reader solution
10.3 Register overview
Table 39. CLRC632 register overview
Sub
address
(Hex)
Register name Function Refer to
Page 0: Command and status
00h Page selects the page register Table 41 on page 50
01h Command starts and stops command execution Table 43 on page 50
02h FIFOData input and output of 64-byte FIFO buffer Table 45 on page 51
03h PrimaryStatus receiver and transmitter and FIFO buffer status flags Table 47 on page 51
04h FIFOLength number of bytes buffered in the FIFO buffer Table 49 on page 52
05h SecondaryStatus secondary status flags Table 51 on page 53
06h InterruptEn enable and disable interrupt request control bits Table 53 on page 53
07h InterruptRq interrupt request flags Table 55 on page 54
Page 1: Control and status
08h Page selects the page register Table 41 on page 50
09h Control control flags for timer unit, power saving etc Table 57 on page 55
0Ah ErrorFlag show the error status of the last command executed Table 59 on page 55
0Bh CollPos bit position of the first bit-collision detected on the RF interface Table 61 on page 56
0Ch TimerValue value of the timer Table 63 on page 57
0Dh CRCResultLSB LSB of the CRC coprocessor register Table 65 on page 57
0Eh CRCResultMSB MSB of the CRC coprocessor register Table 67 on page 57
0Fh BitFraming adjustments for bit oriented frames Table 69 on page 58
Page 2: Transmitter and coder control
10h Page selects the page register Table 41 on page 50
11h TxControl controls the operation of the antenna driver pins TX1 and TX2 Table 71 on page 59
12h CwConductance selects the conductance of the antenna driver pins TX1 and TX2 Table 73 on page 60
13h ModConductance defines the driver output conductance Table 75 on page 60
14h CoderControl sets the clock frequency and the encoding Table 77 on page 61
15h ModWidth selects the modulation pulse width Table 79 on page 62
16h ModWidthSOF selects the SOF pulse-width modulation (I-CODE1 fast mode) Table 81 on page 62
17h TypeBFraming defines the framing for ISO/IEC 14443 B communication Table 83 on page 63
Page 3: Receiver and decoder control
18 Page selects the page register Table 41 on page 50
19 RxControl1 controls receiver behavior Table 85 on page 64
1A DecoderControl controls decoder behavior Table 87 on page 65
1B BitPhase selects the bit-phase between transmitter and receiver clock Table 89 on page 65
1C RxThreshold selects thresholds for the bit decoder Table 91 on page 66
1D BPSKDemControl controls BPSK receiver behavior Table 93 on page 66
1Eh RxControl2 controls decoder and defines the receiver input source Table 95 on page 67
1Fh ClockQControl clock control for the 90 phase-shifted Q-channel clock Table 97 on page 67CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.7 — 27 February 2014
073937 46 of 127
NXP Semiconductors CLRC632
Standard multi-protocol reader solution
Page 4: RF Timing and channel redundancy
20h Page selects the page register Table 41 on page 50
21h RxWait selects the interval after transmission before the receiver starts Table 99 on page 68
22h ChannelRedundancy selects the method and mode used to check data integrity on
the RF channel
Table 101 on page 68
23h CRCPresetLSB preset LSB value for the CRC register Table 103 on page 69
24h CRCPresetMSB preset MSB value for the CRC register Table 105 on page 69
25h TimeSlotPeriod selects the time between automatically transmitted frames Table 107 on page 69
26h MFOUTSelect selects internal signal applied to pin MFOUT, includes the MSB
of value TimeSlotPeriod; see Table 107 on page 69
Table 109 on page 70
27h PreSet27 these values are not changed Table 111 on page 70
Page 5: FIFO, timer and IRQ pin configuration
28h Page selects the page register Table 41 on page 50
29h FIFOLevel defines the FIFO buffer overflow and underflow warning levels Table 49 on page 52
2Ah TimerClock selects the timer clock divider Table 114 on page 71
2Bh TimerControl selects the timer start and stop conditions Table 116 on page 72
2Ch TimerReload defines the timer preset value Table 118 on page 72
2Dh IRQPinConfig configures pin IRQ output stage Table 120 on page 73
2Eh PreSet2E these values are not changed Table 122 on page 73
2Fh PreSet2F these values are not changed Table 123 on page 73
Page 6: reserved registers
30h Page selects the page register Table 41 on page 50
31h reserved reserved Table 124 on page 73
32h reserved reserved
33h reserved reserved
34h reserved reserved
35h reserved reserved
36h reserved reserved
37h reserved reserved
Page 7: Test control
38h Page selects the page register Table 41 on page 50
39h reserved reserved Table 125 on page 74
3Ah TestAnaSelect selects analog test mode Table 126 on page 74
3Bh reserved reserved Table 128 on page 75
3Ch reserved reserved Table 129 on page 75
3Dh TestDigiSelect selects digital test mode Table 130 on page 75
3Eh reserved reserved Table 132 on page 76
3Fh reserved reserved
